TWI800618B - Plasma processing apparatus - Google Patents
Plasma processing apparatus Download PDFInfo
- Publication number
- TWI800618B TWI800618B TW108108426A TW108108426A TWI800618B TW I800618 B TWI800618 B TW I800618B TW 108108426 A TW108108426 A TW 108108426A TW 108108426 A TW108108426 A TW 108108426A TW I800618 B TWI800618 B TW I800618B
- Authority
- TW
- Taiwan
- Prior art keywords
- processing apparatus
- plasma processing
- plasma
- processing
- Prior art date
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
- H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
- H01J37/32—Gas-filled discharge tubes
- H01J37/32431—Constructional details of the reactor
- H01J37/32715—Workpiece holder
- H01J37/32724—Temperature
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
- H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
- H01J37/32—Gas-filled discharge tubes
- H01J37/32009—Arrangements for generation of plasma specially adapted for examination or treatment of objects, e.g. plasma sources
- H01J37/32082—Radio frequency generated discharge
- H01J37/32174—Circuits specially adapted for controlling the RF discharge
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
- H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
- H01J37/32—Gas-filled discharge tubes
- H01J37/32431—Constructional details of the reactor
- H01J37/32715—Workpiece holder
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L21/6831—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using electrostatic chucks
- H01L21/6833—Details of electrostatic chucks
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05H—PLASMA TECHNIQUE; PRODUCTION OF ACCELERATED ELECTRICALLY-CHARGED PARTICLES OR OF NEUTRONS; PRODUCTION OR ACCELERATION OF NEUTRAL MOLECULAR OR ATOMIC BEAMS
- H05H1/00—Generating plasma; Handling plasma
- H05H1/24—Generating plasma
- H05H1/46—Generating plasma using applied electromagnetic fields, e.g. high frequency or microwave energy
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05H—PLASMA TECHNIQUE; PRODUCTION OF ACCELERATED ELECTRICALLY-CHARGED PARTICLES OR OF NEUTRONS; PRODUCTION OR ACCELERATION OF NEUTRAL MOLECULAR OR ATOMIC BEAMS
- H05H2242/00—Auxiliary systems
- H05H2242/20—Power circuits
Applications Claiming Priority (4)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2018-057734 | 2018-03-26 | ||
JP2018057734 | 2018-03-26 | ||
JP2019-029689 | 2019-02-21 | ||
JP2019029689A JP7208819B2 (en) | 2018-03-26 | 2019-02-21 | Plasma processing equipment |
Publications (2)
Publication Number | Publication Date |
---|---|
TW201941665A TW201941665A (en) | 2019-10-16 |
TWI800618B true TWI800618B (en) | 2023-05-01 |
Family
ID=68169689
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
TW108108426A TWI800618B (en) | 2018-03-26 | 2019-03-13 | Plasma processing apparatus |
Country Status (4)
Country | Link |
---|---|
JP (1) | JP7208819B2 (en) |
KR (1) | KR102641619B1 (en) |
CN (1) | CN110366304B (en) |
TW (1) | TWI800618B (en) |
Families Citing this family (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2023012988A (en) * | 2021-07-15 | 2023-01-26 | 東京エレクトロン株式会社 | Filter circuit and plasma processing apparatus |
Citations (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US20100194278A1 (en) * | 2009-02-02 | 2010-08-05 | Chien Ouyang | Flow manipulation with micro plasma |
CN101974735A (en) * | 2007-11-21 | 2011-02-16 | 东京毅力科创株式会社 | Inductively coupled plasma processing apparatus |
US20140110061A1 (en) * | 2012-10-19 | 2014-04-24 | Tokyo Electron Limited | Plasma processing apparatus |
TW201743661A (en) * | 2011-11-22 | 2017-12-16 | 蘭姆研究公司 | Systems and methods for controlling a plasma edge region |
Family Cites Families (13)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2002185339A (en) * | 2000-12-12 | 2002-06-28 | Kokusai Denki Engineering:Kk | Radiating element and high frequency electronic circuit board using the same |
US6541764B2 (en) * | 2001-03-21 | 2003-04-01 | Archimedes Technology Group, Inc. | Helically symmetric plasma mass filter |
US7209096B2 (en) * | 2004-01-22 | 2007-04-24 | Antenex, Inc. | Low visibility dual band antenna with dual polarization |
JP5042661B2 (en) * | 2007-02-15 | 2012-10-03 | 東京エレクトロン株式会社 | Plasma processing apparatus and filter unit |
JP5301812B2 (en) * | 2007-11-14 | 2013-09-25 | 東京エレクトロン株式会社 | Plasma processing equipment |
JP6027374B2 (en) * | 2012-09-12 | 2016-11-16 | 東京エレクトロン株式会社 | Plasma processing apparatus and filter unit |
JP6081292B2 (en) | 2012-10-19 | 2017-02-15 | 東京エレクトロン株式会社 | Plasma processing equipment |
JP5734353B2 (en) * | 2013-06-20 | 2015-06-17 | 東京エレクトロン株式会社 | Plasma processing equipment |
JP6218650B2 (en) * | 2014-03-11 | 2017-10-25 | 東京エレクトロン株式会社 | Plasma processing equipment |
JP6219227B2 (en) | 2014-05-12 | 2017-10-25 | 東京エレクトロン株式会社 | Heater feeding mechanism and stage temperature control method |
JP6219229B2 (en) | 2014-05-19 | 2017-10-25 | 東京エレクトロン株式会社 | Heater feeding mechanism |
JP2016001647A (en) | 2014-06-11 | 2016-01-07 | 東京エレクトロン株式会社 | Plasma processing apparatus |
US10715095B2 (en) | 2017-10-06 | 2020-07-14 | Lam Research Corporation | Radiofrequency (RF) filter for multi-frequency RF bias |
-
2019
- 2019-02-21 JP JP2019029689A patent/JP7208819B2/en active Active
- 2019-03-13 TW TW108108426A patent/TWI800618B/en active
- 2019-03-25 KR KR1020190033475A patent/KR102641619B1/en active IP Right Grant
- 2019-03-26 CN CN201910232867.2A patent/CN110366304B/en active Active
Patent Citations (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN101974735A (en) * | 2007-11-21 | 2011-02-16 | 东京毅力科创株式会社 | Inductively coupled plasma processing apparatus |
US20100194278A1 (en) * | 2009-02-02 | 2010-08-05 | Chien Ouyang | Flow manipulation with micro plasma |
TW201743661A (en) * | 2011-11-22 | 2017-12-16 | 蘭姆研究公司 | Systems and methods for controlling a plasma edge region |
US20140110061A1 (en) * | 2012-10-19 | 2014-04-24 | Tokyo Electron Limited | Plasma processing apparatus |
Also Published As
Publication number | Publication date |
---|---|
KR20190112664A (en) | 2019-10-07 |
JP7208819B2 (en) | 2023-01-19 |
CN110366304A (en) | 2019-10-22 |
CN110366304B (en) | 2022-12-23 |
TW201941665A (en) | 2019-10-16 |
JP2019176138A (en) | 2019-10-10 |
KR102641619B1 (en) | 2024-02-27 |
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