SG11201710709SA - Electrolytic hard gold plating solution substitution inhibitor and electrolytic hard gold plating solution including same - Google Patents

Electrolytic hard gold plating solution substitution inhibitor and electrolytic hard gold plating solution including same

Info

Publication number
SG11201710709SA
SG11201710709SA SG11201710709SA SG11201710709SA SG11201710709SA SG 11201710709S A SG11201710709S A SG 11201710709SA SG 11201710709S A SG11201710709S A SG 11201710709SA SG 11201710709S A SG11201710709S A SG 11201710709SA SG 11201710709S A SG11201710709S A SG 11201710709SA
Authority
SG
Singapore
Prior art keywords
plating solution
gold plating
hard gold
electrolytic hard
including same
Prior art date
Application number
SG11201710709SA
Other languages
English (en)
Inventor
Masato Furukawa
Original Assignee
Metalor Tech (Japan) Corporation
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Metalor Tech (Japan) Corporation filed Critical Metalor Tech (Japan) Corporation
Publication of SG11201710709SA publication Critical patent/SG11201710709SA/en

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D3/00—Electroplating: Baths therefor
    • C25D3/02—Electroplating: Baths therefor from solutions
    • C25D3/56—Electroplating: Baths therefor from solutions of alloys
    • C25D3/62—Electroplating: Baths therefor from solutions of alloys containing more than 50% by weight of gold

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Electrochemistry (AREA)
  • Materials Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Electroplating And Plating Baths Therefor (AREA)
SG11201710709SA 2015-06-26 2016-06-01 Electrolytic hard gold plating solution substitution inhibitor and electrolytic hard gold plating solution including same SG11201710709SA (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2015129063 2015-06-26
PCT/JP2016/066152 WO2016208340A1 (ja) 2015-06-26 2016-06-01 電解硬質金めっき液用置換防止剤及びそれを含む電解硬質金めっき液

Publications (1)

Publication Number Publication Date
SG11201710709SA true SG11201710709SA (en) 2018-01-30

Family

ID=57586255

Family Applications (1)

Application Number Title Priority Date Filing Date
SG11201710709SA SG11201710709SA (en) 2015-06-26 2016-06-01 Electrolytic hard gold plating solution substitution inhibitor and electrolytic hard gold plating solution including same

Country Status (7)

Country Link
US (1) US10577704B2 (ja)
EP (1) EP3315635B1 (ja)
JP (1) JP6715246B2 (ja)
CN (1) CN107709628B (ja)
SG (1) SG11201710709SA (ja)
TW (1) TWI717360B (ja)
WO (1) WO2016208340A1 (ja)

Family Cites Families (17)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS53137035A (en) 1977-12-19 1978-11-30 Nippon Dento Kougiyou Kk Method of electrodepositing glossy gold and nickel
JP2529021B2 (ja) 1990-08-30 1996-08-28 日本エレクトロプレイテイング・エンジニヤース株式会社 金の置換・電食防止剤を含んだシアン系の金メッキ液
FR2828889B1 (fr) * 2001-08-24 2004-05-07 Engelhard Clal Sas Bain electrolytique pour le depot electrochimique de l'or et de ses alliages
JP2003226993A (ja) 2002-02-01 2003-08-15 Electroplating Eng Of Japan Co 金メッキ液及び金メッキ処理方法
US20050153059A1 (en) * 2002-02-28 2005-07-14 Yasuhiro Wakizaka Partial plating method, partially-plated resin base, method for manufacturing multilayered circuit board
JP4129363B2 (ja) 2002-03-15 2008-08-06 エヌ・イーケムキャット株式会社 電解金めっき液及び金めっき方法
JP2004176171A (ja) * 2002-09-30 2004-06-24 Shinko Electric Ind Co Ltd 非シアン電解金めっき液
JP2004190093A (ja) * 2002-12-11 2004-07-08 Ne Chemcat Corp 置換無電解金めっき浴
JP5558675B2 (ja) * 2007-04-03 2014-07-23 ローム・アンド・ハース・エレクトロニック・マテリアルズ，エル．エル．シー． 金属メッキ組成物
KR101079554B1 (ko) * 2008-06-11 2011-11-04 니혼 고쥰도가가쿠 가부시키가이샤 전해 금도금액 및 그것을 이용하여 얻어진 금피막
JP5513784B2 (ja) 2008-08-25 2014-06-04 日本エレクトロプレイテイング・エンジニヤース株式会社 硬質金系めっき液
JP5619348B2 (ja) 2008-11-21 2014-11-05 住友化学株式会社 成形シートの欠陥検査装置
US8608931B2 (en) * 2009-09-25 2013-12-17 Rohm And Haas Electronic Materials Llc Anti-displacement hard gold compositions
JP6145671B2 (ja) * 2012-12-24 2017-06-14 石原ケミカル株式会社 スズ又はスズ合金メッキ浴及び当該メッキ浴を用いて皮膜形成した電子部品
JP6299750B2 (ja) * 2013-04-04 2018-03-28 日立化成株式会社 生体物質捕獲用のフィルター
EP2990507A1 (en) * 2014-08-25 2016-03-02 ATOTECH Deutschland GmbH Composition, use thereof and method for electrodepositing gold containing layers
CN104264195A (zh) * 2014-10-22 2015-01-07 华文蔚 一种巯基咪唑无氰镀金的电镀液及其电镀方法

Also Published As

Publication number Publication date
CN107709628A (zh) 2018-02-16
US10577704B2 (en) 2020-03-03
EP3315635B1 (en) 2020-11-04
JPWO2016208340A1 (ja) 2018-04-12
EP3315635A4 (en) 2019-05-08
CN107709628B (zh) 2020-06-16
KR20180021734A (ko) 2018-03-05
TW201715090A (zh) 2017-05-01
JP6715246B2 (ja) 2020-07-01
WO2016208340A1 (ja) 2016-12-29
TWI717360B (zh) 2021-02-01
EP3315635A1 (en) 2018-05-02
US20180187321A1 (en) 2018-07-05

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