SG11201502044VA - Electrolyte and process for electroplating copper onto abarrier layer - Google Patents

Electrolyte and process for electroplating copper onto abarrier layer

Info

Publication number
SG11201502044VA
SG11201502044VA SG11201502044VA SG11201502044VA SG11201502044VA SG 11201502044V A SG11201502044V A SG 11201502044VA SG 11201502044V A SG11201502044V A SG 11201502044VA SG 11201502044V A SG11201502044V A SG 11201502044VA SG 11201502044V A SG11201502044V A SG 11201502044VA
Authority
SG
Singapore
Prior art keywords
electrolyte
electroplating copper
copper onto
abarrier layer
abarrier
Prior art date
Application number
SG11201502044VA
Other languages
English (en)
Inventor
Vincent Mevellec
Dominique Suhr
Laurianne Religieux
Original Assignee
Alchimer
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Alchimer filed Critical Alchimer
Publication of SG11201502044VA publication Critical patent/SG11201502044VA/en

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D3/00—Electroplating: Baths therefor
    • C25D3/02—Electroplating: Baths therefor from solutions
    • C25D3/38—Electroplating: Baths therefor from solutions of copper
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D7/00—Electroplating characterised by the article coated
    • C25D7/12—Semiconductors
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D7/00—Electroplating characterised by the article coated
    • C25D7/12—Semiconductors
    • C25D7/123—Semiconductors first coated with a seed layer or a conductive layer

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Electrochemistry (AREA)
  • Materials Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Electroplating And Plating Baths Therefor (AREA)
  • Electrodes Of Semiconductors (AREA)
  • Electroplating Methods And Accessories (AREA)
  • Internal Circuitry In Semiconductor Integrated Circuit Devices (AREA)
SG11201502044VA 2012-09-24 2013-08-28 Electrolyte and process for electroplating copper onto abarrier layer SG11201502044VA (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
FR1258925A FR2995912B1 (fr) 2012-09-24 2012-09-24 Electrolyte et procede d'electrodeposition de cuivre sur une couche barriere
PCT/FR2013/051987 WO2014044942A1 (fr) 2012-09-24 2013-08-28 Electrolyte et procédé d'électrodéposition de cuivre sur une couche barrière

Publications (1)

Publication Number Publication Date
SG11201502044VA true SG11201502044VA (en) 2015-05-28

Family

ID=47137948

Family Applications (1)

Application Number Title Priority Date Filing Date
SG11201502044VA SG11201502044VA (en) 2012-09-24 2013-08-28 Electrolyte and process for electroplating copper onto abarrier layer

Country Status (11)

Country Link
US (1) US10472726B2 (fr)
EP (1) EP2898121B8 (fr)
JP (1) JP6218837B2 (fr)
KR (1) KR102206291B1 (fr)
CN (1) CN104685107B (fr)
CA (1) CA2885231A1 (fr)
FR (1) FR2995912B1 (fr)
IL (1) IL237731B (fr)
SG (1) SG11201502044VA (fr)
TW (1) TWI592522B (fr)
WO (1) WO2014044942A1 (fr)

Families Citing this family (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US8575028B2 (en) 2011-04-15 2013-11-05 Novellus Systems, Inc. Method and apparatus for filling interconnect structures
US9865501B2 (en) 2013-03-06 2018-01-09 Lam Research Corporation Method and apparatus for remote plasma treatment for reducing metal oxides on a metal seed layer
US20150299886A1 (en) * 2014-04-18 2015-10-22 Lam Research Corporation Method and apparatus for preparing a substrate with a semi-noble metal layer
US9469912B2 (en) 2014-04-21 2016-10-18 Lam Research Corporation Pretreatment method for photoresist wafer processing
JP6585434B2 (ja) * 2014-10-06 2019-10-02 株式会社荏原製作所 めっき方法
US9472377B2 (en) 2014-10-17 2016-10-18 Lam Research Corporation Method and apparatus for characterizing metal oxide reduction
FR3061601B1 (fr) * 2016-12-29 2022-12-30 Aveni Solution d'electrodeposition de cuivre et procede pour des motifs de facteur de forme eleve
US10443146B2 (en) 2017-03-30 2019-10-15 Lam Research Corporation Monitoring surface oxide on seed layers during electroplating
JP2023069822A (ja) * 2021-11-08 2023-05-18 三菱マテリアル株式会社 酸性電解銅めっき液、プリフォーム層の形成方法、接合用シートの製造方法、接合用基板の製造方法及び接合体の製造方法

Family Cites Families (18)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3617451A (en) * 1969-06-10 1971-11-02 Macdermid Inc Thiosulfate copper plating
JPH01219187A (ja) * 1988-02-25 1989-09-01 Ishihara Chem Co Ltd 電気銅めっき液
JP2678701B2 (ja) * 1992-02-19 1997-11-17 石原薬品 株式会社 電気銅めっき液
JPH0776795A (ja) * 1993-09-09 1995-03-20 Sumitomo Metal Ind Ltd 着色表面処理鋼板とその製造方法
JP3641372B2 (ja) * 1998-10-21 2005-04-20 株式会社荏原製作所 電解めっき方法及び電解めっき装置
US6288449B1 (en) * 1998-12-22 2001-09-11 Agere Systems Guardian Corp. Barrier for copper metallization
JP3498306B2 (ja) * 1999-09-16 2004-02-16 石原薬品株式会社 ボイドフリー銅メッキ方法
US8002962B2 (en) * 2002-03-05 2011-08-23 Enthone Inc. Copper electrodeposition in microelectronics
KR100767943B1 (ko) * 2003-10-17 2007-10-17 닛코킨조쿠 가부시키가이샤 무전해 구리도금액 및 무전해 구리도금방법
US20060243599A1 (en) * 2005-04-28 2006-11-02 Taiwan Semiconductor Manufacturing Company, Ltd. Electroplating additive for improved reliability
JP2007016264A (ja) * 2005-07-06 2007-01-25 Adeka Corp 新規化合物、該化合物からなる電解銅メッキ用添加剤、該添加剤を含有する電解銅メッキ浴、該メッキ浴を使用する電解銅メッキ方法
FR2890983B1 (fr) * 2005-09-20 2007-12-14 Alchimer Sa Composition d'electrodeposition destinee au revetement d'une surface d'un substrat par un metal.
FR2890984B1 (fr) * 2005-09-20 2009-03-27 Alchimer Sa Procede d'electrodeposition destine au revetement d'une surface d'un substrat par un metal.
US7579274B2 (en) * 2006-02-21 2009-08-25 Alchimer Method and compositions for direct copper plating and filing to form interconnects in the fabrication of semiconductor devices
JP5442188B2 (ja) * 2007-08-10 2014-03-12 ローム・アンド・ハース・エレクトロニック・マテリアルズ，エル．エル．シー． 銅めっき液組成物
FR2930785B1 (fr) 2008-05-05 2010-06-11 Alchimer Composition d'electrodeposition et procede de revetement d'un substrat semi-conducteur utilisant ladite composition
JP5583896B2 (ja) * 2008-07-22 2014-09-03 ローム・アンド・ハース・エレクトロニック・マテリアルズ，エル．エル．シー． パラジウムおよびパラジウム合金の高速めっき方法
US20130168255A1 (en) * 2010-06-11 2013-07-04 Alchimer Copper-electroplating composition and process for filling a cavity in a semiconductor substrate using this composition

Also Published As

Publication number Publication date
EP2898121B1 (fr) 2016-08-03
TWI592522B (zh) 2017-07-21
WO2014044942A1 (fr) 2014-03-27
CA2885231A1 (fr) 2014-03-27
CN104685107B (zh) 2017-05-03
US20150218724A1 (en) 2015-08-06
KR102206291B1 (ko) 2021-01-22
US10472726B2 (en) 2019-11-12
TW201418528A (zh) 2014-05-16
JP6218837B2 (ja) 2017-10-25
EP2898121B8 (fr) 2016-09-14
JP2015533946A (ja) 2015-11-26
CN104685107A (zh) 2015-06-03
KR20150056655A (ko) 2015-05-26
FR2995912B1 (fr) 2014-10-10
IL237731B (en) 2018-04-30
FR2995912A1 (fr) 2014-03-28
EP2898121A1 (fr) 2015-07-29

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