MY194185A - Method of manufacturing plating films - Google Patents

Method of manufacturing plating films

Info

Publication number
MY194185A
MY194185A MYPI2014001378A MYPI2014001378A MY194185A MY 194185 A MY194185 A MY 194185A MY PI2014001378 A MYPI2014001378 A MY PI2014001378A MY PI2014001378 A MYPI2014001378 A MY PI2014001378A MY 194185 A MY194185 A MY 194185A
Authority
MY
Malaysia
Prior art keywords
main surface
power source
workpiece
current power
direct current
Prior art date
Application number
MYPI2014001378A
Inventor
Kure Muneaki
Aruga Yosuke
Original Assignee
Shinko Electric Ind Co
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Shinko Electric Ind Co filed Critical Shinko Electric Ind Co
Publication of MY194185A publication Critical patent/MY194185A/en

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D5/00—Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
    • C25D5/18—Electroplating using modulated, pulsed or reversing current
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D17/00—Constructional parts, or assemblies thereof, of cells for electrolytic coating
    • C25D17/007—Current directing devices
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D5/00—Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
    • C25D5/60—Electroplating characterised by the structure or texture of the layers
    • C25D5/605—Surface topography of the layers, e.g. rough, dendritic or nodular layers
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D5/00—Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
    • C25D5/60—Electroplating characterised by the structure or texture of the layers
    • C25D5/605—Surface topography of the layers, e.g. rough, dendritic or nodular layers
    • C25D5/611—Smooth layers
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D5/00—Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
    • C25D5/627—Electroplating characterised by the visual appearance of the layers, e.g. colour, brightness or mat appearance
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D7/00—Electroplating characterised by the article coated
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805—Shape
    • H01L2224/4809—Loop shape
    • H01L2224/48091—Arched
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/481—Disposition
    • H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
    • H01L2224/48247—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a bond pad of the item
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
    • H01L23/488—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
    • H01L23/495—Lead-frames or other flat leads
    • H01L23/49579—Lead-frames or other flat leads characterised by the materials of the lead frames or layers thereon
    • H01L23/49582—Metallic layers on lead frames

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Electrochemistry (AREA)
  • Materials Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Electroplating Methods And Accessories (AREA)
  • Lead Frames For Integrated Circuits (AREA)

Abstract

A method of manufacturing plating films on a first main surface and a second main surface which is opposite to the first main surface, of a workpiece (12), respectively, includes preparing a periodic reverse current power source and a direct current power source; providing a current whose current direction periodically changes in reverse directions at predetermined timing by a periodic reverse current power source between the workpiece (12) and a first electrode that faces the first main surface of the workpiece (12) in plating solution; and providing a direct current by a direct current power source between the workpiece (12) and a second electrode that faces the second main surface of the workpiece (12) in the plating solution, the providing the current by the periodic reverse current power source and the providing the direct current by the direct current power source being performed at the same time such that plating films are formed on the first main surface and the second main surface, respectively.
MYPI2014001378A 2013-05-14 2014-05-12 Method of manufacturing plating films MY194185A (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2013102470A JP6093646B2 (en) 2013-05-14 2013-05-14 Manufacturing method of plating film

Publications (1)

Publication Number Publication Date
MY194185A true MY194185A (en) 2022-11-17

Family

ID=51878578

Family Applications (1)

Application Number Title Priority Date Filing Date
MYPI2014001378A MY194185A (en) 2013-05-14 2014-05-12 Method of manufacturing plating films

Country Status (5)

Country Link
JP (1) JP6093646B2 (en)
KR (1) KR102102263B1 (en)
CN (1) CN104152959B (en)
MY (1) MY194185A (en)
TW (1) TWI627315B (en)

Families Citing this family (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP6685112B2 (en) * 2015-11-18 2020-04-22 株式会社三井ハイテック Lead frame, lead frame package, and manufacturing method thereof
JP6905031B2 (en) * 2016-02-17 2021-07-21 株式会社三井ハイテック Lead frame and semiconductor package
JP6621681B2 (en) * 2016-02-17 2019-12-18 株式会社三井ハイテック Lead frame, manufacturing method thereof, and semiconductor package
JP6782116B2 (en) * 2016-08-02 2020-11-11 古河電気工業株式会社 Silver coating material
CN109468670B (en) * 2018-11-16 2021-03-26 中山品高电子材料有限公司 Method for electroplating copper layer on lead frame
CN112331566A (en) * 2020-11-02 2021-02-05 昆山一鼎工业科技有限公司 Manufacturing equipment and manufacturing method for surface roughness of lead frame

Family Cites Families (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6179988B1 (en) * 1997-08-29 2001-01-30 Electrocopper Products Limited Process for making copper wire
JP3690603B2 (en) * 2002-11-28 2005-08-31 株式会社中央製作所 Current control method for continuous plating
CN2587889Y (en) * 2002-12-11 2003-11-26 吕明 Electrodeposition apparatus for producing high porosity metal strip
JP2005097721A (en) * 2003-08-27 2005-04-14 Yamaha Corp Apparatus and method for plating both sides
CN2712947Y (en) * 2004-07-20 2005-07-27 戴其金 Plating bath with double anode
JP4981488B2 (en) * 2007-03-09 2012-07-18 古河電気工業株式会社 Roughened rolled copper plate and method for producing the same
KR20100066988A (en) * 2008-12-10 2010-06-18 삼성테크윈 주식회사 Uniform pating method for pcb
KR100950442B1 (en) * 2009-05-13 2010-04-02 주식회사 모아기술 Method for antibious surface treatment of aluminum matter using high frequency pluse
CN102337578B (en) * 2010-07-19 2014-04-02 北大方正集团有限公司 Double-sided plating tank, sheet and plating method

Also Published As

Publication number Publication date
TW201500599A (en) 2015-01-01
JP2014221941A (en) 2014-11-27
KR20140135108A (en) 2014-11-25
TWI627315B (en) 2018-06-21
CN104152959B (en) 2018-11-13
KR102102263B1 (en) 2020-04-20
CN104152959A (en) 2014-11-19
JP6093646B2 (en) 2017-03-08

Similar Documents

Publication Publication Date Title
MY194185A (en) Method of manufacturing plating films
TW201614110A (en) Plating method
WO2015028886A3 (en) Nano-gap electrode and methods for manufacturing same
EA201991418A2 (en) METHOD AND SYSTEM FOR INCREASING THE UTILITY OF THE PHOTOELECTRIC DEVICE
BR112018007810A2 (en) electric machine, and electric electromotive rotation production method
MX2018004842A (en) A photovoltaic module.
WO2015112713A3 (en) Value synchronization across neural processors
MY187868A (en) Activation method for silicon substrates
WO2018093240A3 (en) Electrode for electrochemical element and method for manufacturing same
PH12016000452A1 (en) Multilayer ceramic capacitor
MY175045A (en) Film formation system and film formation method for forming metal film
SG11201803826YA (en) Lead frame, lead frame package, and method for manufacturing same
JP2014221941A5 (en)
MY189288A (en) Electrical generator system
MX2022009514A (en) Electric generator.
IN2014DE01279A (en)
ITMI20130954A1 (en) STRUCTURAL ELEMENTER WITH THROUGH CONTACT AND PROCEDURE FOR THE RELATED PRODUCTION
MX2015012535A (en) Power cable with a thick insulation layer and a method for its manufacture.
EP3394901A4 (en) Back contact solar cell substrate, method of manufacturing the same and back contact solar cell
TW201613033A (en) Memory structure and manufacturing method therefor
TR201907493T4 (en) Increasing the expression of a transgene in eukaryotic cells through reduction of RNA interference.
EA201990320A1 (en) CRYSTAL FORMS 3-IL) -1H-IMIDAZOL-2-CARBOXAMIDE
TW201614843A (en) Semiconductor device
TW201614280A (en) Optical member, production system of optical display device, method of produicing optical display device, and raw roll
UA116998U (en) MULTI-TRANSITION SOLAR WITH VERTICAL P-N TRANSITIONS AND GRAPHEN CONTACTS