SG10201806376SA - Plating apparatus - Google Patents

Plating apparatus

Info

Publication number
SG10201806376SA
SG10201806376SA SG10201806376SA SG10201806376SA SG10201806376SA SG 10201806376S A SG10201806376S A SG 10201806376SA SG 10201806376S A SG10201806376S A SG 10201806376SA SG 10201806376S A SG10201806376S A SG 10201806376SA SG 10201806376S A SG10201806376S A SG 10201806376SA
Authority
SG
Singapore
Prior art keywords
electric field
substrate
anode
plating apparatus
opening portion
Prior art date
Application number
SG10201806376SA
Inventor
Yamasaki Gaku
Hirao Tomonori
Yokoyama Toshio
Original Assignee
Ebara Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Ebara Corp filed Critical Ebara Corp
Publication of SG10201806376SA publication Critical patent/SG10201806376SA/en

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D5/00—Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
    • C25D5/10—Electroplating with more than one layer of the same or of different metals
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D17/00—Constructional parts, or assemblies thereof, of cells for electrolytic coating
    • C25D17/001—Apparatus specially adapted for electrolytic coating of wafers, e.g. semiconductors or solar cells
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D17/00—Constructional parts, or assemblies thereof, of cells for electrolytic coating
    • C25D17/007—Current directing devices
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D17/00—Constructional parts, or assemblies thereof, of cells for electrolytic coating
    • C25D17/008—Current shielding devices
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D17/00—Constructional parts, or assemblies thereof, of cells for electrolytic coating
    • C25D17/06—Suspending or supporting devices for articles to be coated
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D17/00—Constructional parts, or assemblies thereof, of cells for electrolytic coating
    • C25D17/06—Suspending or supporting devices for articles to be coated
    • C25D17/08—Supporting racks, i.e. not for suspending
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D17/00—Constructional parts, or assemblies thereof, of cells for electrolytic coating
    • C25D17/10—Electrodes, e.g. composition, counter electrode
    • C25D17/12—Shape or form
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D21/00—Processes for servicing or operating cells for electrolytic coating
    • C25D21/12—Process control or regulation
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D5/00—Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
    • C25D5/02—Electroplating of selected surface areas
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D5/00—Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
    • C25D5/02—Electroplating of selected surface areas
    • C25D5/022—Electroplating of selected surface areas using masking means
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D5/00—Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
    • C25D5/04—Electroplating with moving electrodes
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D7/00—Electroplating characterised by the article coated
    • C25D7/12—Semiconductors
    • C25D7/123—Semiconductors first coated with a seed layer or a conductive layer
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/40—Forming printed elements for providing electric connections to or between printed circuits
    • H05K3/42—Plated through-holes or plated via connections
    • H05K3/423—Plated through-holes or plated via connections characterised by electroplating method

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Organic Chemistry (AREA)
  • Electrochemistry (AREA)
  • Materials Engineering (AREA)
  • Metallurgy (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Sustainable Development (AREA)
  • Automation & Control Theory (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Electroplating Methods And Accessories (AREA)
  • Manufacturing Of Printed Wiring (AREA)
  • Crystals, And After-Treatments Of Crystals (AREA)

Abstract

PLATING APPARATUS A plating apparatus including a plating bath, a substrate holder to be arranged in the plating bath and adapted to hold a substrate, an anode for generating an electric field between the substrate and the anode, and at least one electric field shielding body for shielding the substrate holder and a part or the whole of the electric field, wherein the electric field shielding body has an opening portion for allowing the electric field between the substrate and the anode to pass therethrough, and is configured so as to be capable of adjusting an opening size in a first direction of the opening portion and an opening size in a second direction of the opening portion independently of each other. Representative drawing: Fig. 3
SG10201806376SA 2017-09-22 2018-07-25 Plating apparatus SG10201806376SA (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2017182570A JP7014553B2 (en) 2017-09-22 2017-09-22 Plating equipment

Publications (1)

Publication Number Publication Date
SG10201806376SA true SG10201806376SA (en) 2019-04-29

Family

ID=65808599

Family Applications (1)

Application Number Title Priority Date Filing Date
SG10201806376SA SG10201806376SA (en) 2017-09-22 2018-07-25 Plating apparatus

Country Status (6)

Country Link
US (1) US11332838B2 (en)
JP (1) JP7014553B2 (en)
KR (1) KR102530410B1 (en)
CN (1) CN109537032B (en)
SG (1) SG10201806376SA (en)
TW (1) TWI779099B (en)

Families Citing this family (15)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP7173932B2 (en) * 2019-06-10 2022-11-16 株式会社荏原製作所 Anode holder and plating equipment
JP7193418B2 (en) * 2019-06-13 2022-12-20 株式会社荏原製作所 Plating equipment
JP7227875B2 (en) * 2019-08-22 2023-02-22 株式会社荏原製作所 Substrate holder and plating equipment
JP7296832B2 (en) 2019-09-10 2023-06-23 株式会社荏原製作所 Plating equipment
CN111394758B (en) * 2020-05-14 2023-11-03 绍兴上虞顺风金属表面处理有限公司 Electroplating process and equipment based on metal surfacing field
KR102373173B1 (en) * 2020-08-17 2022-03-10 주식회사 포스코 Rotary electroplating apparatus
US20220396897A1 (en) * 2020-12-22 2022-12-15 Ebara Corporation Plating apparatus, pre-wet process method, and cleaning process method
KR102470673B1 (en) * 2021-05-20 2022-11-25 (주)네오피엠씨 Automatic moving apparatus of shield plate
IT202100015917A1 (en) * 2021-06-17 2022-12-17 Dreamet Srl Method and Apparatus for the Treatment of Metallic Surfaces
KR102565864B1 (en) 2021-06-18 2023-08-10 가부시키가이샤 에바라 세이사꾸쇼 Plating device and plating method
CN116234944A (en) * 2021-11-05 2023-06-06 株式会社荏原制作所 Plating device and method for manufacturing plating device
JP2023069447A (en) 2021-11-05 2023-05-18 株式会社荏原製作所 Plating apparatus and plating method
TWI808530B (en) * 2021-11-08 2023-07-11 日商荏原製作所股份有限公司 Plating device and manufacturing method thereof
JP7098089B1 (en) * 2022-02-07 2022-07-08 株式会社荏原製作所 Plating equipment
JP7285389B1 (en) * 2022-06-27 2023-06-01 株式会社荏原製作所 Plating equipment and plating method

Family Cites Families (16)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS62116799A (en) * 1985-11-15 1987-05-28 C Uyemura & Co Ltd Automatic screen device for plating device
JPH07116636B2 (en) * 1986-09-26 1995-12-13 川崎製鉄株式会社 Cell with radial type
JP2664740B2 (en) * 1988-09-30 1997-10-22 株式会社東芝 Air conditioner
JPH02145791A (en) 1988-11-28 1990-06-05 Eagle Ind Co Ltd Method and equipment for plating and shielding plate for plating
JP3109548B2 (en) 1992-07-02 2000-11-20 イビデン株式会社 Electroplating equipment
JPH10130896A (en) * 1996-10-28 1998-05-19 Matsushita Electric Works Ltd Electroplating method
JP2002121694A (en) 2000-10-16 2002-04-26 Nippon Mektron Ltd Method and apparatus for plating through-hole of printed wiring board
US8177944B2 (en) * 2007-12-04 2012-05-15 Ebara Corporation Plating apparatus and plating method
CN102431425B (en) 2010-09-22 2014-07-30 八千代工业株式会社 Sunroof device
US8932443B2 (en) 2011-06-07 2015-01-13 Deca Technologies Inc. Adjustable wafer plating shield and method
KR20130033722A (en) * 2011-09-27 2013-04-04 삼성전기주식회사 Shielding apparatus and plating device including the same
US20140231245A1 (en) * 2013-02-18 2014-08-21 Globalfoundries Inc. Adjustable current shield for electroplating processes
JP6285199B2 (en) * 2014-02-10 2018-02-28 株式会社荏原製作所 Anode holder and plating apparatus
JP6335763B2 (en) * 2014-11-20 2018-05-30 株式会社荏原製作所 Plating apparatus and plating method
JP6335777B2 (en) * 2014-12-26 2018-05-30 株式会社荏原製作所 Substrate holder, method for holding substrate with substrate holder, and plating apparatus
JP6538541B2 (en) 2015-12-21 2019-07-03 株式会社荏原製作所 Regulation plate, plating apparatus provided with the same, and plating method

Also Published As

Publication number Publication date
JP7014553B2 (en) 2022-02-01
KR102530410B1 (en) 2023-05-09
CN109537032B (en) 2022-11-08
CN109537032A (en) 2019-03-29
US20190093250A1 (en) 2019-03-28
KR20190034073A (en) 2019-04-01
TW201923157A (en) 2019-06-16
TWI779099B (en) 2022-10-01
US11332838B2 (en) 2022-05-17
JP2019056164A (en) 2019-04-11

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