SG11201403244WA - Low toxicity solvent system for polyamideimide resins and solvent system manufacture - Google Patents
Low toxicity solvent system for polyamideimide resins and solvent system manufactureInfo
- Publication number
- SG11201403244WA SG11201403244WA SG11201403244WA SG11201403244WA SG11201403244WA SG 11201403244W A SG11201403244W A SG 11201403244WA SG 11201403244W A SG11201403244W A SG 11201403244WA SG 11201403244W A SG11201403244W A SG 11201403244WA SG 11201403244W A SG11201403244W A SG 11201403244WA
- Authority
- SG
- Singapore
- Prior art keywords
- solvent system
- low toxicity
- polyamideimide resins
- manufacture
- system manufacture
- Prior art date
Links
Classifications
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G73/00—Macromolecular compounds obtained by reactions forming a linkage containing nitrogen with or without oxygen or carbon in the main chain of the macromolecule, not provided for in groups C08G12/00 - C08G71/00
- C08G73/06—Polycondensates having nitrogen-containing heterocyclic rings in the main chain of the macromolecule
- C08G73/10—Polyimides; Polyester-imides; Polyamide-imides; Polyamide acids or similar polyimide precursors
- C08G73/14—Polyamide-imides
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G73/00—Macromolecular compounds obtained by reactions forming a linkage containing nitrogen with or without oxygen or carbon in the main chain of the macromolecule, not provided for in groups C08G12/00 - C08G71/00
- C08G73/06—Polycondensates having nitrogen-containing heterocyclic rings in the main chain of the macromolecule
- C08G73/10—Polyimides; Polyester-imides; Polyamide-imides; Polyamide acids or similar polyimide precursors
- C08G73/1003—Preparatory processes
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09D—COATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
- C09D179/00—Coating compositions based on macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing nitrogen, with or without oxygen, or carbon only, not provided for in groups C09D161/00 - C09D177/00
- C09D179/04—Polycondensates having nitrogen-containing heterocyclic rings in the main chain; Polyhydrazides; Polyamide acids or similar polyimide precursors
- C09D179/08—Polyimides; Polyester-imides; Polyamide-imides; Polyamide acids or similar polyimide precursors
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09D—COATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
- C09D7/00—Features of coating compositions, not provided for in group C09D5/00; Processes for incorporating ingredients in coating compositions
- C09D7/20—Diluents or solvents
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L79/00—Compositions of macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing nitrogen with or without oxygen or carbon only, not provided for in groups C08L61/00 - C08L77/00
- C08L79/04—Polycondensates having nitrogen-containing heterocyclic rings in the main chain; Polyhydrazides; Polyamide acids or similar polyimide precursors
- C08L79/08—Polyimides; Polyester-imides; Polyamide-imides; Polyamide acids or similar polyimide precursors
Landscapes
- Chemical & Material Sciences (AREA)
- Organic Chemistry (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Wood Science & Technology (AREA)
- Life Sciences & Earth Sciences (AREA)
- Engineering & Computer Science (AREA)
- Materials Engineering (AREA)
- Polymers & Plastics (AREA)
- Medicinal Chemistry (AREA)
- Health & Medical Sciences (AREA)
- Macromolecular Compounds Obtained By Forming Nitrogen-Containing Linkages In General (AREA)
- Polyurethanes Or Polyureas (AREA)
- Organic Low-Molecular-Weight Compounds And Preparation Thereof (AREA)
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US201161576247P | 2011-12-15 | 2011-12-15 | |
PCT/US2012/070192 WO2013090933A1 (en) | 2011-12-15 | 2012-12-17 | Low toxicity solvent system for polyamideimide resins and solvent system manufacture |
Publications (1)
Publication Number | Publication Date |
---|---|
SG11201403244WA true SG11201403244WA (en) | 2014-07-30 |
Family
ID=48613287
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
SG11201403244WA SG11201403244WA (en) | 2011-12-15 | 2012-12-17 | Low toxicity solvent system for polyamideimide resins and solvent system manufacture |
Country Status (8)
Country | Link |
---|---|
US (1) | US9751986B2 (pl) |
EP (1) | EP2791208B1 (pl) |
JP (1) | JP6087373B2 (pl) |
CN (2) | CN104144968A (pl) |
ES (1) | ES2641464T3 (pl) |
IN (1) | IN2014DN05779A (pl) |
SG (1) | SG11201403244WA (pl) |
WO (1) | WO2013090933A1 (pl) |
Families Citing this family (21)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US9751986B2 (en) | 2011-12-15 | 2017-09-05 | Fujifilm Hunt Chemicals Us, Inc. | Low toxicity solvent system for polyamideimide resins and solvent system manufacture |
US9029441B2 (en) * | 2011-12-15 | 2015-05-12 | Fujifilm Hunt Chemicals Us, Inc. | Low toxicity solvent system for polyamideimide and polyamide amic acid resins and coating solutions thereof |
WO2015024824A1 (de) * | 2013-08-23 | 2015-02-26 | Basf Se | Verfahren zur herstellung von polyamidimiden unter verwendung von n-formylmorpholin |
DE102014104223A1 (de) * | 2014-03-26 | 2015-10-01 | Elantas Italia S.R.L. | Neues Lösemittel für Polyamidimide und Polyimide |
US9725617B2 (en) * | 2014-04-17 | 2017-08-08 | Fujifilm Hunt Chemicals U.S.A., Inc. | Low toxicity solvent system for polyamideimide and polyamide amic acid resin coating |
US9815941B2 (en) * | 2014-04-17 | 2017-11-14 | Cymer-Dayton, Llc | Low toxicity solvent system for polyamdieimide and polyamide amic acid resin manufacture |
FR3022553A1 (fr) * | 2014-06-20 | 2015-12-25 | Seb Sa | Composition de primaire en phase aqueuse via des polymeres heterocycliques sous forme de poudres obtenues par broyage |
CN107429056B (zh) * | 2015-04-30 | 2021-06-08 | 昭和电工材料株式会社 | 聚酰胺酰亚胺树脂组合物及涂料 |
EP3319736A4 (en) * | 2015-07-10 | 2019-03-13 | Whitford Corporation | COMPOSITION FOR FORMING HIGH-RELEASE, LOW FRICTION FUNCTIONAL COATINGS |
JP6837478B2 (ja) * | 2015-09-25 | 2021-03-03 | ハンツマン・アドヴァンスト・マテリアルズ・ライセンシング・(スイッツランド)・ゲーエムベーハー | ポリアミドイミドの製造 |
WO2017099030A1 (ja) * | 2015-12-07 | 2017-06-15 | 日立化成株式会社 | ポリアミドイミド樹脂組成物及びフッ素塗料 |
JP6822416B2 (ja) * | 2015-12-14 | 2021-01-27 | 昭和電工マテリアルズ株式会社 | ポリアミドイミド樹脂及び塗料 |
US10301506B2 (en) * | 2016-06-06 | 2019-05-28 | Cymer-Dayton, Llc | Full scale process for preparing polymer powders |
WO2018002988A1 (ja) * | 2016-06-27 | 2018-01-04 | 日立化成株式会社 | ポリアミドイミド樹脂組成物及び塗料 |
EP3590992A4 (en) * | 2017-03-01 | 2020-10-28 | Hitachi Chemical Company, Ltd. | POLYAMIDIMIDE RESIN AND USE THEREOF |
JP7251478B2 (ja) * | 2017-08-01 | 2023-04-04 | 株式会社レゾナック | ポリアミドイミド樹脂組成物及びフッ素塗料 |
JP7226507B2 (ja) * | 2017-08-01 | 2023-02-21 | 株式会社レゾナック | ポリアミドイミド樹脂組成物、フッ素塗料、及び導電性組成物 |
JP2021526508A (ja) * | 2018-06-14 | 2021-10-07 | シーイーエム コーポレイション | 固相ペプチド合成のための溶媒系 |
CN110258118B (zh) * | 2019-07-12 | 2021-07-13 | 开封大学 | 水溶性耐温型碳纤维上胶剂及其制备方法 |
KR20230052939A (ko) | 2020-09-22 | 2023-04-20 | 엘란타스 유럽 에스.알.엘. | 폴리아미드이미드를 포함하는 와이어 에나멜 조성물 |
CN115926163A (zh) * | 2022-12-21 | 2023-04-07 | 开封夸克新材料有限公司 | 一种水性聚酰胺酰亚胺树脂分散液及其制备方法 |
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US9029441B2 (en) * | 2011-12-15 | 2015-05-12 | Fujifilm Hunt Chemicals Us, Inc. | Low toxicity solvent system for polyamideimide and polyamide amic acid resins and coating solutions thereof |
US9751986B2 (en) | 2011-12-15 | 2017-09-05 | Fujifilm Hunt Chemicals Us, Inc. | Low toxicity solvent system for polyamideimide resins and solvent system manufacture |
-
2012
- 2012-12-17 US US14/365,459 patent/US9751986B2/en active Active
- 2012-12-17 SG SG11201403244WA patent/SG11201403244WA/en unknown
- 2012-12-17 ES ES12858583.3T patent/ES2641464T3/es active Active
- 2012-12-17 JP JP2014547554A patent/JP6087373B2/ja not_active Expired - Fee Related
- 2012-12-17 CN CN201280061393.6A patent/CN104144968A/zh active Pending
- 2012-12-17 WO PCT/US2012/070192 patent/WO2013090933A1/en active Application Filing
- 2012-12-17 CN CN201711278083.0A patent/CN108384004A/zh active Pending
- 2012-12-17 EP EP12858583.3A patent/EP2791208B1/en not_active Not-in-force
- 2012-12-17 IN IN5779DEN2014 patent/IN2014DN05779A/en unknown
Also Published As
Publication number | Publication date |
---|---|
WO2013090933A1 (en) | 2013-06-20 |
ES2641464T3 (es) | 2017-11-10 |
EP2791208A4 (en) | 2015-07-22 |
JP2015522660A (ja) | 2015-08-06 |
US20160002408A1 (en) | 2016-01-07 |
JP6087373B2 (ja) | 2017-03-01 |
CN104144968A (zh) | 2014-11-12 |
EP2791208A1 (en) | 2014-10-22 |
EP2791208B1 (en) | 2017-09-06 |
CN108384004A (zh) | 2018-08-10 |
IN2014DN05779A (pl) | 2015-04-10 |
US9751986B2 (en) | 2017-09-05 |
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