SG106683A1 - Chuck, lithographic projection apparatus, method of manufacturing a chuck and device manufacturing method - Google Patents

Chuck, lithographic projection apparatus, method of manufacturing a chuck and device manufacturing method

Info

Publication number
SG106683A1
SG106683A1 SG200302379A SG200302379A SG106683A1 SG 106683 A1 SG106683 A1 SG 106683A1 SG 200302379 A SG200302379 A SG 200302379A SG 200302379 A SG200302379 A SG 200302379A SG 106683 A1 SG106683 A1 SG 106683A1
Authority
SG
Singapore
Prior art keywords
chuck
manufacturing
projection apparatus
lithographic projection
device manufacturing
Prior art date
Application number
SG200302379A
Other languages
English (en)
Inventor
Elp Jan Van
Peter Giesen
Der Velde Jacob Jan Van
Original Assignee
Asml Netherlands Bv
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Asml Netherlands Bv filed Critical Asml Netherlands Bv
Publication of SG106683A1 publication Critical patent/SG106683A1/en

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/027—Making masks on semiconductor bodies for further photolithographic processing not provided for in group H01L21/18 or H01L21/34
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/70—Microphotolithographic exposure; Apparatus therefor
    • G03F7/70691—Handling of masks or workpieces
    • G03F7/707—Chucks, e.g. chucking or un-chucking operations or structural details
    • G03F7/70708—Chucks, e.g. chucking or un-chucking operations or structural details being electrostatic; Electrostatically deformable vacuum chucks
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/70—Microphotolithographic exposure; Apparatus therefor
    • G03F7/70691—Handling of masks or workpieces
    • G03F7/707—Chucks, e.g. chucking or un-chucking operations or structural details
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/70—Microphotolithographic exposure; Apparatus therefor
    • G03F7/708—Construction of apparatus, e.g. environment aspects, hygiene aspects or materials
    • G03F7/7095—Materials, e.g. materials for housing, stage or other support having particular properties, e.g. weight, strength, conductivity, thermal expansion coefficient
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/6831—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using electrostatic chucks

Landscapes

  • General Physics & Mathematics (AREA)
  • Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Environmental & Geological Engineering (AREA)
  • Epidemiology (AREA)
  • Public Health (AREA)
  • Health & Medical Sciences (AREA)
  • Exposure And Positioning Against Photoresist Photosensitive Materials (AREA)
  • Exposure Of Semiconductors, Excluding Electron Or Ion Beam Exposure (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
SG200302379A 2002-05-01 2003-04-29 Chuck, lithographic projection apparatus, method of manufacturing a chuck and device manufacturing method SG106683A1 (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
EP02253073A EP1359466A1 (en) 2002-05-01 2002-05-01 Chuck, lithographic projection apparatus, method of manufacturing a chuck and device manufacturing method

Publications (1)

Publication Number Publication Date
SG106683A1 true SG106683A1 (en) 2004-10-29

Family

ID=28799734

Family Applications (1)

Application Number Title Priority Date Filing Date
SG200302379A SG106683A1 (en) 2002-05-01 2003-04-29 Chuck, lithographic projection apparatus, method of manufacturing a chuck and device manufacturing method

Country Status (8)

Country Link
US (1) US6864957B2 (ko)
EP (1) EP1359466A1 (ko)
JP (1) JP3851891B2 (ko)
KR (1) KR100528982B1 (ko)
CN (1) CN100395661C (ko)
DE (1) DE60336189D1 (ko)
SG (1) SG106683A1 (ko)
TW (1) TWI294637B (ko)

Families Citing this family (54)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US7432514B2 (en) * 2002-03-26 2008-10-07 International Business Machines Corporation Method and apparatus for surface potential reflection electron mask lithography
SG125948A1 (en) * 2003-03-31 2006-10-30 Asml Netherlands Bv Supporting structure for use in a lithographic apparatus
US7245357B2 (en) * 2003-12-15 2007-07-17 Asml Netherlands B.V. Lithographic apparatus and device manufacturing method
US8105457B2 (en) * 2003-12-22 2012-01-31 Asml Netherlands B.V. Method for joining at least a first member and a second member, lithographic apparatus and device manufacturing method, as well as a device manufactured thereby
TWI242255B (en) * 2004-07-21 2005-10-21 Touch Micro System Tech Wafer carrier
US7586059B2 (en) * 2004-08-27 2009-09-08 Infineon Technologies Ag Lithography mask substrate labeling system
FR2875054B1 (fr) * 2004-09-08 2006-12-01 Cit Alcatel Support de substrats minces
TWI271815B (en) * 2004-11-30 2007-01-21 Sanyo Electric Co Method for processing stuck object and electrostatic sticking method
SG155256A1 (en) 2005-02-10 2009-09-30 Asml Netherlands Bv Immersion liquid, exposure apparatus, and exposure process
KR100722932B1 (ko) * 2005-09-26 2007-05-30 삼성전자주식회사 온도 감지 장치를 구비하는 정전척 및 이를 구비하는 노광장비 및 포토마스크 표면의 온도를 감지하는 방법
US20070139855A1 (en) * 2005-12-21 2007-06-21 Asml Netherlands B.V. Lithographic apparatus and method of manufacturing an electrostatic clamp for a lithographic apparatus
US7626681B2 (en) * 2005-12-28 2009-12-01 Asml Netherlands B.V. Lithographic apparatus and method
US7978308B2 (en) * 2006-05-15 2011-07-12 Asml Netherlands B.V. Lithographic apparatus and device manufacturing method
JP4908089B2 (ja) * 2006-07-13 2012-04-04 コバレントマテリアル株式会社 静電チャックおよびその製造方法
JP5031292B2 (ja) * 2006-07-27 2012-09-19 コバレントマテリアル株式会社 静電チャック
JP5030260B2 (ja) * 2006-07-27 2012-09-19 コバレントマテリアル株式会社 静電チャック
KR100803834B1 (ko) * 2006-08-21 2008-02-14 프라임 뷰 인터내셔널 코오포레이션 리미티드 포토레지스트 회전 도포기의 척
US8760621B2 (en) * 2007-03-12 2014-06-24 Asml Netherlands B.V. Lithographic apparatus and method
JP4757839B2 (ja) * 2007-05-24 2011-08-24 太平洋セメント株式会社 ガラス質静電チャック及びその製造方法
US8013981B2 (en) * 2007-06-14 2011-09-06 Asml Netherlands B.V. Lithographic apparatus and device manufacturing method
KR100902614B1 (ko) * 2007-07-16 2009-06-11 세메스 주식회사 반도체 제조 장치
JP5024996B2 (ja) * 2007-07-24 2012-09-12 コバレントマテリアル株式会社 ガラス製静電チャックの製造方法
US20090075012A1 (en) * 2007-09-13 2009-03-19 Asml Netherlands B.V. Lithographic apparatus and device manufacturing method
DE102009011863B4 (de) * 2009-03-05 2024-02-08 Asml Netherlands B.V. Leichtgewicht-Trägerstruktur, insbesondere für optische Bauteile, Verfahren zu deren Herstellung und Verwendung der Trägerstruktur
WO2010121844A1 (en) * 2009-04-20 2010-10-28 Asml Netherlands B.V. Lithographic projection apparatus and device manufacturing method
NL2004872A (en) * 2009-06-18 2010-12-20 Asml Netherlands Bv Lithographic projection apparatus.
CN102044466B (zh) * 2009-10-12 2013-03-27 北京北方微电子基地设备工艺研究中心有限责任公司 一种静电卡盘及其残余电荷的消除方法
US8767174B2 (en) * 2010-02-18 2014-07-01 Nikon Corporation Temperature-controlled holding devices for planar articles
DE102010039927A1 (de) * 2010-08-30 2012-03-01 Carl Zeiss Smt Gmbh Substrat für Spiegel für die EUV-Lithographie
WO2012110144A1 (en) * 2011-02-18 2012-08-23 Asml Netherlands B.V. Lithographic apparatus and device manufacturing method.
EP2555234B1 (en) * 2011-08-02 2020-08-19 ASML Holding N.V. Electrostatic clamp, lithographic apparatus and method of manufacturing an electrostatic clamp
KR101583167B1 (ko) * 2011-09-05 2016-01-07 가부시끼가이샤 도시바 레티클 척 클리너 및 레티클 척 클리닝 방법
JP6122856B2 (ja) 2011-10-06 2017-04-26 エーエスエムエル ネザーランズ ビー．ブイ． チャック、リソグラフィ装置及びチャックを使用する方法
EP3683627A1 (en) 2012-02-03 2020-07-22 ASML Netherlands B.V. Substrate holder and lithographic apparatus
NL2010481A (en) * 2012-04-23 2013-10-28 Asml Netherlands Bv Electrostatic clamp, lithographic apparatus and method field.
JP5739376B2 (ja) * 2012-05-16 2015-06-24 信越化学工業株式会社 モールド作製用ブランクおよびモールドの製造方法
DE102012212898A1 (de) * 2012-07-24 2014-01-30 Carl Zeiss Smt Gmbh Spiegelanordnung für eine EUV-Projektionsbelichtungsanlage, Verfahren zum Betreiben derselben, sowie EUV-Projektionsbelichtungsanlage
US8765582B2 (en) * 2012-09-04 2014-07-01 Taiwan Semiconductor Manufacturing Company, Ltd. Method for extreme ultraviolet electrostatic chuck with reduced clamp effect
JP6526575B2 (ja) * 2013-02-07 2019-06-05 エーエスエムエル ホールディング エヌ．ブイ． リソグラフィ装置及び方法
TWI656596B (zh) 2014-08-26 2019-04-11 荷蘭商Ａｓｍｌ控股公司 靜電夾具及其製造方法
CN107077078B (zh) 2014-10-23 2019-04-09 Asml荷兰有限公司 用于光刻设备的支撑台、加载衬底的方法、光刻设备和器件制造方法
US9817208B1 (en) * 2016-09-20 2017-11-14 Applied Materials Israel Ltd. Integrated chuck
US9805906B1 (en) * 2016-09-20 2017-10-31 Applied Materials Israel, Ltd. Mirror support module, a kit and a scanning electron microscope
US10923379B2 (en) * 2017-02-15 2021-02-16 Lam Research Corporation Methods for controlling clamping of insulator-type substrate on electrostatic-type substrate support structure
JP7121122B2 (ja) * 2017-11-20 2022-08-17 エーエスエムエル ネザーランズ ビー．ブイ． 基板ホルダ、基板支持部、基板をクランプシステムにクランプする方法、およびリソグラフィ装置
US10722925B2 (en) * 2017-12-04 2020-07-28 Suss Micro Tec Photomask Equipment Gmbh & Co Kg Treatment head, treatment system and method for treating a local surface area of a substrate
KR102427823B1 (ko) * 2018-06-11 2022-07-29 캐논 톡키 가부시키가이샤 정전척 시스템, 성막장치, 흡착방법, 성막방법 및 전자 디바이스의 제조방법
CN110911330A (zh) * 2018-09-14 2020-03-24 东莞市中麒光电技术有限公司 一种通过转移晶圆批量转移、固定led芯片的吸盘及方法
DE102019101657A1 (de) 2019-01-23 2020-07-23 Berliner Glas Kgaa Herbert Kubatz Gmbh & Co Haltevorrichtung zur elektrostatischen Halterung eines Bauteils mit einem durch Diffusionsbonden gefügten Grundkörper und Verfahren zu deren Herstellung
WO2020216571A1 (en) * 2019-04-25 2020-10-29 Asml Netherlands B.V. A substrate holder for use in a lithographic apparatus
CN111128845B (zh) * 2019-12-16 2022-10-21 北京北方华创微电子装备有限公司 应用于薄膜沉积装置的托盘
KR102288309B1 (ko) * 2020-02-12 2021-08-10 한국광기술원 마이크로 led 디스플레이 제조방법
DE102020104907A1 (de) 2020-02-25 2021-08-26 Berliner Glas GmbH Verfahren zur Herstellung eines Bauelements durch atomares Diffusionsbonden
US20220308465A1 (en) * 2021-03-26 2022-09-29 Taiwan Semiconductor Manufacturing Company, Ltd. Method and apparatus for removing contamination

Family Cites Families (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5835333A (en) * 1995-10-30 1998-11-10 Lam Research Corporation Negative offset bipolar electrostatic chucks
US6108189A (en) * 1996-04-26 2000-08-22 Applied Materials, Inc. Electrostatic chuck having improved gas conduits
US5954982A (en) * 1997-02-12 1999-09-21 Nikon Corporation Method and apparatus for efficiently heating semiconductor wafers or reticles
JP2000068198A (ja) * 1998-03-31 2000-03-03 Asm Lithography Bv 改良基板ホルダ付きリソグラフィ―的投影装置
JP2000286189A (ja) * 1999-03-31 2000-10-13 Nikon Corp 露光装置および露光方法ならびにデバイス製造方法
JP3805134B2 (ja) * 1999-05-25 2006-08-02 東陶機器株式会社 絶縁性基板吸着用静電チャック
US6368942B1 (en) * 2000-03-31 2002-04-09 Euv Llc Method for fabricating an ultra-low expansion mask blank having a crystalline silicon layer
JP4106858B2 (ja) * 2000-06-26 2008-06-25 松下電器産業株式会社 スピーカユニット
US6542224B2 (en) * 2000-10-13 2003-04-01 Corning Incorporated Silica-based light-weight EUV lithography stages

Also Published As

Publication number Publication date
EP1359466A1 (en) 2003-11-05
CN100395661C (zh) 2008-06-18
KR100528982B1 (ko) 2005-11-16
JP2004047982A (ja) 2004-02-12
DE60336189D1 (de) 2011-04-14
TWI294637B (en) 2008-03-11
TW200410303A (en) 2004-06-16
CN1456933A (zh) 2003-11-19
KR20030086912A (ko) 2003-11-12
JP3851891B2 (ja) 2006-11-29
US20040012767A1 (en) 2004-01-22
US6864957B2 (en) 2005-03-08

Similar Documents

Publication Publication Date Title
SG106683A1 (en) Chuck, lithographic projection apparatus, method of manufacturing a chuck and device manufacturing method
SG108323A1 (en) Chuck, lithographic apparatus and device manufacturing method
SG121762A1 (en) Lithographic apparatus, and device manufacturing method
SG121847A1 (en) Method for cleaning a surface of a component of a lithographic projection apparatus, lithographic projection apparatus, device manufacturing method and cleaning system
SG121820A1 (en) Lithographic apparatus and device manufacturing method
SG121819A1 (en) Lithographic apparatus and device manufacturing method
SG2010050110A (en) Lithographic apparatus and device manufacturing method
SG130007A1 (en) Lithographic apparatus and device manufacturing method
SG121829A1 (en) Lithographic apparatus and device manufacturing method
SG108317A1 (en) Lithographic apparatus and device manufacturing method
AU2003289271A1 (en) Exposure apparatus, exposure method and method for manufacturing device
AU2003302831A1 (en) Exposure method, exposure apparatus and method for manufacturing device
SG120906A1 (en) Lithographic apparatus and device manufacturing method
SG106138A1 (en) Lithographic apparatus and device manufacturing method
SG112970A1 (en) Lithographic projection apparatus and device manufacturing method
SG121780A1 (en) Lithographic apparatus and device manufacturing method
SG103902A1 (en) Lithographic apparatus and device manufacturing method
SG107660A1 (en) Lithographic apparatus, device manufacturing method, and device manufactured thereby
SG110121A1 (en) Method for exposing a substrate and lithographic projection apparatus
SG123556A1 (en) Lithographic apparatus and device manufacturing method
SG123587A1 (en) Lithographic apparatus, device manufacturing method, and device manufactured thereby
SG103893A1 (en) Lithographic apparatus and device manufacturing method
SG110038A1 (en) Lithographic apparatus, device manufacturing method, and device manufactured thereby
SG123589A1 (en) A lithographic projection mask, a device manufacturing method using a lithographic projection mask and a device manufactured thereby
SG111171A1 (en) Lithographic projection apparatus and device manufacturing method