JP6538541B2 - Regulation plate, plating apparatus provided with the same, and plating method - Google Patents

Description

  The present invention relates to a regulation plate, a plating apparatus provided with the same, and a plating method.

  Conventionally, a bump is formed on a fine wiring groove, hole or resist opening provided on the surface of a substrate such as a semiconductor wafer, or is electrically connected to an electrode or the like of a package on the surface of the substrate It is practiced to form an electrode). As a method of forming the wiring and the bump, for example, an electrolytic plating method, a vapor deposition method, a printing method, a ball bump method and the like are known. With the increase in the number of I / Os of semiconductor chips and the reduction in the pitch, electrolytic plating methods which can be miniaturized and whose performance is relatively stable are often used.

  When forming a wiring or bump by electrolytic plating, a seed layer (power feeding layer) with low electric resistance is formed on the surface of a wiring metal, a hole or a barrier metal provided in a resist opening on the substrate. A plating film grows on the surface of this seed layer. In recent years, with the miniaturization of wiring and bumps, a seed layer with a thinner film thickness has been used. As the thickness of the seed layer decreases, the electrical resistance (sheet resistance) of the seed layer increases.

  Generally, the substrate to be plated has electrical contacts at its periphery. Therefore, a current corresponding to the combined resistance of the electrical resistance value of the plating solution and the electrical resistance value of the seed layer from the central portion of the substrate to the electrical contact flows in the central portion of the substrate. On the other hand, a current substantially corresponding to the electric resistance value of the plating solution flows through the peripheral portion of the substrate (near the electrical contacts). That is, in the central portion of the substrate, current hardly flows by the electric resistance value of the seed layer from the central portion of the substrate to the electrical contact. This phenomenon where current concentrates on the periphery of the substrate is called terminal effect.

  In a substrate having a relatively thin seed layer, the electrical resistance value of the seed layer from the central portion of the substrate to the electrical contact is relatively large. For this reason, when plating on a substrate having a relatively thin seed layer, the terminal effect becomes remarkable. As a result, the plating rate at the central portion of the substrate decreases, the thickness of the plated film at the central portion of the substrate becomes thinner than the plated film at the peripheral portion of the substrate, and the in-plane uniformity of the film thickness decreases.

  In order to suppress the decrease in the in-plane uniformity of the film thickness due to the terminal effect, it is necessary to adjust the electric field applied to the substrate. For example, there is known a plating apparatus in which a control plate for adjusting the potential distribution between the anode and the substrate is disposed between the anode and the substrate (see Patent Document 1).

JP, 2005-029863, A

  By the way, the influence of the terminal effect differs depending on the thickness of the seed layer of the substrate. Specifically, as described above, since the sheet resistance is relatively large when the film thickness of the seed layer is relatively thin, the influence of the terminal effect appears notably. On the other hand, when the film thickness of the seed layer is relatively thick, the influence of the terminal effect is relatively small because the sheet resistance is relatively small.

  Also, the influence of the terminal effect may differ depending on not only the thickness of the seed layer but also other factors. For example, it is formed on the substrate when the resist opening ratio of the substrate (the ratio of the area of the area not covered by the resist (the opening of the resist) to the area of the area bordered by the resist outer edge) is relatively high The area of the plating film is relatively large. For this reason, as the plating film is formed on the substrate, the formed plating film facilitates the flow of current also to the central portion of the substrate. In other words, the formation of the plating film on the substrate reduces the electrical resistance value from the central portion of the substrate to the electrical contacts, so the influence of the terminal effect gradually decreases. On the other hand, when the resist opening ratio of the substrate is relatively low, the area of the plating film formed on the substrate is relatively small. For this reason, when the resist opening ratio of the substrate is relatively low, even if the plating film is formed on the substrate, the electrical resistance from the central portion of the substrate to the electrical contact is higher than when the resist opening ratio of the substrate is relatively high. The change in value is small and the effect of the terminal effect remains large.

  Further, when the electrical resistance value of the plating solution for processing the substrate is relatively large, the influence of the terminal effect is smaller than in the case where the electrical resistance value of the plating solution for processing the substrate is relatively small. Specifically, assuming that the electrical resistance value of the plating solution is R1 and the electrical resistance value of the seed layer from the central portion of the substrate to the electrical contacts is R2, the central portion of the substrate corresponds to the combined resistance value (R1 + R2). Current flows. On the other hand, a current substantially corresponding to the electric resistance value R1 of the plating solution flows in the substrate peripheral portion (near the electric contact). Therefore, if the electric resistance value R1 increases, the influence of the electric resistance value R2 on the current flowing to the central portion of the substrate decreases, and the influence of the terminal effect decreases.

  As described above, the influence of the terminal effect differs depending on the characteristics of the substrate and the conditions for processing the substrate. For this reason, in the case of sequentially plating a plurality of substrates different in the influence of the terminal effect in a single plating apparatus, in order to suppress the decrease in the in-plane uniformity of the film thickness due to the terminal effect, It is necessary to adjust the electric field applied to the substrate in accordance with the conditions for processing the substrate. However, in order to adjust the electric field according to the characteristics of the substrate and the conditions for processing the substrate with the adjustment plate as described in Patent Document 1, the adjustment plate meeting the conditions for processing the substrate and the characteristics of the substrate You have to prepare more than one.

  Further, even if a plurality of adjusting plates are prepared, it takes time and effort to take out the adjusting plate from the plating tank and install another adjusting plate each time a substrate having different characteristics and processing conditions is processed.

  The present invention has been made in view of the above problems, and one of its objects is to suppress the decrease in in-plane uniformity due to the effect of the terminal effect when plating on a plurality of substrates having different characteristics and processing conditions. It is an object of the present invention to provide a regulation plate, a plating apparatus and a plating method provided with the same.

  According to one aspect of the invention, a regulation plate is provided for regulating the current between the anode and the substrate to be plated. The regulation plate includes a plate body having an opening through which current passes, a plurality of first blades for reducing the diameter of the opening, and a first for translating the plurality of first blades in the radial direction of the opening. And a moving mechanism.

According to this aspect, the diameter of the opening of the regulation plate can be adjusted by narrowing the diameter of the opening with the first blade. Thereby, when the characteristics or processing conditions of the first substrate and the second substrate are different from each other, it is possible to suppress the decrease in in-plane uniformity due to the effect of the terminal effect. Specifically, when the substrate is plated under the condition where the influence of the terminal effect appears remarkably, the film forming speed at the peripheral portion of the substrate can be suppressed by reducing the diameter of the opening of the regulation plate. The in-plane uniformity of the substrate can be improved. In addition, since the first blade is configured to translate, the plurality of first blades can move in the radial direction while maintaining the angular relationship with the other first blades. Therefore, as compared with the case where the plurality of diaphragm blades are rotated about a predetermined axis to reduce the diameter of the aperture as in the diaphragm mechanism of a camera, the circular shape of the aperture formed by the first blade can be maintained. it can.

  In one aspect of the present invention, the first moving mechanism includes a ring member disposed along the edge, and any one of the ring member and the plurality of first blades has the first opening. And the other of the ring member and the plurality of first blades has a slide pin sliding on the slide elongated hole.

  According to this aspect, the slide elongated hole provided in any one of the ring member and the plurality of first blades slides with the slide pin provided in the other of the ring member and the plurality of first blades. Therefore, by rotating the ring member in the circumferential direction, the slide pin slides in the slide elongated hole, and the first blade can be moved in the radial direction of the opening.

  In one embodiment of the present invention, the first moving mechanism includes a blade pressing member fixed to the side opposite to the ring member of the plurality of first blades, and the blade pressing member and the plurality of first blades One of them has a guide elongated hole formed in parallel with the translational movement direction of the first blade, and the other of the other of the blade pressing member and the plurality of first blades slides in the guide elongated hole. Have a pin.

  According to this aspect, the blade pressing member and the guide pin provided on the other of the plurality of first blades slide in the guide long hole provided on any one of the blade pressing member and the plurality of first blades. . Therefore, when the plurality of first blades are moved by the movement mechanism, the first blades can be translated in a desired direction while preventing the plurality of first blades from rotational movement.

  In one aspect of the present invention, the first moving mechanism includes a rotating member for rotating the ring member in the circumferential direction, and the rotating member includes a ring portion fixed to the ring member, and the ring portion. And a lever portion that rotates in the circumferential direction.

  According to this aspect, the ring portion can be rotated in the circumferential direction by operating the lever portion with an actuator or manually. Since the ring portion is fixed to the ring member, the ring member rotates as the ring portion rotates. Thereby, the slide slot or slide pin provided in the ring member can slide with the slide pins or slide slots provided in the plurality of first blades, and the plurality of first blades can be translated.

  In one aspect of the present invention, any one of the plate main body portion and the ring portion has a support elongated hole formed along the rotational direction of the ring portion, and the other of the plate main body portion and the ring portion Has a support pin slidably engaged with the support slot.

  According to this aspect, the support pin provided on the other of the plate main body portion and the ring portion is slidably engaged with the support elongated hole provided on any one of the plate main body portion and the ring portion. . The ring portion is supported on the plate body by the support pin engaging with the support elongated hole. Since the support elongated holes are formed along the rotation direction of the ring portion, the ring portion can be rotated by the support pins sliding on the support elongated holes.

  In one aspect of the present invention, the inner peripheral edge of each of the plurality of first blades is formed in an arc shape, and overlaps with the other first blades to form a substantially circular inner peripheral edge.

  According to this aspect, when the plurality of first blades translate in the radial direction of the opening to reduce the diameter of the opening, the inner peripheral edge of the plurality of first blades can maintain a substantially circular shape.

  In one aspect of the present invention, the regulation plate is disposed at a position shifted from the plurality of first blades in a direction orthogonal to the radial direction of the first opening, and a plurality of regulation plates are used to narrow the diameter of the first opening. And a second moving mechanism for translating the plurality of second blades in the radial direction of the first opening.

  According to this form, the regulation plate has an opening having a first diameter formed by the plurality of first blades and an opening having a second diameter formed by the plurality of second blades. By appropriately adjusting the sizes of the first diameter and the second diameter, respectively, the current passing through the opening of the regulation plate can be adjusted more appropriately.

  In one aspect of the present invention, a straight line connecting the center of the opening formed by the plurality of first blades and the center of the opening formed by the plurality of second blades is orthogonal to the radial direction of these openings. The first blade and the second blade are disposed.

  According to this aspect, the first blade and the second blade are arranged such that the center of the opening formed by the first blade and the center of the opening formed by the second blade coincide with each other. Therefore, when positioning the regulation plate in the plating tank, it is not necessary to separately position the center of the opening formed by the plurality of first blades and the center of the opening formed by the plurality of second blades. Therefore, even when high accuracy is required at the position of the opening center of the regulation plate, the regulation plate can be easily positioned.

  According to one aspect of the invention, a regulation plate is provided for regulating the current between the anode and the substrate to be plated. The regulation plate has a first plate main body having a first edge forming a first opening through which current flows, and a plurality of first blades for narrowing the diameter of the first opening; And a second plate main body having a second edge forming a second opening through which the second plate passes and a plurality of second blades for narrowing the diameter of the second opening. The first plate main body and the straight line connecting the center of the opening formed by the plurality of first blades and the center of the opening formed by the plurality of second blades is orthogonal to the radial direction of the openings; The second plate body is connected to each other.

  According to this form, the regulation plate has an opening having a first diameter formed by the plurality of first blades and an opening having a second diameter formed by the plurality of second blades. By appropriately adjusting the sizes of the first diameter and the second diameter, respectively, the current passing through the opening of the regulation plate can be adjusted more appropriately. Further, the first blade and the second blade are arranged such that the center of the opening formed by the first blade and the center of the opening formed by the second blade coincide with each other. Therefore, when positioning the regulation plate in the plating tank, it is not necessary to separately position the center of the opening formed by the plurality of first blades and the center of the opening formed by the plurality of second blades. Therefore, even when high accuracy is required at the position of the opening center of the regulation plate, the regulation plate can be easily positioned.

In one aspect of the present invention, the diameter of the opening formed by the plurality of first blades and the diameter of the opening formed by the plurality of second blades can be adjusted independently of each other. Ru.

  According to this aspect, the diameter of the opening defined by the plurality of first blades can be different from the diameter of the opening defined by the plurality of second blades. Thus, for example, the diameter of the opening defined by the blade close to the substrate is reduced, and the diameter of the opening defined by the blade far from the substrate is increased, etc. It can be made smaller.

  According to one aspect of the present invention, a plating apparatus is provided. The plating apparatus is integrally attached to an anode holder configured to hold an anode, a substrate holder disposed opposite to the anode holder, configured to hold a substrate, and the anode holder. The anode mask has a second opening through which the current flowing between the anode and the substrate passes, and one of the regulation plates described above, and the anode mask adjusts the diameter of the second opening. Adjustment mechanism.

  According to this aspect, the diameter of the second opening of the anode mask can be adjusted for each of the first substrate and the second substrate. Thereby, when the characteristics or processing conditions of the first substrate and the second substrate are different from each other, it is possible to suppress the decrease in in-plane uniformity due to the effect of the terminal effect. Specifically, when the second substrate is plated under the condition that the influence of the terminal effect appears significantly, the electric field is concentrated in the central portion of the substrate by reducing the diameter of the second opening, The film thickness at the central portion of the substrate can be increased. In addition, when the diameter of the first opening of the regulation plate is reduced, the deposition rate at the peripheral portion of the substrate can be suppressed. Therefore, the in-plane uniformity of the substrate W can be further improved by adjusting both the diameter of the first opening of the regulation plate and the diameter of the second opening of the anode mask.

  According to one aspect of the present invention, a plating method is provided. This plating method comprises the steps of: disposing, in a plating tank, an anode holder integrally provided with an anode mask having a first opening through which a current flowing between the anode and the substrate passes; a substrate holder for holding the first substrate Placing a regulation plate having a second opening and a third opening through which a current flowing between the anode and the substrate passes, between the anode mask and the substrate. And adjusting the diameter of the first opening to a first diameter to plate the first substrate, disposing the substrate holder for holding the second substrate in the plating tank, and The diameter of the first opening is adjusted to a second diameter smaller than the first diameter, and the diameters of the second opening and the third opening of the regulation plate are changed, respectively. The It has a Kkisuru step.

  According to this aspect, the diameter of the first opening of the anode mask can be adjusted for each of the first substrate and the second substrate. Thereby, when the characteristics or processing conditions of the first substrate and the second substrate are different from each other, it is possible to suppress the decrease in in-plane uniformity due to the effect of the terminal effect. Specifically, when the second substrate is plated under the condition that the influence of the terminal effect appears significantly, the electric field is concentrated in the central portion of the substrate by reducing the diameter of the first opening. The film thickness at the central portion of the substrate can be increased. Further, by changing the diameter of the second opening and the diameter of the third opening of the regulation plate, respectively, it is possible to suppress the deposition rate at the peripheral portion of the substrate, and improve the in-plane uniformity of the substrate W. Can.

It is a schematic sectional side view of the plating apparatus concerning this embodiment. It is a schematic front view of an anode mask. It is a schematic front view of an anode mask. It is a front side perspective view of a regulation plate in the state where an opening diameter is comparatively large. It is a rear side perspective view of a regulation plate in the state where an opening diameter is comparatively large. It is a front side perspective view of a regulation plate in the state where an opening diameter is comparatively small. It is an exploded perspective view of a regulation plate. It is a front side perspective view of a plate body part. It is a rear surface side perspective view of a plate body part. It is a figure which shows the front side perspective view of a ring member. The front side perspective view of a rotation member is shown. The front side perspective view of the 1st blade which constitutes a blade object is shown. It is a front side perspective view of a blade control member. It is a front side perspective view of a protection member. It is a partial front view from the front side of a regulation plate. FIG. 7 is a rear view of a regulation plate having an opening of maximum internal diameter. FIG. 7 is a rear view of a regulation plate having an opening of the smallest inner diameter. FIG. 7 is a front perspective view of a regulation plate having a plurality of first blades and a plurality of second blades according to another embodiment. FIG. 7 is a rear perspective view of a regulation plate having a plurality of first blades and a plurality of second blades according to another embodiment. It is a disassembled perspective view of the 1st plate main part of the regulation plate concerning other embodiments, and the 2nd plate main part. It is a disassembled perspective view of the 1st plate main-body part of the regulation plate which concerns on other embodiment. It is a disassembled perspective view of the 2nd plate main-body part of the regulation plate which concerns on other embodiment. It is a figure which shows the profile of the plating film of the board | substrate of a high resist aperture ratio, and the board | substrate of a low resist aperture ratio. It is a figure which shows the profile of the plating film of the board | substrate which has a thick seed layer, and the board | substrate which has a thin seed layer. It is a figure which shows the profile of the plating film of the board | substrate plated with the plating solution which has comparatively high electric resistance, and the board | substrate plated with the plating solution which has comparatively low electric resistance.

  Hereinafter, embodiments of the present invention will be described with reference to the drawings. In the drawings described below, the same or corresponding components are denoted by the same reference numerals, and duplicate descriptions will be omitted.

  FIG. 1 is a schematic side sectional view of the plating apparatus according to the present embodiment. As illustrated, the plating apparatus 10 according to the present embodiment includes an anode holder 20 configured to hold the anode 21, a substrate holder 40 configured to hold the substrate W, the anode holder 20, and the substrate And a plating tank 50 for housing the holder 40 therein.

  As shown in FIG. 1, the plating tank 50 includes a plating treatment tank 52 for containing a plating solution Q containing an additive, and a plating solution discharge tank 54 for receiving and discharging the plating solution Q overflowed from the plating treatment tank 52; It has partition wall 55 which divides plating processing tank 52 and plating solution discharge tank 54.

The anode holder 20 holding the anode 21 and the substrate holder 40 holding the substrate W are immersed in the plating solution Q in the plating tank 52 so that the anode 21 and the surface W1 to be plated of the substrate W are substantially parallel to each other. Provided. A voltage is applied by the plating power supply 59 in a state in which the anode 21 and the substrate W are immersed in the plating solution Q of the plating treatment tank 52. Thereby, metal ions are reduced at the surface W1 to be plated of the substrate W, and a film is formed on the surface W1 to be plated.

  The plating treatment tank 52 has a plating solution supply port 56 for supplying the plating solution Q to the inside of the tank. The plating solution discharge tank 54 has a plating solution discharge port 57 for discharging the plating solution Q overflowed from the plating treatment tank 52. The plating solution supply port 56 is disposed at the bottom of the plating treatment tank 52, and the plating solution discharge port 57 is disposed at the bottom of the plating solution discharge tank 54.

  When the plating solution Q is supplied from the plating solution supply port 56 to the plating treatment tank 52, the plating solution Q overflows from the plating treatment tank 52, flows over the partition wall 55 and flows into the plating solution discharge tank 54. The plating solution Q that has flowed into the plating solution discharge tank 54 is discharged from the plating solution discharge port 57, and impurities are removed by a filter or the like that the plating solution circulation device 58 has. The plating solution Q from which the impurities have been removed is supplied to the plating treatment tank 52 via the plating solution supply port 56 by the plating solution circulation device 58.

  The anode holder 20 has an anode mask 25 for adjusting the electric field between the anode 21 and the substrate W. The anode mask 25 is a substantially plate-like member made of, for example, a dielectric material, and is provided on the front surface of the anode holder 20. Here, the front surface of the anode holder 20 refers to the surface facing the substrate holder 40. That is, the anode mask 25 is disposed between the anode 21 and the substrate holder 40. The anode mask 25 has an opening 25a (corresponding to an example of a second opening) through which the current flowing between the anode 21 and the substrate W passes in a substantially central portion. The diameter of the opening 25 a is preferably smaller than the diameter of the anode 21. As described later, the anode mask 25 is configured to be able to adjust the diameter of the opening 25a.

  The anode mask 25 has an anode mask attachment portion 25 b on its outer periphery for attaching the anode mask 25 integrally to the anode holder 20. The position of the anode mask 25 may be between the anode holder 20 and the substrate holder 40, but is preferably closer to the anode holder 20 than the intermediate position between the anode holder 20 and the substrate holder 40. Also, for example, the anode mask 25 may be disposed on the front surface of the anode holder 20 without being attached to the anode holder 20. However, when the anode mask 25 is attached to the anode holder 20 as in the present embodiment, the relative position of the anode mask 25 to the anode holder 20 is fixed, so the position of the anode 21 deviates from the position of the opening 25a. Can be prevented.

  The anode 21 held by the anode holder 20 is preferably an insoluble anode. When the anode 21 is an insoluble anode, the anode 21 does not dissolve even if the plating process proceeds, and the shape of the anode 21 does not change. Therefore, since the positional relationship (distance) between the anode mask 25 and the surface of the anode 21 does not change, the positional relationship between the anode mask 25 and the surface of the anode 21 changes, so that the electric field between the anode 21 and the substrate W Can be prevented from changing.

  The plating apparatus 10 further includes a regulation plate 60 for adjusting the current between the anode 21 and the substrate W. The regulation plate 60 is a substantially plate-shaped member made of, for example, a dielectric material, and is disposed between the anode mask 25 and the substrate holder 40 (substrate W). The regulation plate 60 has an opening 60a (corresponding to an example of a first opening) through which the current flowing between the anode 21 and the substrate W passes. The diameter of the opening 60 a is preferably smaller than the diameter of the substrate W. As described later, the regulation plate 60 is configured to be able to adjust the diameter of the opening 60a.

  The regulation plate 60 is preferably closer to the substrate holder 40 than the intermediate position between the anode holder 20 and the substrate holder 40. As the regulation plate 60 is disposed closer to the substrate holder 40, the film thickness of the peripheral portion of the substrate W can be more accurately controlled by adjusting the diameter of the opening 60a of the regulation plate 60.

  Between the regulation plate 60 and the substrate holder 40, a paddle 18 for stirring the plating solution Q in the vicinity of the surface W1 to be plated of the substrate W is provided. The paddle 18 is a substantially rod-like member, and is provided in the plating tank 52 so as to face the vertical direction. One end of the paddle 18 is fixed to the paddle drive device 19. The paddle 18 is horizontally moved along the surface W1 to be plated of the substrate W by the paddle driving device 19, whereby the plating solution Q is agitated.

  Next, the anode mask 25 shown in FIG. 1 will be described in detail. 2 and 3 are schematic front views of the anode mask 25. FIG. FIG. 2 shows the anode mask 25 when the diameter of the opening 25a is relatively large. FIG. 3 shows the anode mask 25 when the diameter of the opening 25a is relatively small. Here, as the opening 25a of the anode mask 25 is smaller, the current flowing from the anode 21 to the substrate W is concentrated at the central portion of the surface W1 to be plated of the substrate W. Therefore, when the opening 25a is made smaller, the film thickness at the central portion of the to-be-plated surface W1 of the substrate W tends to increase.

  As shown in FIG. 2, the anode mask 25 has a substantially annular edge 26. The diameter of the opening 25a of the anode mask 25 shown in FIG. 2 is the largest. The diameter of the opening 25 a in this case coincides with the inner diameter of the edge 26.

  As shown in FIG. 3, the anode mask 25 has a plurality of diaphragm blades 27 (corresponding to an example of an adjusting mechanism) configured to be able to adjust the opening 25 a. The diaphragm blades 27 cooperate to define the opening 25a. Each of the diaphragm blades 27 enlarges or reduces the diameter of the opening 25a (adjusts the diameter of the opening 25a) by the same structure as the diaphragm mechanism of the camera. The aperture 25 a of the anode mask 25 shown in FIG. 3 is formed into a non-circular (for example, polygonal) shape by the diaphragm blade 27. The diameter of the opening 25a in this case refers to the shortest distance of the opposing sides of the polygon or the diameter of the inscribed circle. Alternatively, the diameter of the opening 25a can be defined by the diameter of a circle having an area equivalent to the opening area. The distance between the anode 21 and the surface of the diaphragm blade 27 facing the anode 21 is, for example, 0 mm or more and 8 mm or less.

  Each of the diaphragm blades 27 manually enlarges or reduces the diameter of the opening 25a, for example. Further, each of the diaphragm blades 27 may be configured to be driven using air pressure or an electrical driving force. The adjustment mechanism using the diaphragm blade 27 is characterized in that the opening 25a can be varied relatively widely. When the substrate is circular, it is desirable that the opening 25a of the anode mask 25 be circular. However, maintaining a perfect circle in the entire range from the minimum diameter to the maximum diameter of the opening 25a in the opening 25a whose diameter is relatively widely variable is accompanied by mechanical difficulty. Generally, when the opening through which the current flowing between the anode 21 and the substrate W passes is not completely circular, the azimuthal angle distribution of the electric field becomes uneven, and the plating thickness distribution formed on the peripheral portion of the substrate W The shape of the opening may be transferred to the However, since the anode mask 25 is integrally attached to the anode holder 20, the distance between the anode mask 25 and the substrate can be sufficiently long, and even if the opening is not perfect circular, the influence on the plating film thickness distribution is maximized. Can be reduced to

Next, the regulation plate 60 shown in FIG. 1 will be described in detail. FIG. 4 shows a front perspective view of the regulation plate 60 in a state in which the diameter of the opening 60a is relatively large, and FIG. 5 shows a rear perspective view of the regulation plate 60 in a state in which the diameter of the opening 60a is relatively large. 6 shows a front perspective view of the regulation plate 60 in a state where the diameter of the opening 60a is relatively small.

  As shown in FIGS. 4 to 6, the regulation plate 60 has a substantially plate-like plate body 61. The plate main body portion 61 has a pair of suspending portions 62 for suspending and suspending the regulation plate 60 at the edge of the plating tank 52 shown in FIG. Further, the plate main body 61 has an opening 60a at a substantially central portion thereof. The opening 60 a is formed by an opening adjustment portion 63 provided in the plate main body 61.

  As shown in FIG. 5, on the back side of the regulation plate 60, a rotating member 100 that constitutes a part of the opening adjustment portion 63 is attached. Further, as shown in FIG. 6, the regulation plate 60 has a blade 70 configured to reduce the diameter of the opening 60a. Details of the rotating member 100 and the blade 70 will be described later.

  FIG. 7 is an exploded perspective view of the regulation plate 60. As shown in FIG. As shown in FIG. 7, the regulation plate 60 includes a plate body 61, a blade 70, a ring member 80, a blade pressing member 90, a rotating member 100, and a protecting member 110. The opening adjustment portion 63 is configured by the blade body 70, the ring member 80, the blade pressing member 90, the rotating member 100, and the protection member 110. The regulation plate 60 also has an edge 64 that forms an opening 60 a with the plate body 61.

  The blade body 70 has a plurality of first blades 71 for reducing the diameter of the opening 60 a and is located on the front side of the edge 64 of the regulation plate 60. In the present embodiment, the front side of the regulation plate 60 refers to a surface facing the substrate holder 40 shown in FIG. However, in another embodiment, the regulation plate 60 may be disposed in the plating bath 52 of FIG. 1 such that the front side of the regulation plate 60 faces the anode holder 20 shown in FIG.

  The ring member 80 is configured to translate the plurality of first blades 71 in the radial direction of the opening 60a. The ring member 80 is disposed along the edge 64 of the regulation plate 60. In the present embodiment, the ring member 80 is disposed along the inner circumferential surface of the edge 64 of the regulation plate 60. However, the present invention is not limited to this, and the ring member 80 may be disposed on the front side of the edge 64 of the regulation plate 60, for example.

  The blade pressing member 90 is disposed on the front side of the blade 70 (the side opposite to the ring member 80). The rotating member 100 is disposed on the rear surface side of the plate main body 61, and is coupled to the ring member 80 as described later. Hereinafter, each member constituting the regulation plate 60 will be described in detail.

  FIG. 8 shows a front side perspective view of the plate body 61, and FIG. 9 shows a rear side perspective view of the plate body 61. As shown in FIG. As shown in FIG. 8, the plate main body 61 is a substantially plate-like member, and has an opening 60 a at a substantially central portion thereof. On the front side of the plate body 61, an edge 64 having an opening substantially the same as the opening 60a is fixed. The edge 64 forms an opening 60 a together with the plate body 61. As shown in FIG. 9, the plate body 61 has, on the rear surface side, a plurality of pin holes 65 for inserting a support pin that slidably supports the rotating member 100. Further, the edge portion 64 has a plurality of screw holes 66 on its front side for screwing screws for fixing the blade pressing member 90 and the protection member 110.

FIG. 10 is a front perspective view of the ring member 80. As shown in FIG. As described above, the ring member 80 is disposed along the inner peripheral surface of the opening 60 a of the plate main body 61 shown in FIGS. 8 and 9. Therefore, the outer diameter of the ring member 80 is configured to be approximately the same as the inner diameter of the edge 64 that constitutes the opening 60 a of the plate body 61. Therefore, the inner diameter of the ring member 80 is the maximum inner diameter of the opening 60a. As illustrated, the ring member 80 (corresponding to an example of the first moving mechanism) has a plurality of slide slots 81 on its front side. In the present embodiment, eight slide slots 81 corresponding to the number of first blades 71 constituting the blade 70 are provided in the ring member 80. The slide slot 81 may or may not penetrate toward the rear side of the ring member 80. The slide elongated hole 81 is configured to be inclined with respect to the radial direction of the opening 60 a. In other words, the slide elongated hole 81 is disposed so as to be inclined such that the longitudinal direction of the elongated hole does not face the center of the opening 60a. Each of the slide elongated holes 81 is provided in the ring member 80 so as to be rotationally symmetrical with respect to the central axis of the opening 60a. In the present embodiment, eight slide slots 81 are provided, so each of the slide slots 81 is eight-fold rotational symmetric.

  FIG. 11 shows a front side perspective view of the rotation member 100. FIG. The rotating member 100 has a ring portion 101 and a plate-like lever portion 102 attached to the ring portion 101. The ring portion 101 is fixed to the rear surface side of the ring member 80 shown in FIG. The inner diameter of the ring portion 101 is configured to substantially coincide with the inner diameter of the ring member 80. The lever portion 102 is coupled to the outer peripheral portion of the ring portion 101, and swinging the lever portion 102 in the circumferential direction of the ring portion 101 causes the ring portion 101 to rotate in the circumferential direction within a swing angle range.

  Four convex portions 104 are provided on the outer periphery of the ring portion 101, and support elongated holes 103 along the circumferential direction of the ring portion 101 are formed in each of the convex portions 104. As described later, the support elongated holes 103 are slidably supported by support pins fixed to the pin holes 65 of the plate main body 61 shown in FIG.

  FIG. 12 shows a front perspective view of the first blade 71 constituting the blade body 70. As shown in FIG. As illustrated, the first blade 71 is a fan-shaped member whose inner peripheral edge is formed in an arc shape. The first blades 71 overlap each other with the other first blades 71 as shown in FIG. 7 to form a generally circular inner peripheral edge of the blade body 70 as a whole. In the present embodiment, the blade body 70 is configured of eight first blades 71, but the blade body 70 can be configured of any number of first blades 71.

  A slide pin 72 configured to slide in the slide long hole 81 of the ring member 80 shown in FIG. 10 is provided on the rear surface side of the first blade 71. In the present embodiment, one slide pin 72 is provided on the first blade 71, but the present invention is not limited to this. Two or more slide pins 72 may be provided on the first blade 71. In this case, it is necessary to match the number of slide elongated holes 81 of the ring member 80 shown in FIG. 10 with the number of slide pins 72.

  Further, on the front surface side of the first blade 71, a guide pin 73 configured to slide in a guide long hole 91 of a blade pressing member 90 shown in FIG. 13 described later is provided. In the present embodiment, the two guide pins 73 are provided on the first blade 71, but the invention is not limited thereto. One or more guide pins 73 may be provided on the first blade 71.

FIG. 13 is a front perspective view of the blade pressing member 90. FIG. The blade pressing member 90 is a substantially plate-like member, and an opening 60 a is formed in a substantially central portion thereof. The diameter of the opening 60a of the blade pressing member 90 has substantially the same diameter as the inner diameter of the ring member 80 shown in FIG. The blade pressing member 90 has a plurality of guide elongated holes 91. In the present embodiment, sixteen guide elongated holes 91 are provided in the blade pressing member 90, and two guide elongated holes 91 correspond to the two guide pins 73 of the first blade 71 shown in FIG. The number of the guide elongated holes 91 can be appropriately changed according to the number of the guide pins 73. The guide elongated hole 91 is formed in parallel with the translational movement direction of the first blade 71. The blade pressing member 90 also has a plurality of screw holes 92. By aligning the position of the screw hole 66 formed in the edge 64 of the plate main body 61 with the position of the screw hole 92 shown in FIG. It can be fixed.

  The blade pressing member 90 is disposed such that the rear surface side is in contact with the front surface side of the blade body 70. Therefore, when the first blade 71 of the blade 70 translates in the radial direction of the opening 60 a, the first blade 71 translates while in contact with the blade pressing member 90. In order to reduce wear of the blade pressing member 90 and the first blade 71, the blade pressing member 90 is preferably made of, for example, a low friction resin such as PTFE.

  FIG. 14 is a front perspective view of the protection member 110. FIG. The protective member 110 is a substantially plate-like member, and an opening 60 a is formed in a substantially central portion thereof. The diameter of the opening 60a of the protective member 110 is substantially the same as the inner diameter of the ring member 80 shown in FIG. The protective member 110 is disposed on the front side of the blade pressing member 90. The protective member 110 has a plurality of screw holes 111. The protective member 110 may be fixed to the plate main body 61 by screwing the screw holes 66 shown in FIG. 8 and the positions of the screw holes 92 shown in FIG. it can. The protective member 110 is made of, for example, vinyl chloride and protects the front side of the blade pressing member 90.

  Next, the mechanism for translating the first blade 71 shown in FIG. 12 will be described in detail. FIG. 15 is a partial front view of the regulation plate 60 from the front side. In FIG. 15, the rotating member 100, the plurality of first blades 71, the blade pressing member 90, and the slide elongated holes 81 of the ring member 80 are shown to be transmitted, and the other members are illustrated in a simplified manner. Because it is omitted.

  As shown in FIG. 15, the plurality of first blades 71 are arranged to have an overlapping portion 75 that partially overlaps the other first blades 71. The inner peripheral edges of the plurality of first blades 71 are formed in a substantially circular shape. In the illustrated state, the slide pins 72 of the plurality of first blades 71 are located substantially in the middle of the slide elongated hole 81, and the guide pins 73 are located substantially in the middle of the guide elongated hole 91. In the illustrated state, the inner diameter of the inner peripheral edge of the plurality of first blades 71 is smaller than the inner diameter of the opening 60 a of the regulation plate 60. Therefore, the plurality of first blades 71 reduce the inner diameter of the opening 60 a of the regulation plate 60.

  When the lever portion 102 of the rotating member 100 moves in the direction of the arrow A1 or A2, that is, in the circumferential direction of the ring portion 101, the ring member 80 (not shown) coupled to the ring portion 101 also rotates in the circumferential direction. For example, when the lever portion 102 moves in the direction of arrow A1 (clockwise in the figure), the ring member 80 rotates clockwise. Thereby, the slide pin 72 of the first blade 71 slides in the slide long hole 81, and the minimum diameter portion 81 a of the slide long hole 81 moves toward the slide pin 72. At this time, as the minimum diameter portion 81a of the slide elongated hole 81 moves toward the slide pin 72, the first blade 71 moves radially inward of the opening 60a. The guide pin 73 of the first blade 71 slides in the inside of the guide long hole 91, so that circumferential movement and rotational movement of the first blade 71 are prevented. Therefore, the first blade 71 can reliably translate in the radial direction.

Further, for example, when the lever portion 102 moves in the direction of the arrow A2 (counterclockwise in the figure), the ring member 80 rotates counterclockwise. Thereby, the slide pin 72 of the first blade 71 slides in the slide long hole 81, and the maximum diameter portion 81 b of the slide long hole 81 moves toward the slide pin 72. At this time, as the largest diameter portion 81b of the slide elongated hole 81 moves toward the slide pin 72, the first blade 71 translates radially outward of the opening 60a.

  The plurality of first blades 71 similarly translate in the radial direction. Therefore, the plurality of first blades can move in the radial direction while maintaining the angular relationship between the first blade 71 and the other first blades 71. Thus, compared to the case where the aperture blades are rotated about a predetermined axis to reduce the diameter of the aperture, as in the case of the aperture mechanism of a camera, the circular shape of the inner peripheral edge formed by the first blade 71 You can keep it.

  FIG. 16 is a rear view of the regulation plate 60 having the opening 60a of the largest inner diameter, and FIG. 17 is a rear view of the regulation plate 60 having the opening 60a of the smallest inner diameter. As shown in FIG. 16, when the regulation plate 60 has the opening 60a with the largest inner diameter, the lever portion 102 of the rotating member 100 is relatively positioned to the right, and the movable portion is movable by the stopper 67 provided on the plate body 61. Range is limited. In the state shown in FIG. 16, the first blade 71 (not shown) is located at the outermost position in the radial direction of the opening 60 a, and the inner peripheral edge of the first blade 71 substantially matches the inner peripheral edge of the ring portion 101 of the rotating member 100. Do.

  The plate main body 61 is provided with four support pins 105. The support pin 105 slidably engages with the support elongated hole 103 provided in the convex portion 104 of the ring portion 101. Thereby, when the lever portion 102 is operated, the ring portion 101 is guided to rotate in the circumferential direction along the support elongated hole 103.

  As shown in FIG. 17, when the regulation plate 60 has the opening 60 a with the smallest inner diameter, the lever portion 102 of the rotating member 100 is relatively positioned to the left, and is movable by the stopper 67 provided on the plate main body 61. Range is limited. In the state shown in FIG. 17, the plurality of first blades 71 are positioned at the innermost position in the radial direction of the opening 60 a, and the first blade 71 reduces the opening 60 a of the regulation plate 60.

  The lever portion 102 may be automatically operated by, for example, a mechanical actuator, or may be manually operated by an operator. Also, the lever portion 102 can be fixed at an arbitrary position between the pair of stoppers 67.

  As described above, according to the regulation plate 60 according to the present embodiment, the diameter of the opening 60a can be adjusted by reducing the diameter of the opening 60a with the plurality of first blades 71. Thereby, when the characteristics or processing conditions of the first substrate and the second substrate are different from each other, it is possible to suppress the decrease in in-plane uniformity due to the effect of the terminal effect. Specifically, when the substrate is plated under the condition that the influence of the terminal effect appears significantly, the film forming speed at the peripheral portion of the substrate is suppressed by reducing the diameter of the opening a of the regulation plate 60. And the in-plane uniformity of the substrate can be improved. In addition, since the first blade 71 is configured to translate, the plurality of first blades 71 can move in the radial direction while maintaining the angular relationship with the other first blades 71. Therefore, compared with the case where a plurality of diaphragm blades are rotated about a predetermined axis to reduce the diameter of the aperture as in the diaphragm mechanism of a camera, the shape of the inner peripheral edge formed by the first blade 71 is maintained. be able to.

  In the present embodiment, the first blade 71 has the slide pin 72, and the ring member 80 has the slide long hole 81. However, the present invention is not limited to this. The ring member 80 may have the slide pin 72, and the first blade 71 may have the corresponding slide elongated hole 81. As described above, even when the first blade 71 and the ring member 80 are configured, the slide pin 72 slides in the slide long hole 81 by the ring member 80 rotating in the circumferential direction, and the first blade 71 Can move in the radial direction.

  In the present embodiment, the first blade 71 has a guide pin 73, and the blade pressing member 90 has a guide long hole 91. However, the present invention is not limited to this, and the blade pressing member 90 may have the guide pin 73, and the first blade 71 may have the corresponding guide elongated hole 91. Thus, even when the first blade 71 and the blade pressing member 90 are configured, when the first blade 71 is moved by the ring member 80, the guide pin 73 slides in the guide long hole 91, and the first Movement and rotational movement of the blade 71 in the circumferential direction can be prevented.

  In the present embodiment, the convex portion 104 having the support elongated hole 103 is formed in the ring portion 101 of the rotation member 100, and the support pin 105 is fixed to the plate main body portion 61. However, the present invention is not limited to this, and the ring portion 101 of the rotating member 100 may have the support pins 105, and the plate body portion 61 may have the corresponding support elongated holes 103. Even when the rotating member 100 and the plate main body 61 are configured as described above, when the ring 101 is swung by the lever 102, the support pin 105 slides in the support elongated hole 103, and the ring The 101 can be rotated in its circumferential direction.

  Furthermore, in the present embodiment, the regulation plate 60 has only the blade body 70 (the plurality of first blades 71) as a means for reducing the diameter of the opening 60a. However, the regulation plate 60 may have a plurality of second blades other than the plurality of first blades 71 and a mechanism for translating the plurality of second blades. In this case, the plurality of second blades are disposed at positions deviated from the plurality of first blades 71 in the direction orthogonal to the radial direction of the opening 60a. The mechanism for translating the plurality of second blades is the same as the mechanism described above for translating the plurality of first blades 71, whereby the plurality of second blades translate in the radial direction of the opening 60a. Hereinafter, specific examples will be described with reference to the drawings.

  FIG. 18 is a front perspective view of a regulation plate having a plurality of first blades and a plurality of second blades according to another embodiment, and FIG. 19 is a rear perspective view of the regulation plate. Components corresponding to the parts shown in FIGS. 4 to 17 in the drawings described below are given the same reference numerals as those used in FIGS. 4 to 17 with “A” or “B” added thereto, and duplicate explanations are given. Omit.

  As shown in FIGS. 18 and 19, the regulation plate 60 of the present embodiment has a first plate main portion 61 </ b> A and a second plate main portion 61 </ b> B. The first plate main portion 61A has a first opening adjustment portion 63A, and the second plate main portion 61B has a second opening adjustment portion 63B. The first plate main portion 61A and the second plate main portion 61B are connected to each other by an optional fixing means 120 such as a screw or a bolt. In the illustrated regulation plate 60, the first plate main portion 61A and the second plate main portion 62B are in close contact with each other with no gap therebetween, and are connected to each other by the fixing means 120. However, the present invention is not limited to this, and the first plate main portion 61A and the second plate main portion 62B may be connected to each other with a gap. In addition, the fixing means 120 may have an adjusting mechanism for adjusting the size of the gap between the first plate main portion 61A and the second plate main portion 62B. Thereby, the mutual distance between a plurality of first blades 71A (see FIG. 21) and a plurality of second blades 71B (see FIG. 22) described later can be arbitrarily adjusted.

The first plate main portion 61A has an opening 69A for exposing the handle portion 105A of the rotating member 100A to the outside. Further, the second plate main portion 61B has an opening 69B for exposing the handle portion 105B of the rotating member 100B to the outside. The handle 105A exposed from the opening 69A and the handle 105B exposed from the opening 69B can be independently operated using an arbitrary actuator or manually. Thereby, the plurality of first blades 71A and the plurality of second blades 71B shown in FIG. 21 can be independently translated in the radial direction.

  FIG. 20 is an exploded perspective view of the first plate main portion 61A and the second plate main portion 62B. As illustrated, the first plate main body portion 61A and the second plate main body portion 62B are connected to each other such that the surface on which the rotation member 100A is provided and the surface on which the rotation member 100B is provided face each other. The first plate main portion 61A has a cavity 68A that can accommodate the rotation member 100A and the rotation member 100B. When the first plate body 61A and the second plate body 61B are connected, the cavity 68A is configured to receive the rotating member 100A and the rotating member 100B.

  The first plate main portion 61A has a first opening 169A at a substantially central portion thereof through which current passes. Further, the second plate main portion 61B has a second opening 169B at a substantially central portion thereof through which current passes. The first plate body 61A and the second plate body 61B are connected to each other such that the center of the first opening 169A and the center of the second opening 169B are concentric. In other words, the first plate main portion 61A and the second plate main portion 61B are mutually connected so that the straight line connecting the center of the first opening 169A and the center of the second opening 169B is orthogonal to the radial direction of each opening. Be done.

  FIG. 21 is an exploded perspective view of the first plate main portion 61A. As illustrated, the first plate main portion 61A includes a blade 70A, a ring member 80A, a blade pressing member 90A, a rotating member 100A, and a protecting member 110A. In the present embodiment, the plurality of first blades 71A constituting the blade body 70 have two slide pins 72A. The ring member 80A has a pair of slide slots 81A corresponding to the two slide pins 72A.

  FIG. 22 is an exploded perspective view of the second plate main portion 61B. As illustrated, the second plate main portion 61B includes a blade body 70B, a ring member 80B, a blade pressing member 90B, a rotation member 100B, and a protection member 110B. In the present embodiment, the plurality of second blades 71B constituting the blade body 70 have two slide pins 72B. The ring member 80B has a pair of slide slots 81B corresponding to the two slide pins 72B.

  The first plate main portion 61A and the second plate main portion 61B are formed by the centers of the openings formed by the plurality of first blades 71A shown in FIG. 21 and the openings formed by the plurality of second blades 71B shown in FIG. Are connected to one another such that the centers of are concentric. In other words, a straight line connecting the center of the opening formed by the plurality of first blades 71A and the center of the opening formed by the plurality of second blades 71B is perpendicular to the radial direction of each opening. The plate body 61A and the second plate body 61B are connected to each other.

  Thus, according to the regulation plate 60 having the plurality of first blades 71A and the plurality of second blades 71B, the diameter of the opening 60a is set for both the plurality of first blades 71A and the plurality of second blades 71B. I can squeeze. In this case, the film forming speed at the peripheral portion of the substrate can be further suppressed by the plurality of first blades 71A and the plurality of second blades 71B. Therefore, it is possible to improve the in-plane uniformity of the substrate having a tendency to increase the film thickness of the substrate peripheral portion.

When a plurality of conventional regulation plates are installed in the plating tank, it is necessary to position the center of the opening for each of the plurality of regulation plates, which is troublesome. On the other hand, when the plurality of first blades 71A and the plurality of second blades 71B are provided in the common regulation plate 60, the opening formed by the first blade 71A and the opening formed by the second blade 71B The center is relatively fixed. Therefore, when positioning the regulation plate 60 in the plating bath, it is necessary to separately position the opening center formed by the plurality of first blades 71A and the opening center formed by the plurality of second blades 71B. Absent. Therefore, even if high accuracy is required at the position of the opening center of the regulation plate 60, the regulation plate 60 can be easily positioned.

  Further, since the blade body 70A of the regulation plate 60 is composed of the plurality of first blades 71A, the shape of the opening is not strictly a perfect circle. Therefore, it is difficult to completely remove the variation in the electric field applied to the substrate W due to the shape of the opening. However, by having the plurality of second blades 71B, the variation in the electric field due to the aperture shape of the plurality of first blades 71A and the variation in the electric field due to the aperture shape of the plurality of second blades 71B cancel each other out. The variation of the electric field can be alleviated, and the plating film formed on the substrate W can be made closer to a true circle.

  Further, as shown in FIG. 15, the plurality of first blades 71 has an overlapping portion 75 with the adjacent first blade 71 and a portion not overlapping with the adjacent first blade 71, as shown in FIG. 15. Since the thickness of the overlapping portion 75 is larger than that of the non-overlapping portion, the effect of suppressing the electric field is different in the portion not overlapping the overlapping portion 75. Therefore, variations in the electric field may occur in the circumferential direction of the opening. On the other hand, when the regulation plate 60 includes the plurality of second blades 71B in addition to the plurality of first blades 71A, the circumferential position of the overlapping portion of the plurality of second blades 71B is the overlap of the plurality of first blades 71A By displacing from the circumferential position of the part, it is possible to alleviate the variation of the electric field due to the overlapping part of both blades. Preferably, the variation in electric field can be further alleviated by arranging the circumferential positions of the overlapping portions of the plurality of second blades 71B and the circumferential positions of the overlapping portions of the plurality of first blades 71A in a staggered arrangement.

  Further, according to the regulation plate having the plurality of first blades 71A and the plurality of second blades 71B, the diameter of the opening 60A defined by the plurality of first blades 71A and the opening 60B defined by the plurality of second blades 71B. And the diameter of the Thus, for example, the diameter of the opening defined by the blade close to the substrate is reduced, and the diameter of the opening defined by the blade far from the substrate is increased, etc. It can be made smaller.

  Next, a process of plating the substrate W with the plating apparatus 10 shown in FIG. 1 will be described. As described above, the influence of the terminal effect differs depending on the characteristics of the substrate W, the conditions for processing the substrate W, and the like. Therefore, in the case of plating a plurality of substrates W different in the influence of the terminal effect in the single plating apparatus 10, in order to suppress the decrease in the in-plane uniformity of the film thickness due to the terminal effect, It is necessary to adjust the electric field applied to the substrate W in accordance with the characteristics, the conditions for processing the substrate W, and the like.

  In the plating apparatus 10 according to the present embodiment, the in-plane uniformity of the plating film of the substrate W is adjusted by adjusting at least the diameter of the opening 25 a of the anode mask 25 in accordance with the characteristics of the substrate W or the conditions for processing the substrate W. Can be suppressed.

Specifically, when the resist opening ratio of the second substrate is lower than the resist opening ratio of the first substrate, as described above, even if the plating film is formed on the second substrate, the resist opening is formed. The change in electrical resistance from the central portion of the substrate to the electrical contact is smaller than that of the first substrate, which has a relatively high rate. Therefore, even if the plating film is formed to a certain extent on the second substrate, the influence of the terminal effect on the second substrate remains large. Therefore, when the first substrate and the second substrate are plated under the same conditions other than the resist aperture ratio of the substrate, the film thickness of the second substrate is larger than that of the first substrate, and the substrate The film thickness at the central portion becomes relatively thin. Therefore, when the second substrate is plated by the plating apparatus 10, the diameter of the opening 25a of the anode mask 25 is smaller than the diameter of the opening 25a when the first substrate is plated. Thus, the film thickness of the central portion of the second substrate can be increased. Therefore, in both the first substrate and the second substrate, it is possible to suppress the decrease in in-plane uniformity due to the effect of the terminal effect.

  In addition, when the seed layer of the second substrate is thinner than the seed layer of the first substrate, as described above, the terminal effect on the second substrate becomes remarkable. For this reason, when the first substrate and the second substrate are plated under the same conditions other than the thickness of the seed layer, the film thickness of the substrate peripheral portion of the second substrate becomes thicker than that of the first substrate, The film thickness at the center of the substrate becomes relatively thin. Therefore, when the second substrate is plated by the plating apparatus 10, the diameter of the opening 25a of the anode mask 25 is smaller than the diameter of the opening 25a when the first substrate is plated. Thus, the film thickness of the central portion of the second substrate can be increased. Therefore, in both the first substrate and the second substrate, it is possible to suppress the decrease in in-plane uniformity due to the effect of the terminal effect.

  Furthermore, when the second substrate is plated using a plating solution having a lower electrical resistance than the plating solution used for the first substrate, as described above, the terminal effect on the second substrate is remarkable. Become. For this reason, when the first substrate and the second substrate are plated under the same conditions other than the electric resistance value of the plating solution, the film thickness of the second substrate is larger than that of the first substrate. The film thickness at the central portion of the substrate becomes relatively thin. Therefore, when the second substrate is plated by the plating apparatus 10, the diameter of the opening 25a of the anode mask 25 is smaller than the diameter of the opening 25a when the first substrate is plated. Thus, the film thickness of the central portion of the second substrate can be increased. Therefore, in both the first substrate and the second substrate, it is possible to suppress the decrease in in-plane uniformity due to the effect of the terminal effect.

  Furthermore, in the plating apparatus 10 according to the present embodiment, in addition to adjusting the diameter of the opening 25 a of the anode mask 25, the diameter of the opening 60 a of the regulation plate 60 is adjusted to adjust the in-plane of the plating film of the substrate W Uniformity can be improved.

  The regulation plate 60 is provided at a position closer to the substrate W than the anode mask 25. Therefore, the plating current that has passed through the opening 60 a of the regulation plate 60 is less likely to diffuse to the peripheral portion of the substrate W. Therefore, the film thickness of the peripheral portion of the substrate W can be reduced by reducing the diameter of the opening 60a of the regulation plate 60, and the film thickness of the peripheral portion of the substrate W can be increased by increasing the diameter of the opening 60a.

  The diameter of the opening 60 a of the regulation plate 60 is preferably adjusted appropriately in accordance with the film thickness distribution of the substrate W which is changed by adjusting the diameter of the opening 25 a of the anode mask 25. Therefore, when plating the second substrate with different characteristics of the first substrate or the conditions for processing the first substrate, the diameter of the opening 25a of the anode mask 25 is smaller than the diameter when the first substrate is processed. Alternatively, the diameter is adjusted to be large, and the diameter of the opening 60a of the regulation plate 60 is appropriately changed. When the regulation plate 60 has a plurality of first blades 71A and a plurality of second blades 71B as shown in FIGS. 18 to 22, the openings 69A and 69B formed by the respective blades are respectively independently selected as appropriate. It can be changed. Therefore, in plating on a plurality of substrates having different characteristics and processing conditions, it is possible to provide an apparatus configuration that can more accurately control the decrease in in-plane uniformity due to the effect of the terminal effect.

  Next, the change of the profile of the plating film of the substrate W by changing the diameter of the opening 25 a of the anode mask 25 and the diameter of the opening 60 a of the regulation plate 60 will be specifically described. Hereinafter, an example using the regulation plate 60 shown in FIGS. 4 to 17 will be shown.

  FIG. 23 is a view showing a profile of the plated film of the substrate W with a high resist aperture ratio (80%) and the substrate W with a low resist aperture ratio (10%). In the figure, "AM" is the diameter of the opening 25a of the anode mask 25, "RP" is the diameter of the opening 60a of the regulation plate 60, "HDP" is the substrate W with a high resist opening ratio, "LDP" is a low resist opening ratio The substrate W is shown. The substrate W with a high resist aperture ratio and the substrate W with a low resist aperture ratio both have a seed layer thickness of 50 nm to 100 nm, and the profile of FIG. 23 is plated using a relatively low resistance plating solution. Is the profile of

  As shown in the figure, when the substrate 25 with a high resist aperture ratio is plated with the diameter of the opening 25a of 230 mm and the diameter of the opening 60a of 276 mm (hereinafter referred to as condition A), the film thickness at the central portion of the substrate is large. The film thickness of the peripheral portion becomes thinner. On the other hand, when the substrate 25 with a high resist aperture ratio is plated with the diameter of the opening 25a being 270 mm and the diameter of the opening 60a being 276 mm (hereinafter referred to as condition C), the condition C is that the diameter of the opening 25a is condition A The film thickness of the central portion of the substrate becomes thinner because When the substrate W with a high resist opening ratio is plated with the diameter of the opening 25a being 270 mm and the diameter of the opening 60a being 280 mm (hereinafter referred to as condition B), the condition B is that the diameter of the opening 60a is smaller than the condition C. Because the size is large, the film thickness of the substrate peripheral portion becomes thick.

  When plating the substrate W with a low resist opening ratio to a diameter of the opening 25a of 270 mm and a diameter of the opening 60a of 276 mm (hereinafter referred to as condition E), the film thickness at the central portion of the substrate is thin and the film thickness at the substrate peripheral portion Becomes thicker. This means that the film thickness at the peripheral portion of the substrate is increased due to the effect of the terminal effect. On the other hand, when the diameter of the opening 25a is 220 mm and the diameter of the opening 60a is 276 mm (hereinafter referred to as condition F), the diameter W of the opening 25a is the condition E. The film thickness of the central portion of the substrate is increased because In the case where the substrate 25 having a low resist aperture ratio is plated with the diameter of the opening 25a of 220 mm and the diameter of the opening 60a of 274 mm (hereinafter referred to as condition D), the diameter of the opening 60a is smaller than the condition F in the condition D. Because of the small size, the film thickness of the peripheral portion of the substrate becomes thin.

  As shown in FIG. 23, even for a substrate W with a low resist opening ratio in which the influence of the terminal effect appears relatively prominent, the diameter of the opening 25a is set to the opening 25a suitable for plating the substrate W with a high resist opening ratio. By making the diameter smaller than the diameter (270 mm, conditions B and C), it is possible to suppress the decrease in in-plane uniformity of the film thickness of the substrate W due to the terminal effect (see conditions D and F). Furthermore, by adjusting the diameter of the opening 60a of the regulation plate 60, the film thickness of the peripheral portion of the substrate W can be adjusted, and the reduction in in-plane uniformity of the film thickness of the substrate W due to the terminal effect is further suppressed. Can (see condition D).

  FIG. 24 is a view showing a profile of a plated film of a substrate W having a thick seed layer (500 nm or more) and a substrate W having a thin seed layer (50 to 100 nm). It should be noted that both the substrate W having a thick seed layer and the substrate W having a thin seed layer have a resist aperture ratio of 10%, and the profile of FIG. 24 is plated using a plating solution of relatively low resistance. It is a profile.

As illustrated, when the substrate W having a thick seed layer is plated by setting the diameter of the opening 25a to 230 mm and setting the diameter of the opening 60a to 276 mm (hereinafter referred to as condition A), the film thickness at the central portion of the substrate is large. The film thickness of the peripheral portion becomes thinner. In contrast, when the substrate W having a thick seed layer is plated with the diameter of the opening 25a being 270 mm and the diameter of the opening 60a being 276 mm (hereinafter referred to as condition C), the condition C is that the diameter of the opening 25a is condition A The film thickness of the central portion of the substrate becomes thinner because In the case where the substrate W having a thick seed layer is plated by setting the diameter of the opening 25a to 270 mm and the diameter of the opening 60a to 278 mm (hereinafter referred to as condition B), the diameter of the opening 60a is smaller than the condition C in condition B. Because the size is large, the film thickness of the substrate peripheral portion becomes thick.

  When the substrate 25 having a thin seed layer is plated with the opening 25a having a diameter of 270 mm and the opening 60a having a diameter of 276 mm (hereinafter referred to as condition E), the film thickness at the central portion of the substrate is thin and the film thickness at the substrate peripheral portion Becomes thicker. This means that the film thickness at the peripheral portion of the substrate is increased due to the effect of the terminal effect. In contrast, when the substrate W having a thin seed layer is plated with the diameter of the opening 25a being 220 mm and the diameter of the opening 60a being 276 mm (hereinafter referred to as condition F), the condition F is that the diameter of the opening 25a is the condition E The film thickness of the central portion of the substrate is increased because When the substrate W having a thin seed layer is plated with the diameter of the opening 25a of 220 mm and the diameter of the opening 60a of 274 mm (hereinafter referred to as condition D), the diameter of the opening 60a is smaller than that of the condition F. Because of the small size, the film thickness of the peripheral portion of the substrate becomes thin.

  As shown in FIG. 24, even if the substrate W has a thin seed layer in which the effect of the terminal effect appears relatively prominently, the diameter of the opening 25a is set to the opening 25a suitable for plating the substrate W having a thick seed layer. By making the diameter smaller than the diameter (270 mm, conditions B and C), it is possible to suppress the decrease in in-plane uniformity of the film thickness of the substrate W due to the terminal effect (see conditions D and F). Furthermore, by adjusting the diameter of the opening 60a of the regulation plate 60, the film thickness of the peripheral portion of the substrate W can be adjusted, and the reduction in in-plane uniformity of the film thickness of the substrate W due to the terminal effect is further suppressed. Can (see condition D).

  FIG. 25 shows a profile of a plating film of a substrate W plated with a plating solution (type-A) having a relatively high electrical resistance and a plating film of the substrate W plated with a plating solution (type-B) having a relatively low electrical resistance. FIG. The substrate W plated with a plating solution having a relatively high electrical resistance and the substrate W plated with a plating solution having a relatively low electrical resistance both have a resist aperture ratio of 10%, and the thickness of the seed layer Is 50 nm to 100 nm.

  As illustrated, when the substrate W to be plated with a plating solution having a relatively high electrical resistance is plated with the diameter of the opening 25a being 230 mm and the diameter of the opening 60a being 276 mm (hereinafter referred to as condition A), the substrate center The film thickness of the portion is thick, and the film thickness of the peripheral portion of the substrate is thin. On the other hand, when the substrate W plated with a plating solution having a relatively high electric resistance is plated with the diameter of the opening 25a being 260 mm and the diameter of the opening 60a being 276 mm (hereinafter referred to as condition C), condition C Since the diameter of the opening 25a is larger than that of the condition A, the film thickness at the central portion of the substrate becomes thinner. When the substrate W to be plated with a plating solution having a relatively high electric resistance is plated with the diameter of the opening 25a being 260 mm and the diameter of the opening 60a being 272 mm (hereinafter referred to as condition B), the condition B is the opening 60a. The film thickness of the peripheral portion of the substrate becomes thinner because the diameter of the substrate is smaller than the condition C.

When the substrate W plated with a plating solution having a relatively low electrical resistance is plated with the diameter of the opening 25a being 270 mm and the diameter of the opening 60a being 276 mm (hereinafter referred to as condition E), the film thickness of the central portion of the substrate is The thickness is thin, and the film thickness of the substrate peripheral portion is thick. This means that the film thickness at the peripheral portion of the substrate is increased due to the effect of the terminal effect. On the other hand, when the substrate W plated with a plating solution having a relatively low electric resistance is plated with the diameter of the opening 25a being 220 mm and the diameter of the opening 60a being 276 mm (hereinafter referred to as condition F), condition F Since the diameter of the opening 25a is smaller than the condition E, the film thickness at the central portion of the substrate is increased. When the substrate W to be plated with a plating solution having a relatively low electric resistance is plated with the diameter of the opening 25a being 220 mm and the diameter of the opening 60a being 274 mm (hereinafter referred to as condition D), the condition D is the opening 60a. The film thickness of the peripheral portion of the substrate becomes thinner because the diameter of the substrate is smaller than the condition F.

  As shown in FIG. 25, even if the substrate W is plated with a plating solution having a relatively low electrical resistance, the diameter of the opening 25a is the plating treatment of the substrate W plated with a plating solution having a relatively high electrical resistance. By reducing the diameter (260 mm, conditions B and C) of the appropriate opening 25a, it is possible to suppress the decrease in in-plane uniformity of the film thickness of the substrate W due to the terminal effect (see conditions D and F). Furthermore, by adjusting the diameter of the opening 60a of the regulation plate 60, the film thickness of the peripheral portion of the substrate W can be adjusted, and the reduction in in-plane uniformity of the film thickness of the substrate W due to the terminal effect is further suppressed. Can (see condition D).

  As shown in FIG. 23 to FIG. 25, in order to perform plating with good uniformity under each condition where the influence of the terminal effect is different, the variation width of the diameter of the opening 25 a of the anode mask 25 corresponds to the opening 60 a of the regulation plate 60. It is desirable to make it larger than the change width of the diameter of. In order to be able to adjust the diameter of the opening 25a of the anode mask 25 with a large change width, a mechanism using the diaphragm blade 27 as described above is preferable. Since the anode mask 25 and the substrate W are separated, the electric flux spreads between the anode mask 25 and the substrate W even if the opening 25a of the anode mask 25 is reduced, and the thickness of the plating film over a large range of the substrate W Distribution can be adjusted.

  In the peripheral portion of the substrate W, the electric flux spread outward between the anode mask 25 and the substrate W is concentrated at the peripheral portion of the substrate W even if the influence of the terminal effect is removed, so the plating film tends to be thick. Such adjustment of the plating film thickness of the relatively narrow range of the peripheral portion of the substrate W is achieved by the opening adjustment portion 63 of the regulation plate 60. Since the regulation plate 60 is close to the substrate W, the electric field at the peripheral portion of the substrate W can be shielded directly, and the plating film thickness at the peripheral portion of the substrate W can be adjusted even with a relatively small change in the opening diameter. .

  As mentioned above, although embodiment of this invention was described, embodiment of the invention mentioned above is for making an understanding of this invention easy, and does not limit this invention. The present invention can be modified and improved without departing from the gist thereof, and the present invention naturally includes the equivalents thereof. In addition, any combination or omission of each component described in the claims and the specification is possible in a range in which at least a part of the above-mentioned problems can be solved or in a range where at least a part of the effect is exhibited. is there. For example, in the above embodiment, the plurality of diaphragm blades 27 are used as a mechanism for adjusting the diameter of the opening 25a of the anode mask 25, and the plurality of first blades 71A and a plurality of first blades 71A as a mechanism for adjusting the diameter of the opening 60a of the regulation plate 60. A plurality of second blades 71B are used. However, the diameter of the opening 25a of the anode mask 25 may be adjusted using the plurality of first blades 71A and the plurality of second blades 71B, or the opening 60a of the regulation plate 60 is adjusted with the plurality of diaphragm blades 27. You may do so. Moreover, it is possible to employ | adopt not only the several aperture blade 27, several 1st braid | blade 71A, and several 2nd braid | blade 71B, but the adjustment mechanism of another form.

DESCRIPTION OF SYMBOLS 10 plating apparatus 20 anode holder 21 anode 25 anode mask 25a opening 40 substrate holder 60 regulation plate 60a opening 71, 71A first blade 71B second blade 72, 72A, 72B slide pin 73 guide pin 80, 80A, 80B ring member 81, 81A, 81B Slide long hole 90, 90A, 90B Blade holding member 91 Guide long hole W Substrate

Claims (14)

A regulation plate for regulating the current between the anode and the substrate to be plated,
A plate body having an edge forming a circular first opening through which current flows ;
A plurality of first blades for reducing the diameter of the first opening , wherein the openings formed by the plurality of first blades are circular ;
A first moving mechanism for translating the plurality of first blades in the radial direction of the first opening.   In the regulation plate according to claim 1,
  A regulation plate, wherein the shape of the openings formed by the plurality of first blades is maintained in a circular shape when the plurality of first blades translate in the radial direction of the first opening.   The regulation plate according to claim 1 or 2
  A regulation plate disposed in the plating tank at a distance from an anode holder holding the anode. The regulation plate according to any one of claims 1 to 3
The first moving mechanism includes a ring member disposed along the edge,
Any one of the ring member and the plurality of first blades has a slide elongated hole inclined with respect to the radial direction of the first opening,
A regulation plate, wherein the other of the ring member and the plurality of first blades has a slide pin that slides the slide elongated hole. In the regulation plate according to claim 4 ,
The first moving mechanism includes a blade pressing member fixed to the side opposite to the ring member of the plurality of first blades,
One of the blade pressing member and the plurality of first blades has a guide elongated hole formed in parallel with the translational movement direction of the first blade,
A regulation plate, wherein the other of the blade pressing member and the plurality of first blades has a guide pin that slides the guide elongated hole. In the regulation plate according to claim 4 or 5 ,
The first moving mechanism includes a rotating member for rotating the ring member in the circumferential direction,
A regulation plate comprising: a ring portion fixed to the ring member; and a lever portion rotating the ring portion in a circumferential direction. In the regulation plate according to claim 6 ,
Any one of the plate body and the ring has a support elongated hole formed along the rotation direction of the ring,
A regulation plate, wherein the other of the plate body portion and the ring portion has a support pin slidably engaged with the support elongated hole. The regulation plate according to any one of claims 1 to 7
A regulation plate, wherein the inner peripheral edge of each of the plurality of first blades is formed in an arc shape, and the other first blades overlap each other to form a substantially circular inner peripheral edge. A regulation plate according to any one of claims 1 to 8
A plurality of second blades disposed at positions offset from the plurality of first blades in a direction orthogonal to the radial direction of the first openings, for narrowing the diameter of the first openings;
A second moving mechanism for translating the plurality of second blades in the radial direction of the first opening. In the regulation plate according to claim 9 ,
The first blade and the first blade and the straight line connecting the center of the opening formed by the plurality of first blades and the center of the opening formed by the plurality of second blades are orthogonal to the radial direction of these openings. Regulation plate on which the second blade is placed. A regulation plate for regulating the current between the anode and the first side of the substrate to be plated,
A first plate body having a first edge defining a first opening through which current passes, and a plurality of first blades for reducing the diameter of the first opening;
A second plate body having a second edge forming a second opening through which current passes, and a plurality of second blades for reducing the diameter of the second opening;
The first plate main body and the straight line connecting the center of the opening formed by the plurality of first blades and the center of the opening formed by the plurality of second blades is orthogonal to the radial direction of the openings; A regulation plate, with which the second plate body is connected. The regulation plate according to any one of claims 9 to 11 .
A regulation plate configured such that the diameter of the opening formed by the plurality of first blades and the diameter of the opening formed by the plurality of second blades can be adjusted independently of each other. An anode holder configured to hold the anode;
A substrate holder disposed opposite to the anode holder and configured to hold a substrate;
An anode mask integrally attached to the anode holder and having a third opening through which a current flowing between the anode and the substrate passes;
And a regulation plate according to any one of the preceding claims.
The plating apparatus, wherein the anode mask has an adjustment mechanism that adjusts the diameter of the third opening. Placing in a plating tank an anode holder integrally provided with an anode mask having a first opening through which a current flowing between the anode and the substrate passes;
Placing a substrate holder for holding the first substrate in the plating tank;
Placing between the anode mask and the substrate a regulation plate having a second opening and a third opening through which the current flowing between the anode and the substrate passes;
Adjusting the diameter of the first opening to a first diameter and plating the first substrate;
Placing a substrate holder for holding the second substrate in the plating tank;
The diameter of the first opening is adjusted to a second diameter smaller than the first diameter, and the diameters of the second opening and the third opening of the regulation plate are changed, respectively. And plating the substrate.

Images