SG11201606807SA - Electrical discharge inspection device, wire bonding device, and electrical discharge inspection method - Google Patents

Electrical discharge inspection device, wire bonding device, and electrical discharge inspection method

Info

Publication number
SG11201606807SA
SG11201606807SA SG11201606807SA SG11201606807SA SG11201606807SA SG 11201606807S A SG11201606807S A SG 11201606807SA SG 11201606807S A SG11201606807S A SG 11201606807SA SG 11201606807S A SG11201606807S A SG 11201606807SA SG 11201606807S A SG11201606807S A SG 11201606807SA
Authority
SG
Singapore
Prior art keywords
electrical discharge
discharge inspection
wire bonding
inspection method
bonding device
Prior art date
Application number
SG11201606807SA
Other languages
English (en)
Inventor
Kazumasa Sasakura
Hiroaki Yoshino
Yuki Sekine
Original Assignee
Shinkawa Kk
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Shinkawa Kk filed Critical Shinkawa Kk
Publication of SG11201606807SA publication Critical patent/SG11201606807SA/en

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Classifications

    • H—ELECTRICITY
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    • H01L24/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies
    • H01L24/78—Apparatus for connecting with wire connectors
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R19/00—Arrangements for measuring currents or voltages or for indicating presence or sign thereof
    • G01R19/0092—Arrangements for measuring currents or voltages or for indicating presence or sign thereof measuring current only
    • G—PHYSICS
    • G04—HOROLOGY
    • G04F—TIME-INTERVAL MEASURING
    • G04F10/00—Apparatus for measuring unknown time intervals by electric means
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  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Manufacturing & Machinery (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Wire Bonding (AREA)
  • Electrical Discharge Machining, Electrochemical Machining, And Combined Machining (AREA)
  • Testing Relating To Insulation (AREA)
SG11201606807SA 2014-02-17 2015-02-10 Electrical discharge inspection device, wire bonding device, and electrical discharge inspection method SG11201606807SA (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2014027925 2014-02-17
PCT/JP2015/053665 WO2015122411A1 (ja) 2014-02-17 2015-02-10 放電検査装置、ワイヤボンディング装置、および放電検査方法

Publications (1)

Publication Number Publication Date
SG11201606807SA true SG11201606807SA (en) 2016-09-29

Family

ID=53800154

Family Applications (1)

Application Number Title Priority Date Filing Date
SG11201606807SA SG11201606807SA (en) 2014-02-17 2015-02-10 Electrical discharge inspection device, wire bonding device, and electrical discharge inspection method

Country Status (7)

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CN106463423B (zh) 2019-10-25
WO2015122411A1 (ja) 2015-08-20
JPWO2015122411A1 (ja) 2017-03-30
TW201533818A (zh) 2015-09-01
CN106463423A (zh) 2017-02-22
KR20160122805A (ko) 2016-10-24
TWI562252B (en) 2016-12-11

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