SG11201710129RA - Substrate processing device - Google Patents
Substrate processing deviceInfo
- Publication number
- SG11201710129RA SG11201710129RA SG11201710129RA SG11201710129RA SG11201710129RA SG 11201710129R A SG11201710129R A SG 11201710129RA SG 11201710129R A SG11201710129R A SG 11201710129RA SG 11201710129R A SG11201710129R A SG 11201710129RA SG 11201710129R A SG11201710129R A SG 11201710129RA
- Authority
- SG
- Singapore
- Prior art keywords
- processing device
- substrate processing
- substrate
- processing
- Prior art date
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67017—Apparatus for fluid treatment
- H01L21/67028—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67017—Apparatus for fluid treatment
- H01L21/67063—Apparatus for fluid treatment for etching
- H01L21/67075—Apparatus for fluid treatment for etching for wet etching
- H01L21/6708—Apparatus for fluid treatment for etching for wet etching using mainly spraying means, e.g. nozzles
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B08—CLEANING
- B08B—CLEANING IN GENERAL; PREVENTION OF FOULING IN GENERAL
- B08B3/00—Cleaning by methods involving the use or presence of liquid or steam
- B08B3/04—Cleaning involving contact with liquid
- B08B3/08—Cleaning involving contact with liquid the liquid having chemical or dissolving effect
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B08—CLEANING
- B08B—CLEANING IN GENERAL; PREVENTION OF FOULING IN GENERAL
- B08B3/00—Cleaning by methods involving the use or presence of liquid or steam
- B08B3/04—Cleaning involving contact with liquid
- B08B3/10—Cleaning involving contact with liquid with additional treatment of the liquid or of the object being cleaned, e.g. by heat, by electricity or by vibration
- B08B3/102—Cleaning involving contact with liquid with additional treatment of the liquid or of the object being cleaned, e.g. by heat, by electricity or by vibration with means for agitating the liquid
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer or carrier concentration layer
- H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic System or AIIIBV compounds with or without impurities, e.g. doping materials
- H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
- H01L21/31—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to form insulating layers thereon, e.g. for masking or by using photolithographic techniques; After treatment of these layers; Selection of materials for these layers
- H01L21/3105—After-treatment
- H01L21/311—Etching the insulating layers by chemical or physical means
- H01L21/31105—Etching inorganic layers
- H01L21/31111—Etching inorganic layers by chemical means
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67017—Apparatus for fluid treatment
- H01L21/67023—Apparatus for fluid treatment for general liquid treatment, e.g. etching followed by cleaning
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67017—Apparatus for fluid treatment
- H01L21/67063—Apparatus for fluid treatment for etching
- H01L21/67075—Apparatus for fluid treatment for etching for wet etching
- H01L21/67086—Apparatus for fluid treatment for etching for wet etching with the semiconductor substrates being dipped in baths or vessels
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
- H01L21/68714—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support
- H01L21/68771—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support characterised by supporting more than one semiconductor substrate
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2015120309 | 2015-06-15 | ||
PCT/JP2016/067492 WO2016204106A1 (ja) | 2015-06-15 | 2016-06-13 | 基板処理装置 |
Publications (1)
Publication Number | Publication Date |
---|---|
SG11201710129RA true SG11201710129RA (en) | 2018-01-30 |
Family
ID=57546540
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
SG11201710129RA SG11201710129RA (en) | 2015-06-15 | 2016-06-13 | Substrate processing device |
Country Status (7)
Country | Link |
---|---|
US (1) | US10615059B2 (ja) |
JP (1) | JP6231249B2 (ja) |
KR (1) | KR101882155B1 (ja) |
CN (1) | CN107710388B (ja) |
SG (1) | SG11201710129RA (ja) |
TW (1) | TWI685893B (ja) |
WO (1) | WO2016204106A1 (ja) |
Families Citing this family (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP7212767B2 (ja) * | 2019-09-12 | 2023-01-25 | キオクシア株式会社 | 基板処理装置 |
Family Cites Families (22)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP3214503B2 (ja) | 1990-11-28 | 2001-10-02 | 東京エレクトロン株式会社 | 洗浄装置 |
JP3343033B2 (ja) * | 1996-06-28 | 2002-11-11 | 大日本スクリーン製造株式会社 | 基板処理装置 |
US6045624A (en) * | 1996-09-27 | 2000-04-04 | Tokyo Electron Limited | Apparatus for and method of cleaning objects to be processed |
JP3171807B2 (ja) * | 1997-01-24 | 2001-06-04 | 東京エレクトロン株式会社 | 洗浄装置及び洗浄方法 |
JPH11145105A (ja) * | 1997-11-13 | 1999-05-28 | Tokyo Electron Ltd | 洗浄装置 |
US6352083B1 (en) * | 1997-11-20 | 2002-03-05 | Dainippon Screen Mfg. Co., Ltd. | Substrate treating apparatus and substrate treating method |
JP2002028592A (ja) * | 2000-07-17 | 2002-01-29 | Shimada Phys & Chem Ind Co Ltd | 洗浄装置 |
JP2002134467A (ja) * | 2000-10-26 | 2002-05-10 | Daikin Ind Ltd | 基板処理装置 |
TW529041B (en) * | 2000-12-21 | 2003-04-21 | Toshiba Corp | Chemical decontamination method and treatment method and apparatus of chemical decontamination solution |
EP1736568A4 (en) * | 2004-04-15 | 2011-01-12 | Tokyo Electron Ltd | LIQUID TREATMENT DEVICE AND LIQUID TREATMENT PROCESS |
JP2006108512A (ja) * | 2004-10-07 | 2006-04-20 | Ses Co Ltd | 基板処理装置 |
DE102005015758A1 (de) * | 2004-12-08 | 2006-06-14 | Astec Halbleitertechnologie Gmbh | Verfahren und Vorrichtung zum Ätzen von in einer Ätzlösung aufgenommenen Substraten |
US20060157197A1 (en) * | 2005-01-18 | 2006-07-20 | Tadashi Maegawa | Substrate processing apparatus |
JP2006310767A (ja) * | 2005-03-28 | 2006-11-09 | Dainippon Screen Mfg Co Ltd | 基板処理装置 |
JP2007012859A (ja) * | 2005-06-30 | 2007-01-18 | Dainippon Screen Mfg Co Ltd | 基板処理装置および基板処理方法 |
JP2007208223A (ja) * | 2006-02-06 | 2007-08-16 | Sharp Corp | ウェットエッチング装置およびウェットエッチング方法 |
JP2009081257A (ja) * | 2007-09-26 | 2009-04-16 | Dainippon Screen Mfg Co Ltd | 基板処理装置 |
TWI406330B (zh) * | 2007-09-26 | 2013-08-21 | Dainippon Screen Mfg | 基板處理裝置及基板處理方法 |
JP5016430B2 (ja) * | 2007-09-26 | 2012-09-05 | 大日本スクリーン製造株式会社 | 基板処理装置 |
JP2009231579A (ja) * | 2008-03-24 | 2009-10-08 | Dainippon Screen Mfg Co Ltd | 基板処理装置及び基板処理方法 |
JP2013070022A (ja) * | 2011-09-06 | 2013-04-18 | Dainippon Screen Mfg Co Ltd | 基板処理装置及び基板処理方法 |
US20160303622A1 (en) * | 2013-10-23 | 2016-10-20 | Brooks Ccs Gmbh | Cleaning Systems and Methods for Semiconductor Substrate Storage Articles |
-
2016
- 2016-06-13 JP JP2017525212A patent/JP6231249B2/ja active Active
- 2016-06-13 WO PCT/JP2016/067492 patent/WO2016204106A1/ja active Application Filing
- 2016-06-13 SG SG11201710129RA patent/SG11201710129RA/en unknown
- 2016-06-13 US US15/736,032 patent/US10615059B2/en active Active
- 2016-06-13 CN CN201680029796.0A patent/CN107710388B/zh active Active
- 2016-06-13 KR KR1020177027431A patent/KR101882155B1/ko active IP Right Grant
- 2016-06-14 TW TW105118514A patent/TWI685893B/zh active
Also Published As
Publication number | Publication date |
---|---|
JP6231249B2 (ja) | 2017-11-15 |
US10615059B2 (en) | 2020-04-07 |
KR20170129789A (ko) | 2017-11-27 |
CN107710388A (zh) | 2018-02-16 |
TWI685893B (zh) | 2020-02-21 |
KR101882155B1 (ko) | 2018-07-25 |
TW201717274A (zh) | 2017-05-16 |
US20180190515A1 (en) | 2018-07-05 |
CN107710388B (zh) | 2021-08-24 |
JPWO2016204106A1 (ja) | 2017-11-30 |
WO2016204106A1 (ja) | 2016-12-22 |
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