SG11201709978PA - Composite sheet for forming protective film - Google Patents

Composite sheet for forming protective film

Info

Publication number
SG11201709978PA
SG11201709978PA SG11201709978PA SG11201709978PA SG11201709978PA SG 11201709978P A SG11201709978P A SG 11201709978PA SG 11201709978P A SG11201709978P A SG 11201709978PA SG 11201709978P A SG11201709978P A SG 11201709978PA SG 11201709978P A SG11201709978P A SG 11201709978PA
Authority
SG
Singapore
Prior art keywords
protective film
composite sheet
forming protective
forming
composite
Prior art date
Application number
SG11201709978PA
Other languages
English (en)
Inventor
Hiroyuki Yoneyama
Naoya Saiki
Rikiya Kobashi
Original Assignee
Lintec Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Lintec Corp filed Critical Lintec Corp
Publication of SG11201709978PA publication Critical patent/SG11201709978PA/en

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J7/00—Adhesives in the form of films or foils
    • C09J7/30—Adhesives in the form of films or foils characterised by the adhesive composition
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09D—COATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
    • C09D163/00—Coating compositions based on epoxy resins; Coating compositions based on derivatives of epoxy resins
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09D—COATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
    • C09D7/00—Features of coating compositions, not provided for in group C09D5/00; Processes for incorporating ingredients in coating compositions
    • C09D7/40—Additives
    • C09D7/60—Additives non-macromolecular
    • C09D7/63—Additives non-macromolecular organic
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J133/00—Adhesives based on homopolymers or copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and at least one being terminated by only one carboxyl radical, or of salts, anhydrides, esters, amides, imides, or nitriles thereof; Adhesives based on derivatives of such polymers
    • C09J133/04—Homopolymers or copolymers of esters
    • C09J133/06—Homopolymers or copolymers of esters of esters containing only carbon, hydrogen and oxygen, the oxygen atom being present only as part of the carboxyl radical
    • C09J133/08—Homopolymers or copolymers of acrylic acid esters
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J133/00—Adhesives based on homopolymers or copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and at least one being terminated by only one carboxyl radical, or of salts, anhydrides, esters, amides, imides, or nitriles thereof; Adhesives based on derivatives of such polymers
    • C09J133/04—Homopolymers or copolymers of esters
    • C09J133/06—Homopolymers or copolymers of esters of esters containing only carbon, hydrogen and oxygen, the oxygen atom being present only as part of the carboxyl radical
    • C09J133/10—Homopolymers or copolymers of methacrylic acid esters
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67132—Apparatus for placing on an insulating substrate, e.g. tape
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/6835—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support
    • H01L21/6836—Wafer tapes, e.g. grinding or dicing support tapes
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J2203/00—Applications of adhesives in processes or use of adhesives in the form of films or foils
    • C09J2203/326—Applications of adhesives in processes or use of adhesives in the form of films or foils for bonding electronic components such as wafers, chips or semiconductors

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Organic Chemistry (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Physics & Mathematics (AREA)
  • Power Engineering (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Materials Engineering (AREA)
  • Wood Science & Technology (AREA)
  • Adhesive Tapes (AREA)
  • Adhesives Or Adhesive Processes (AREA)
  • Dicing (AREA)
SG11201709978PA 2015-06-05 2016-06-03 Composite sheet for forming protective film SG11201709978PA (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2015114714 2015-06-05
PCT/JP2016/066588 WO2016195071A1 (ja) 2015-06-05 2016-06-03 保護膜形成用複合シート

Publications (1)

Publication Number Publication Date
SG11201709978PA true SG11201709978PA (en) 2017-12-28

Family

ID=57441268

Family Applications (1)

Application Number Title Priority Date Filing Date
SG11201709978PA SG11201709978PA (en) 2015-06-05 2016-06-03 Composite sheet for forming protective film

Country Status (6)

Country Link
JP (2) JP6630956B2 (zh)
KR (1) KR102509165B1 (zh)
CN (1) CN107615454B (zh)
SG (1) SG11201709978PA (zh)
TW (2) TWI705116B (zh)
WO (1) WO2016195071A1 (zh)

Families Citing this family (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI641494B (zh) * 2015-11-04 2018-11-21 日商琳得科股份有限公司 第一保護膜形成用片、第一保護膜形成方法以及半導體晶片的製造方法
KR102445532B1 (ko) * 2017-03-30 2022-09-20 린텍 가부시키가이샤 보호막 형성용 복합 시트
WO2020054355A1 (ja) * 2018-09-11 2020-03-19 リンテック株式会社 保護膜形成用フィルム、保護膜形成用複合シート、検査方法及び識別方法
JP7500169B2 (ja) * 2019-08-30 2024-06-17 リンテック株式会社 保護膜形成用複合シート
JP7312679B2 (ja) * 2019-11-19 2023-07-21 日東電工株式会社 粘着剤付き光学フィルムおよびその製造方法
JP2022092286A (ja) 2020-12-10 2022-06-22 リンテック株式会社 保護膜付きワークの製造方法及び保護膜形成フィルム付きワークの製造方法
US20230107095A1 (en) 2021-10-01 2023-04-06 Nitto Denko Corporation Backgrinding tape
JP2023053920A (ja) 2021-10-01 2023-04-13 日東電工株式会社 半導体加工用粘着テープに用いられる粘着剤組成物、および、該粘着剤組成物を用いた粘着テープ

Family Cites Families (18)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
MY138566A (en) * 2004-03-15 2009-06-30 Hitachi Chemical Co Ltd Dicing/die bonding sheet
JP4493643B2 (ja) * 2006-12-06 2010-06-30 日東電工株式会社 再剥離型粘着剤組成物、及び粘着テープ又はシート
EP2151858A2 (en) * 2008-08-04 2010-02-10 Nitto Denko Corporation Dicing die-bonding film
JP5681374B2 (ja) * 2010-04-19 2015-03-04 日東電工株式会社 ダイシングテープ一体型半導体裏面用フィルム
JP5210346B2 (ja) * 2010-04-19 2013-06-12 電気化学工業株式会社 粘着シート及び電子部品の製造方法
CN102337089B (zh) * 2010-07-07 2014-01-29 古河电气工业株式会社 晶片加工用胶带和使用其的半导体加工方法
KR20120055601A (ko) * 2010-08-06 2012-05-31 닛토덴코 가부시키가이샤 전자 부품의 제조 방법
JP5781302B2 (ja) * 2010-12-28 2015-09-16 日東電工株式会社 放射線硬化型粘着剤組成物及び粘着シート
WO2012165368A1 (ja) * 2011-05-27 2012-12-06 電気化学工業株式会社 粘着シート
CN104541360B (zh) * 2012-08-23 2019-10-01 琳得科株式会社 带保护膜形成层的切割片和芯片的制造方法
JP5965824B2 (ja) * 2012-11-26 2016-08-10 積水化学工業株式会社 後硬化テープ及び接合部材の接合方法
JP6180139B2 (ja) * 2013-03-11 2017-08-16 リンテック株式会社 保護膜形成用複合シートおよび保護膜形成用フィルム付チップの製造方法
JP6262717B2 (ja) * 2013-03-13 2018-01-17 リンテック株式会社 保護膜付チップの製造方法
JP5774799B2 (ja) * 2013-03-27 2015-09-09 リンテック株式会社 保護膜形成用複合シート
KR102215668B1 (ko) * 2013-03-28 2021-02-15 린텍 가부시키가이샤 보호막 형성용 복합 시트, 보호막이 있는 칩 및 보호막이 있는 칩의 제조 방법
KR102216458B1 (ko) * 2013-06-14 2021-02-17 덴카 주식회사 반도체 검사용 내열성 점착 시트
JP5950869B2 (ja) * 2013-06-20 2016-07-13 古河電気工業株式会社 半導体ウエハ表面保護用粘着テープ
SG11201600548SA (en) * 2013-08-01 2016-02-26 Lintec Corp Protective film formation-use composite sheet

Also Published As

Publication number Publication date
KR102509165B1 (ko) 2023-03-10
TW202043416A (zh) 2020-12-01
TW201706387A (zh) 2017-02-16
KR20180016411A (ko) 2018-02-14
WO2016195071A1 (ja) 2016-12-08
JP2020017758A (ja) 2020-01-30
TWI745029B (zh) 2021-11-01
TWI705116B (zh) 2020-09-21
JP6924243B2 (ja) 2021-08-25
JPWO2016195071A1 (ja) 2018-03-22
CN107615454A (zh) 2018-01-19
CN107615454B (zh) 2020-12-18
JP6630956B2 (ja) 2020-01-15

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