SG11201803057VA - Receiving system for components - Google Patents
Receiving system for componentsInfo
- Publication number
- SG11201803057VA SG11201803057VA SG11201803057VA SG11201803057VA SG11201803057VA SG 11201803057V A SG11201803057V A SG 11201803057VA SG 11201803057V A SG11201803057V A SG 11201803057VA SG 11201803057V A SG11201803057V A SG 11201803057VA SG 11201803057V A SG11201803057V A SG 11201803057VA
- Authority
- SG
- Singapore
- Prior art keywords
- components
- receiving system
- receiving
- Prior art date
Links
Classifications
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67132—Apparatus for placing on an insulating substrate, e.g. tape
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67144—Apparatus for mounting on conductive members, e.g. leadframes or conductors on insulating substrates
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67242—Apparatus for monitoring, sorting or marking
- H01L21/67259—Position monitoring, e.g. misposition detection or presence detection
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67242—Apparatus for monitoring, sorting or marking
- H01L21/67288—Monitoring of warpage, curvature, damage, defects or the like
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
- H01L21/67703—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations between different workstations
- H01L21/67721—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations between different workstations the substrates to be conveyed not being semiconductor wafers or large planar substrates, e.g. chips, lead frames
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/68—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for positioning, orientation or alignment
- H01L21/681—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for positioning, orientation or alignment using optical controlling means
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L21/6835—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L21/6835—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support
- H01L21/6836—Wafer tapes, e.g. grinding or dicing support tapes
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
- H01L24/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies
- H01L24/75—Apparatus for connecting with bump connectors or layer connectors
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
- H05K13/02—Feeding of components
- H05K13/021—Loading or unloading of containers
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
- H05K13/08—Monitoring manufacture of assemblages
- H05K13/081—Integration of optical monitoring devices in assembly lines; Processes using optical monitoring devices specially adapted for controlling devices or machines in assembly lines
- H05K13/0813—Controlling of single components prior to mounting, e.g. orientation, component geometry
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B38/00—Ancillary operations in connection with laminating processes
- B32B38/10—Removing layers, or parts of layers, mechanically or chemically
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B43/00—Operations specially adapted for layered products and not otherwise provided for, e.g. repairing; Apparatus therefor
- B32B43/006—Delaminating
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67242—Apparatus for monitoring, sorting or marking
- H01L21/67259—Position monitoring, e.g. misposition detection or presence detection
- H01L21/67265—Position monitoring, e.g. misposition detection or presence detection of substrates stored in a container, a magazine, a carrier, a boat or the like
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
- H01L21/67703—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations between different workstations
- H01L21/67706—Mechanical details, e.g. roller, belt
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2221/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof covered by H01L21/00
- H01L2221/67—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere
- H01L2221/683—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L2221/68304—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support
- H01L2221/68313—Auxiliary support including a cavity for storing a finished device, e.g. IC package, or a partly finished device, e.g. die, during manufacturing or mounting
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2221/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof covered by H01L21/00
- H01L2221/67—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere
- H01L2221/683—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L2221/68304—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support
- H01L2221/68368—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support used in a transfer process involving at least two transfer steps, i.e. including an intermediate handle substrate
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies and for methods related thereto
- H01L2224/75—Apparatus for connecting with bump connectors or layer connectors
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies and for methods related thereto
- H01L2224/75—Apparatus for connecting with bump connectors or layer connectors
- H01L2224/757—Means for aligning
- H01L2224/75753—Means for optical alignment, e.g. sensors
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies and for methods related thereto
- H01L2224/75—Apparatus for connecting with bump connectors or layer connectors
- H01L2224/758—Means for moving parts
- H01L2224/75821—Upper part of the bonding apparatus, i.e. bonding head
- H01L2224/75822—Rotational mechanism
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies and for methods related thereto
- H01L2224/75—Apparatus for connecting with bump connectors or layer connectors
- H01L2224/758—Means for moving parts
- H01L2224/75821—Upper part of the bonding apparatus, i.e. bonding head
- H01L2224/75822—Rotational mechanism
- H01L2224/75823—Pivoting mechanism
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies and for methods related thereto
- H01L2224/75—Apparatus for connecting with bump connectors or layer connectors
- H01L2224/758—Means for moving parts
- H01L2224/75821—Upper part of the bonding apparatus, i.e. bonding head
- H01L2224/75824—Translational mechanism
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
- H05K13/04—Mounting of components, e.g. of leadless components
- H05K13/0417—Feeding with belts or tapes
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T156/00—Adhesive bonding and miscellaneous chemical manufacture
- Y10T156/11—Methods of delaminating, per se; i.e., separating at bonding face
- Y10T156/1126—Using direct fluid current against work during delaminating
- Y10T156/1132—Using vacuum directly against work during delaminating
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- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T156/00—Adhesive bonding and miscellaneous chemical manufacture
- Y10T156/19—Delaminating means
- Y10T156/1928—Differential fluid pressure delaminating means
- Y10T156/1944—Vacuum delaminating means [e.g., vacuum chamber, etc.]
Landscapes
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Computer Hardware Design (AREA)
- Power Engineering (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Operations Research (AREA)
- Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
- Investigating Materials By The Use Of Optical Means Adapted For Particular Applications (AREA)
- Specific Conveyance Elements (AREA)
- Preliminary Treatment Of Fibers (AREA)
- Spray Control Apparatus (AREA)
- Manipulator (AREA)
- Testing Or Measuring Of Semiconductors Or The Like (AREA)
- Investigating Or Analyzing Materials By The Use Of Ultrasonic Waves (AREA)
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
DE102015013495.7A DE102015013495B4 (de) | 2015-10-16 | 2015-10-16 | Empfangseinrichtung für Bauteile und Verfahren zum Entnehmen fehlerhafter Bauteile aus dieser |
PCT/EP2016/072479 WO2017063835A1 (de) | 2015-10-16 | 2016-09-22 | Empfangseinrichtung für bauteile |
Publications (1)
Publication Number | Publication Date |
---|---|
SG11201803057VA true SG11201803057VA (en) | 2018-05-30 |
Family
ID=57047183
Family Applications (2)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
SG11201802020WA SG11201802020WA (en) | 2015-10-16 | 2016-09-22 | Device and method for self-adjustment of a component-handling device for electronic components |
SG11201803057VA SG11201803057VA (en) | 2015-10-16 | 2016-09-22 | Receiving system for components |
Family Applications Before (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
SG11201802020WA SG11201802020WA (en) | 2015-10-16 | 2016-09-22 | Device and method for self-adjustment of a component-handling device for electronic components |
Country Status (11)
Country | Link |
---|---|
US (2) | US10347514B2 (zh) |
EP (2) | EP3363042B1 (zh) |
JP (2) | JP6626195B2 (zh) |
KR (2) | KR102067203B1 (zh) |
CN (2) | CN108369917B (zh) |
DE (1) | DE102015013495B4 (zh) |
MY (2) | MY194246A (zh) |
PH (1) | PH12018500800A1 (zh) |
SG (2) | SG11201802020WA (zh) |
TW (2) | TWI704851B (zh) |
WO (2) | WO2017063835A1 (zh) |
Families Citing this family (25)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
DE102015013494B3 (de) * | 2015-10-16 | 2017-04-06 | Mühlbauer Gmbh & Co. Kg | Bauteilhandhabungsvorrichtung und Verfahren zum Entnehmen von Bauteilen von einem strukturierten Bauteilvorrat und zum Ablegen an einer Empfangseinrichtung |
JP5975556B1 (ja) * | 2015-12-11 | 2016-08-23 | 上野精機株式会社 | 移載装置 |
CN107868976B (zh) * | 2016-09-23 | 2020-06-12 | 株式会社村田制作所 | 处理装置、部件输送装置以及处理方法 |
US10651067B2 (en) * | 2017-01-26 | 2020-05-12 | Brooks Automation, Inc. | Method and apparatus for substrate transport apparatus position compensation |
WO2018188731A1 (de) * | 2017-04-11 | 2018-10-18 | Muehlbauer GmbH & Co. KG | Bauteil-empfangseinrichtung mit optischem sensor |
DE102017124582A1 (de) * | 2017-10-20 | 2019-04-25 | Asm Assembly Systems Gmbh & Co. Kg | Ergänzungswerkzeug für Chip-Transfervorrichtung mit Entnahmewerkzeug und Wendewerkzeug |
EP3503172B1 (en) * | 2017-12-20 | 2024-04-03 | Nexperia B.V. | Apparatus and system |
US11089292B2 (en) * | 2018-01-26 | 2021-08-10 | Optikos Corporation | Configurable camera stimulation and metrology apparatus and method therefor |
KR101921021B1 (ko) * | 2018-04-06 | 2018-11-21 | (주)이즈미디어 | 회전식 카메라모듈 검사장치 |
DE102018006760A1 (de) * | 2018-08-27 | 2020-02-27 | Mühlbauer Gmbh & Co. Kg | Inspektion beim Übertragen elektronischer Bauteile von einem ersten zu einem zweiten Träger |
DE102018006771B4 (de) | 2018-08-27 | 2022-09-08 | Mühlbauer Gmbh & Co. Kg | Vorrichtung und Verfahren zum Übertragen elektronischer Bauteile von einem ersten zu einem zweiten Träger |
US10741434B2 (en) * | 2018-09-24 | 2020-08-11 | Asm Technology Singapore Pte Ltd | Apparatus for packing ultra-small electronic devices |
CN109650030A (zh) * | 2018-12-20 | 2019-04-19 | 浙江新发现机械制造有限公司 | 一种纸容器半成品转送装置 |
JP2020183907A (ja) * | 2019-05-08 | 2020-11-12 | アスリートFa株式会社 | 電子部品検査装置 |
DE102019004470B4 (de) | 2019-06-25 | 2021-12-09 | Mühlbauer Gmbh & Co. Kg | Bauteilfördervorrichtung mit einer Einstelleinheit und Verfahren zum Einstellen einer Bauteilfördervorrichtung |
US10748794B1 (en) * | 2019-07-09 | 2020-08-18 | Asm Technology Singapore Pte Ltd | Apparatus for transferring electronic devices |
EP4084047A4 (en) * | 2019-12-26 | 2023-06-14 | Sato Holdings Kabushiki Kaisha | IC CHIP MOUNTING DEVICE AND IC CHIP MOUNTING METHOD |
DE102020116385B3 (de) * | 2020-06-22 | 2021-09-23 | Asm Assembly Systems Gmbh & Co. Kg | Bestückkopf mit zwei Rotoranordnungen mit individuell aktuierbaren Handhabungseinrichtungen, Bestückautomat und Verfahren zum automatischen Bestücken eines Bauelementeträgers |
CN111721781A (zh) * | 2020-06-30 | 2020-09-29 | 深圳中科飞测科技有限公司 | 一种检测设备及检测设备的检测方法 |
US20220059406A1 (en) * | 2020-08-21 | 2022-02-24 | Advanced Semiconductor Engineering, Inc. | Method for manufacturing semiconductor package |
KR20220030431A (ko) * | 2020-08-31 | 2022-03-11 | 삼성전자주식회사 | 상부 전극용 체결 자동화 장치 |
CN117693810A (zh) * | 2021-07-26 | 2024-03-12 | 维耶尔公司 | 微型led缺陷管理 |
JP7126285B1 (ja) * | 2021-09-17 | 2022-08-26 | 上野精機株式会社 | 電子部品の処理装置 |
JP7117041B1 (ja) | 2021-09-17 | 2022-08-12 | 上野精機株式会社 | 電子部品の処理装置 |
CN115036443B (zh) * | 2022-08-11 | 2022-10-21 | 成都思越智能装备股份有限公司 | 一种oled面板贴合设备 |
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-
2015
- 2015-10-16 DE DE102015013495.7A patent/DE102015013495B4/de active Active
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- 2016-09-22 JP JP2018519695A patent/JP6626195B2/ja active Active
- 2016-09-22 EP EP16775129.6A patent/EP3363042B1/de active Active
- 2016-09-22 CN CN201680069488.0A patent/CN108369917B/zh active Active
- 2016-09-22 US US15/768,448 patent/US10347514B2/en active Active
- 2016-09-22 SG SG11201802020WA patent/SG11201802020WA/en unknown
- 2016-09-22 SG SG11201803057VA patent/SG11201803057VA/en unknown
- 2016-09-22 EP EP16775131.2A patent/EP3363045B1/de active Active
- 2016-09-22 TW TW105130580A patent/TWI704851B/zh active
- 2016-09-22 TW TW105130579A patent/TWI714634B/zh active
- 2016-09-22 KR KR1020187010691A patent/KR102067203B1/ko active IP Right Grant
- 2016-09-22 MY MYPI2018000530A patent/MY194246A/en unknown
- 2016-09-22 KR KR1020187013950A patent/KR102186429B1/ko active IP Right Grant
- 2016-09-22 WO PCT/EP2016/072479 patent/WO2017063835A1/de active Application Filing
- 2016-09-22 WO PCT/EP2016/072482 patent/WO2017063838A1/de active Application Filing
- 2016-09-22 CN CN201680060239.5A patent/CN108352346B/zh active Active
- 2016-09-22 JP JP2018519344A patent/JP2018533842A/ja active Pending
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PH12018500800A1 (en) | 2018-10-29 |
SG11201802020WA (en) | 2018-05-30 |
TWI714634B (zh) | 2021-01-01 |
TW201715946A (zh) | 2017-05-01 |
KR20180071317A (ko) | 2018-06-27 |
EP3363042B1 (de) | 2019-11-27 |
US20180315628A1 (en) | 2018-11-01 |
US10347514B2 (en) | 2019-07-09 |
CN108352346A (zh) | 2018-07-31 |
MY194246A (en) | 2022-11-24 |
TWI704851B (zh) | 2020-09-11 |
EP3363045A1 (de) | 2018-08-22 |
US20180303015A1 (en) | 2018-10-18 |
KR102186429B1 (ko) | 2020-12-03 |
US10529601B2 (en) | 2020-01-07 |
CN108352346B (zh) | 2022-09-30 |
WO2017063838A1 (de) | 2017-04-20 |
CN108369917B (zh) | 2022-05-10 |
EP3363042A1 (de) | 2018-08-22 |
DE102015013495A1 (de) | 2017-04-20 |
MY196046A (en) | 2023-03-09 |
JP2018533843A (ja) | 2018-11-15 |
KR20180071264A (ko) | 2018-06-27 |
JP2018533842A (ja) | 2018-11-15 |
JP6626195B2 (ja) | 2019-12-25 |
DE102015013495B4 (de) | 2018-04-26 |
TW201715948A (zh) | 2017-05-01 |
CN108369917A (zh) | 2018-08-03 |
KR102067203B1 (ko) | 2020-01-17 |
WO2017063835A1 (de) | 2017-04-20 |
EP3363045B1 (de) | 2020-01-08 |
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