SG11201504125UA - Method of making transparent conductors on a substrate - Google Patents

Method of making transparent conductors on a substrate

Info

Publication number
SG11201504125UA
SG11201504125UA SG11201504125UA SG11201504125UA SG11201504125UA SG 11201504125U A SG11201504125U A SG 11201504125UA SG 11201504125U A SG11201504125U A SG 11201504125UA SG 11201504125U A SG11201504125U A SG 11201504125UA SG 11201504125U A SG11201504125U A SG 11201504125UA
Authority
SG
Singapore
Prior art keywords
substrate
transparent conductors
making transparent
making
conductors
Prior art date
Application number
SG11201504125UA
Other languages
English (en)
Inventor
Shawn C Dodds
Matthew S Stay
Mikhail L Pekurovsky
Matthew H Frey
Mark J Pellerite
John P Baetzold
Original Assignee
3M Innovative Properties Co
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 3M Innovative Properties Co filed Critical 3M Innovative Properties Co
Publication of SG11201504125UA publication Critical patent/SG11201504125UA/en

Links

Classifications

    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06F—ELECTRIC DIGITAL DATA PROCESSING
    • G06F1/00—Details not covered by groups G06F3/00 - G06F13/00 and G06F21/00
    • G06F1/16—Constructional details or arrangements
    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06F—ELECTRIC DIGITAL DATA PROCESSING
    • G06F3/00—Input arrangements for transferring data to be processed into a form capable of being handled by the computer; Output arrangements for transferring data from processing unit to output unit, e.g. interface arrangements
    • G06F3/01—Input arrangements or combined input and output arrangements for interaction between user and computer
    • G06F3/03—Arrangements for converting the position or the displacement of a member into a coded form
    • G06F3/041—Digitisers, e.g. for touch screens or touch pads, characterised by the transducing means
    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06F—ELECTRIC DIGITAL DATA PROCESSING
    • G06F3/00—Input arrangements for transferring data to be processed into a form capable of being handled by the computer; Output arrangements for transferring data from processing unit to output unit, e.g. interface arrangements
    • G06F3/01—Input arrangements or combined input and output arrangements for interaction between user and computer
    • G06F3/03—Arrangements for converting the position or the displacement of a member into a coded form
    • G06F3/041—Digitisers, e.g. for touch screens or touch pads, characterised by the transducing means
    • G06F3/0412—Digitisers structurally integrated in a display
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B82—NANOTECHNOLOGY
    • B82B—NANOSTRUCTURES FORMED BY MANIPULATION OF INDIVIDUAL ATOMS, MOLECULES, OR LIMITED COLLECTIONS OF ATOMS OR MOLECULES AS DISCRETE UNITS; MANUFACTURE OR TREATMENT THEREOF
    • B82B1/00—Nanostructures formed by manipulation of individual atoms or molecules, or limited collections of atoms or molecules as discrete units
    • B82B1/002—Devices comprising flexible or deformable elements
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B82—NANOTECHNOLOGY
    • B82Y—SPECIFIC USES OR APPLICATIONS OF NANOSTRUCTURES; MEASUREMENT OR ANALYSIS OF NANOSTRUCTURES; MANUFACTURE OR TREATMENT OF NANOSTRUCTURES
    • B82Y15/00—Nanotechnology for interacting, sensing or actuating, e.g. quantum dots as markers in protein assays or molecular motors
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B82—NANOTECHNOLOGY
    • B82Y—SPECIFIC USES OR APPLICATIONS OF NANOSTRUCTURES; MEASUREMENT OR ANALYSIS OF NANOSTRUCTURES; MANUFACTURE OR TREATMENT OF NANOSTRUCTURES
    • B82Y40/00—Manufacture or treatment of nanostructures
    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06F—ELECTRIC DIGITAL DATA PROCESSING
    • G06F2203/00—Indexing scheme relating to G06F3/00 - G06F3/048
    • G06F2203/041—Indexing scheme relating to G06F3/041 - G06F3/045
    • G06F2203/04103—Manufacturing, i.e. details related to manufacturing processes specially suited for touch sensitive devices
    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06F—ELECTRIC DIGITAL DATA PROCESSING
    • G06F2203/00—Indexing scheme relating to G06F3/00 - G06F3/048
    • G06F2203/041—Indexing scheme relating to G06F3/041 - G06F3/045
    • G06F2203/04112—Electrode mesh in capacitive digitiser: electrode for touch sensing is formed of a mesh of very fine, normally metallic, interconnected lines that are almost invisible to see. This provides a quite large but transparent electrode surface, without need for ITO or similar transparent conductive material
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10S977/00—Nanotechnology
    • Y10S977/70—Nanostructure
    • Y10S977/762—Nanowire or quantum wire, i.e. axially elongated structure having two dimensions of 100 nm or less
    • Y10S977/766—Bent wire, i.e. having nonliner longitudinal axis
    • Y10S977/767—Mesh structure
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10S977/00—Nanotechnology
    • Y10S977/84—Manufacture, treatment, or detection of nanostructure
    • Y10S977/887—Nanoimprint lithography, i.e. nanostamp
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10S977/00—Nanotechnology
    • Y10S977/902—Specified use of nanostructure
    • Y10S977/932—Specified use of nanostructure for electronic or optoelectronic application
    • Y10S977/953—Detector using nanostructure
    • Y10S977/956—Of mechanical property

Landscapes

  • Engineering & Computer Science (AREA)
  • Theoretical Computer Science (AREA)
  • General Engineering & Computer Science (AREA)
  • Human Computer Interaction (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Laminated Bodies (AREA)
  • Manufacturing Of Electric Cables (AREA)
  • Non-Insulated Conductors (AREA)
  • Printing Methods (AREA)
SG11201504125UA 2012-12-07 2013-12-02 Method of making transparent conductors on a substrate SG11201504125UA (en)

Applications Claiming Priority (4)

Application Number Priority Date Filing Date Title
US201261734793P 2012-12-07 2012-12-07
US201361782634P 2013-03-14 2013-03-14
US201361840876P 2013-06-28 2013-06-28
PCT/US2013/072624 WO2014088950A1 (en) 2012-12-07 2013-12-02 Method of making transparent conductors on a substrate

Publications (1)

Publication Number Publication Date
SG11201504125UA true SG11201504125UA (en) 2015-06-29

Family

ID=50883903

Family Applications (1)

Application Number Title Priority Date Filing Date
SG11201504125UA SG11201504125UA (en) 2012-12-07 2013-12-02 Method of making transparent conductors on a substrate

Country Status (8)

Country Link
US (2) US10254786B2 (ko)
EP (1) EP2929417A4 (ko)
JP (1) JP6700787B2 (ko)
KR (1) KR102145157B1 (ko)
CN (1) CN104838342B (ko)
BR (1) BR112015013033A2 (ko)
SG (1) SG11201504125UA (ko)
WO (1) WO2014088950A1 (ko)

Families Citing this family (34)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
FR3000917B1 (fr) * 2013-01-11 2015-02-20 Bobst Lyon Procede de commande, pour commander une machine de transformation, machine de transformation et programme d'ordinateur pour realiser un tel procede de commande
WO2015017143A1 (en) 2013-07-31 2015-02-05 3M Innovative Properties Company Bonding electronic components to patterned nanowire transparent conductors
US9807871B2 (en) 2013-08-28 2017-10-31 3M Innovative Properties Company Electronic assembly with fiducial marks for precision registration during subsequent processing steps
BR112016006975A2 (pt) 2013-09-30 2017-08-01 3M Innovative Properties Co revestimento protetor para padrão condutivo impresso em condutores transparentes de nanofio dotados de um padrão
SG11201603375TA (en) 2013-11-06 2016-05-30 3M Innovative Properties Co Microcontact printing stamps with functional features
US10166571B2 (en) * 2013-12-10 2019-01-01 Lg Display Co., Ltd. Refining method for microstructure
TWI564762B (zh) * 2015-04-22 2017-01-01 恆顥科技股份有限公司 觸控薄膜疊層卷的製作方法與所製得之觸控薄膜疊層片
WO2017003789A1 (en) 2015-06-30 2017-01-05 3M Innovative Properties Company Electronic devices comprising a via and methods of forming such electronic devices
WO2017003820A1 (en) 2015-06-30 2017-01-05 3M Innovative Properties Company Patterned overcoat layer
CN107835976B (zh) 2015-07-21 2021-06-11 3M创新有限公司 导电膜、组件、以及从导电图案移除静电荷的方法
KR102555869B1 (ko) * 2015-08-06 2023-07-13 삼성전자주식회사 도전체 및 그 제조 방법
US10564780B2 (en) 2015-08-21 2020-02-18 3M Innovative Properties Company Transparent conductors including metal traces and methods of making same
EP3384368A1 (de) * 2015-12-04 2018-10-10 Leonhard Kurz Stiftung & Co. KG Folie sowie verfahren zur herstellung einer folie
WO2017159698A1 (ja) * 2016-03-18 2017-09-21 国立大学法人大阪大学 金属ナノワイヤ層が形成された基材及びその製造方法
CN109311288B (zh) 2016-05-25 2021-01-12 3M创新有限公司 用于触摸传感器的基底
EP3483898A4 (en) * 2016-07-08 2019-06-12 Asahi Kasei Kabushiki Kaisha CONDUCTIVE FILM, ELECTRONIC PAPER, TOUCH PANEL AND FLAT SCREEN DISPLAY
CN110121921A (zh) * 2016-12-29 2019-08-13 3M创新有限公司 用于制备导电图案的方法以及包含导电图案的制品
KR101841946B1 (ko) * 2017-02-24 2018-03-26 동우 화인켐 주식회사 장력 제어를 이용한 터치 센서 필름 제조방법
DE102017106055B4 (de) * 2017-03-21 2021-04-08 Tdk Corporation Trägersubstrat für stressempflindliches Bauelement und Verfahren zur Herstellung
WO2019003056A1 (en) 2017-06-29 2019-01-03 3M Innovative Properties Company ARTICLE AND METHODS OF MANUFACTURING
JP7253550B2 (ja) 2017-11-30 2023-04-06 スリーエム イノベイティブ プロパティズ カンパニー 自己支持型３層積層体を含む基板
US10058014B1 (en) 2017-12-13 2018-08-21 International Business Machines Corporation Conductive adhesive layer for gasket assembly
JP2021003806A (ja) * 2018-01-29 2021-01-14 スリーエム イノベイティブ プロパティズ カンパニー 糸状部材への印刷方法、及び糸状のこぎり
CN109871141B (zh) * 2018-12-29 2023-02-03 赣州市德普特科技有限公司 一种触摸屏制作工艺中的布线区保护方法
KR20200085386A (ko) * 2019-01-04 2020-07-15 삼성디스플레이 주식회사 표시 장치 및 이의 제조 방법
US11261529B2 (en) * 2020-03-31 2022-03-01 Futuretech Capital, Inc. Reduced visibility conductive micro mesh touch sensor
KR102461794B1 (ko) * 2020-08-13 2022-11-02 한국과학기술연구원 은 나노와이어 메쉬 전극 및 이의 제조방법
CN114496352A (zh) * 2020-11-12 2022-05-13 天材创新材料科技(厦门)有限公司 纳米银线保护层结构及其制备方法
US11961632B2 (en) 2020-12-04 2024-04-16 Korea Advanced Institute Of Science And Technology Fabrication method of conductive nanonetworks using mastermold
KR20220079435A (ko) 2020-12-04 2022-06-13 한국과학기술원 희생층을 이용한 투명 전도성 네트워크 제조방법
KR102628299B1 (ko) 2020-12-04 2024-01-24 한국과학기술원 마스터몰드를 이용한 투명 전도성 네트워크 제조방법
KR20220079437A (ko) 2020-12-04 2022-06-13 한국과학기술원 나노마스크를 이용한 투명 전도성 네트워크 제조방법
US11513638B2 (en) 2020-12-18 2022-11-29 Cambrios Film Solutions Corporation Silver nanowire protection layer structure and manufacturing method thereof
CN113764564B (zh) * 2021-08-31 2024-01-23 Tcl华星光电技术有限公司 基板制备方法及膜片结构

Family Cites Families (48)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3654384A (en) 1970-05-25 1972-04-04 Magnavox Co Apparatus for modifying electrical signals
US4895630A (en) 1985-08-28 1990-01-23 W. H. Brady Co. Rapidly removable undercoating for vacuum deposition of patterned layers onto substrates
JPH05224818A (ja) 1992-02-10 1993-09-03 Matsushita Electric Ind Co Ltd タッチパネル装置
TWI231293B (en) * 1997-11-12 2005-04-21 Jsr Corp Transfer film
US6037005A (en) 1998-05-12 2000-03-14 3M Innovative Properties Company Display substrate electrodes with auxiliary metal layers for enhanced conductivity
US20030148024A1 (en) 2001-10-05 2003-08-07 Kodas Toivo T. Low viscosity precursor compositons and methods for the depositon of conductive electronic features
TWI268813B (en) * 2002-04-24 2006-12-21 Sipix Imaging Inc Process for forming a patterned thin film conductive structure on a substrate
KR100486915B1 (ko) 2002-09-12 2005-05-03 엘지전자 주식회사 포토필링법을 이용한 플라즈마 디스플레이 패널의 전극제조방법
US6975067B2 (en) 2002-12-19 2005-12-13 3M Innovative Properties Company Organic electroluminescent device and encapsulation method
US7175876B2 (en) 2003-06-27 2007-02-13 3M Innovative Properties Company Patterned coating method employing polymeric coatings
US20050196707A1 (en) 2004-03-02 2005-09-08 Eastman Kodak Company Patterned conductive coatings
JP5224818B2 (ja) 2004-12-28 2013-07-03 ジェミン エックス ファーマシューティカルズ カナダ インコーポレイテッド ジピロール化合物およびそれを含む医薬組成物
KR20140084242A (ko) * 2005-06-20 2014-07-04 피에스엠에이 디벨롭먼트 캄파니, 엘엘씨 Ｐｓｍａ 항체-약물 접합체
KR20120128155A (ko) 2005-08-12 2012-11-26 캄브리오스 테크놀로지즈 코포레이션 나노와이어 기반의 투명 도전체
US20090246486A1 (en) 2005-09-22 2009-10-01 Fujifilm Corporation Light-transmittable electromagnetic wave shielding film, process for producing light-transmittable electromagnetic wave shielding film, film for display panel, optical filter for display panel and plasma display panel
US8264137B2 (en) * 2006-01-03 2012-09-11 Samsung Electronics Co., Ltd. Curing binder material for carbon nanotube electron emission cathodes
US8461992B2 (en) 2006-05-12 2013-06-11 Solstice Medical, Llc RFID coupler for metallic implements
US20080048996A1 (en) 2006-08-11 2008-02-28 Unidym, Inc. Touch screen devices employing nanostructure networks
WO2008046058A2 (en) 2006-10-12 2008-04-17 Cambrios Technologies Corporation Nanowire-based transparent conductors and applications thereof
US8018568B2 (en) 2006-10-12 2011-09-13 Cambrios Technologies Corporation Nanowire-based transparent conductors and applications thereof
US7867907B2 (en) * 2006-10-17 2011-01-11 Semiconductor Energy Laboratory Co., Ltd. Method for manufacturing semiconductor device
WO2008127313A2 (en) 2006-11-17 2008-10-23 The Regents Of The University Of California Electrically conducting and optically transparent nanowire networks
JP4902344B2 (ja) * 2006-12-27 2012-03-21 富士フイルム株式会社 金属パターン材料の製造方法
KR100875168B1 (ko) * 2007-07-26 2008-12-22 주식회사 동부하이텍 반도체 소자의 금속배선 잔류 폴리머 제거방법
US8378046B2 (en) 2007-10-19 2013-02-19 3M Innovative Properties Company High refractive index pressure-sensitive adhesives
CN102015922A (zh) 2008-02-26 2011-04-13 凯博瑞奥斯技术公司 用于喷墨沉积传导性特征的方法和组合物
WO2009108771A2 (en) 2008-02-28 2009-09-03 3M Innovative Properties Company Methods of patterning a conductor on a substrate
JP5086886B2 (ja) * 2008-05-15 2012-11-28 富士通コンポーネント株式会社 座標検出装置の製造方法
WO2010014683A2 (en) * 2008-08-01 2010-02-04 3M Innovative Properties Company Touch sensitive devices with composite electrodes
JP5474097B2 (ja) 2009-02-06 2014-04-16 エルジー・ケム・リミテッド タッチスクリーンおよびその製造方法
US20100238133A1 (en) 2009-03-17 2010-09-23 Wintek Corporation Capacitive touch panel
JP2010271796A (ja) * 2009-05-19 2010-12-02 Optrex Corp 電極間接続構造およびタッチパネル
KR101362863B1 (ko) * 2009-06-30 2014-02-14 디아이씨 가부시끼가이샤 투명 도전층 패턴의 형성 방법
WO2011025782A1 (en) 2009-08-24 2011-03-03 Cambrios Technologies Corporation Contact resistance measurement for resistance linearity in nanostructure thin films
CN101699376B (zh) 2009-09-04 2011-09-14 深超光电（深圳）有限公司 触控面板及触控面板的检测方法
US20110057905A1 (en) * 2009-09-04 2011-03-10 Hong-Chih Yu Touch Panel and Inspection Method Thereof
KR101073280B1 (ko) 2010-04-01 2011-10-12 삼성모바일디스플레이주식회사 터치 스크린 패널 및 이를 구비한 영상표시장치
JP5857051B2 (ja) * 2010-08-23 2016-02-10 コーニンクレッカ フィリップス エヌ ヴェＫｏｎｉｎｋｌｉｊｋｅ Ｐｈｉｌｉｐｓ Ｎ．Ｖ． 不透明導電性領域の自己整合被覆
KR101367569B1 (ko) * 2010-12-29 2014-02-28 주식회사 엘지화학 터치 스크린 및 이의 제조방법
US9482693B2 (en) * 2011-02-04 2016-11-01 Shin-Etsu Polymer Co., Ltd. Capacitive sensor sheet and production method thereof
US8558807B2 (en) 2011-02-15 2013-10-15 Teh-Zheng Lin Transparent touch panel
JP2012182005A (ja) 2011-03-01 2012-09-20 Nitto Denko Corp 有機エレクトロルミネッセンス素子の製法
US8854326B2 (en) 2011-03-10 2014-10-07 Wintek Corporation Touch panel and touch-sensitive display device
CN102870508B (zh) * 2011-04-26 2016-10-12 日本梅克特隆株式会社 用于制造透明印刷电路的方法和用于制造透明触摸板的方法
KR20120127556A (ko) * 2011-05-14 2012-11-22 정병현 투명 도전막 에칭 방법
JP5806066B2 (ja) 2011-09-30 2015-11-10 富士フイルム株式会社 電極パターン、タッチパネル、液晶表示装置及び、有機ｅｌディスプレイ
KR101373044B1 (ko) * 2012-04-19 2014-03-11 삼성디스플레이 주식회사 터치 스크린 패널
JP6581080B2 (ja) 2013-10-23 2019-09-25 スリーエム イノベイティブ プロパティズ カンパニー テクスチャー化フィルムを製造するためのシステム及び方法

Also Published As

Publication number Publication date
US10831233B2 (en) 2020-11-10
EP2929417A4 (en) 2016-07-20
JP6700787B2 (ja) 2020-05-27
CN104838342A (zh) 2015-08-12
BR112015013033A2 (pt) 2017-07-11
US20190187746A1 (en) 2019-06-20
KR20150093208A (ko) 2015-08-17
US10254786B2 (en) 2019-04-09
EP2929417A1 (en) 2015-10-14
JP2016509332A (ja) 2016-03-24
KR102145157B1 (ko) 2020-08-18
CN104838342B (zh) 2018-03-13
US20150316955A1 (en) 2015-11-05
WO2014088950A1 (en) 2014-06-12

Similar Documents

Publication Publication Date Title
SG11201504125UA (en) Method of making transparent conductors on a substrate
EP2763519A4 (en) TRANSPARENT CONDUCTIVE SUBSTRATE AND METHOD FOR PRODUCING THE SAME
HK1201633A1 (en) Patterned transparent conductors and related manufacturing methods
EP2874137A4 (en) METHOD FOR PRODUCING AN MOUNTING STRUCTURE ON A DISPLAY SUBSTRATE
EP2824676A4 (en) METHOD FOR MANUFACTURING TRANSPARENT CONDUCTIVE PATTERN
PL2839054T3 (pl) Sposób otrzymywania podłoża powlekanego
EP2632237A4 (en) WIRING SUBSTRATE
PL3492274T3 (pl) Sposób zdobienia panelu
EP2913831A4 (en) PROCESS FOR PRODUCING RARE EARTH MAGNET
EP2699065A4 (en) CIRCUIT BOARD
EP2565170A4 (en) PROCESS FOR PRODUCING TRANSPARENT SUBSTRATE
EP2698426A4 (en) CELLULAR ADHESION PHOTOGRAPHING BASE MATERIAL
GB2498994B (en) Method of making a flexible circuit
EP2927977A4 (en) CONDUCTIVE SUBSTRATE AND METHOD FOR MANUFACTURING THE SAME
EP2925089A4 (en) SUBSTRATE FOR FLEXIBLE DEVICES AND METHOD FOR PRODUCING THE SAME
EP2738776A4 (en) TRANSPARENT CONDUCTOR AND METHOD FOR MANUFACTURING THE SAME
GB201222620D0 (en) Method of applying a conductive adhesive
EP2916630A4 (en) SUBSTRATE AND METHOD FOR THE PRODUCTION OF THE SUBSTRATE
EP2835818A4 (en) TRANSPARENT SEMICONDUCTOR COMPOUND AND PROCESS FOR PRODUCING THE SAME
EP2690941A4 (en) WIRING SUBSTRATE
SG11201503933RA (en) Substrate etching method
EP3457439C0 (en) ELECTRONIC DEVICES
EP2763517A4 (en) Substrate Preparation Process
EP2821217A4 (en) MANUFACTURING METHOD FOR LABELS
EP2750172A4 (en) WIRING SUBSTRATE