TW201842578A - Plasma processing apparatus - Google Patents
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本發明之各種態樣及實施形態係關於一種電漿處理裝置。Various aspects and embodiments of the present invention are directed to a plasma processing apparatus.
一直以來，已知對半導體晶圓(以下亦稱為「晶圓」)等被處理體使用電漿進行蝕刻等電漿處理之電漿處理裝置。該電漿處理裝置若進行電漿處理，則腔室內之部件會消耗。例如，以電漿之均勻化為目的設置於晶圓之外周部之聚焦環亦有靠近電漿之情形，消耗速度快。聚焦環之消耗程度對晶圓上之製程結果產生較大之影響。例如，若於聚焦環上之電漿鞘與晶圓上之電漿鞘之高度位置產生偏差，則晶圓之外周附近之蝕刻特性降低，對均勻性等造成影響。因此，於電漿處理裝置中，若聚焦環以某程度消耗，則大氣開放而更換聚焦環。 然而，電漿處理裝置若大氣開放則要花時間維護。又，電漿處理裝置若部件更換之頻度變高，則生產性降低，亦影響到成本。 因此，為了將晶圓與聚焦環之高度始終保持為固定，提出一種藉由驅動機構使聚焦環上升之技術(例如，參照下述專利文獻1)。 [先前技術文獻] [專利文獻] [專利文獻1]日本專利特開2002-176030號公報A plasma processing apparatus that performs plasma treatment such as etching on a semiconductor wafer (hereinafter also referred to as "wafer") using plasma is known. When the plasma processing apparatus performs plasma processing, components in the chamber are consumed. For example, the focus ring disposed on the outer periphery of the wafer for the purpose of plasma homogenization is also close to the plasma, and the consumption speed is fast. The degree of consumption of the focus ring has a large impact on the process results on the wafer. For example, if the plasma sheath on the focus ring deviates from the height position of the plasma sheath on the wafer, the etching characteristics in the vicinity of the outer periphery of the wafer are lowered, which affects uniformity and the like. Therefore, in the plasma processing apparatus, if the focus ring is consumed to some extent, the atmosphere is opened and the focus ring is replaced. However, the plasma processing apparatus takes time to maintain if the atmosphere is open. Further, when the frequency of replacement of components in the plasma processing apparatus is increased, productivity is lowered and the cost is also affected. Therefore, in order to keep the height of the wafer and the focus ring constant, a technique of raising the focus ring by a drive mechanism has been proposed (for example, refer to Patent Document 1 below). [Prior Art Document] [Patent Document] [Patent Document 1] Japanese Patent Laid-Open Publication No. 2002-176030
[發明所欲解決之問題] 然而，於根據消耗而使聚焦環上升之情形時，聚焦環與載置面會離開。於電漿處理裝置中，於聚焦環自載置面離開之情形時，無法進行對於熱輸入之除熱，導致聚焦環成為高溫，從而有蝕刻特性產生變化之情形。該結果，於電漿處理裝置中，對被處理體之電漿處理之均勻性降低。 [解決問題之技術手段] 於一實施態樣中，所揭示之電漿處理裝置具有第1載置台、第2載置台、及升降機構。第1載置台載置成為電漿處理之對象之被處理體。第2載置台設置於第1載置台之外周，載置聚焦環，且於內部設置有調溫機構。升降機構使第2載置台升降。 [發明之效果] 根據所揭示之電漿處理裝置之一態樣，發揮可抑制對被處理體之電漿處理之均勻性降低之效果。[Problem to be Solved by the Invention] However, when the focus ring is raised in accordance with the consumption, the focus ring and the placement surface are separated. In the plasma processing apparatus, when the focus ring is separated from the mounting surface, heat removal from the heat input cannot be performed, and the focus ring becomes high temperature, and the etching characteristics are changed. As a result, in the plasma processing apparatus, the uniformity of the plasma treatment of the object to be processed is lowered. [Technical means for solving the problem] In one embodiment, the plasma processing apparatus disclosed has a first mounting table, a second mounting table, and a lifting mechanism. The first stage mounts a target object to be subjected to plasma processing. The second stage is placed on the outer circumference of the first stage, and the focus ring is placed thereon, and a temperature adjustment mechanism is provided inside. The lifting mechanism raises and lowers the second stage. [Effects of the Invention] According to one aspect of the disclosed plasma processing apparatus, it is possible to suppress the effect of reducing the uniformity of the plasma treatment of the object to be processed.
以下，參照圖式對本案所揭示之電漿處理裝置之實施形態詳細地進行說明。再者，於各圖式中對相同或相當之部分標註相同之符號。又，並非由本實施形態而限定所揭示之發明。各實施形態能夠於不使處理內容矛盾之範圍適當組合。 (第1實施形態) [電漿處理裝置之構成] 首先，說明實施形態之電漿處理裝置10之概略構成。圖1係表示實施形態之電漿處理裝置之概略構成之概略剖視圖。電漿處理裝置10具有氣密地構成且設為電性接地電位之處理容器1。該處理容器1設為圓筒狀且由例如於表面形成有陽極氧化被膜之鋁等所構成。處理容器1區劃產生電漿之處理空間。於處理容器1內，收容有水平支持作為被處理體(work-piece，工件)之晶圓W之第1載置台2。 第1載置台2於上下方向呈朝向底面之大致圓柱狀，上側之底面設為載置晶圓W之載置面6d。第1載置台2之載置面6d設為與晶圓W相同程度之尺寸。第1載置台2包含基台3及靜電吸盤6。 基台3係由導電性之金屬、例如於表面形成有陽極氧化被膜之鋁等所構成。基台3作為下部電極而發揮功能。基台3支持於絕緣體之支持台4，支持台4設置於處理容器1之底部。 靜電吸盤6係上表面為平坦之圓盤狀，且該上表面設為載置晶圓W之載置面6d。靜電吸盤6於俯視時設置於第1載置台2之中央。靜電吸盤6具有電極6a及絕緣體6b。電極6a設置於絕緣體6b之內部，於電極6a連接有直流電源12。靜電吸盤6構成為，藉由自直流電源12對電極6a施加直流電壓而由庫侖力吸附晶圓W。又，靜電吸盤6於絕緣體6b之內部設置有加熱器6c。加熱器6c經由未圖示之饋電機構而被供給電力，控制晶圓W之溫度。 第1載置台2沿著外周面於周圍設置有第2載置台7。第2載置台7形成為內徑較第1載置台2之外徑大出特定尺寸之圓筒狀，且與第1載置台2同軸而配置。第2載置台7之上側之面設為載置環狀之聚焦環5之載置面9d。聚焦環5例如由單晶矽形成，且載置於第2載置台7。 第2載置台7包含基台8及聚焦環加熱器9。基台8係由與基台3同樣之導電性之金屬、例如於表面形成有陽極氧化被膜之鋁等所構成。基台3中，成為支持台4側之下部於徑向上大於上部，且至第2載置台7之下部之位置為止形成為平板狀。基台8支持於基台3。聚焦環加熱器9支持於基台8。聚焦環加熱器9中，上表面設為平坦之環狀之形狀，且將該上表面作為載置聚焦環5之載置面9d。聚焦環加熱器9具有加熱器9a及絕緣體9b。加熱器9a設置於絕緣體9b之內部，且內包於絕緣體9b。加熱器9a經由未圖示之饋電機構而被供給電力，控制聚焦環5之溫度。如此，晶圓W之溫度與聚焦環5之溫度藉由不同之加熱器而獨立地控制。 於基台3上，連接有供給RF(Radio Frequency，射頻)電力之饋電棒50。於饋電棒50上，經由第1整合器11a而連接有第1RF電源10a，又，經由第2整合器11b而連接有第2RF電源10b。第1RF電源10a係電漿產生用之電源，其構成為自該第1RF電源10a對第1載置台2之基台3供給特定頻率之高頻電力。又，第2RF電源10b係離子取入用(偏壓用)之電源，其構成為自該第2RF電源10b對第1載置台2之基台3供給較第1RF電源10a低之特定頻率之高頻電力。 於基台3之內部形成有冷媒流路2d。冷媒流路2d中，於一端部連接有冷媒入口配管2b，於另一端部連接有冷媒出口配管2c。又，於基台8之內部形成有冷媒流路7d。冷媒流路7d中，於一端部連接有冷媒入口配管7b，於另一端部連接有冷媒出口配管7c。冷媒流路2d位於晶圓W之下方且以吸收晶圓W之熱之方式而發揮功能。冷媒流路7d位於聚焦環5之下方且以吸收聚焦環5之熱之方式而發揮功能。電漿處理裝置10構成為，藉由使冷媒、例如冷卻水等分別於冷媒流路2d及冷媒流路7d中循環而能夠個別地控制第1載置台2及第2載置台7之溫度。再者，電漿處理裝置10亦可構成為對晶圓W或聚焦環5之背面側供給冷熱傳遞用氣體而能夠個別地控制溫度。例如，亦可以貫通第1載置台2等之方式於晶圓W之背面設置用以供給氦氣等冷熱傳遞用氣體(背面氣體)之氣體供給管。氣體供給管連接於氣體供給源。藉由該等構成而將由靜電吸盤6吸附保持於第1載置台2之上表面之晶圓W控制為特定之溫度。 另一方面，於第1載置台2之上方，以與第1載置台2平行地面對面之方式設置有具有作為上部電極之功能之簇射頭16。簇射頭16與第1載置台2作為一對電極(上部電極與下部電極)而發揮功能。 簇射頭16設置於處理容器1之頂壁部分。簇射頭16具備本體部16a及成為電極板之上部頂板16b，且經由絕緣性構件95而支持於處理容器1之上部。本體部16a構成為，包含導電性材料、例如於表面形成有陽極氧化被膜之鋁等，且於其下部可裝卸自如地支持上部頂板16b。 於本體部16a之內部設置有氣體擴散室16c，以位於該氣體擴散室16c之下部之方式，於本體部16a之底部形成有多數之氣體流經孔16d。又，於上部頂板16b，以於厚度方向貫通該上部頂板16b之方式將氣體導入孔16e設置成與上述之氣體流經孔16d重疊。藉由此種構成，將供給至氣體擴散室16c之處理氣體經由氣體流經孔16d及氣體導入孔16e而分散成噴淋狀供給至處理容器1內。 於本體部16a形成有用以向氣體擴散室16c導入處理氣體之氣體導入口16g。於該氣體導入口16g，連接有氣體供給配管15a之一端。於該氣體供給配管15a之另一端，連接有供給處理氣體之處理氣體供給源15。於氣體供給配管15a，自上游側依序設置有質量流量控制器(MFC)15b、及開閉閥V2。而且，將來自處理氣體供給源15之用於電漿蝕刻之處理氣體經由氣體供給配管15a而供給至氣體擴散室16c，且自該氣體擴散室16c經由氣體流經孔16d及氣體導入孔16e而分散成噴淋狀供給至處理容器1內。 於作為上述之上部電極之簇射頭16，經由低通濾波器(LPF)71而電性連接有可變直流電源72。該可變直流電源72構成為，能夠藉由接通、斷開開關73而進行饋電之接通、斷開。可變直流電源72之電流、電壓以及接通、斷開開關73之接通、斷開藉由下述控制部90而控制。再者，如下所述，於自第1RF電源10a、第2RF電源10b對第1載置台2施加高頻而於處理空間產生電漿時，視需要藉由控制部90使接通、斷開開關73接通，對作為上部電極之簇射頭16施加特定之直流電壓。 又，以自處理容器1之側壁朝較簇射頭16之高度位置更靠上方延伸之方式設置有圓筒狀之接地導體1a。該圓筒狀之接地導體1a於其上部具有頂壁。 於處理容器1之底部形成有排氣口81，於該排氣口81，經由排氣管82而連接有排氣裝置83。排氣裝置83具有真空泵，其構成為可藉由使該真空泵作動而將處理容器1內減壓至特定之真空度。另一方面，於處理容器1內之側壁設置有晶圓W之搬入搬出口84，於該搬入搬出口84，設置有開閉該搬入搬出口84之閘閥85。 於處理容器1之側部內側，沿著內壁面設置有積存物遮罩86。積存物遮罩86防止蝕刻副產物(積存物)附著於處理容器1。於該積存物遮罩86之與晶圓W大致相同之高度位置，設置有以能夠控制相對於接地之電位之方式連接之導電性構件(GND塊)89，藉此防止異常放電。又，於積存物遮罩86之下端部，設置有沿著第1載置台2延伸之積存物遮罩87。積存物遮罩86、87裝卸自如地構成。 上述構成之電漿處理裝置10藉由控制部90統括地控制其動作。於該控制部90，設置有具備CPU且控制電漿處理裝置10之各部之製程控制器91、使用者介面92、及記憶部93。 為了使步驟管理者管理電漿處理裝置10，將使用者介面92由進行指令之輸入操作之鍵盤、及將電漿處理裝置10之運轉狀況可視化顯示之顯示器等構成。 於記憶部93中儲存有處方(recipe)，該處方記憶有用以藉由製程控制器91之控制而實現電漿處理裝置10執行之各種處理之控制程式(軟體)或處理條件資料等。而且，視需要，由來自使用者介面92之指示等將任意之處方自記憶部93調出且使製程控制器91執行，藉此於製程控制器91之控制下，於電漿處理裝置10中執行所需之處理。又，控制程式或處理條件資料等處方亦能夠利用儲存於電腦能讀取之電腦記憶媒體(例如硬碟、CD(Compact Disc，光碟)、軟碟、半導體記憶體等)等中之狀態者，或自其他裝置例如經由專用線路隨時傳送而於線上使用。 [第1載置台及第2載置台之構成] 其次，參照圖2，對第1實施形態之第1載置台2及第2載置台7之要部構成進行說明。圖2係表示第1實施形態之第1載置台及第2載置台之要部構成之概略剖視圖。 第1載置台2包含基台3及靜電吸盤6。靜電吸盤6經由絕緣層30而接著於基台3。靜電吸盤6呈圓板狀，且以與基台3成同軸之方式設置。靜電吸盤6於絕緣體6b之內部設置有電極6a。靜電吸盤6之上表面設為載置晶圓W之載置面6d。於靜電吸盤6之下端，形成有朝靜電吸盤6之徑向外側突出之凸緣部6e。即，靜電吸盤6之外徑根據側面之位置而不同。 靜電吸盤6於絕緣體6b之內部設置有加熱器6c。又，於基台3之內部形成有冷媒流路2d。冷媒流路2d及加熱器6c係作為調整晶圓W之溫度之調溫機構而發揮功能。再者，加熱器6c亦可不存在於絕緣體6b之內部。例如，加熱器6c亦可貼附於靜電吸盤6之背面，只要介存於載置面6d與冷媒流路2d之間即可。又，加熱器6c可於載置面6d之區域整面設置1個，亦可針對將載置面6d分割後之每一區域個別地設置。即，加熱器6c亦可針對將載置面6d分割後之每一區域個別地設置複數個。例如，加熱器6c亦可將第1載置台2之載置面6d根據自中心起之距離而分為複數個區域，且於各區域以包圍第1載置台2之中心之方式呈環狀延伸。或亦可包含將中心區域加熱之加熱器、及以包圍中心區域之外側之方式呈環狀延伸之加熱器。又，亦可將以包圍載置面6d之中心之方式呈環狀延伸之區域根據自中心起之方向而分為複數個區域，且於各區域設置加熱器6c。 圖3係自上方向觀察第1載置台及第2載置台之俯視圖。圖3中以圓板狀表示第1載置台2之載置面6d。載置面6d根據自中心起之距離及方向而分為複數個區域HT1，於各區域HT1個別地設置有加熱器6c。藉此，電漿處理裝置10可針對每一區域HT1控制晶圓W之溫度。 返回至圖2。第2載置台7包含基台8及聚焦環加熱器9。基台8支持於基台3。聚焦環加熱器9於絕緣體9b之內部設置有加熱器9a。又，於基台8之內部形成有冷媒流路7d。冷媒流路7d及加熱器9a係作為調整聚焦環5之溫度之調溫機構而發揮功能。聚焦環加熱器9經由絕緣層49而接著於基台8。聚焦環加熱器9之上表面設為載置聚焦環5之載置面9d。再者，於聚焦環加熱器9之上表面，亦可設置熱傳導性較高之片材構件等。 聚焦環5係圓環狀之構件，其以與第2載置台7成同軸之方式設置。於聚焦環5之內側側面，形成有朝徑向內側突出之凸部5a。即，聚焦環5之內徑根據內側側面之位置而不同。例如，未形成凸部5a之部位之內徑大於晶圓W之外徑及靜電吸盤6之凸緣部6e之外徑。另一方面，形成有凸部5a之部位之內徑小於靜電吸盤6之凸緣部6e之外徑，且大於靜電吸盤6之未形成凸緣部6e之部位之外徑。 聚焦環5以成為凸部5a與靜電吸盤6之凸緣部6e之上表面離開、且亦自靜電吸盤6之側面離開之狀態之方式配置於第2載置台7。即，於聚焦環5之凸部5a之下表面與靜電吸盤6之凸緣部6e之上表面之間形成有間隙。又，於聚焦環5之凸部5a之側面與靜電吸盤6之未形成凸緣部6e之側面之間形成有間隙。而且，聚焦環5之凸部5a位於第1載置台2之基台3與第2載置台7之基台8之間之間隙34之上方。即，自與載置面6d正交之方向觀察，凸部5a存在於與間隙34重疊之位置且覆蓋該間隙34。藉此，可抑制電漿進入至間隙34。 加熱器9a呈與基台8同軸之環狀。加熱器9a可於載置面9d之區域整面設置1個，亦可針對將載置面9d分割後之每一區域個別地設置。即，加熱器9a亦可針對將載置面9d分割後之每一區域個別地設置複數個。例如，加熱器9a亦可將第2載置台7之載置面9d根據第2載置台7之自中心起之方向而分為複數個區域，且於各區域設置加熱器9a。例如，圖3中，以圓板狀表示於第1載置台2之載置面6d之周圍之第2載置台7之載置面9d。載置面9d根據自中心起之方向而分為複數個區域HT2，且於各區域HT2個別地設置有加熱器9a。藉此，電漿處理裝置10可針對每一區域HT2控制聚焦環5之溫度。 返回至圖2。電漿處理裝置10設置有測定聚焦環5之上表面之高度之測定部110。於本實施形態中，構成作為藉由雷射光之干涉而測量距離之光干涉儀之測定部110而測定聚焦環5之上表面之高度。測定部110具有光射出部110a及光纖110b。於第1載置台2上，於第2載置台7之下部設置有光射出部110a。於光射出部110a之上部設置有用以阻隔真空之石英窗111。又，於第1載置台2與第2載置台7之間，設置有用以阻隔真空之O形環(O-Ring)112。又，於第2載置台7上，與設置有測定部110之位置對應地形成有貫通至上表面之貫通孔113。再者，於貫通孔113中，亦可設置使雷射光透過之構件。 光射出部110a藉由光纖110b而與測定控制單元114連接。測定控制單元114內置有光源，產生測量用之雷射光。由測定控制單元114產生之雷射光經由光纖110b而自光射出部110a出射。自光射出部110a出射之雷射光之一部分由石英窗111或聚焦環5反射，且所反射之雷射光入射至光射出部110a。 圖4係表示雷射光之反射系統之圖。石英窗111於光射出部110a側之面實施抗反射處理，使雷射光之反射減小。如圖4所示，自光射出部110a出射之雷射光之一部分主要分別於石英窗111之上表面、聚焦環5之下表面及聚焦環5之上表面反射，且入射至光射出部110a。 入射至光射出部110a之光經由光纖110b而引導至測定控制單元114。測定控制單元114內置有分光器等，且根據所反射之雷射光之干涉狀態而測量距離。例如，於測定控制單元114，根據所入射之雷射光之干涉狀態，針對每一反射面間之相互距離之差而檢測光之強度。 圖5係表示光之檢測強度之分佈之一例之圖。於測定控制單元114，將反射面間之相互距離設為光路長而檢測光之強度。圖5之曲線圖之橫軸表示光路長 之相互距離。橫軸之0表示所有之相互距離之起點。圖5之曲線圖之縱軸表示檢測之光之強度。光干涉儀根據所反射之光之干涉狀態而測量相互距離。於反射中，往復2次通過相互距離之光路。因此，光路長作為相互距離×2×折射率而測定。例如，將石英窗111之厚度設X1 ，且將石英之折射率設為3.6之情形時，以石英窗111之下表面為基準之情形時之至石英窗111之上表面為止之光路長成為X1 ×2×3.6=7.2X1 。於圖5之例中，於石英窗111之上表面經反射之光作為於光路長7.2X1 中強度有峰值者而檢測 。又，於將貫通孔113之厚度設為X2 ，並將貫通孔113內設為空氣且折射率設為1.0之情形時，以石英窗111之上表面為基準之情形時之至聚焦環5之下表面為止之光路長成為X2 ×2×1.0=2X2 。於圖5之例中，於聚焦環5之下表面經反射之光作為於光路長2X2 中強度有峰值者而檢測。又，於將聚焦環5之厚度設為X3 ，並將聚焦環5設為矽且折射率設為1.5之情形時，以聚焦環5之下表面為基準之情形時之至聚焦環5之上表面為止之光路長成為X3 ×2×1.5=3X3 。於圖5之例中，於聚焦環5之上表面經反射之光作為光路長3X3 中強度有峰值者而檢測。 確定新品之聚焦環5之厚度或材料。於測定控制單元114，登錄新品之聚焦環5之厚度或材料之折射率。測定控制單元114算出與新品之聚焦環5之厚度或材料之折射率對應之光路長，且自所算出之光路長附近強度成為峰值之光之峰值之位置測量聚焦環5之厚度。例如，測定控制單元114自光路長3X3 之附近強度成為峰值之光之峰值之位置測量聚焦環5之厚度。測定控制單元114將測量結果輸出至控制部90。再者，聚焦環5之厚度亦可由控制部90測量。例如，於測定控制單元114，分別測量檢測強度成為峰值之光路長，且將測量結果輸出至控制部90。於控制部90，登錄新品之聚焦環5之厚度或材料之折射率。於控制部90，亦可算出與新品之聚焦環5之厚度或材料之折射率對應之光路長，且自所算出之光路長附近強度成為峰值之光之峰值之位置測量聚焦環5之厚度。 返回至圖2。於第1載置台2，設置有使第2載置台7升降之升降機構120。例如，於第1載置台2，於成為第2載置台7之下部之位置設置有升降機構120。升降機構120內置有致動器，藉由致動器之驅動力而使桿120a伸縮從而使第2載置台7升降。升降機構120可為以齒輪等更換馬達之驅動力而獲得使桿120a伸縮之驅動力者，亦可為藉由液壓等而獲得使桿120a伸縮之驅動力者。 又，第1載置台2設置有與第2載置台7電性導通之導通部130。導通部130構成為，即便藉由升降機構120使第2載置台7升降亦使第1載置台2與第2載置台7電性導通。例如，導通部130構成可撓性配線、或即便第2載置台7升降亦使導體與基台8接觸而電性導通之機構。導通部130以使第2載置台7與第1載置台2之電性特性成為相同之方式而設置。例如，導通部130於第1載置台2之周面設置有複數個。供給至第1載置台2之RF電力經由導通部130亦供給至第2載置台7。再者，導通部130亦可設置於第1載置台2之上表面與第2載置台7之下表面之間。 於本實施形態之電漿處理裝置10中，設置有3組之測定部110及升降機構120。例如，於第2載置台7，將測定部110及升降機構120作為1組，於第2載置台7之圓周方向上以均等之間隔配置。圖3中表示測定部110及升降機構120之配置位置。測定部110及升降機構120於第2載置台7上，於第2載置台7之圓周方向每隔120度之角度設置於相同之位置。再者，測定部110及升降機構120於第2載置台7上亦可設置4組以上。又，測定部110及升降機構120於第2載置台7之圓周方向亦可離開相隔而配置。 測定控制單元114測量各測定部110之位置之聚焦環5之厚度，且將測量結果輸出至控制部90。控制部90根據測定結果，以將聚焦環之上表面保持特定之高度之方式獨立地驅動升降機構120。例如，控制部90針對測定部110及升降機構120之每一組，根據測定部110之測定結果而使升降機構120獨立地升降。例如，控制部90根據相對於新品之聚焦環5之厚度所測定之聚焦環5之厚度而特定出聚焦環5之消耗量，且根據消耗量控制升降機構120而使第2載置台7上升。例如，控制部90控制升降機構120，使第2載置台7上升相當於聚焦環5消耗量之量。 聚焦環5之消耗量有於第2載置台7之圓周方向上產生偏差之情形。電漿處理裝置10如圖3般配置3組以上之測定部110及升降功能120，於每一配置部位特定出聚焦環5之消耗量，且根據消耗量控制升降機構120而使第2載置台7上升。藉此，電漿處理裝置10可使聚焦環5之上表面相對於晶圓W之上表面之位置於圓周方向上一致。藉此，電漿處理裝置10能夠維持蝕刻特性之圓周方向之均勻性。 [作用及效果] 其次，對本實施形態之電漿處理裝置10之作用及效果進行說明。圖6係說明使第2載置台上升之流程之一例之圖。圖6(A)表示將新品之聚焦環5載置於第2載置台7之狀態。於第2載置台7載置新品之聚焦環5時，以使聚焦環5之上表面成為特定之高度之方式調整高度。例如，於第2載置台7載置有新品之聚焦環5時，以獲得蝕刻處理之晶圓W之均勻性之方式而調整高度。伴隨著對晶圓W之蝕刻處理，聚焦環5亦消耗。圖6(B)表示聚焦環5消耗之狀態。於圖6(B)之例中，聚焦環5之上表面消耗0.2 mm。電漿處理裝置10使用測定部110測定聚焦環5之上表面之高度，且特定出聚焦環5之消耗量。然後，電漿處理裝置10根據消耗量，控制升降機構120而使第2載置台7上升。聚焦環5之高度之測定較佳為將處理容器1內之溫度穩定成進行電漿處理之溫度之時序。又，聚焦環5之高度之測定可於對1片晶圓W之蝕刻處理中週期性地進行複數次，亦可針對每1片晶圓W進行1次，亦可針對每特定片之晶圓W進行1次，還可以管理者所指定週期進行。圖6(C)表示使第2載置台7上升之狀態。於圖6(C)之例中，使第2載置台7上升0.2 mm而使聚焦環5之上表面上升0.2 mm。再者，以即便第2載置台7上升亦不會產生影響之方式構成。例如，冷媒流路7d構成可撓性配管、或即便第2載置台7升降亦能夠供給冷媒之機構。對加熱器9a供給電力之配線構成可撓性配線、或即便第2載置台7升降亦電性導通之機構。 藉此，電漿處理裝置10即便於聚焦環5消耗之情形時，亦可抑制晶圓W之外周附近之蝕刻特性之降低，可抑制蝕刻處理之晶圓W之均勻性之降低。又，電漿處理裝置10於載置有聚焦環5之狀態下使第2載置台7上升。藉此，聚焦環5藉由第2載置台7而可將來自電漿之熱輸入除熱。該結果，電漿處理裝置10可將聚焦環5之溫度保持為所需之溫度，故可抑制由來自電漿之熱輸入導致之蝕刻特性變化。 此處，使用比較例說明效果。圖7係表示比較例之構成之一例之圖。圖7之例表示藉由驅動機構150僅使聚焦環5上升相當於聚焦環5消耗量之量之構成之情形。根據消耗而使聚焦環5上升之情形時，聚焦環5與載置面151離開。如此於聚焦環5自載置面151離開之情形時，無法將來自電漿之熱輸入進行除熱，從而有聚焦環5成為高溫、且蝕刻特性產生變化之情形。又，於聚焦環5自載置面151離開之情形時，有靜電量或阻抗等電性特性或施加之電壓產生變化，且電性變化對電漿造成影響，從而使蝕刻特性產生變化之情形。 圖8係表示蝕刻特性之變化之一例之圖。圖8之橫軸表示自晶圓W之中心起之距離。圖8之縱軸表示將晶圓W之中心之蝕刻量設為100%之情形時與自晶圓W之中心起之距離相應之位置之蝕刻量。圖8中表示對晶圓W之設為基準之蝕刻量之曲線圖。又，圖8中表示對晶圓W連續地進行蝕刻處理時之第1塊、第10塊、第25塊之蝕刻量之曲線圖。第1塊之曲線圖成為與基準接近之曲線圖。另一方面，第10塊遠離基準。第25塊較第10塊更遠離基準。其原因在於，藉由來自電漿之熱輸入而使聚焦環5成為高溫。即，如圖7所示，於根據消耗而使聚焦環5上升之情形時，可對第1塊保持蝕刻處理之晶圓W之均勻性，但於對晶圓W連續地進行蝕刻處理之情形時，無法保持蝕刻處理之晶圓W之均勻性。 另一方面，本實施形態之電漿處理裝置10於載置有聚焦環5之狀態下使第2載置台7上升。藉此，電漿處理裝置10可藉由第2載置台7而將對聚焦環5之來自電漿之熱輸入進行除熱，故即便於對晶圓W連續地進行蝕刻處理之情形時，亦可抑制蝕刻特性產生變化。 如此，電漿處理裝置10具有載置晶圓W之第1載置台2、及設置於第1載置台2之外周並載置聚焦環5且於內部設置有調溫機構之第2載置台7。而且，電漿處理裝置10中，升降機構120使第2載置台7升降。藉此，電漿處理裝置10於藉由升降機構120使第2載置台7升降而使聚焦環5升降之情形時，亦可藉由第2載置台7而將對聚焦環5之來自電漿之熱輸入進行除熱，故可抑制對晶圓W之電漿處理之均勻性之降低。 又，電漿處理裝置10中，第2載置台7與第1載置台2導通。藉此，電漿處理裝置10於藉由升降機構120使第2載置台7升降而使聚焦環5升降之情形時，亦可抑制聚焦環5之電性特性或施加之電壓產生變化，故可抑制對電漿之特性之變化。 又，電漿處理裝置10具有測定聚焦環5之上表面之高度之測定部110。又，電漿處理裝置10中，升降機構120以使聚焦環5之上表面相對於晶圓W之上表面保持預先設定之範圍之方式進行驅動。電漿處理裝置10藉由升降機構120使第2載置台7升降而使聚焦環5升降，藉此抑制聚焦環5之溫度之變化。又，電漿處理裝置10藉由使第2載置台7與第1載置台2導通而抑制聚焦環5之電性特性之變化、或施加之電壓之變化。因此，電漿處理裝置10中，升降機構120藉由以使聚焦環5之上表面相對於晶圓W之上表面保持預先設定之範圍之方式進行驅動這樣的簡單控制便可抑制對晶圓W之電漿處理之均勻性之降低。 又，電漿處理裝置10中，測定部110及升降機構120相對於第2載置台7台設置3組以上，且以使聚焦環5之上表面保持特定之高度之方式獨立地驅動。藉此，電漿處理裝置10可使聚焦環5之上表面相對於晶圓W之上表面之位置於圓周方向一致。藉此，電漿處理裝置10能夠維持蝕刻特性之圓周方向之均勻性。 (第2實施形態) 其次，對第2實施形態進行說明。第2實施形態之電漿處理裝置10之概略構成與圖1所示之第1實施形態之電漿處理裝置10之構成之一部分相同，故對於相同之部分標註相同之符號，主要對不同之點省略說明。 [第1載置台及第2載置台之構成] 參照圖9、圖10，對第2實施形態之第1載置台2及第2載置台7之要部構成進行說明。圖9係表示第2實施形態之第1載置台及第2載置台之要部構成之立體圖。 第1載置台2包含基台3。基台3形成為圓柱狀，於軸向之一面3a配置上述之靜電吸盤6。又，基台3設置有沿著外周朝外側突出之凸緣部200。本實施形態之基台3於外周之側面之自中央部起之下側，形成有使外徑增大而朝外側伸出之伸出部201，於側面之伸出部之更下部設置有朝外側突出之凸緣部200。凸緣部200於上表面之周向之3個以上之位置，形成有貫通於軸向之貫通孔210。本實施形態之凸緣部200於周向以均等之間隔形成有3個貫通孔210。 第2載置台7包含基台8。基台8形成為內徑較基台3之面3a之外徑大出特定尺寸之圓筒狀，且於軸向之一面8a配置上述聚焦環加熱器9。又，基台8於下表面，以與凸緣部200之貫通孔210相同之間隔設置有柱狀部220。本實施形態之基台8於下表面，於周向以均等之間隔形成有3個柱狀部220。 將基台8設為與基台3同軸，且以使柱狀部220插入至貫通孔210之方式使周向之位置對準而配置於基台3之凸緣部200上。 圖10係表示第2實施形態之第1載置台及第2載置台之要部構成之概略剖視圖。圖10之例係表示貫通孔210之位置之第1載置台2及第2載置台7之剖面之圖。 基台3支持於絕緣體之支持台4。於基台3及支持台4形成有貫通孔210。 貫通孔210形成為自中央附近起之下部之直徑小於上部，且形成有階211。柱狀部220對應於貫通孔210，形成為自中央附近起之下部之直徑小於上部。 基台8配置於基台3之凸緣部200上。基台8形成為外徑大於基台3，且於與基台3對向之下表面之較基台3之外徑大之部分形成有朝下部突出之圓環部221。於將基台8配置於基台3之凸緣部200上之情形時，圓環部221以覆蓋凸緣部200之側面之方式而形成。 於貫通孔210中插入有柱狀部220。於各貫通孔210中，設置有使第2載置台7升降之升降機構120。例如，基台3於各貫通孔210之下部，設置有使柱狀部220升降之升降機構120。升降機構120內置有致動器，且藉由致動器之驅動力使桿120a伸縮而使柱狀部220升降。 於貫通孔210中設置有密封構件。例如，於貫通孔210之與柱狀部220對向之面，沿著貫通孔之周向設置有O形環等密封件240。密封件240與柱狀部220接觸。又，於基台8與基台3之與軸向並行之面，設置有密封構件。例如，基台3於伸出部201之側面，沿著周面設置有密封件241。基台3於凸緣部200之側面，沿著周面設置有密封件242。 又，基台3於貫通孔210之階211附近之周面之一部分，設置有與基台8電性導通之導通部250。導通部250構成為，即便藉由升降機構120使基台8升降亦使基台3與基台8電性導通。例如，導通部250構成可撓性配線、或即便基台8升降亦使導體與基台8接觸而電性導通之機構。導通部250以使基台3與基台8之電性特性成為相同之方式而設置。 又，基台3於貫通孔210之階211部分設置有與基台3之內側之下部相連之導管260。導管260連接於未圖示之真空泵。真空泵可為設置於第1排氣裝置83者，亦可另外設置。第2實施形態之電漿處理裝置10藉由使真空泵作動而經由導管260進行抽真空，對基台8與基台3之間之由密封件240、密封件241、及密封件242所形成之空間進行減壓。 第1載置台2之下側之空間設為大氣壓。例如，支持台4於內側之下部形成有空間270，且設為大氣壓。貫通孔210與空間270導通。電漿處理裝置10藉由密封件240將貫通孔210密封，以此抑制基台3內部之大氣壓流入至處理容器1內。 且說，電漿處理裝置10中，於藉由升降機構120使柱狀部220升降之情形時，隨著柱狀部220之移動而使大氣自密封件240流入。 因此，電漿處理裝置10中，藉由導管260進行抽真空，對基台8與基台3之間之由密封件240、密封件241、及密封件242所形成之空間進行減壓。 藉此，於電漿處理裝置10中，可抑制自密封件240部分所流入之大氣流入至處理容器1內。又，電漿處理裝置10中，即便於在導通部250等產生有微粒之情形時，亦可藉由導管260進行抽真空而抑制微粒流入至處理容器1內。 又，電漿處理裝置10中，藉由密封件240將貫通孔210密封，藉由導管260進行抽真空，對基台8與基台3之間之由密封件240、密封件241、及密封件242所形成之空間進行減壓。藉此，基台3中，僅與柱狀部220對應之面積量未受到大氣壓之反作用力。例如，於未藉由導管260進行抽真空之情形時，大氣壓之反作用力成為200 kgf左右，但於藉由導管260進行抽真空之情形時，大氣壓之反作用力減輕至15 kgf左右。藉此，可減輕於使第2載置台7升降時之升降機構120之致動器之負載。 如此，第1載置台2設置有凸緣部200，其沿著外周朝外側突出，且於周向之3個以上之位置形成有貫通於軸向之貫通孔210。第2載置台7設置有柱狀部220，其沿著第1載置台2之外周而配置於凸緣部200之上部，且於與凸緣部200對向之下表面之與貫通孔210對應之位置插入至貫通孔210。升降機構120藉由使柱狀部220相對於貫通孔210於軸向移動而使第2載置台7升降。又，電漿處理裝置10中，於貫通孔210中設置有與柱狀部220接觸而密封之第1密封構件(密封件240)。電漿處理裝置10中，於第1載置台2與第2載置台7之與軸向並行之面，設置有將第1載置台2與第2載置台7之間密封之第2密封構件(密封件241、密封件242)。電漿處理裝置10具有對第1載置台2與第2載置台7之間之由第1密封構件及第2密封構件所形成之空間進行減壓之減壓部(導管260、真空泵)。藉此，第2實施形態之電漿處理裝置10可抑制大氣流入至處理容器1內。又，電漿處理裝置10可抑制微粒流入至處理容器1內。又，電漿處理裝置10可減輕使第2載置台7升降時之升降機構120之致動器之負載。 以上，對各種實施形態進行了說明，但並不限定於上述實施形態而是能夠構成各種變化態樣。例如，上述電漿處理裝置10為電容耦合型之電漿處理裝置10，但可採用任意之電漿處理裝置10。例如，電漿處理裝置10亦可為如感應耦合型之電漿處理裝置10、藉由微波之類之表面波使氣體激發之電漿處理裝置10般之任意類型之電漿處理裝置10。 又，於上述實施形態中，以藉由導通部130使第1載置台2與第2載置台7電性導通之情形為例進行了說明，但並不限定於此。例如，亦可使第2載置台7與對第1載置台2供給RF電力之RF電源導通。例如，亦可使第2載置台7供給自第1整合器11a及第2整合器11b供給之RF電力。 又，於上述實施形態中，以於第2載置台7設置有冷媒流路7d及加熱器9a作為調整聚焦環5之溫度之調溫機構之情形為例進行了說明，但並不限定於此。例如，第2載置台7亦可僅設置冷媒流路7d或加熱器9a之任一者。又，調溫機構只要可調整聚焦環5之溫度則可為任意，並不限定於冷媒流路7d及加熱器9a。 又，於上述實施形態中，以使第2載置台7上升相當於聚焦環5之上表面消耗之消耗量之情形為例進行了說明，但並不限定於此。例如，電漿處理裝置10亦可根據實施之電漿處理之種類而使第2載置台7升降，改變聚焦環5相對於晶圓W之位置。例如，電漿處理裝置10針對電漿處理之每一種類將聚焦環5之位置記憶於記憶部93。製程控制器91亦可以如下方式使聚焦環5升降，即，自記憶部93讀出與要實施之電漿處理之種類對應之聚焦環5之位置，且使第2載置台7升降而成為讀出之位置。又，電漿處理裝置10於對1片晶圓W之處理中，亦可使第2載置台7升降，改變聚焦環5相對於晶圓W之位置。例如，電漿處理裝置10針對電漿處理之每一製程將聚焦環5之位置記憶於記憶部93。製程控制器91亦可自記憶部93讀出要實施之電漿處理之各製程之聚焦環5之位置，且於電漿處理中，根據要實施之製程而使第2載置台7升降，且使聚焦環5升降而成為與要實施之製程對應之位置。Hereinafter, embodiments of the plasma processing apparatus disclosed in the present invention will be described in detail with reference to the drawings. In the drawings, the same or equivalent elements are denoted by the same reference numerals. Further, the invention disclosed is not limited by the embodiment. Each embodiment can be appropriately combined without departing from the scope of the processing contents. (First Embodiment) [Configuration of Plasma Processing Apparatus] First, a schematic configuration of a plasma processing apparatus 10 according to an embodiment will be described. Fig. 1 is a schematic cross-sectional view showing a schematic configuration of a plasma processing apparatus according to an embodiment. The plasma processing apparatus 10 has a processing container 1 that is configured to be airtight and that is electrically grounded. The processing container 1 is formed in a cylindrical shape and is made of, for example, aluminum or the like having an anodized film formed on its surface. The processing container 1 is zoned to produce a processing space for the plasma. In the processing container 1, a first mounting table 2 that horizontally supports a wafer W as a workpiece (work-piece) is housed. The first mounting table 2 has a substantially columnar shape facing the bottom surface in the vertical direction, and the bottom surface on the upper side is a mounting surface 6d on which the wafer W is placed. The mounting surface 6d of the first mounting table 2 is set to have the same size as the wafer W. The first stage 2 includes a base 3 and an electrostatic chuck 6. The base 3 is made of a conductive metal such as aluminum having an anodized film formed on its surface. The base 3 functions as a lower electrode. The base 3 is supported on a support table 4 of an insulator, and the support table 4 is disposed at the bottom of the processing container 1. The electrostatic chuck 6 has a flat disk shape on its upper surface, and the upper surface is a mounting surface 6d on which the wafer W is placed. The electrostatic chuck 6 is provided at the center of the first mounting table 2 in plan view. The electrostatic chuck 6 has an electrode 6a and an insulator 6b. The electrode 6a is disposed inside the insulator 6b, and a DC power source 12 is connected to the electrode 6a. The electrostatic chuck 6 is configured to adsorb the wafer W by Coulomb force by applying a DC voltage to the electrode 6a from the DC power source 12. Further, the electrostatic chuck 6 is provided with a heater 6c inside the insulator 6b. The heater 6c is supplied with electric power via a feed mechanism (not shown) to control the temperature of the wafer W. The first mounting table 2 is provided with a second mounting table 7 around the outer peripheral surface. The second mounting table 7 is formed in a cylindrical shape having an inner diameter larger than the outer diameter of the first mounting table 2 by a specific size, and is disposed coaxially with the first mounting table 2 . The upper surface of the second stage 7 is a mounting surface 9d on which the annular focus ring 5 is placed. The focus ring 5 is formed, for example, of a single crystal crucible, and is placed on the second stage 7. The second stage 7 includes a base 8 and a focus ring heater 9. The base 8 is made of a metal similar in conductivity to the base 3, for example, aluminum having an anodized film formed on its surface. In the base 3, the lower portion of the support table 4 side is formed in a flat shape in a radial direction larger than the upper portion and at a position below the lower portion of the second mounting table 7. The base 8 is supported on the base 3. The focus ring heater 9 is supported on the base 8. In the focus ring heater 9, the upper surface has a flat annular shape, and the upper surface serves as a mounting surface 9d on which the focus ring 5 is placed. The focus ring heater 9 has a heater 9a and an insulator 9b. The heater 9a is provided inside the insulator 9b and is enclosed in the insulator 9b. The heater 9a is supplied with electric power via a feed mechanism (not shown) to control the temperature of the focus ring 5. Thus, the temperature of the wafer W and the temperature of the focus ring 5 are independently controlled by different heaters. A feed bar 50 for supplying RF (Radio Frequency) power is connected to the base 3. The first RF power source 10a is connected to the power feeding rod 50 via the first integrator 11a, and the second RF power source 10b is connected via the second integrator 11b. The first RF power source 10a is a power source for generating plasma, and is configured to supply high frequency power of a specific frequency to the base 3 of the first mounting table 2 from the first RF power source 10a. Further, the second RF power source 10b is a power source for ion extraction (bias), and is configured to supply the base station 3 of the first stage 2 with a higher specific frequency than the first RF power source 10a from the second RF power source 10b. Frequency power. A refrigerant flow path 2d is formed inside the base 3. In the refrigerant flow path 2d, a refrigerant inlet pipe 2b is connected to one end, and a refrigerant outlet pipe 2c is connected to the other end. Further, a refrigerant flow path 7d is formed inside the base 8. In the refrigerant flow path 7d, a refrigerant inlet pipe 7b is connected to one end, and a refrigerant outlet pipe 7c is connected to the other end. The refrigerant flow path 2d is located below the wafer W and functions to absorb the heat of the wafer W. The refrigerant flow path 7d is located below the focus ring 5 and functions to absorb the heat of the focus ring 5. The plasma processing apparatus 10 is configured to individually control the temperatures of the first stage 2 and the second stage 7 by circulating a refrigerant, for example, cooling water, in the refrigerant flow path 2d and the refrigerant flow path 7d. Further, the plasma processing apparatus 10 may be configured to supply the cold heat transfer gas to the back side of the wafer W or the focus ring 5, and to individually control the temperature. For example, a gas supply pipe for supplying a cold heat transfer gas (back surface gas) such as helium gas may be provided on the back surface of the wafer W so as to penetrate the first mounting table 2 or the like. The gas supply pipe is connected to the gas supply source. With these configurations, the wafer W adsorbed and held by the electrostatic chuck 6 on the upper surface of the first stage 2 is controlled to a specific temperature. On the other hand, above the first mounting table 2, a shower head 16 having a function as an upper electrode is provided so as to face the first mounting table 2 in parallel with the ground. The shower head 16 and the first mounting table 2 function as a pair of electrodes (upper electrode and lower electrode). The shower head 16 is disposed at a top wall portion of the processing container 1. The shower head 16 includes a main body portion 16a and an upper plate 16b serving as an electrode plate, and is supported by the upper portion of the processing container 1 via an insulating member 95. The main body portion 16a is configured to include a conductive material, for example, aluminum having an anodized film formed on its surface, and detachably support the upper top plate 16b at a lower portion thereof. A gas diffusion chamber 16c is provided inside the main body portion 16a, and a plurality of gas flow holes 16d are formed at the bottom of the main body portion 16a so as to be located below the gas diffusion chamber 16c. Further, the gas introduction hole 16e is provided to overlap the gas flow hole 16d in the upper top plate 16b so as to penetrate the upper top plate 16b in the thickness direction. With this configuration, the processing gas supplied to the gas diffusion chamber 16c is dispersed and sprayed into the processing container 1 through the gas flow hole 16d and the gas introduction hole 16e. A gas introduction port 16g for introducing a processing gas into the gas diffusion chamber 16c is formed in the main body portion 16a. One end of the gas supply pipe 15a is connected to the gas introduction port 16g. At the other end of the gas supply pipe 15a, a processing gas supply source 15 for supplying a processing gas is connected. The gas supply pipe 15a is provided with a mass flow controller (MFC) 15b and an opening and closing valve V2 in this order from the upstream side. Further, the processing gas for plasma etching from the processing gas supply source 15 is supplied to the gas diffusion chamber 16c via the gas supply pipe 15a, and flows from the gas diffusion chamber 16c through the gas through the hole 16d and the gas introduction hole 16e. The mixture is dispersed into a spray form and supplied into the processing container 1. A variable DC power source 72 is electrically connected to the shower head 16 as the upper electrode via a low pass filter (LPF) 71. The variable DC power supply 72 is configured to be capable of turning on and off the feed by turning the switch 73 on and off. The current and voltage of the variable DC power source 72 and the turning on and off of the on/off switch 73 are controlled by the control unit 90 described below. When the high frequency is applied to the first mounting table 2 from the first RF power supply 10a and the second RF power supply 10b and plasma is generated in the processing space, the control unit 90 turns the switch on and off as necessary. 73 is turned on to apply a specific DC voltage to the shower head 16 as the upper electrode. Further, a cylindrical ground conductor 1a is provided so as to extend from the side wall of the processing container 1 to a position higher than the height of the shower head 16. The cylindrical ground conductor 1a has a top wall at an upper portion thereof. An exhaust port 81 is formed at the bottom of the processing container 1, and an exhaust device 83 is connected to the exhaust port 81 via an exhaust pipe 82. The exhaust device 83 has a vacuum pump configured to depressurize the inside of the processing container 1 to a specific degree of vacuum by actuating the vacuum pump. On the other hand, a loading/unloading port 84 for the wafer W is provided on the side wall of the processing container 1, and a gate valve 85 for opening and closing the loading/unloading port 84 is provided in the loading/unloading port 84. On the inner side of the side portion of the processing container 1, a reservoir mask 86 is provided along the inner wall surface. The reservoir mask 86 prevents etching by-products (storage) from adhering to the processing container 1. A conductive member (GND block) 89 that can be connected to the potential of the ground is provided at substantially the same height position as the wafer W of the reservoir mask 86, thereby preventing abnormal discharge. Further, a storage mask 87 extending along the first mounting table 2 is provided at the lower end portion of the storage mask 86. The storage masks 86 and 87 are detachably constructed. The plasma processing apparatus 10 having the above configuration controls the operation of the plasma processing apparatus 10 in a controlled manner. The control unit 90 is provided with a process controller 91 including a CPU and controlling each unit of the plasma processing apparatus 10, a user interface 92, and a memory unit 93. In order to allow the step manager to manage the plasma processing apparatus 10, the user interface 92 is constituted by a keyboard for inputting commands, and a display for visually displaying the operation state of the plasma processing apparatus 10. A recipe is stored in the memory unit 93, and the recipe memory is a control program (software) or processing condition data for realizing various processes executed by the plasma processing apparatus 10 under the control of the process controller 91. Further, if necessary, any place is called from the memory unit 93 by the instruction from the user interface 92 and the process controller 91 is executed, thereby being controlled by the process controller 91 in the plasma processing apparatus 10. Perform the required processing. In addition, prescriptions such as control programs or processing condition data can also be stored in a computer memory medium (such as a hard disk, a CD (Compact Disc), a floppy disk, a semiconductor memory, etc.) that can be read by a computer. Or use it online from other devices, for example, via a dedicated line. [Configuration of the First Mounting Table and the Second Mounting Table] Next, the configuration of the main parts of the first mounting table 2 and the second mounting table 7 according to the first embodiment will be described with reference to Fig. 2 . Fig. 2 is a schematic cross-sectional view showing a configuration of a main part of a first stage and a second stage according to the first embodiment. The first stage 2 includes a base 3 and an electrostatic chuck 6. The electrostatic chuck 6 is followed by the base 3 via the insulating layer 30. The electrostatic chuck 6 has a disk shape and is disposed coaxially with the base 3. The electrostatic chuck 6 is provided with an electrode 6a inside the insulator 6b. The upper surface of the electrostatic chuck 6 is a mounting surface 6d on which the wafer W is placed. At the lower end of the electrostatic chuck 6, a flange portion 6e that protrudes outward in the radial direction of the electrostatic chuck 6 is formed. That is, the outer diameter of the electrostatic chuck 6 differs depending on the position of the side surface. The electrostatic chuck 6 is provided with a heater 6c inside the insulator 6b. Further, a refrigerant flow path 2d is formed inside the base 3. The refrigerant flow path 2d and the heater 6c function as a temperature adjustment mechanism for adjusting the temperature of the wafer W. Furthermore, the heater 6c may not be present inside the insulator 6b. For example, the heater 6c may be attached to the back surface of the electrostatic chuck 6, and may be interposed between the mounting surface 6d and the refrigerant flow path 2d. Further, the heater 6c may be provided on the entire surface of the mounting surface 6d, or may be provided separately for each of the regions in which the mounting surface 6d is divided. In other words, the heater 6c may be provided in plural for each of the regions in which the placement surface 6d is divided. For example, the heater 6c may divide the mounting surface 6d of the first mounting table 2 into a plurality of regions based on the distance from the center, and extend in a ring shape so as to surround the center of the first mounting table 2 in each region. . Or it may include a heater that heats the central area and a heater that extends in a ring shape so as to surround the outer side of the central area. Further, a region extending in a ring shape so as to surround the center of the placement surface 6d may be divided into a plurality of regions in accordance with the direction from the center, and the heater 6c may be provided in each region. 3 is a plan view of the first mounting table and the second mounting table as seen from above. In Fig. 3, the mounting surface 6d of the first mounting table 2 is shown in a disk shape. The mounting surface 6d is divided into a plurality of regions HT1 in accordance with the distance and direction from the center, and the heater 6c is separately provided in each of the regions HT1. Thereby, the plasma processing apparatus 10 can control the temperature of the wafer W for each of the regions HT1. Go back to Figure 2. The second stage 7 includes a base 8 and a focus ring heater 9. The base 8 is supported on the base 3. The focus ring heater 9 is provided with a heater 9a inside the insulator 9b. Further, a refrigerant flow path 7d is formed inside the base 8. The refrigerant flow path 7d and the heater 9a function as a temperature adjustment mechanism that adjusts the temperature of the focus ring 5. The focus ring heater 9 is followed by the base 8 via the insulating layer 49. The upper surface of the focus ring heater 9 is a mounting surface 9d on which the focus ring 5 is placed. Further, a sheet member having a high thermal conductivity or the like may be provided on the upper surface of the focus ring heater 9. The focus ring 5 is an annular member that is disposed coaxially with the second stage 7. A convex portion 5a that protrudes inward in the radial direction is formed on the inner side surface of the focus ring 5. That is, the inner diameter of the focus ring 5 differs depending on the position of the inner side surface. For example, the inner diameter of the portion where the convex portion 5a is not formed is larger than the outer diameter of the wafer W and the outer diameter of the flange portion 6e of the electrostatic chuck 6. On the other hand, the inner diameter of the portion where the convex portion 5a is formed is smaller than the outer diameter of the flange portion 6e of the electrostatic chuck 6, and is larger than the outer diameter of the portion of the electrostatic chuck 6 where the flange portion 6e is not formed. The focus ring 5 is disposed on the second stage 7 so that the convex portion 5a is separated from the upper surface of the flange portion 6e of the electrostatic chuck 6 and is also separated from the side surface of the electrostatic chuck 6. That is, a gap is formed between the lower surface of the convex portion 5a of the focus ring 5 and the upper surface of the flange portion 6e of the electrostatic chuck 6. Further, a gap is formed between the side surface of the convex portion 5a of the focus ring 5 and the side surface of the electrostatic chuck 6 where the flange portion 6e is not formed. Further, the convex portion 5a of the focus ring 5 is positioned above the gap 34 between the base 3 of the first mounting table 2 and the base 8 of the second mounting table 7. That is, the convex portion 5a exists at a position overlapping the gap 34 and covers the gap 34 as viewed in a direction orthogonal to the mounting surface 6d. Thereby, the plasma can be suppressed from entering the gap 34. The heater 9a has a ring shape coaxial with the base 8. The heater 9a may be provided on the entire surface of the mounting surface 9d, or may be provided separately for each region in which the mounting surface 9d is divided. In other words, the heater 9a may be provided separately for each of the regions in which the placement surface 9d is divided. For example, the heater 9a may divide the mounting surface 9d of the second mounting table 7 into a plurality of regions in accordance with the direction from the center of the second mounting table 7, and install the heater 9a in each region. For example, in FIG. 3, the mounting surface 9d of the 2nd mounting stage 7 in the surroundings of the mounting surface 6d of the 1st mounting stage 2 is shown in the disk shape. The mounting surface 9d is divided into a plurality of regions HT2 in accordance with the direction from the center, and the heater 9a is separately provided in each of the regions HT2. Thereby, the plasma processing apparatus 10 can control the temperature of the focus ring 5 for each zone HT2. Go back to Figure 2. The plasma processing apparatus 10 is provided with a measuring unit 110 that measures the height of the upper surface of the focus ring 5. In the present embodiment, the height of the upper surface of the focus ring 5 is measured by the measuring unit 110 of the optical interferometer that measures the distance by the interference of the laser light. The measuring unit 110 has a light emitting portion 110a and an optical fiber 110b. On the first mounting table 2, a light emitting portion 110a is provided below the second mounting table 7. A quartz window 111 for blocking the vacuum is provided on the upper portion of the light emitting portion 110a. Further, an O-ring 112 for blocking the vacuum is provided between the first mounting table 2 and the second mounting table 7. Further, on the second mounting table 7, a through hole 113 penetrating to the upper surface is formed corresponding to the position at which the measuring unit 110 is provided. Further, a member for transmitting the laser light may be provided in the through hole 113. The light emitting portion 110a is connected to the measurement control unit 114 via the optical fiber 110b. The measurement control unit 114 incorporates a light source to generate laser light for measurement. The laser light generated by the measurement control unit 114 is emitted from the light emitting portion 110a via the optical fiber 110b. A portion of the laser light emitted from the light emitting portion 110a is partially reflected by the quartz window 111 or the focus ring 5, and the reflected laser light is incident on the light emitting portion 110a. Figure 4 is a diagram showing a reflection system of laser light. The quartz window 111 is subjected to an anti-reflection treatment on the surface of the light emitting portion 110a side to reduce the reflection of the laser light. As shown in FIG. 4, a part of the laser light emitted from the light emitting portion 110a is mainly reflected on the upper surface of the quartz window 111, the lower surface of the focus ring 5, and the upper surface of the focus ring 5, and is incident on the light emitting portion 110a. The light incident on the light emitting portion 110a is guided to the measurement control unit 114 via the optical fiber 110b. The measurement control unit 114 incorporates a spectroscope or the like, and measures the distance based on the interference state of the reflected laser light. For example, the measurement control unit 114 detects the intensity of the light for the difference in mutual distance between each of the reflecting surfaces based on the interference state of the incident laser light. Fig. 5 is a view showing an example of the distribution of the detection intensity of light. In the measurement control unit 114, the mutual distance between the reflecting surfaces is set to be the optical path length, and the intensity of the light is detected. The horizontal axis of the graph of Fig. 5 indicates the length of the optical path The mutual distance. A zero on the horizontal axis indicates the starting point of all mutual distances. The vertical axis of the graph of Fig. 5 indicates the intensity of the detected light. The optical interferometer measures the mutual distance based on the interference state of the reflected light. In the reflection, the optical path of the mutual distance is reciprocated twice. Therefore, the optical path length is measured as a mutual distance × 2 × refractive index. For example, the thickness of the quartz window 111 is set to X. 1 When the refractive index of the quartz is set to 3.6, the optical path length to the upper surface of the quartz window 111 when the lower surface of the quartz window 111 is used as the reference becomes X. 1 ×2×3.6=7.2X 1 . In the example of FIG. 5, the light reflected on the upper surface of the quartz window 111 is used as the optical path length of 7.2X. 1 Medium intensity peaks detected . Moreover, the thickness of the through hole 113 is set to X. 2 When the inside of the through hole 113 is air and the refractive index is 1.0, the optical path length to the lower surface of the focus ring 5 when the upper surface of the quartz window 111 is used as the reference becomes X. 2 ×2×1.0=2X 2 . In the example of FIG. 5, the light reflected on the lower surface of the focus ring 5 is used as the optical path length 2X. 2 The medium intensity has a peak and is detected. Also, the thickness of the focus ring 5 is set to X. 3 When the focus ring 5 is set to 矽 and the refractive index is set to 1.5, the optical path length to the upper surface of the focus ring 5 when the lower surface of the focus ring 5 is used as the reference becomes X. 3 ×2×1.5=3X 3 . In the example of FIG. 5, the reflected light on the surface of the focus ring 5 is taken as the optical path length 3X. 3 The medium intensity has a peak and is detected. Determine the thickness or material of the focus ring 5 of the new product. The measurement control unit 114 registers the thickness of the focus ring 5 of the new product or the refractive index of the material. The measurement control unit 114 calculates the optical path length corresponding to the thickness of the focus ring 5 of the new product or the refractive index of the material, and measures the thickness of the focus ring 5 from the position of the peak of the light whose intensity is the peak near the calculated optical path length. degree. For example, the measurement control unit 114 is 3X from the optical path length 3 The thickness of the focus ring 5 is measured at a position where the intensity of the vicinity of the peak becomes the peak of the light. The measurement control unit 114 outputs the measurement result to the control unit 90. Furthermore, the thickness of the focus ring 5 can also be measured by the control unit 90. For example, in the measurement control unit 114, the optical path length at which the detection intensity becomes a peak is measured, and the measurement result is output to the control unit 90. The control unit 90 registers the thickness of the focus ring 5 of the new product or the refractive index of the material. The control unit 90 can also calculate the optical path length corresponding to the thickness of the focus ring 5 of the new product or the refractive index of the material, and measure the thickness of the focus ring 5 from the position of the peak of the light whose intensity is the peak near the calculated optical path length. Go back to Figure 2. The first mounting table 2 is provided with an elevating mechanism 120 for elevating and lowering the second mounting table 7. For example, the first mounting table 2 is provided with a lifting mechanism 120 at a position that is a lower portion of the second mounting table 7. The elevating mechanism 120 incorporates an actuator, and the rod 120a expands and contracts by the driving force of the actuator to raise and lower the second stage 7. The elevating mechanism 120 may obtain a driving force for expanding and contracting the rod 120a by replacing the driving force of the motor with a gear or the like, or may obtain a driving force for expanding and contracting the rod 120a by hydraulic pressure or the like. Further, the first mounting table 2 is provided with a conduction portion 130 that is electrically connected to the second mounting table 7. The conduction portion 130 is configured to electrically connect the first mounting table 2 and the second mounting table 7 even when the second mounting table 7 is moved up and down by the elevating mechanism 120. For example, the conductive portion 130 constitutes a flexible wiring or a mechanism that electrically connects the conductor to the base 8 even when the second mounting table 7 moves up and down. The conduction portion 130 is provided so that the electrical characteristics of the second mounting table 7 and the first mounting table 2 are the same. For example, the conduction portion 130 is provided in plural numbers on the circumferential surface of the first mounting table 2. The RF power supplied to the first mounting table 2 is also supplied to the second mounting table 7 via the conduction portion 130. Further, the conduction portion 130 may be provided between the upper surface of the first mounting table 2 and the lower surface of the second mounting table 7. In the plasma processing apparatus 10 of the present embodiment, three sets of the measuring unit 110 and the elevating mechanism 120 are provided. For example, in the second mounting table 7, the measuring unit 110 and the elevating mechanism 120 are set as one set, and are disposed at equal intervals in the circumferential direction of the second mounting table 7. FIG. 3 shows the arrangement positions of the measuring unit 110 and the elevating mechanism 120. The measuring unit 110 and the elevating mechanism 120 are disposed at the same position on the second mounting table 7 at an angle of 120 degrees in the circumferential direction of the second mounting table 7. Further, the measurement unit 110 and the elevating mechanism 120 may be provided in four or more groups on the second mounting table 7. Further, the measuring unit 110 and the elevating mechanism 120 may be disposed apart from each other in the circumferential direction of the second mounting table 7. The measurement control unit 114 measures the thickness of the focus ring 5 at the position of each measurement unit 110, and outputs the measurement result to the control unit 90. The control unit 90 independently drives the elevating mechanism 120 so that the upper surface of the focus ring is maintained at a specific height based on the measurement result. For example, the control unit 90 raises and lowers the elevating mechanism 120 independently based on the measurement result of the measuring unit 110 for each of the measuring unit 110 and the elevating mechanism 120. For example, the control unit 90 specifies the consumption amount of the focus ring 5 based on the thickness of the focus ring 5 measured with respect to the thickness of the focus ring 5 of the new product, and controls the elevating mechanism 120 according to the consumption amount to raise the second stage 7 . For example, the control unit 90 controls the elevating mechanism 120 to raise the second mounting table 7 by the amount corresponding to the consumption of the focus ring 5. The consumption of the focus ring 5 is different in the circumferential direction of the second stage 7. As shown in FIG. 3, the plasma processing apparatus 10 arranges three or more sets of the measuring unit 110 and the lifting function 120, and specifies the consumption amount of the focus ring 5 for each arrangement portion, and controls the lifting mechanism 120 according to the consumption amount to make the second stage. 7 rose. Thereby, the plasma processing apparatus 10 can make the position of the upper surface of the focus ring 5 coincide with the upper surface of the wafer W in the circumferential direction. Thereby, the plasma processing apparatus 10 can maintain the uniformity of the circumferential direction of the etching characteristics. [Operation and Effect] Next, the action and effect of the plasma processing apparatus 10 of the present embodiment will be described. Fig. 6 is a view showing an example of a flow for raising the second stage. Fig. 6(A) shows a state in which the focus ring 5 of the new product is placed on the second stage 7. When the new focus ring 5 is placed on the second stage 7, the height is adjusted so that the upper surface of the focus ring 5 has a specific height. For example, when the new focus ring 5 is placed on the second stage 7, the height is adjusted so as to obtain the uniformity of the wafer W to be etched. The focus ring 5 is also consumed along with the etching process of the wafer W. Fig. 6(B) shows the state in which the focus ring 5 is consumed. In the example of Fig. 6(B), the upper surface of the focus ring 5 consumes 0.2 mm. The plasma processing apparatus 10 measures the height of the upper surface of the focus ring 5 using the measuring unit 110, and specifies the consumption amount of the focus ring 5. Then, the plasma processing apparatus 10 controls the elevating mechanism 120 to raise the second stage 7 in accordance with the amount of consumption. The measurement of the height of the focus ring 5 is preferably a timing at which the temperature in the processing container 1 is stabilized to the temperature at which the plasma treatment is performed. Moreover, the height of the focus ring 5 can be measured periodically in the etching process for one wafer W, once for each wafer W, or for each specific wafer. W is performed once, and can also be performed by the period specified by the manager. FIG. 6(C) shows a state in which the second stage 7 is raised. In the example of Fig. 6(C), the second stage 7 is raised by 0.2 mm and the upper surface of the focus ring 5 is raised by 0.2 mm. Furthermore, it is configured so as not to have an influence even if the second stage 7 is raised. For example, the refrigerant flow path 7d constitutes a flexible pipe or a mechanism capable of supplying a refrigerant even when the second stage 7 is moved up and down. The wiring for supplying electric power to the heater 9a constitutes a flexible wiring or a mechanism that is electrically connected even when the second mounting table 7 is raised and lowered. As a result, even when the focus ring 5 is consumed, the plasma processing apparatus 10 can suppress a decrease in etching characteristics in the vicinity of the periphery of the wafer W, and can suppress a decrease in the uniformity of the wafer W to be etched. Further, the plasma processing apparatus 10 raises the second stage 7 in a state where the focus ring 5 is placed. Thereby, the focus ring 5 can remove heat from the heat input of the plasma by the second stage 7. As a result, the plasma processing apparatus 10 can maintain the temperature of the focus ring 5 at a desired temperature, so that variations in etching characteristics caused by heat input from the plasma can be suppressed. Here, the effect will be described using a comparative example. Fig. 7 is a view showing an example of the configuration of a comparative example. The example of Fig. 7 shows a configuration in which only the focus ring 5 is raised by the drive mechanism 150 by the amount corresponding to the consumption of the focus ring 5. When the focus ring 5 is raised in accordance with the consumption, the focus ring 5 is separated from the mounting surface 151. When the focus ring 5 is separated from the mounting surface 151 as described above, the heat input from the plasma cannot be removed, and the focus ring 5 is heated to a high temperature and the etching characteristics are changed. Further, when the focus ring 5 is separated from the mounting surface 151, there is a change in the electrical properties or the applied voltage of the electrostatic charge or the impedance, and the electrical change affects the plasma, thereby causing a change in the etching characteristics. . Fig. 8 is a view showing an example of a change in etching characteristics. The horizontal axis of Fig. 8 indicates the distance from the center of the wafer W. The vertical axis of Fig. 8 indicates the etching amount at a position corresponding to the distance from the center of the wafer W when the etching amount of the center of the wafer W is 100%. FIG. 8 is a graph showing the amount of etching for the wafer W as a reference. In addition, FIG. 8 is a graph showing the etching amounts of the first block, the tenth block, and the twenty-th block when the wafer W is continuously subjected to the etching process. The graph of the first block becomes a graph close to the reference. On the other hand, the 10th block is far from the reference. Block 25 is farther from the benchmark than Block 10. The reason for this is that the focus ring 5 is brought to a high temperature by heat input from the plasma. That is, as shown in FIG. 7, when the focus ring 5 is raised in accordance with the consumption, the uniformity of the wafer W to be etched can be maintained for the first block, but the wafer W is continuously etched. At the time, the uniformity of the wafer W to be etched cannot be maintained. On the other hand, in the plasma processing apparatus 10 of the present embodiment, the second stage 7 is raised in a state in which the focus ring 5 is placed. Thereby, the plasma processing apparatus 10 can remove the heat input from the plasma of the focus ring 5 by the second stage 7, so that even when the wafer W is continuously etched, It is possible to suppress variations in etching characteristics. In this manner, the plasma processing apparatus 10 includes the first mounting table 2 on which the wafer W is placed, and the second mounting table 7 provided on the outer circumference of the first mounting table 2 and on which the focus ring 5 is placed and in which the temperature adjustment mechanism is provided. . Further, in the plasma processing apparatus 10, the elevating mechanism 120 raises and lowers the second stage 7. Accordingly, when the plasma processing apparatus 10 raises and lowers the second loading stage 7 by the elevating mechanism 120 to raise and lower the focus ring 5, the plasma from the focusing ring 5 can be used by the second mounting table 7. The heat input removes heat, so that the uniformity of the plasma treatment of the wafer W can be suppressed. Further, in the plasma processing apparatus 10, the second stage 7 and the first stage 2 are electrically connected. Therefore, when the plasma processing apparatus 10 raises and lowers the focus stage 5 by raising and lowering the second stage 7 by the elevating mechanism 120, the electrical characteristics of the focus ring 5 or the applied voltage can be suppressed from changing. Suppress changes in the characteristics of the plasma. Further, the plasma processing apparatus 10 has a measuring unit 110 that measures the height of the upper surface of the focus ring 5. Further, in the plasma processing apparatus 10, the elevating mechanism 120 drives the upper surface of the focus ring 5 so as to maintain a predetermined range with respect to the upper surface of the wafer W. The plasma processing apparatus 10 raises and lowers the second stage 7 by the elevating mechanism 120 to raise and lower the focus ring 5, thereby suppressing a change in the temperature of the focus ring 5. Further, the plasma processing apparatus 10 suppresses a change in the electrical characteristics of the focus ring 5 or a change in the applied voltage by turning on the second stage 7 and the first stage 2 . Therefore, in the plasma processing apparatus 10, the elevating mechanism 120 can suppress the wafer W by simply controlling the upper surface of the focus ring 5 to maintain a predetermined range with respect to the upper surface of the wafer W. The uniformity of the plasma treatment is reduced. In the plasma processing apparatus 10, the measurement unit 110 and the elevating mechanism 120 are provided in three or more sets with respect to the second mounting table 7, and are driven independently so that the upper surface of the focus ring 5 is maintained at a specific height. Thereby, the plasma processing apparatus 10 can make the position of the upper surface of the focus ring 5 with respect to the upper surface of the wafer W coincide in the circumferential direction. Thereby, the plasma processing apparatus 10 can maintain the uniformity of the circumferential direction of the etching characteristics. (Second Embodiment) Next, a second embodiment will be described. The schematic configuration of the plasma processing apparatus 10 of the second embodiment is the same as that of the plasma processing apparatus 10 of the first embodiment shown in Fig. 1. Therefore, the same portions are denoted by the same reference numerals, and the main points are different. The description is omitted. [Configuration of the First Mounting Table and the Second Mounting Table] The main components of the first mounting table 2 and the second mounting table 7 according to the second embodiment will be described with reference to Figs. 9 and 10 . Fig. 9 is a perspective view showing a configuration of essential parts of a first stage and a second stage according to the second embodiment. The first stage 2 includes a base 3. The base 3 is formed in a cylindrical shape, and the above-described electrostatic chuck 6 is disposed on one of the axial faces 3a. Further, the base 3 is provided with a flange portion 200 that protrudes outward along the outer circumference. The base 3 of the present embodiment is formed with a projecting portion 201 that increases the outer diameter and projects outwardly from the lower side of the side surface of the outer circumference, and is provided at a lower portion of the projecting portion of the side surface. The flange portion 200 protruding outward. The flange portion 200 has a through hole 210 penetrating through the axial direction at three or more positions in the circumferential direction of the upper surface. In the flange portion 200 of the present embodiment, three through holes 210 are formed at equal intervals in the circumferential direction. The second stage 7 includes a base 8 . The base 8 is formed into a cylindrical shape having an inner diameter larger than the outer diameter of the surface 3a of the base 3 by a specific size, and the focus ring heater 9 is disposed on one of the axial faces 8a. Further, the base 8 is provided with a columnar portion 220 at the same interval as the through hole 210 of the flange portion 200 on the lower surface. On the lower surface of the base 8 of the present embodiment, three columnar portions 220 are formed at equal intervals in the circumferential direction. The base 8 is disposed coaxially with the base 3, and is placed on the flange portion 200 of the base 3 so as to be aligned in the circumferential direction so that the columnar portion 220 is inserted into the through hole 210. Fig. 10 is a schematic cross-sectional view showing the configuration of essential parts of a first stage and a second stage in the second embodiment. The example of FIG. 10 is a cross-sectional view showing the first mounting table 2 and the second mounting table 7 at the position of the through hole 210. The base 3 is supported by a support table 4 for the insulator. A through hole 210 is formed in the base 3 and the support base 4. The through hole 210 is formed such that the diameter from the lower portion near the center is smaller than the upper portion, and the step 211 is formed. The columnar portion 220 corresponds to the through hole 210, and is formed such that the diameter from the lower portion near the center is smaller than the upper portion. The base 8 is disposed on the flange portion 200 of the base 3. The base 8 is formed to have an outer diameter larger than the base 3, and an annular portion 221 that protrudes toward the lower portion is formed in a portion of the lower surface of the lower surface of the base 3 that is larger than the outer surface of the base 3. When the base 8 is placed on the flange portion 200 of the base 3, the annular portion 221 is formed to cover the side surface of the flange portion 200. A columnar portion 220 is inserted into the through hole 210. An elevating mechanism 120 that elevates and lowers the second mounting table 7 is provided in each of the through holes 210. For example, the base 3 is provided with a lifting mechanism 120 for moving the columnar portion 220 up and down in the lower portion of each of the through holes 210. The elevating mechanism 120 has an actuator built therein, and the rod 120a is expanded and contracted by the driving force of the actuator to raise and lower the columnar portion 220. A sealing member is provided in the through hole 210. For example, a sealing member 240 such as an O-ring is provided along the circumferential direction of the through hole in a direction in which the through hole 210 faces the columnar portion 220. The seal 240 is in contact with the columnar portion 220. Further, a sealing member is provided on the surface of the base 8 and the base 3 which are parallel to the axial direction. For example, the base 3 is provided on the side surface of the projecting portion 201 with a seal 241 along the circumferential surface. The base 3 is provided on the side surface of the flange portion 200 with a seal 242 along the circumferential surface. Further, the base 3 is provided with a conductive portion 250 electrically connected to the base 8 at a portion of the circumferential surface near the step 211 of the through hole 210. The conducting portion 250 is configured to electrically connect the base 3 and the base 8 even when the base 8 is raised and lowered by the lifting mechanism 120. For example, the conductive portion 250 constitutes a flexible wiring or a mechanism that electrically connects the conductor to the base 8 even when the base 8 is raised and lowered. The conduction portion 250 is provided in such a manner that the electrical characteristics of the base 3 and the base 8 are the same. Further, the base 3 is provided with a duct 260 connected to the lower portion of the inner side of the base 3 at a step 211 of the through hole 210. The duct 260 is connected to a vacuum pump (not shown). The vacuum pump may be provided in the first exhaust device 83 or may be separately provided. In the plasma processing apparatus 10 of the second embodiment, the vacuum pump is operated to evacuate via the conduit 260, and the seal member 240, the seal member 241, and the seal member 242 are formed between the base 8 and the base 3. Space is decompressed. The space on the lower side of the first stage 2 is set to atmospheric pressure. For example, the support table 4 is formed with a space 270 at the lower portion of the inner side, and is set to atmospheric pressure. The through hole 210 is electrically connected to the space 270. The plasma processing apparatus 10 seals the through hole 210 by the sealing member 240, thereby suppressing the atmospheric pressure inside the base 3 from flowing into the processing container 1. In the plasma processing apparatus 10, when the columnar portion 220 is moved up and down by the elevating mechanism 120, the atmosphere flows from the sealing member 240 as the columnar portion 220 moves. Therefore, in the plasma processing apparatus 10, the space formed by the seal 240, the seal 241, and the seal 242 between the base 8 and the base 3 is decompressed by vacuuming the duct 260. Thereby, in the plasma processing apparatus 10, the inflow of the atmosphere from the portion of the sealing member 240 into the processing container 1 can be suppressed. Further, in the plasma processing apparatus 10, even when particles are generated in the conduction portion 250 or the like, the catheter 260 can be evacuated to suppress the flow of particles into the processing container 1. Further, in the plasma processing apparatus 10, the through hole 210 is sealed by the sealing member 240, and the vacuum is applied by the conduit 260, and the seal member 240, the sealing member 241, and the seal between the base 8 and the base 3 are sealed. The space formed by the member 242 is decompressed. Thereby, in the base 3, only the area amount corresponding to the columnar portion 220 is not subjected to the reaction force of the atmospheric pressure. For example, when the vacuum is not applied by the conduit 260, the reaction force of the atmospheric pressure is about 200 kgf. However, when the vacuum is applied by the conduit 260, the reaction force of the atmospheric pressure is reduced to about 15 kgf. Thereby, the load of the actuator of the elevating mechanism 120 when the second mounting table 7 is moved up and down can be reduced. In this manner, the first mounting table 2 is provided with the flange portion 200 that protrudes outward along the outer circumference, and has a through hole 210 penetrating through the axial direction at three or more positions in the circumferential direction. The second mounting table 7 is provided with a columnar portion 220 which is disposed above the flange portion 200 along the outer circumference of the first mounting table 2 and corresponds to the through hole 210 on the lower surface of the flange portion 200. The position is inserted into the through hole 210. The elevating mechanism 120 moves the second mounting table 7 up and down by moving the columnar portion 220 in the axial direction with respect to the through hole 210. Further, in the plasma processing apparatus 10, the first sealing member (seal 240) that is in contact with the columnar portion 220 and sealed is provided in the through hole 210. In the plasma processing apparatus 10, a second sealing member that seals between the first mounting table 2 and the second mounting table 7 is provided on a surface parallel to the axial direction of the first mounting table 2 and the second mounting table 7 ( Seal 241, seal 242). The plasma processing apparatus 10 has a pressure reducing portion (conduit 260, vacuum pump) that decompresses a space formed by the first sealing member and the second sealing member between the first mounting table 2 and the second mounting table 7. As a result, the plasma processing apparatus 10 of the second embodiment can suppress the inflow of air into the processing container 1. Further, the plasma processing apparatus 10 can suppress the inflow of particles into the processing container 1. Further, the plasma processing apparatus 10 can reduce the load of the actuator of the elevating mechanism 120 when the second stage 7 is moved up and down. Although various embodiments have been described above, the present invention is not limited to the above-described embodiments, and various modifications can be made. For example, the plasma processing apparatus 10 described above is a capacitively coupled plasma processing apparatus 10, but any of the plasma processing apparatuses 10 may be employed. For example, the plasma processing apparatus 10 may be any type of plasma processing apparatus 10 such as an inductively coupled plasma processing apparatus 10 and a plasma processing apparatus 10 that excites gas by surface waves such as microwaves. Further, in the above-described embodiment, the case where the first mounting table 2 and the second mounting table 7 are electrically connected by the conduction portion 130 has been described as an example, but the present invention is not limited thereto. For example, the second stage 7 and the RF power source that supplies RF power to the first stage 2 may be turned on. For example, the second stage 7 may be supplied with RF power supplied from the first integrator 11a and the second integrator 11b. Further, in the above-described embodiment, the case where the second stage 7 is provided with the refrigerant flow path 7d and the heater 9a as the temperature adjustment mechanism for adjusting the temperature of the focus ring 5 has been described as an example, but the present invention is not limited thereto. . For example, the second stage 7 may be provided with only one of the refrigerant flow path 7d or the heater 9a. Further, the temperature adjustment mechanism may be any temperature as long as the temperature of the focus ring 5 can be adjusted, and is not limited to the refrigerant flow path 7d and the heater 9a. Further, in the above-described embodiment, the case where the second mounting table 7 is raised by the amount of consumption of the upper surface of the focus ring 5 has been described as an example. However, the present invention is not limited thereto. For example, the plasma processing apparatus 10 can also raise and lower the second stage 7 according to the type of plasma processing performed, and change the position of the focus ring 5 with respect to the wafer W. For example, the plasma processing apparatus 10 memorizes the position of the focus ring 5 in the memory unit 93 for each type of plasma processing. The process controller 91 can also raise and lower the focus ring 5 in such a manner that the position of the focus ring 5 corresponding to the type of plasma processing to be performed is read from the memory unit 93, and the second stage 7 is moved up and down to become a read. Out of position. Further, in the processing of one wafer W, the plasma processing apparatus 10 can also raise and lower the second stage 7, and change the position of the focus ring 5 with respect to the wafer W. For example, the plasma processing apparatus 10 memorizes the position of the focus ring 5 in the memory portion 93 for each process of the plasma processing. The process controller 91 can also read the position of the focus ring 5 of each process of the plasma processing to be performed from the memory unit 93, and in the plasma processing, the second stage 7 is lifted and lowered according to the process to be performed, and The focus ring 5 is raised and lowered to become a position corresponding to the process to be performed.
1‧‧‧處理容器1‧‧‧Processing container
1a‧‧‧接地導體1a‧‧‧Ground conductor
2‧‧‧第1載置台2‧‧‧1st stage
2b‧‧‧冷媒入口配管2b‧‧‧Refrigerant inlet piping
2c‧‧‧冷媒出口配管2c‧‧‧Refrigerant export piping
2d‧‧‧冷媒流路2d‧‧‧Refrigerant flow path
3‧‧‧基台3‧‧‧Abutment
4‧‧‧支持台4‧‧‧Support desk
5‧‧‧聚焦環5‧‧‧ Focus ring
5a‧‧‧凸部5a‧‧‧ convex
6‧‧‧靜電吸盤6‧‧‧Electrostatic suction cup
6a‧‧‧電極6a‧‧‧electrode
6b‧‧‧絕緣體6b‧‧‧Insulator
6c‧‧‧加熱器6c‧‧‧heater
6d‧‧‧載置面6d‧‧‧Loading surface
6e‧‧‧氣體導入孔6e‧‧‧ gas introduction hole
7‧‧‧第2載置台7‧‧‧2nd stage
7b‧‧‧冷媒入口配管7b‧‧‧Refrigerant inlet piping
7c‧‧‧冷媒出口配管7c‧‧‧Refrigerant export piping
7d‧‧‧冷媒流路7d‧‧‧Refrigerant flow path
8‧‧‧基台8‧‧‧Abutment
8a‧‧‧一面8a‧‧‧ side
9‧‧‧聚焦環加熱器9‧‧‧ Focus ring heater
9a‧‧‧加熱器9a‧‧‧heater
9b‧‧‧絕緣體9b‧‧‧Insulator
9d‧‧‧載置面9d‧‧‧Loading surface
10‧‧‧電漿處理裝置10‧‧‧ Plasma processing unit
10a‧‧‧第1RF電源10a‧‧‧1RF power supply
10b‧‧‧第2RF電源10b‧‧‧2RF power supply
11b‧‧‧第2整合器11b‧‧‧2nd Integrator
12‧‧‧直流電源12‧‧‧DC power supply
15‧‧‧處理氣體供給源15‧‧‧Processing gas supply
15a‧‧‧氣體供給配管15a‧‧‧Gas supply piping
15b‧‧‧質量流量控制器15b‧‧‧mass flow controller
16‧‧‧簇射頭16‧‧‧Tufted head
16a‧‧‧本體部16a‧‧‧ Body Department
16b‧‧‧上部頂板16b‧‧‧Upper roof
16c‧‧‧氣體擴散室16c‧‧‧Gas diffusion chamber
16d‧‧‧氣體流經孔16d‧‧‧ gas flow through the hole
16e‧‧‧氣體導入孔16e‧‧‧ gas introduction hole
16g‧‧‧氣體導入口16g‧‧‧ gas inlet
30‧‧‧絕緣層30‧‧‧Insulation
34‧‧‧間隙34‧‧‧ gap
49‧‧‧絕緣層49‧‧‧Insulation
50‧‧‧饋電棒50‧‧‧Feed rod
71‧‧‧低通濾波器71‧‧‧ low pass filter
72‧‧‧可變直流電源72‧‧‧Variable DC power supply
73‧‧‧開關73‧‧‧ switch
81‧‧‧排氣口81‧‧‧Exhaust port
82‧‧‧排氣管82‧‧‧Exhaust pipe
83‧‧‧排氣裝置83‧‧‧Exhaust device
84‧‧‧搬入搬出口84‧‧‧ Move in and out
85‧‧‧閘閥85‧‧‧ gate valve
86‧‧‧積存物遮罩86‧‧‧ Storage mask
87‧‧‧積存物遮罩87‧‧‧ Storage mask
89‧‧‧導電性構件89‧‧‧Electrical components
90‧‧‧控制部90‧‧‧Control Department
91‧‧‧製程控制器91‧‧‧Process Controller
92‧‧‧使用者介面92‧‧‧User interface
93‧‧‧記憶部93‧‧‧Memory Department
95‧‧‧絕緣性構件95‧‧‧Insulating components
110‧‧‧測定部110‧‧‧Determination Department
110a‧‧‧光射出部110a‧‧‧Lighting Department
110b‧‧‧光纖110b‧‧‧Fiber
111‧‧‧石英窗111‧‧‧Quartz window
112‧‧‧O形環112‧‧‧O-ring
113‧‧‧貫通孔113‧‧‧through holes
114‧‧‧測定控制單元114‧‧‧Measurement control unit
120‧‧‧升降機構120‧‧‧ Lifting mechanism
120a‧‧‧桿120a‧‧‧ pole
130‧‧‧導通部130‧‧‧Training Department
150‧‧‧驅動機構150‧‧‧ drive mechanism
151‧‧‧載置面151‧‧‧Loading surface
200‧‧‧凸緣部200‧‧‧Flange
201‧‧‧伸出部201‧‧‧Outreach
210‧‧‧貫通孔210‧‧‧through holes
211‧‧‧階211‧‧‧
220‧‧‧柱狀部220‧‧‧ Column
221‧‧‧圓環部221‧‧‧Round Department
240‧‧‧密封件240‧‧‧Seal
241‧‧‧密封件241‧‧‧Seal
242‧‧‧密封件242‧‧‧Seal
250‧‧‧導通部250‧‧‧Training Department
260‧‧‧導管260‧‧‧ catheter
270‧‧‧空間270‧‧‧ space
HT1‧‧‧區域HT1‧‧‧ area
HT2‧‧‧區域HT2‧‧‧ area
V2‧‧‧開閉閥V2‧‧‧Opening valve
W‧‧‧ 晶圓W‧‧‧ Wafer
X1‧‧‧石英窗之厚度X 1 ‧‧‧Crystal window thickness
X2‧‧‧貫通孔之厚度X 2 ‧‧‧through hole thickness
X3‧‧‧聚焦環之厚度X 3 ‧‧‧ thickness of the focus ring
圖1係表示實施形態之電漿處理裝置之概略構成之概略剖視圖。 圖2係表示第1實施形態之第1載置台及第2載置台之要部構成之概略剖視圖。 圖3係自上方向觀察第1載置台及第2載置台之俯視圖。 圖4係表示雷射光之反射系統之圖。 圖5係表示光之檢測強度之分佈之一例的圖。 圖6(A)~(C)係說明使第2載置台上升之流程之一例之圖。 圖7係表示比較例之構成之一例之圖。 圖8係表示蝕刻特性之變化之一例之圖。 圖9係表示第2實施形態之第1載置台及第2載置台之要部構成之立體圖。 圖10係表示第2實施形態之第1載置台及第2載置台之要部構成之概略剖視圖。Fig. 1 is a schematic cross-sectional view showing a schematic configuration of a plasma processing apparatus according to an embodiment. Fig. 2 is a schematic cross-sectional view showing a configuration of a main part of a first stage and a second stage according to the first embodiment. 3 is a plan view of the first mounting table and the second mounting table as seen from above. Figure 4 is a diagram showing a reflection system of laser light. Fig. 5 is a view showing an example of a distribution of light detection intensity. 6(A) to 6(C) are views showing an example of a flow for raising the second stage. Fig. 7 is a view showing an example of the configuration of a comparative example. Fig. 8 is a view showing an example of a change in etching characteristics. Fig. 9 is a perspective view showing a configuration of essential parts of a first stage and a second stage according to the second embodiment. Fig. 10 is a schematic cross-sectional view showing the configuration of essential parts of a first stage and a second stage in the second embodiment.
Claims (7)
Applications Claiming Priority (4)
| Application Number | Priority Date | Filing Date | Title |
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| JP2017087052 | 2017-04-26 | ||
| JP2017-087052 | 2017-04-26 | ||
| JP2018000367A JP7033926B2 (en) | 2017-04-26 | 2018-01-05 | Plasma processing equipment |
| JP2018-000367 | 2018-01-05 |
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| Publication Number | Publication Date |
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| TW201842578A true TW201842578A (en) | 2018-12-01 |
| TWI797119B TWI797119B (en) | 2023-04-01 |
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| TW107113489A TWI797119B (en) | 2017-04-26 | 2018-04-20 | Plasma processing apparatus |
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| Country | Link |
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| JP (1) | JP7033926B2 (en) |
| SG (1) | SG10201803285XA (en) |
| TW (1) | TWI797119B (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
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| CN111725045A (en) * | 2019-03-22 | 2020-09-29 | 东京毅力科创株式会社 | Substrate processing apparatus and method for detecting presence or absence of focus ring on mounting table |
| CN112309819A (en) * | 2019-08-02 | 2021-02-02 | 东京毅力科创株式会社 | Edge ring, mounting table, substrate processing apparatus, and substrate processing method |
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| US10784089B2 (en) * | 2019-02-01 | 2020-09-22 | Applied Materials, Inc. | Temperature and bias control of edge ring |
| KR102228545B1 (en) * | 2019-04-03 | 2021-03-16 | 주식회사 테스 | Substrate processing apparatus |
| KR102477910B1 (en) * | 2019-07-02 | 2022-12-16 | 세메스 주식회사 | Apparatus and method for treating substrate |
| US11551916B2 (en) * | 2020-03-20 | 2023-01-10 | Applied Materials, Inc. | Sheath and temperature control of a process kit in a substrate processing chamber |
| CN113838732B (en) * | 2020-06-08 | 2023-10-31 | 中微半导体设备(上海)股份有限公司 | Focusing ring lifting mechanism, installation method and plasma processing device |
| US11721569B2 (en) | 2021-06-18 | 2023-08-08 | Applied Materials, Inc. | Method and apparatus for determining a position of a ring within a process kit |
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| JP2001230239A (en) | 2000-02-15 | 2001-08-24 | Tokyo Electron Ltd | Apparatus and method for treating |
| JP3388228B2 (en) | 2000-12-07 | 2003-03-17 | 株式会社半導体先端テクノロジーズ | Plasma etching apparatus and plasma etching method |
| JP4596883B2 (en) | 2004-10-28 | 2010-12-15 | 京セラ株式会社 | Annular heater |
| JP2006173223A (en) | 2004-12-14 | 2006-06-29 | Toshiba Corp | Plasma etching device and plasma etching method using the same |
| US7544270B2 (en) * | 2005-11-14 | 2009-06-09 | Infineon Technologies Ag | Apparatus for processing a substrate |
| JP2011210853A (en) | 2010-03-29 | 2011-10-20 | Tokyo Electron Ltd | Method for measuring wear rate |
| JP5584517B2 (en) * | 2010-05-12 | 2014-09-03 | 東京エレクトロン株式会社 | Plasma processing apparatus and semiconductor device manufacturing method |
| US9508530B2 (en) * | 2011-11-21 | 2016-11-29 | Lam Research Corporation | Plasma processing chamber with flexible symmetric RF return strap |
| JP6080571B2 (en) * | 2013-01-31 | 2017-02-15 | 東京エレクトロン株式会社 | Mounting table and plasma processing apparatus |
| JP6689020B2 (en) * | 2013-08-21 | 2020-04-28 | 東京エレクトロン株式会社 | Plasma processing device |
| CN105575863B (en) * | 2014-11-10 | 2019-02-22 | 中微半导体设备(上海)有限公司 | Plasma processing apparatus, substrate discharge mechanism and method |
| KR20170014384A (en) | 2015-07-30 | 2017-02-08 | 삼성전자주식회사 | Dry etching apparatus |
| JP6541565B2 (en) | 2015-09-25 | 2019-07-10 | 東京エレクトロン株式会社 | Mounting table and plasma processing apparatus |
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2018
- 2018-01-05 JP JP2018000367A patent/JP7033926B2/en active Active
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Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN111725045A (en) * | 2019-03-22 | 2020-09-29 | 东京毅力科创株式会社 | Substrate processing apparatus and method for detecting presence or absence of focus ring on mounting table |
| CN111725045B (en) * | 2019-03-22 | 2024-04-16 | 东京毅力科创株式会社 | Substrate processing apparatus and method for detecting presence or absence of focus ring on mounting table |
| CN112309819A (en) * | 2019-08-02 | 2021-02-02 | 东京毅力科创株式会社 | Edge ring, mounting table, substrate processing apparatus, and substrate processing method |
Also Published As
| Publication number | Publication date |
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| TWI797119B (en) | 2023-04-01 |
| JP7033926B2 (en) | 2022-03-11 |
| SG10201803285XA (en) | 2018-11-29 |
| JP2018186263A (en) | 2018-11-22 |
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