SG10201803285XA - Plasma processing apparatus - Google Patents
Plasma processing apparatusInfo
- Publication number
- SG10201803285XA SG10201803285XA SG10201803285XA SG10201803285XA SG10201803285XA SG 10201803285X A SG10201803285X A SG 10201803285XA SG 10201803285X A SG10201803285X A SG 10201803285XA SG 10201803285X A SG10201803285X A SG 10201803285XA SG 10201803285X A SG10201803285X A SG 10201803285XA
- Authority
- SG
- Singapore
- Prior art keywords
- processing apparatus
- plasma processing
- mounting table
- mounting
- elevation mechanism
- Prior art date
Links
Landscapes
- Drying Of Semiconductors (AREA)
- Plasma Technology (AREA)
- Encapsulation Of And Coatings For Semiconductor Or Solid State Devices (AREA)
- Physical Vapour Deposition (AREA)
Abstract
PLASMA PROCESSING APPARATUS A plasma processing apparatus includes a first mounting table on which a target object to be processed is mounted, a second mounting table provided around the first mounting table, and an elevation mechanism. A focus ring is mounted on the second mounting table. The second mounting 10 table has therein a temperature control mechanism. The elevation mechanism is configured to vertically move the second mounting table. FIG. 1 15 -45-
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2017087052 | 2017-04-26 | ||
JP2018000367A JP7033926B2 (en) | 2017-04-26 | 2018-01-05 | Plasma processing equipment |
Publications (1)
Publication Number | Publication Date |
---|---|
SG10201803285XA true SG10201803285XA (en) | 2018-11-29 |
Family
ID=64355140
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
SG10201803285XA SG10201803285XA (en) | 2017-04-26 | 2018-04-19 | Plasma processing apparatus |
Country Status (3)
Country | Link |
---|---|
JP (1) | JP7033926B2 (en) |
SG (1) | SG10201803285XA (en) |
TW (1) | TWI797119B (en) |
Families Citing this family (8)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US10784089B2 (en) * | 2019-02-01 | 2020-09-22 | Applied Materials, Inc. | Temperature and bias control of edge ring |
JP7186646B2 (en) * | 2019-03-22 | 2022-12-09 | 東京エレクトロン株式会社 | SUBSTRATE PROCESSING APPARATUS AND METHOD FOR DETECTING PRESENCE OF FOCUS RING ON PLACEMENT |
KR102228545B1 (en) * | 2019-04-03 | 2021-03-16 | 주식회사 테스 | Substrate processing apparatus |
KR102477910B1 (en) * | 2019-07-02 | 2022-12-16 | 세메스 주식회사 | Apparatus and method for treating substrate |
JP7321026B2 (en) * | 2019-08-02 | 2023-08-04 | 東京エレクトロン株式会社 | EDGE RING, PLACE, SUBSTRATE PROCESSING APPARATUS, AND SUBSTRATE PROCESSING METHOD |
US11551916B2 (en) * | 2020-03-20 | 2023-01-10 | Applied Materials, Inc. | Sheath and temperature control of a process kit in a substrate processing chamber |
CN113838732B (en) * | 2020-06-08 | 2023-10-31 | 中微半导体设备(上海)股份有限公司 | Focusing ring lifting mechanism, installation method and plasma processing device |
US11721569B2 (en) * | 2021-06-18 | 2023-08-08 | Applied Materials, Inc. | Method and apparatus for determining a position of a ring within a process kit |
Family Cites Families (13)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2001230239A (en) * | 2000-02-15 | 2001-08-24 | Tokyo Electron Ltd | Apparatus and method for treating |
JP3388228B2 (en) * | 2000-12-07 | 2003-03-17 | 株式会社半導体先端テクノロジーズ | Plasma etching apparatus and plasma etching method |
JP4596883B2 (en) * | 2004-10-28 | 2010-12-15 | 京セラ株式会社 | Annular heater |
JP2006173223A (en) * | 2004-12-14 | 2006-06-29 | Toshiba Corp | Plasma etching device and plasma etching method using the same |
US7544270B2 (en) * | 2005-11-14 | 2009-06-09 | Infineon Technologies Ag | Apparatus for processing a substrate |
JP2011210853A (en) * | 2010-03-29 | 2011-10-20 | Tokyo Electron Ltd | Method for measuring wear rate |
JP5584517B2 (en) * | 2010-05-12 | 2014-09-03 | 東京エレクトロン株式会社 | Plasma processing apparatus and semiconductor device manufacturing method |
WO2013078434A1 (en) * | 2011-11-24 | 2013-05-30 | Lam Research Corporation | Plasma processing chamber with flexible symmetric rf return strap |
JP6080571B2 (en) * | 2013-01-31 | 2017-02-15 | 東京エレクトロン株式会社 | Mounting table and plasma processing apparatus |
JP6689020B2 (en) * | 2013-08-21 | 2020-04-28 | 東京エレクトロン株式会社 | Plasma processing device |
CN105575863B (en) * | 2014-11-10 | 2019-02-22 | 中微半导体设备(上海)有限公司 | Plasma processing apparatus, substrate discharge mechanism and method |
KR20170014384A (en) * | 2015-07-30 | 2017-02-08 | 삼성전자주식회사 | Dry etching apparatus |
JP6541565B2 (en) * | 2015-09-25 | 2019-07-10 | 東京エレクトロン株式会社 | Mounting table and plasma processing apparatus |
-
2018
- 2018-01-05 JP JP2018000367A patent/JP7033926B2/en active Active
- 2018-04-19 SG SG10201803285XA patent/SG10201803285XA/en unknown
- 2018-04-20 TW TW107113489A patent/TWI797119B/en active
Also Published As
Publication number | Publication date |
---|---|
TWI797119B (en) | 2023-04-01 |
TW201842578A (en) | 2018-12-01 |
JP2018186263A (en) | 2018-11-22 |
JP7033926B2 (en) | 2022-03-11 |
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