EP2898121B8 - Electrolyte et procédé d'électrodéposition de cuivre sur une couche barrière - Google Patents

Electrolyte et procédé d'électrodéposition de cuivre sur une couche barrière Download PDF

Info

Publication number
EP2898121B8
EP2898121B8 EP13767028.7A EP13767028A EP2898121B8 EP 2898121 B8 EP2898121 B8 EP 2898121B8 EP 13767028 A EP13767028 A EP 13767028A EP 2898121 B8 EP2898121 B8 EP 2898121B8
Authority
EP
European Patent Office
Prior art keywords
electrolyte
barrier layer
copper onto
electrodepositing copper
electrodepositing
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active
Application number
EP13767028.7A
Other languages
German (de)
English (en)
Other versions
EP2898121B1 (fr
EP2898121A1 (fr
Inventor
Vincent Mevellec
Dominique Suhr
Laurianne RELIGIEUX
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Aveni SA
Original Assignee
Aveni SA
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Aveni SA filed Critical Aveni SA
Publication of EP2898121A1 publication Critical patent/EP2898121A1/fr
Application granted granted Critical
Publication of EP2898121B1 publication Critical patent/EP2898121B1/fr
Publication of EP2898121B8 publication Critical patent/EP2898121B8/fr
Active legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D3/00—Electroplating: Baths therefor
    • C25D3/02—Electroplating: Baths therefor from solutions
    • C25D3/38—Electroplating: Baths therefor from solutions of copper
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D7/00—Electroplating characterised by the article coated
    • C25D7/12—Semiconductors
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D7/00—Electroplating characterised by the article coated
    • C25D7/12—Semiconductors
    • C25D7/123—Semiconductors first coated with a seed layer or a conductive layer

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Electrochemistry (AREA)
  • Materials Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Electroplating And Plating Baths Therefor (AREA)
  • Electrodes Of Semiconductors (AREA)
  • Electroplating Methods And Accessories (AREA)
  • Internal Circuitry In Semiconductor Integrated Circuit Devices (AREA)
EP13767028.7A 2012-09-24 2013-08-28 Electrolyte et procédé d'électrodéposition de cuivre sur une couche barrière Active EP2898121B8 (fr)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
FR1258925A FR2995912B1 (fr) 2012-09-24 2012-09-24 Electrolyte et procede d'electrodeposition de cuivre sur une couche barriere
PCT/FR2013/051987 WO2014044942A1 (fr) 2012-09-24 2013-08-28 Electrolyte et procédé d'électrodéposition de cuivre sur une couche barrière

Publications (3)

Publication Number Publication Date
EP2898121A1 EP2898121A1 (fr) 2015-07-29
EP2898121B1 EP2898121B1 (fr) 2016-08-03
EP2898121B8 true EP2898121B8 (fr) 2016-09-14

Family

ID=47137948

Family Applications (1)

Application Number Title Priority Date Filing Date
EP13767028.7A Active EP2898121B8 (fr) 2012-09-24 2013-08-28 Electrolyte et procédé d'électrodéposition de cuivre sur une couche barrière

Country Status (11)

Country Link
US (1) US10472726B2 (fr)
EP (1) EP2898121B8 (fr)
JP (1) JP6218837B2 (fr)
KR (1) KR102206291B1 (fr)
CN (1) CN104685107B (fr)
CA (1) CA2885231A1 (fr)
FR (1) FR2995912B1 (fr)
IL (1) IL237731B (fr)
SG (1) SG11201502044VA (fr)
TW (1) TWI592522B (fr)
WO (1) WO2014044942A1 (fr)

Families Citing this family (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20120261254A1 (en) 2011-04-15 2012-10-18 Reid Jonathan D Method and apparatus for filling interconnect structures
US9865501B2 (en) 2013-03-06 2018-01-09 Lam Research Corporation Method and apparatus for remote plasma treatment for reducing metal oxides on a metal seed layer
US20150299886A1 (en) * 2014-04-18 2015-10-22 Lam Research Corporation Method and apparatus for preparing a substrate with a semi-noble metal layer
US9469912B2 (en) 2014-04-21 2016-10-18 Lam Research Corporation Pretreatment method for photoresist wafer processing
JP6585434B2 (ja) * 2014-10-06 2019-10-02 株式会社荏原製作所 めっき方法
US9472377B2 (en) 2014-10-17 2016-10-18 Lam Research Corporation Method and apparatus for characterizing metal oxide reduction
FR3061601B1 (fr) * 2016-12-29 2022-12-30 Aveni Solution d'electrodeposition de cuivre et procede pour des motifs de facteur de forme eleve
US10443146B2 (en) 2017-03-30 2019-10-15 Lam Research Corporation Monitoring surface oxide on seed layers during electroplating
JP2023069822A (ja) * 2021-11-08 2023-05-18 三菱マテリアル株式会社 酸性電解銅めっき液、プリフォーム層の形成方法、接合用シートの製造方法、接合用基板の製造方法及び接合体の製造方法

Family Cites Families (18)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3617451A (en) * 1969-06-10 1971-11-02 Macdermid Inc Thiosulfate copper plating
JPH01219187A (ja) * 1988-02-25 1989-09-01 Ishihara Chem Co Ltd 電気銅めっき液
JP2678701B2 (ja) * 1992-02-19 1997-11-17 石原薬品 株式会社 電気銅めっき液
JPH0776795A (ja) * 1993-09-09 1995-03-20 Sumitomo Metal Ind Ltd 着色表面処理鋼板とその製造方法
JP3641372B2 (ja) * 1998-10-21 2005-04-20 株式会社荏原製作所 電解めっき方法及び電解めっき装置
US6288449B1 (en) * 1998-12-22 2001-09-11 Agere Systems Guardian Corp. Barrier for copper metallization
JP3498306B2 (ja) * 1999-09-16 2004-02-16 石原薬品株式会社 ボイドフリー銅メッキ方法
US8002962B2 (en) * 2002-03-05 2011-08-23 Enthone Inc. Copper electrodeposition in microelectronics
JP4327163B2 (ja) * 2003-10-17 2009-09-09 日鉱金属株式会社 無電解銅めっき液および無電解銅めっき方法
US20060243599A1 (en) * 2005-04-28 2006-11-02 Taiwan Semiconductor Manufacturing Company, Ltd. Electroplating additive for improved reliability
JP2007016264A (ja) * 2005-07-06 2007-01-25 Adeka Corp 新規化合物、該化合物からなる電解銅メッキ用添加剤、該添加剤を含有する電解銅メッキ浴、該メッキ浴を使用する電解銅メッキ方法
FR2890983B1 (fr) * 2005-09-20 2007-12-14 Alchimer Sa Composition d'electrodeposition destinee au revetement d'une surface d'un substrat par un metal.
FR2890984B1 (fr) * 2005-09-20 2009-03-27 Alchimer Sa Procede d'electrodeposition destine au revetement d'une surface d'un substrat par un metal.
US7579274B2 (en) * 2006-02-21 2009-08-25 Alchimer Method and compositions for direct copper plating and filing to form interconnects in the fabrication of semiconductor devices
JP5442188B2 (ja) * 2007-08-10 2014-03-12 ローム・アンド・ハース・エレクトロニック・マテリアルズ，エル．エル．シー． 銅めっき液組成物
FR2930785B1 (fr) 2008-05-05 2010-06-11 Alchimer Composition d'electrodeposition et procede de revetement d'un substrat semi-conducteur utilisant ladite composition
JP5583896B2 (ja) * 2008-07-22 2014-09-03 ローム・アンド・ハース・エレクトロニック・マテリアルズ，エル．エル．シー． パラジウムおよびパラジウム合金の高速めっき方法
JP2013536314A (ja) * 2010-06-11 2013-09-19 アルスィメール 銅電着組成物及びこの組成物を用いた半導体基板の空洞の充填方法

Also Published As

Publication number Publication date
KR20150056655A (ko) 2015-05-26
JP2015533946A (ja) 2015-11-26
US20150218724A1 (en) 2015-08-06
CN104685107A (zh) 2015-06-03
TWI592522B (zh) 2017-07-21
FR2995912B1 (fr) 2014-10-10
FR2995912A1 (fr) 2014-03-28
CN104685107B (zh) 2017-05-03
IL237731B (en) 2018-04-30
TW201418528A (zh) 2014-05-16
US10472726B2 (en) 2019-11-12
CA2885231A1 (fr) 2014-03-27
SG11201502044VA (en) 2015-05-28
EP2898121B1 (fr) 2016-08-03
WO2014044942A1 (fr) 2014-03-27
EP2898121A1 (fr) 2015-07-29
JP6218837B2 (ja) 2017-10-25
KR102206291B1 (ko) 2021-01-22

Similar Documents

Publication Publication Date Title
EP2898121B8 (fr) Electrolyte et procédé d'électrodéposition de cuivre sur une couche barrière
EP2840110A4 (fr) Procédé de fabrication d'un film de revêtement dur
EP2860798B8 (fr) Procédé de fabrication d'une électrode
EP2694642B8 (fr) Procédé pour régénérer des cellules
EP2693444A4 (fr) Composition conductrice, film conducteur utilisant la composition conductrice, et procédé de fabrication du film conducteur
EP2682948A4 (fr) Structure conductrice et procédé de fabrication correspondant
EP2840107A4 (fr) Film de revêtement dur et son procédé de fabrication
EP2692762A4 (fr) Composition électroconductrice, film électroconducteur utilisant ladite composition et son procédé de production
EP2786441A4 (fr) Procédé d'alcalinisation d'anodes
EP2594613A4 (fr) Composition de revêtement conducteur et procédé de fabrication d'une couche conductrice à l'aide de celle-ci
EP2725587A4 (fr) Procédé de formation d'un film conducteur, film conducteur, procédé d'isolation et film isolant
EP2798675A4 (fr) Procédés et appareil associés à une couche centrale de substrat
EP2690691A4 (fr) Couche poreuse conductrice pour batteries, et procédé de fabrication associé
ZA201206551B (en) Method for providing a substrate with a barrier and a substrate comprising a barrier
EP2690200A4 (fr) Anode d'extraction électrolytique et procédé d'extraction électrolytique l'utilisant
EP2711177A4 (fr) Couche de revêtement et procédé permettant de former une couche de revêtement
EP2529395A4 (fr) Procédé pour améliorer le dépôt de substrats non conducteurs
HRP20181436T1 (hr) Postupak za primjenu nanočestica
ZA201308276B (en) Termination for electrical cables and method for manufacturing such a termination
IL227985B (en) A method for creating an entertainment film
EP2927977A4 (fr) Substrat conducteur et son procédé de fabrication
EP2905098A4 (fr) Outil de revêtement de film dur et procédé de fabrication dudit outil
EP2927346A4 (fr) Procédé de revêtement permettant de réduire la dégradation d'une couche barrière
EP2871645A4 (fr) Procédé de formation d'un film conducteur, et promoteur de frittage
EP2894032A4 (fr) Procédé de fabrication d'un stratifié

Legal Events

Date Code Title Description
PUAI Public reference made under article 153(3) epc to a published international application that has entered the european phase

Free format text: ORIGINAL CODE: 0009012

17P Request for examination filed

Effective date: 20150312

AK Designated contracting states

Kind code of ref document: A1

Designated state(s): AL AT BE BG CH CY CZ DE DK EE ES FI FR GB GR HR HU IE IS IT LI LT LU LV MC MK MT NL NO PL PT RO RS SE SI SK SM TR

AX Request for extension of the european patent

Extension state: BA ME

RIN1 Information on inventor provided before grant (corrected)

Inventor name: RELIGIEUX, LAURIANNE

Inventor name: MEVELLEC, VINCENT

Inventor name: SUHR, DOMINIQUE

DAX Request for extension of the european patent (deleted)
GRAP Despatch of communication of intention to grant a patent

Free format text: ORIGINAL CODE: EPIDOSNIGR1

RIC1 Information provided on ipc code assigned before grant

Ipc: C25D 3/38 20060101AFI20160113BHEP

Ipc: C25D 7/12 20060101ALI20160113BHEP

INTG Intention to grant announced

Effective date: 20160211

GRAS Grant fee paid

Free format text: ORIGINAL CODE: EPIDOSNIGR3

GRAA (expected) grant

Free format text: ORIGINAL CODE: 0009210

AK Designated contracting states

Kind code of ref document: B1

Designated state(s): AL AT BE BG CH CY CZ DE DK EE ES FI FR GB GR HR HU IE IS IT LI LT LU LV MC MK MT NL NO PL PT RO RS SE SI SK SM TR

REG Reference to a national code

Ref country code: GB

Ref legal event code: FG4D

Free format text: NOT ENGLISH

RAP2 Party data changed (patent owner data changed or rights of a patent transferred)

Owner name: AVENI

REG Reference to a national code

Ref country code: CH

Ref legal event code: EP

Ref country code: AT

Ref legal event code: REF

Ref document number: 817400

Country of ref document: AT

Kind code of ref document: T

Effective date: 20160815

REG Reference to a national code

Ref country code: IE

Ref legal event code: FG4D

Free format text: LANGUAGE OF EP DOCUMENT: FRENCH

REG Reference to a national code

Ref country code: FR

Ref legal event code: PLFP

Year of fee payment: 4

REG Reference to a national code

Ref country code: DE

Ref legal event code: R096

Ref document number: 602013010111

Country of ref document: DE

REG Reference to a national code

Ref country code: NL

Ref legal event code: MP

Effective date: 20160803

REG Reference to a national code

Ref country code: LT

Ref legal event code: MG4D

PG25 Lapsed in a contracting state [announced via postgrant information from national office to epo]

Ref country code: NL

Free format text: LAPSE BECAUSE OF FAILURE TO SUBMIT A TRANSLATION OF THE DESCRIPTION OR TO PAY THE FEE WITHIN THE PRESCRIBED TIME-LIMIT

Effective date: 20160803

Ref country code: NO

Free format text: LAPSE BECAUSE OF FAILURE TO SUBMIT A TRANSLATION OF THE DESCRIPTION OR TO PAY THE FEE WITHIN THE PRESCRIBED TIME-LIMIT

Effective date: 20161103

Ref country code: FI

Free format text: LAPSE BECAUSE OF FAILURE TO SUBMIT A TRANSLATION OF THE DESCRIPTION OR TO PAY THE FEE WITHIN THE PRESCRIBED TIME-LIMIT

Effective date: 20160803

Ref country code: LT

Free format text: LAPSE BECAUSE OF FAILURE TO SUBMIT A TRANSLATION OF THE DESCRIPTION OR TO PAY THE FEE WITHIN THE PRESCRIBED TIME-LIMIT

Effective date: 20160803

Ref country code: RS

Free format text: LAPSE BECAUSE OF FAILURE TO SUBMIT A TRANSLATION OF THE DESCRIPTION OR TO PAY THE FEE WITHIN THE PRESCRIBED TIME-LIMIT

Effective date: 20160803

Ref country code: IT

Free format text: LAPSE BECAUSE OF FAILURE TO SUBMIT A TRANSLATION OF THE DESCRIPTION OR TO PAY THE FEE WITHIN THE PRESCRIBED TIME-LIMIT

Effective date: 20160803

Ref country code: HR

Free format text: LAPSE BECAUSE OF FAILURE TO SUBMIT A TRANSLATION OF THE DESCRIPTION OR TO PAY THE FEE WITHIN THE PRESCRIBED TIME-LIMIT

Effective date: 20160803

Ref country code: IS

Free format text: LAPSE BECAUSE OF FAILURE TO SUBMIT A TRANSLATION OF THE DESCRIPTION OR TO PAY THE FEE WITHIN THE PRESCRIBED TIME-LIMIT

Effective date: 20161203

PG25 Lapsed in a contracting state [announced via postgrant information from national office to epo]

Ref country code: GR

Free format text: LAPSE BECAUSE OF FAILURE TO SUBMIT A TRANSLATION OF THE DESCRIPTION OR TO PAY THE FEE WITHIN THE PRESCRIBED TIME-LIMIT

Effective date: 20161104

Ref country code: SE

Free format text: LAPSE BECAUSE OF FAILURE TO SUBMIT A TRANSLATION OF THE DESCRIPTION OR TO PAY THE FEE WITHIN THE PRESCRIBED TIME-LIMIT

Effective date: 20160803

Ref country code: ES

Free format text: LAPSE BECAUSE OF FAILURE TO SUBMIT A TRANSLATION OF THE DESCRIPTION OR TO PAY THE FEE WITHIN THE PRESCRIBED TIME-LIMIT

Effective date: 20160803

Ref country code: PT

Free format text: LAPSE BECAUSE OF FAILURE TO SUBMIT A TRANSLATION OF THE DESCRIPTION OR TO PAY THE FEE WITHIN THE PRESCRIBED TIME-LIMIT

Effective date: 20161205

Ref country code: LV

Free format text: LAPSE BECAUSE OF FAILURE TO SUBMIT A TRANSLATION OF THE DESCRIPTION OR TO PAY THE FEE WITHIN THE PRESCRIBED TIME-LIMIT

Effective date: 20160803

Ref country code: BE

Free format text: LAPSE BECAUSE OF NON-PAYMENT OF DUE FEES

Effective date: 20160831

Ref country code: PL

Free format text: LAPSE BECAUSE OF FAILURE TO SUBMIT A TRANSLATION OF THE DESCRIPTION OR TO PAY THE FEE WITHIN THE PRESCRIBED TIME-LIMIT

Effective date: 20160803

REG Reference to a national code

Ref country code: CH

Ref legal event code: PL

PG25 Lapsed in a contracting state [announced via postgrant information from national office to epo]

Ref country code: CH

Free format text: LAPSE BECAUSE OF NON-PAYMENT OF DUE FEES

Effective date: 20160831

Ref country code: LI

Free format text: LAPSE BECAUSE OF NON-PAYMENT OF DUE FEES

Effective date: 20160831

Ref country code: EE

Free format text: LAPSE BECAUSE OF FAILURE TO SUBMIT A TRANSLATION OF THE DESCRIPTION OR TO PAY THE FEE WITHIN THE PRESCRIBED TIME-LIMIT

Effective date: 20160803

Ref country code: RO

Free format text: LAPSE BECAUSE OF FAILURE TO SUBMIT A TRANSLATION OF THE DESCRIPTION OR TO PAY THE FEE WITHIN THE PRESCRIBED TIME-LIMIT

Effective date: 20160803

REG Reference to a national code

Ref country code: DE

Ref legal event code: R097

Ref document number: 602013010111

Country of ref document: DE

REG Reference to a national code

Ref country code: FR

Ref legal event code: PLFP

Year of fee payment: 5

PG25 Lapsed in a contracting state [announced via postgrant information from national office to epo]

Ref country code: SM

Free format text: LAPSE BECAUSE OF FAILURE TO SUBMIT A TRANSLATION OF THE DESCRIPTION OR TO PAY THE FEE WITHIN THE PRESCRIBED TIME-LIMIT

Effective date: 20160803

Ref country code: CZ

Free format text: LAPSE BECAUSE OF FAILURE TO SUBMIT A TRANSLATION OF THE DESCRIPTION OR TO PAY THE FEE WITHIN THE PRESCRIBED TIME-LIMIT

Effective date: 20160803

Ref country code: BG

Free format text: LAPSE BECAUSE OF FAILURE TO SUBMIT A TRANSLATION OF THE DESCRIPTION OR TO PAY THE FEE WITHIN THE PRESCRIBED TIME-LIMIT

Effective date: 20161103

Ref country code: DK

Free format text: LAPSE BECAUSE OF FAILURE TO SUBMIT A TRANSLATION OF THE DESCRIPTION OR TO PAY THE FEE WITHIN THE PRESCRIBED TIME-LIMIT

Effective date: 20160803

Ref country code: SK

Free format text: LAPSE BECAUSE OF FAILURE TO SUBMIT A TRANSLATION OF THE DESCRIPTION OR TO PAY THE FEE WITHIN THE PRESCRIBED TIME-LIMIT

Effective date: 20160803

REG Reference to a national code

Ref country code: IE

Ref legal event code: MM4A

PLBE No opposition filed within time limit

Free format text: ORIGINAL CODE: 0009261

STAA Information on the status of an ep patent application or granted ep patent

Free format text: STATUS: NO OPPOSITION FILED WITHIN TIME LIMIT

PG25 Lapsed in a contracting state [announced via postgrant information from national office to epo]

Ref country code: MC

Free format text: LAPSE BECAUSE OF FAILURE TO SUBMIT A TRANSLATION OF THE DESCRIPTION OR TO PAY THE FEE WITHIN THE PRESCRIBED TIME-LIMIT

Effective date: 20160803

26N No opposition filed

Effective date: 20170504

PG25 Lapsed in a contracting state [announced via postgrant information from national office to epo]

Ref country code: IE

Free format text: LAPSE BECAUSE OF NON-PAYMENT OF DUE FEES

Effective date: 20160828

PG25 Lapsed in a contracting state [announced via postgrant information from national office to epo]

Ref country code: LU

Free format text: LAPSE BECAUSE OF NON-PAYMENT OF DUE FEES

Effective date: 20160828

Ref country code: SI

Free format text: LAPSE BECAUSE OF FAILURE TO SUBMIT A TRANSLATION OF THE DESCRIPTION OR TO PAY THE FEE WITHIN THE PRESCRIBED TIME-LIMIT

Effective date: 20160803

GBPC Gb: european patent ceased through non-payment of renewal fee

Effective date: 20170828

REG Reference to a national code

Ref country code: FR

Ref legal event code: PLFP

Year of fee payment: 6

PG25 Lapsed in a contracting state [announced via postgrant information from national office to epo]

Ref country code: HU

Free format text: LAPSE BECAUSE OF FAILURE TO SUBMIT A TRANSLATION OF THE DESCRIPTION OR TO PAY THE FEE WITHIN THE PRESCRIBED TIME-LIMIT; INVALID AB INITIO

Effective date: 20130828

PG25 Lapsed in a contracting state [announced via postgrant information from national office to epo]

Ref country code: MK

Free format text: LAPSE BECAUSE OF FAILURE TO SUBMIT A TRANSLATION OF THE DESCRIPTION OR TO PAY THE FEE WITHIN THE PRESCRIBED TIME-LIMIT

Effective date: 20160803

Ref country code: CY

Free format text: LAPSE BECAUSE OF FAILURE TO SUBMIT A TRANSLATION OF THE DESCRIPTION OR TO PAY THE FEE WITHIN THE PRESCRIBED TIME-LIMIT

Effective date: 20160803

Ref country code: MT

Free format text: LAPSE BECAUSE OF FAILURE TO SUBMIT A TRANSLATION OF THE DESCRIPTION OR TO PAY THE FEE WITHIN THE PRESCRIBED TIME-LIMIT

Effective date: 20160803

PG25 Lapsed in a contracting state [announced via postgrant information from national office to epo]

Ref country code: GB

Free format text: LAPSE BECAUSE OF NON-PAYMENT OF DUE FEES

Effective date: 20170828

PG25 Lapsed in a contracting state [announced via postgrant information from national office to epo]

Ref country code: TR

Free format text: LAPSE BECAUSE OF FAILURE TO SUBMIT A TRANSLATION OF THE DESCRIPTION OR TO PAY THE FEE WITHIN THE PRESCRIBED TIME-LIMIT

Effective date: 20160803

Ref country code: AL

Free format text: LAPSE BECAUSE OF FAILURE TO SUBMIT A TRANSLATION OF THE DESCRIPTION OR TO PAY THE FEE WITHIN THE PRESCRIBED TIME-LIMIT

Effective date: 20160803

REG Reference to a national code

Ref country code: AT

Ref legal event code: UEP

Ref document number: 817400

Country of ref document: AT

Kind code of ref document: T

Effective date: 20160803

PGFP Annual fee paid to national office [announced via postgrant information from national office to epo]

Ref country code: AT

Payment date: 20220718

Year of fee payment: 10

REG Reference to a national code

Ref country code: DE

Ref legal event code: R082

Ref document number: 602013010111

Country of ref document: DE

Representative=s name: CBDL PATENTANWAELTE GBR, DE

P01 Opt-out of the competence of the unified patent court (upc) registered

Effective date: 20230526

REG Reference to a national code

Ref country code: AT

Ref legal event code: MM01

Ref document number: 817400

Country of ref document: AT

Kind code of ref document: T

Effective date: 20230828

PG25 Lapsed in a contracting state [announced via postgrant information from national office to epo]

Ref country code: AT

Free format text: LAPSE BECAUSE OF NON-PAYMENT OF DUE FEES

Effective date: 20230828

PG25 Lapsed in a contracting state [announced via postgrant information from national office to epo]

Ref country code: AT

Free format text: LAPSE BECAUSE OF NON-PAYMENT OF DUE FEES

Effective date: 20230828

PGFP Annual fee paid to national office [announced via postgrant information from national office to epo]

Ref country code: DE

Payment date: 20240723

Year of fee payment: 12

PGFP Annual fee paid to national office [announced via postgrant information from national office to epo]

Ref country code: FR

Payment date: 20240723

Year of fee payment: 12