SG10201803285XA - Plasma processing apparatus - Google Patents

Plasma processing apparatus

Info

Publication number
SG10201803285XA
SG10201803285XA SG10201803285XA SG10201803285XA SG10201803285XA SG 10201803285X A SG10201803285X A SG 10201803285XA SG 10201803285X A SG10201803285X A SG 10201803285XA SG 10201803285X A SG10201803285X A SG 10201803285XA SG 10201803285X A SG10201803285X A SG 10201803285XA
Authority
SG
Singapore
Prior art keywords
processing apparatus
plasma processing
mounting table
mounting
elevation mechanism
Prior art date
Application number
SG10201803285XA
Inventor
Ueda Takehiro
Electron Limited Tokyo
Nagai Kenji
Original Assignee
Tokyo Electron Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Tokyo Electron Ltd filed Critical Tokyo Electron Ltd
Publication of SG10201803285XA publication Critical patent/SG10201803285XA/en

Links

Landscapes

  • Drying Of Semiconductors (AREA)
  • Plasma Technology (AREA)
  • Encapsulation Of And Coatings For Semiconductor Or Solid State Devices (AREA)
  • Physical Vapour Deposition (AREA)

Abstract

PLASMA PROCESSING APPARATUS A plasma processing apparatus includes a first mounting table on which a target object to be processed is mounted, a second mounting table provided around the first mounting table, and an elevation mechanism. A focus ring is mounted on the second mounting table. The second mounting 10 table has therein a temperature control mechanism. The elevation mechanism is configured to vertically move the second mounting table. FIG. 1 15 -45-
SG10201803285XA 2017-04-26 2018-04-19 Plasma processing apparatus SG10201803285XA (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2017087052 2017-04-26
JP2018000367A JP7033926B2 (en) 2017-04-26 2018-01-05 Plasma processing equipment

Publications (1)

Publication Number Publication Date
SG10201803285XA true SG10201803285XA (en) 2018-11-29

Family

ID=64355140

Family Applications (1)

Application Number Title Priority Date Filing Date
SG10201803285XA SG10201803285XA (en) 2017-04-26 2018-04-19 Plasma processing apparatus

Country Status (3)

Country Link
JP (1) JP7033926B2 (en)
SG (1) SG10201803285XA (en)
TW (1) TWI797119B (en)

Families Citing this family (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US10784089B2 (en) * 2019-02-01 2020-09-22 Applied Materials, Inc. Temperature and bias control of edge ring
JP7186646B2 (en) * 2019-03-22 2022-12-09 東京エレクトロン株式会社 SUBSTRATE PROCESSING APPARATUS AND METHOD FOR DETECTING PRESENCE OF FOCUS RING ON PLACEMENT
KR102228545B1 (en) * 2019-04-03 2021-03-16 주식회사 테스 Substrate processing apparatus
KR102477910B1 (en) * 2019-07-02 2022-12-16 세메스 주식회사 Apparatus and method for treating substrate
JP7321026B2 (en) * 2019-08-02 2023-08-04 東京エレクトロン株式会社 EDGE RING, PLACE, SUBSTRATE PROCESSING APPARATUS, AND SUBSTRATE PROCESSING METHOD
US11551916B2 (en) * 2020-03-20 2023-01-10 Applied Materials, Inc. Sheath and temperature control of a process kit in a substrate processing chamber
CN113838732B (en) * 2020-06-08 2023-10-31 中微半导体设备(上海)股份有限公司 Focusing ring lifting mechanism, installation method and plasma processing device
US11721569B2 (en) * 2021-06-18 2023-08-08 Applied Materials, Inc. Method and apparatus for determining a position of a ring within a process kit

Family Cites Families (13)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2001230239A (en) * 2000-02-15 2001-08-24 Tokyo Electron Ltd Apparatus and method for treating
JP3388228B2 (en) * 2000-12-07 2003-03-17 株式会社半導体先端テクノロジーズ Plasma etching apparatus and plasma etching method
JP4596883B2 (en) * 2004-10-28 2010-12-15 京セラ株式会社 Annular heater
JP2006173223A (en) * 2004-12-14 2006-06-29 Toshiba Corp Plasma etching device and plasma etching method using the same
US7544270B2 (en) * 2005-11-14 2009-06-09 Infineon Technologies Ag Apparatus for processing a substrate
JP2011210853A (en) * 2010-03-29 2011-10-20 Tokyo Electron Ltd Method for measuring wear rate
JP5584517B2 (en) * 2010-05-12 2014-09-03 東京エレクトロン株式会社 Plasma processing apparatus and semiconductor device manufacturing method
WO2013078434A1 (en) * 2011-11-24 2013-05-30 Lam Research Corporation Plasma processing chamber with flexible symmetric rf return strap
JP6080571B2 (en) * 2013-01-31 2017-02-15 東京エレクトロン株式会社 Mounting table and plasma processing apparatus
JP6689020B2 (en) * 2013-08-21 2020-04-28 東京エレクトロン株式会社 Plasma processing device
CN105575863B (en) * 2014-11-10 2019-02-22 中微半导体设备(上海)有限公司 Plasma processing apparatus, substrate discharge mechanism and method
KR20170014384A (en) * 2015-07-30 2017-02-08 삼성전자주식회사 Dry etching apparatus
JP6541565B2 (en) * 2015-09-25 2019-07-10 東京エレクトロン株式会社 Mounting table and plasma processing apparatus

Also Published As

Publication number Publication date
TWI797119B (en) 2023-04-01
TW201842578A (en) 2018-12-01
JP2018186263A (en) 2018-11-22
JP7033926B2 (en) 2022-03-11

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