SG11201508324VA - Centering of a plate in a holder both at room temperatures and at higher temperatures - Google Patents
Centering of a plate in a holder both at room temperatures and at higher temperaturesInfo
- Publication number
- SG11201508324VA SG11201508324VA SG11201508324VA SG11201508324VA SG11201508324VA SG 11201508324V A SG11201508324V A SG 11201508324VA SG 11201508324V A SG11201508324V A SG 11201508324VA SG 11201508324V A SG11201508324V A SG 11201508324VA SG 11201508324V A SG11201508324V A SG 11201508324VA
- Authority
- SG
- Singapore
- Prior art keywords
- temperatures
- centering
- holder
- plate
- room
- Prior art date
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
- H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
- H01J37/32—Gas-filled discharge tubes
- H01J37/34—Gas-filled discharge tubes operating with cathodic sputtering
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
- H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
- H01J37/32—Gas-filled discharge tubes
- H01J37/34—Gas-filled discharge tubes operating with cathodic sputtering
- H01J37/3411—Constructional aspects of the reactor
- H01J37/3435—Target holders (includes backing plates and endblocks)
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
- C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
- C23C14/34—Sputtering
- C23C14/3407—Cathode assembly for sputtering apparatus, e.g. Target
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
- H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
- H01J37/32—Gas-filled discharge tubes
- H01J37/34—Gas-filled discharge tubes operating with cathodic sputtering
- H01J37/3411—Constructional aspects of the reactor
- H01J37/3414—Targets
- H01J37/3417—Arrangements
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
- H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
- H01J37/32—Gas-filled discharge tubes
- H01J37/34—Gas-filled discharge tubes operating with cathodic sputtering
- H01J37/3411—Constructional aspects of the reactor
- H01J37/3414—Targets
- H01J37/3423—Shape
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
- H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
- H01J37/32—Gas-filled discharge tubes
- H01J37/34—Gas-filled discharge tubes operating with cathodic sputtering
- H01J37/3411—Constructional aspects of the reactor
- H01J37/3438—Electrodes other than cathode
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
- H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
- H01J37/32—Gas-filled discharge tubes
- H01J37/34—Gas-filled discharge tubes operating with cathodic sputtering
- H01J37/3464—Operating strategies
- H01J37/3467—Pulsed operation, e.g. HIPIMS
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
- H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
- H01J37/32—Gas-filled discharge tubes
- H01J37/34—Gas-filled discharge tubes operating with cathodic sputtering
- H01J37/3488—Constructional details of particle beam apparatus not otherwise provided for, e.g. arrangement, mounting, housing, environment; special provisions for cleaning or maintenance of the apparatus
- H01J37/3497—Temperature of target
Landscapes
- Chemical & Material Sciences (AREA)
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Plasma & Fusion (AREA)
- Analytical Chemistry (AREA)
- Metallurgy (AREA)
- Materials Engineering (AREA)
- Mechanical Engineering (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Organic Chemistry (AREA)
- Physical Vapour Deposition (AREA)
- Telescopes (AREA)
- Magnetic Resonance Imaging Apparatus (AREA)
- Coating By Spraying Or Casting (AREA)
- Nozzles (AREA)
- Manufacturing Of Magnetic Record Carriers (AREA)
- Packaging For Recording Disks (AREA)
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US201361809524P | 2013-04-08 | 2013-04-08 | |
| PCT/EP2014/000928 WO2014166621A1 (de) | 2013-04-08 | 2014-04-07 | Zentrierung einer platte in einer halterung sowohl bei raum- als auch bei höheren temperaturen |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| SG11201508324VA true SG11201508324VA (en) | 2015-11-27 |
Family
ID=50486885
Family Applications (3)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| SG11201508324VA SG11201508324VA (en) | 2013-04-08 | 2014-04-07 | Centering of a plate in a holder both at room temperatures and at higher temperatures |
| SG10201708186QA SG10201708186QA (en) | 2013-04-08 | 2014-04-07 | Sputtering target having increased power compatibility |
| SG11201508311VA SG11201508311VA (en) | 2013-04-08 | 2014-04-07 | Sputtering target having increased power compatibility |
Family Applications After (2)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| SG10201708186QA SG10201708186QA (en) | 2013-04-08 | 2014-04-07 | Sputtering target having increased power compatibility |
| SG11201508311VA SG11201508311VA (en) | 2013-04-08 | 2014-04-07 | Sputtering target having increased power compatibility |
Country Status (21)
| Country | Link |
|---|---|
| US (2) | US9564300B2 (ja) |
| EP (2) | EP2984673B1 (ja) |
| JP (2) | JP6655531B2 (ja) |
| KR (2) | KR102190319B1 (ja) |
| CN (2) | CN105324830B (ja) |
| AR (2) | AR096021A1 (ja) |
| BR (2) | BR112015025747A2 (ja) |
| CA (2) | CA2908897C (ja) |
| ES (1) | ES2675332T3 (ja) |
| HK (2) | HK1214403A1 (ja) |
| HU (1) | HUE038784T2 (ja) |
| IL (2) | IL241980B (ja) |
| MX (2) | MX350172B (ja) |
| MY (2) | MY185549A (ja) |
| PH (2) | PH12015502328A1 (ja) |
| PL (1) | PL2984674T3 (ja) |
| RU (2) | RU2665059C2 (ja) |
| SG (3) | SG11201508324VA (ja) |
| TR (1) | TR201809526T4 (ja) |
| TW (2) | TW201443263A (ja) |
| WO (2) | WO2014166620A1 (ja) |
Families Citing this family (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US10435784B2 (en) | 2016-08-10 | 2019-10-08 | Applied Materials, Inc. | Thermally optimized rings |
| BR112019025350A2 (pt) | 2017-06-01 | 2020-06-23 | Oerlikon Surface Solutions Ag, Pfäffikon | Conjunto de alvo para evaporação segura e econômica de materiais quebradiços |
| CN108130516A (zh) * | 2018-01-03 | 2018-06-08 | 梧州三和新材料科技有限公司 | 一种使用泡沫金属增强冷却的真空镀阴极靶 |
| US11600517B2 (en) * | 2018-08-17 | 2023-03-07 | Taiwan Semiconductor Manufacturing Co., Ltd. | Screwless semiconductor processing chambers |
| CN110066980A (zh) * | 2019-05-31 | 2019-07-30 | 德淮半导体有限公司 | 环状靶材部件、半导体工艺设备及其工作方法 |
| WO2021115703A1 (en) * | 2019-12-13 | 2021-06-17 | Evatec Ag | Gas ring for a pvd source |
Family Cites Families (18)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5724890Y2 (ja) * | 1979-10-31 | 1982-05-29 | ||
| EP0393344A1 (de) | 1989-04-20 | 1990-10-24 | Balzers Aktiengesellschaft | Haltevorrichtung für Targets von Zerstäubungsquellen und Verfahren zum Festhalten eines Targets in einer Halterung |
| DE4015388C2 (de) * | 1990-05-14 | 1997-07-17 | Leybold Ag | Kathodenzerstäubungsvorrichtung |
| KR100231397B1 (ko) * | 1991-01-28 | 1999-11-15 | 튜그룰 야사르 | 음극 스퍼터링용 타겟 |
| DE9102052U1 (ja) * | 1991-02-21 | 1991-06-13 | Hauzer Holding B.V., Venlo, Nl | |
| JP3030921B2 (ja) * | 1991-05-01 | 2000-04-10 | 日新電機株式会社 | イオン源の引出し電極装置 |
| DE59208623D1 (de) * | 1991-05-08 | 1997-07-24 | Balzers Hochvakuum | Verfahren zur Montage bzw. Demontage einer Targetplatte in einem Vakuumprozessraum, Montageanordnung hierfür sowie Targetplatte bzw. Vakuumkammer |
| DE4133564C2 (de) * | 1991-10-10 | 1999-11-18 | Leybold Ag | Vorrichtung zur lösbaren Befestigung eines Targets oder Targetgrundkörpers auf der Kathodenhalterung |
| RU2037559C1 (ru) * | 1992-08-10 | 1995-06-19 | Волин Эрнст Михайлович | Способ нанесения покрытий на изделия методом ионного распыления и устройство для его осуществления |
| US5876573A (en) * | 1995-07-10 | 1999-03-02 | Cvc, Inc. | High magnetic flux cathode apparatus and method for high productivity physical-vapor deposition |
| DE19535894A1 (de) | 1995-09-27 | 1997-04-03 | Leybold Materials Gmbh | Target für die Sputterkathode einer Vakuumbeschichtungsanlage und Verfahren zu seiner Herstellung |
| US6217832B1 (en) * | 1998-04-30 | 2001-04-17 | Catalytica, Inc. | Support structures for a catalyst |
| JP4251713B2 (ja) * | 1999-05-21 | 2009-04-08 | 株式会社アルバック | スパッタ装置 |
| US6589352B1 (en) * | 1999-12-10 | 2003-07-08 | Applied Materials, Inc. | Self aligning non contact shadow ring process kit |
| JP4101524B2 (ja) * | 2002-02-05 | 2008-06-18 | 芝浦メカトロニクス株式会社 | 成膜装置 |
| JP2010116605A (ja) * | 2008-11-13 | 2010-05-27 | Fujikura Ltd | ターゲット保持装置、ならびにこれを用いた成膜装置および成膜方法 |
| JP2011165964A (ja) * | 2010-02-10 | 2011-08-25 | Hitachi Kokusai Electric Inc | 半導体装置の製造方法 |
| DE102012006717A1 (de) | 2012-04-04 | 2013-10-10 | Oerlikon Trading Ag, Trübbach | An eine indirekte Kühlvorrichtung angepasstes Target |
-
2014
- 2014-04-07 SG SG11201508324VA patent/SG11201508324VA/en unknown
- 2014-04-07 RU RU2015147496A patent/RU2665059C2/ru not_active IP Right Cessation
- 2014-04-07 PL PL14718509T patent/PL2984674T3/pl unknown
- 2014-04-07 BR BR112015025747A patent/BR112015025747A2/pt not_active IP Right Cessation
- 2014-04-07 SG SG10201708186QA patent/SG10201708186QA/en unknown
- 2014-04-07 TR TR2018/09526T patent/TR201809526T4/tr unknown
- 2014-04-07 WO PCT/EP2014/000927 patent/WO2014166620A1/de active Application Filing
- 2014-04-07 US US14/783,383 patent/US9564300B2/en active Active
- 2014-04-07 JP JP2016506806A patent/JP6655531B2/ja active Active
- 2014-04-07 RU RU2015147497A patent/RU2665058C2/ru not_active IP Right Cessation
- 2014-04-07 CA CA2908897A patent/CA2908897C/en active Active
- 2014-04-07 BR BR112015025749A patent/BR112015025749A2/pt not_active IP Right Cessation
- 2014-04-07 HU HUE14718509A patent/HUE038784T2/hu unknown
- 2014-04-07 CN CN201480031545.7A patent/CN105324830B/zh not_active Expired - Fee Related
- 2014-04-07 CN CN201480026375.3A patent/CN105210169B/zh active Active
- 2014-04-07 SG SG11201508311VA patent/SG11201508311VA/en unknown
- 2014-04-07 AR ARP140101500A patent/AR096021A1/es unknown
- 2014-04-07 AR ARP140101499A patent/AR099253A1/es unknown
- 2014-04-07 KR KR1020157031127A patent/KR102190319B1/ko active IP Right Grant
- 2014-04-07 MY MYPI2015703579A patent/MY185549A/en unknown
- 2014-04-07 MY MYPI2015703578A patent/MY178843A/en unknown
- 2014-04-07 ES ES14718509.4T patent/ES2675332T3/es active Active
- 2014-04-07 WO PCT/EP2014/000928 patent/WO2014166621A1/de active Application Filing
- 2014-04-07 JP JP2016506805A patent/JP6360884B2/ja active Active
- 2014-04-07 EP EP14717412.2A patent/EP2984673B1/de active Active
- 2014-04-07 MX MX2015014209A patent/MX350172B/es active IP Right Grant
- 2014-04-07 EP EP14718509.4A patent/EP2984674B1/de active Active
- 2014-04-07 KR KR1020157031126A patent/KR102234454B1/ko active IP Right Grant
- 2014-04-07 MX MX2015014210A patent/MX350171B/es active IP Right Grant
- 2014-04-07 CA CA2908892A patent/CA2908892C/en active Active
- 2014-04-07 US US14/783,168 patent/US9536714B2/en active Active - Reinstated
- 2014-04-08 TW TW103112846A patent/TW201443263A/zh unknown
- 2014-04-08 TW TW103112844A patent/TW201443258A/zh unknown
-
2015
- 2015-10-07 PH PH12015502328A patent/PH12015502328A1/en unknown
- 2015-10-08 IL IL241980A patent/IL241980B/en active IP Right Grant
- 2015-10-08 IL IL241979A patent/IL241979B/en active IP Right Grant
- 2015-10-08 PH PH12015502338A patent/PH12015502338B1/en unknown
-
2016
- 2016-03-02 HK HK16102413.7A patent/HK1214403A1/zh unknown
- 2016-06-29 HK HK16107567.0A patent/HK1219562A1/zh not_active IP Right Cessation
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