SG111114A1 - Polyamide composition - Google Patents

Polyamide composition

Info

Publication number
SG111114A1
SG111114A1 SG200303592A SG200303592A SG111114A1 SG 111114 A1 SG111114 A1 SG 111114A1 SG 200303592 A SG200303592 A SG 200303592A SG 200303592 A SG200303592 A SG 200303592A SG 111114 A1 SG111114 A1 SG 111114A1
Authority
SG
Singapore
Prior art keywords
polyamide composition
polyamide
composition
Prior art date
Application number
SG200303592A
Other languages
English (en)
Inventor
Oka Hidaki
Matsuoka Hideharu
Kuki Toru
Original Assignee
Kuraray Co
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Kuraray Co filed Critical Kuraray Co
Publication of SG111114A1 publication Critical patent/SG111114A1/en

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L77/00—Compositions of polyamides obtained by reactions forming a carboxylic amide link in the main chain; Compositions of derivatives of such polymers
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K3/00—Use of inorganic substances as compounding ingredients
    • C08K3/18—Oxygen-containing compounds, e.g. metal carbonyls
    • C08K3/20—Oxides; Hydroxides
    • C08K3/22—Oxides; Hydroxides of metals
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K3/00—Use of inorganic substances as compounding ingredients
    • C08K3/18—Oxygen-containing compounds, e.g. metal carbonyls
    • C08K3/20—Oxides; Hydroxides
    • C08K3/22—Oxides; Hydroxides of metals
    • C08K2003/2237—Oxides; Hydroxides of metals of titanium
    • C08K2003/2241—Titanium dioxide

Landscapes

  • Chemical & Material Sciences (AREA)
  • Health & Medical Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Organic Chemistry (AREA)
  • Compositions Of Macromolecular Compounds (AREA)
SG200303592A 2002-06-21 2003-06-18 Polyamide composition SG111114A1 (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2002181283 2002-06-21

Publications (1)

Publication Number Publication Date
SG111114A1 true SG111114A1 (en) 2005-05-30

Family

ID=29717534

Family Applications (1)

Application Number Title Priority Date Filing Date
SG200303592A SG111114A1 (en) 2002-06-21 2003-06-18 Polyamide composition

Country Status (7)

Country Link
US (1) US7009029B2 (zh)
EP (1) EP1375578A1 (zh)
KR (1) KR100926927B1 (zh)
CN (1) CN1260300C (zh)
CA (1) CA2432522C (zh)
SG (1) SG111114A1 (zh)
TW (1) TWI258494B (zh)

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WO2013080820A1 (ja) * 2011-11-29 2013-06-06 東レ株式会社 炭素繊維強化熱可塑性樹脂組成物、そのペレットおよび成形品
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US20150337108A1 (en) * 2013-01-11 2015-11-26 Asahi Kasei Chemicals Corporation Polyamide composition and molded product
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WO2015080426A1 (ko) * 2013-11-26 2015-06-04 삼성에스디아이 주식회사 폴리아마이드 성형체 및 그 제조 방법
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KR20180104053A (ko) 2016-01-21 2018-09-19 티코나 엘엘씨 금속성 안료를 함유하는 폴리아미드 조성물
WO2019121160A1 (en) 2017-12-19 2019-06-27 Basf Se A stabilizer composition, its use and a plastic composition comprising the same
EP4151886A1 (en) 2018-04-23 2023-03-22 Asahi Kasei Kabushiki Kaisha Cellulose-containing gear
CN110922749A (zh) * 2019-10-26 2020-03-27 张家港大塚化学有限公司 Led用高耐候性、高反射率聚酰胺复合材料的制备方法
CN111978717A (zh) * 2020-07-15 2020-11-24 宁波墨西科技有限公司 一种高光且具备电磁屏蔽功能的as/pa9t复合材料及其制备方法
CN111647268B (zh) * 2020-07-22 2022-10-21 宁波金雨科技实业有限公司 一种聚酰胺喷片材料及其制备方法
CN114672154B (zh) * 2020-12-25 2024-04-02 金发科技股份有限公司 一种led用半芳香族聚酰胺模塑组合物
CN115838532B (zh) * 2021-09-18 2024-03-01 珠海万通特种工程塑料有限公司 一种pa10t模塑复合材料及其制备方法和应用
WO2024120825A1 (en) 2022-12-07 2024-06-13 Basf Se Polyamide composition

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS59113049A (ja) * 1982-12-20 1984-06-29 Unitika Ltd 樹脂組成物
JPH0384060A (ja) * 1989-08-26 1991-04-09 Unitika Ltd 樹脂組成物
EP0659799A2 (en) * 1993-12-24 1995-06-28 Kuraray Co., Ltd. Polyamide and polyamide composition
JPH07228776A (ja) * 1994-02-18 1995-08-29 Kuraray Co Ltd 成形材料用ポリアミド組成物

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JP2001139804A (ja) 1999-11-12 2001-05-22 Toray Ind Inc 共重合ポリアミド、繊維および成形品
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Patent Citations (4)

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Publication number Priority date Publication date Assignee Title
JPS59113049A (ja) * 1982-12-20 1984-06-29 Unitika Ltd 樹脂組成物
JPH0384060A (ja) * 1989-08-26 1991-04-09 Unitika Ltd 樹脂組成物
EP0659799A2 (en) * 1993-12-24 1995-06-28 Kuraray Co., Ltd. Polyamide and polyamide composition
JPH07228776A (ja) * 1994-02-18 1995-08-29 Kuraray Co Ltd 成形材料用ポリアミド組成物

Also Published As

Publication number Publication date
EP1375578A1 (en) 2004-01-02
US7009029B2 (en) 2006-03-07
CN1477153A (zh) 2004-02-25
KR100926927B1 (ko) 2009-11-17
TWI258494B (en) 2006-07-21
TW200401803A (en) 2004-02-01
CA2432522C (en) 2010-09-21
CN1260300C (zh) 2006-06-21
KR20040000326A (ko) 2004-01-03
US20040034152A1 (en) 2004-02-19
CA2432522A1 (en) 2003-12-21

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