IN2014DN05779A - - Google Patents

Info

Publication number
IN2014DN05779A
IN2014DN05779A IN5779DEN2014A IN2014DN05779A IN 2014DN05779 A IN2014DN05779 A IN 2014DN05779A IN 5779DEN2014 A IN5779DEN2014 A IN 5779DEN2014A IN 2014DN05779 A IN2014DN05779 A IN 2014DN05779A
Authority
IN
India
Prior art keywords
solvent system
polyamideimide resins
manufacture
aprotic
distillation
Prior art date
Application number
Inventor
John Sidenstick
David Noga
Kathryn Mullins
Mace Phillips
Original Assignee
Fujifilm Hunt Chemicals Us Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Fujifilm Hunt Chemicals Us Inc filed Critical Fujifilm Hunt Chemicals Us Inc
Publication of IN2014DN05779A publication Critical patent/IN2014DN05779A/en

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G73/00—Macromolecular compounds obtained by reactions forming a linkage containing nitrogen with or without oxygen or carbon in the main chain of the macromolecule, not provided for in groups C08G12/00 - C08G71/00
    • C08G73/06—Polycondensates having nitrogen-containing heterocyclic rings in the main chain of the macromolecule
    • C08G73/10—Polyimides; Polyester-imides; Polyamide-imides; Polyamide acids or similar polyimide precursors
    • C08G73/14—Polyamide-imides
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G73/00—Macromolecular compounds obtained by reactions forming a linkage containing nitrogen with or without oxygen or carbon in the main chain of the macromolecule, not provided for in groups C08G12/00 - C08G71/00
    • C08G73/06—Polycondensates having nitrogen-containing heterocyclic rings in the main chain of the macromolecule
    • C08G73/10—Polyimides; Polyester-imides; Polyamide-imides; Polyamide acids or similar polyimide precursors
    • C08G73/1003—Preparatory processes
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09D—COATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
    • C09D179/00—Coating compositions based on macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing nitrogen, with or without oxygen, or carbon only, not provided for in groups C09D161/00 - C09D177/00
    • C09D179/04—Polycondensates having nitrogen-containing heterocyclic rings in the main chain; Polyhydrazides; Polyamide acids or similar polyimide precursors
    • C09D179/08—Polyimides; Polyester-imides; Polyamide-imides; Polyamide acids or similar polyimide precursors
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09D—COATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
    • C09D7/00—Features of coating compositions, not provided for in group C09D5/00; Processes for incorporating ingredients in coating compositions
    • C09D7/20—Diluents or solvents
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L79/00—Compositions of macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing nitrogen with or without oxygen or carbon only, not provided for in groups C08L61/00 - C08L77/00
    • C08L79/04—Polycondensates having nitrogen-containing heterocyclic rings in the main chain; Polyhydrazides; Polyamide acids or similar polyimide precursors
    • C08L79/08—Polyimides; Polyester-imides; Polyamide-imides; Polyamide acids or similar polyimide precursors

Landscapes

  • Chemical & Material Sciences (AREA)
  • Organic Chemistry (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Engineering & Computer Science (AREA)
  • Materials Engineering (AREA)
  • Wood Science & Technology (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Health & Medical Sciences (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Macromolecular Compounds Obtained By Forming Nitrogen-Containing Linkages In General (AREA)
  • Polyurethanes Or Polyureas (AREA)
  • Organic Low-Molecular-Weight Compounds And Preparation Thereof (AREA)

Abstract

Disclosed is a low toxicity aprotic alkyl amide solvent system used for the manufacture and application of polyamideimide resins and an efficient method for manufacturing the polyamideimide resins in a solvent system in a single reaction with distillation which allows recycling of intermediate streams. The solvent system can be used for either the manufacture or the dissolution of polyamideimide resins.
IN5779DEN2014 2011-12-15 2012-12-17 IN2014DN05779A (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US201161576247P 2011-12-15 2011-12-15
PCT/US2012/070192 WO2013090933A1 (en) 2011-12-15 2012-12-17 Low toxicity solvent system for polyamideimide resins and solvent system manufacture

Publications (1)

Publication Number Publication Date
IN2014DN05779A true IN2014DN05779A (en) 2015-04-10

Family

ID=48613287

Family Applications (1)

Application Number Title Priority Date Filing Date
IN5779DEN2014 IN2014DN05779A (en) 2011-12-15 2012-12-17

Country Status (8)

Country Link
US (1) US9751986B2 (en)
EP (1) EP2791208B1 (en)
JP (1) JP6087373B2 (en)
CN (2) CN104144968A (en)
ES (1) ES2641464T3 (en)
IN (1) IN2014DN05779A (en)
SG (1) SG11201403244WA (en)
WO (1) WO2013090933A1 (en)

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CN104144968A (en) 2011-12-15 2014-11-12 富士胶片亨特化学品美国有限公司 Low toxicity solvent system for polyamideimide resins and solvent system manufacture good technology corporation
US9029441B2 (en) * 2011-12-15 2015-05-12 Fujifilm Hunt Chemicals Us, Inc. Low toxicity solvent system for polyamideimide and polyamide amic acid resins and coating solutions thereof
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US9815941B2 (en) * 2014-04-17 2017-11-14 Cymer-Dayton, Llc Low toxicity solvent system for polyamdieimide and polyamide amic acid resin manufacture
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WO2016175099A1 (en) * 2015-04-30 2016-11-03 日立化成株式会社 Polyamideimide resin composition and coating material
JP2018524440A (en) * 2015-07-10 2018-08-30 ウィットフォード コーポレーション Functional coating forming composition having high releasability and low friction
US10920019B2 (en) * 2015-09-25 2021-02-16 Huntsman International Llc Preparation of poly amidoimides
JP6741020B2 (en) * 2015-12-07 2020-08-19 日立化成株式会社 Polyamideimide resin composition and fluorine coating
JP6822416B2 (en) * 2015-12-14 2021-01-27 昭和電工マテリアルズ株式会社 Polyamide-imide resin and paint
US10301506B2 (en) * 2016-06-06 2019-05-28 Cymer-Dayton, Llc Full scale process for preparing polymer powders
JP7021084B2 (en) * 2016-06-27 2022-02-16 昭和電工マテリアルズ株式会社 Polyamide-imide resin compositions and paints
JP6789499B2 (en) * 2017-03-01 2020-11-25 昭和電工マテリアルズ株式会社 Polyamide-imide resin and its use
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JP7226507B2 (en) * 2017-08-01 2023-02-21 株式会社レゾナック Polyamideimide resin composition, fluorine paint, and conductive composition
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CN110258118B (en) * 2019-07-12 2021-07-13 开封大学 Water-soluble temperature-resistant carbon fiber sizing agent and preparation method thereof
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CN115926163A (en) * 2022-12-21 2023-04-07 开封夸克新材料有限公司 Water-based polyamide-imide resin dispersion liquid and preparation method thereof

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Also Published As

Publication number Publication date
JP6087373B2 (en) 2017-03-01
CN104144968A (en) 2014-11-12
ES2641464T3 (en) 2017-11-10
EP2791208A1 (en) 2014-10-22
EP2791208A4 (en) 2015-07-22
EP2791208B1 (en) 2017-09-06
US20160002408A1 (en) 2016-01-07
US9751986B2 (en) 2017-09-05
SG11201403244WA (en) 2014-07-30
JP2015522660A (en) 2015-08-06
CN108384004A (en) 2018-08-10
WO2013090933A1 (en) 2013-06-20

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