SG102707A1 - Generation and use of integrated circuit profile-based simulation information - Google Patents
Generation and use of integrated circuit profile-based simulation informationInfo
- Publication number
- SG102707A1 SG102707A1 SG200300820A SG200300820A SG102707A1 SG 102707 A1 SG102707 A1 SG 102707A1 SG 200300820 A SG200300820 A SG 200300820A SG 200300820 A SG200300820 A SG 200300820A SG 102707 A1 SG102707 A1 SG 102707A1
- Authority
- SG
- Singapore
- Prior art keywords
- generation
- integrated circuit
- simulation information
- based simulation
- circuit profile
- Prior art date
Links
Classifications
-
- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06F—ELECTRIC DIGITAL DATA PROCESSING
- G06F30/00—Computer-aided design [CAD]
- G06F30/20—Design optimisation, verification or simulation
-
- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06F—ELECTRIC DIGITAL DATA PROCESSING
- G06F2119/00—Details relating to the type or aim of the analysis or the optimisation
- G06F2119/08—Thermal analysis or thermal optimisation
Landscapes
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Theoretical Computer Science (AREA)
- General Physics & Mathematics (AREA)
- Geometry (AREA)
- General Engineering & Computer Science (AREA)
- Evolutionary Computation (AREA)
- Computer Hardware Design (AREA)
- Design And Manufacture Of Integrated Circuits (AREA)
- Exposure And Positioning Against Photoresist Photosensitive Materials (AREA)
- Exposure Of Semiconductors, Excluding Electron Or Ion Beam Exposure (AREA)
- Preparing Plates And Mask In Photomechanical Process (AREA)
- Management, Administration, Business Operations System, And Electronic Commerce (AREA)
- Testing Or Measuring Of Semiconductors Or The Like (AREA)
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US10/087,069 US7136796B2 (en) | 2002-02-28 | 2002-02-28 | Generation and use of integrated circuit profile-based simulation information |
Publications (1)
Publication Number | Publication Date |
---|---|
SG102707A1 true SG102707A1 (en) | 2004-03-26 |
Family
ID=27733421
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
SG200300820A SG102707A1 (en) | 2002-02-28 | 2003-02-27 | Generation and use of integrated circuit profile-based simulation information |
Country Status (6)
Country | Link |
---|---|
US (2) | US7136796B2 (ko) |
EP (1) | EP1341225A2 (ko) |
JP (3) | JP2003324041A (ko) |
KR (1) | KR100525567B1 (ko) |
SG (1) | SG102707A1 (ko) |
TW (1) | TWI273457B (ko) |
Families Citing this family (63)
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US7136796B2 (en) * | 2002-02-28 | 2006-11-14 | Timbre Technologies, Inc. | Generation and use of integrated circuit profile-based simulation information |
US7131076B2 (en) * | 2002-08-21 | 2006-10-31 | Synopsys Inc. | Method of interactive visualization and parameter selection for engineering design |
US7263477B2 (en) * | 2003-06-09 | 2007-08-28 | Cadence Design Systems, Inc. | Method and apparatus for modeling devices having different geometries |
US7441219B2 (en) * | 2003-06-24 | 2008-10-21 | National Semiconductor Corporation | Method for creating, modifying, and simulating electrical circuits over the internet |
JP4138613B2 (ja) * | 2003-09-05 | 2008-08-27 | 株式会社東芝 | 製造工程設計方法及び製造工程設計支援方法 |
AU2003300005A1 (en) | 2003-12-19 | 2005-08-03 | International Business Machines Corporation | Differential critical dimension and overlay metrology apparatus and measurement method |
US7791727B2 (en) | 2004-08-16 | 2010-09-07 | Asml Netherlands B.V. | Method and apparatus for angular-resolved spectroscopic lithography characterization |
US20080144036A1 (en) * | 2006-12-19 | 2008-06-19 | Asml Netherlands B.V. | Method of measurement, an inspection apparatus and a lithographic apparatus |
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JP4899086B2 (ja) * | 2006-03-16 | 2012-03-21 | 富士通セミコンダクター株式会社 | 荷電粒子ビーム露光データの補正工程を有する半導体装置の製造方法 |
US7490304B2 (en) * | 2006-06-23 | 2009-02-10 | International Business Machines Corporation | Determining geometrical configuration of interconnect structure |
US7555395B2 (en) * | 2006-09-26 | 2009-06-30 | Tokyo Electron Limited | Methods and apparatus for using an optically tunable soft mask to create a profile library |
US20080074678A1 (en) * | 2006-09-26 | 2008-03-27 | Tokyo Electron Limited | Accuracy of optical metrology measurements |
US20080074677A1 (en) * | 2006-09-26 | 2008-03-27 | Tokyo Electron Limited | accuracy of optical metrology measurements |
US7763404B2 (en) * | 2006-09-26 | 2010-07-27 | Tokyo Electron Limited | Methods and apparatus for changing the optical properties of resists |
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US7504705B2 (en) * | 2006-09-29 | 2009-03-17 | International Business Machines Corporation | Striped on-chip inductor |
US8011317B2 (en) * | 2006-12-29 | 2011-09-06 | Intermolecular, Inc. | Advanced mixing system for integrated tool having site-isolated reactors |
US7386817B1 (en) * | 2007-01-02 | 2008-06-10 | International Business Machines Corporation | Method of determining stopping powers of design structures with respect to a traveling particle |
US20090164183A1 (en) * | 2007-12-20 | 2009-06-25 | International Business Machines Corporation | Methodology for Thermal Modeling of On-Chip Interconnects Based on Electromagnetic Simulation Tools |
CN102160054B (zh) | 2008-08-14 | 2014-05-07 | Lsi公司 | 用于设计使用自适应电压和调节优化的集成电路的系统和方法 |
US20100058157A1 (en) * | 2008-09-01 | 2010-03-04 | SAM Group, Inc. | System And Method For Analyzing A Plurality Of Information Systems |
KR101652042B1 (ko) * | 2008-10-30 | 2016-08-29 | 삼성전자주식회사 | 공정-소자-회로 통합 시뮬레이션 시스템 |
KR20100078433A (ko) * | 2008-12-30 | 2010-07-08 | 주식회사 동부하이텍 | 사다리꼴 금속배선의 시뮬레이션을 위한 모델링 구조 |
TWI406147B (zh) * | 2009-11-06 | 2013-08-21 | Lsi Corp | 用於設計使用適應性電壓及比例最佳化之積體電路之系統及方法 |
US8713511B1 (en) * | 2011-09-16 | 2014-04-29 | Suvolta, Inc. | Tools and methods for yield-aware semiconductor manufacturing process target generation |
US8468471B2 (en) * | 2011-09-23 | 2013-06-18 | Kla-Tencor Corp. | Process aware metrology |
US9031684B2 (en) * | 2011-11-01 | 2015-05-12 | Taiwan Semiconductor Manufacturing Company, Ltd. | Multi-factor advanced process control method and system for integrated circuit fabrication |
US8966417B2 (en) * | 2012-05-04 | 2015-02-24 | Trajectory Design Automation Corporation | Method and system for estimating a diffusion potential of a diffusive property |
US9404743B2 (en) | 2012-11-01 | 2016-08-02 | Taiwan Semiconductor Manufacturing Company, Ltd. | Method for validating measurement data |
US10242142B2 (en) | 2013-03-14 | 2019-03-26 | Coventor, Inc. | Predictive 3-D virtual fabrication system and method |
US8959464B2 (en) | 2013-03-14 | 2015-02-17 | Coventor, Inc. | Multi-etch process using material-specific behavioral parameters in 3-D virtual fabrication environment |
US9317632B2 (en) * | 2013-03-14 | 2016-04-19 | Coventor, Inc. | System and method for modeling epitaxial growth in a 3-D virtual fabrication environment |
KR102615912B1 (ko) | 2014-02-24 | 2023-12-19 | 도쿄엘렉트론가부시키가이샤 | 감광화된 화학적 증폭 레지스트 화학물질을 사용하는 방법과 기술 및 프로세스 |
JP6895600B2 (ja) | 2014-02-25 | 2021-06-30 | 東京エレクトロン株式会社 | 現像可能な底部反射防止コーティングおよび着色インプラントレジストのための化学増幅方法および技術 |
CN103984094B (zh) * | 2014-05-22 | 2017-04-12 | 中国科学院光电技术研究所 | 一种光学系统热性能仿真方法 |
US10138550B2 (en) * | 2014-09-10 | 2018-11-27 | Toshiba Memory Corporation | Film deposition method and an apparatus |
US20160217405A1 (en) * | 2015-01-28 | 2016-07-28 | Jochen Steinbach | Change Requests |
CN105261565B (zh) * | 2015-09-08 | 2018-05-08 | 浙江省能源与核技术应用研究院 | 一种增大单向微触发可控硅触发电流的方法 |
CN105930261B (zh) | 2016-01-16 | 2018-06-22 | 平安科技(深圳)有限公司 | 测试方法及测试终端 |
US10429745B2 (en) * | 2016-02-19 | 2019-10-01 | Osaka University | Photo-sensitized chemically amplified resist (PS-CAR) simulation |
US10048594B2 (en) | 2016-02-19 | 2018-08-14 | Tokyo Electron Limited | Photo-sensitized chemically amplified resist (PS-CAR) model calibration |
KR20180115299A (ko) * | 2016-02-22 | 2018-10-22 | 에이에스엠엘 네델란즈 비.브이. | 계측 데이터에 대한 기여도들의 분리 |
JP6909374B2 (ja) | 2016-05-13 | 2021-07-28 | 東京エレクトロン株式会社 | 光増感化学又は感光性化学増幅レジストを用いた限界寸法制御 |
WO2017197288A1 (en) | 2016-05-13 | 2017-11-16 | Tokyo Electron Limited | Critical dimension control by use of a photo agent |
WO2017210153A1 (en) | 2016-05-30 | 2017-12-07 | Coventor, Inc. | System and method for electrical behavior modeling in a 3d virtual fabrication environment |
CN106382117B (zh) * | 2016-11-03 | 2018-11-02 | 太原理工大学 | 横轴式掘进机截齿及其截割头载荷模拟方法 |
EP3358413A1 (en) * | 2017-02-02 | 2018-08-08 | ASML Netherlands B.V. | Metrology method, apparatus and computer program |
JP7097757B2 (ja) | 2017-06-18 | 2022-07-08 | コベンター・インコーポレーテッド | 仮想半導体デバイス製作環境におけるキーパラメータ識別、プロセスモデル較正、及び変動性解析のためのシステムと方法 |
CN107368655A (zh) * | 2017-07-21 | 2017-11-21 | 中冶集团武汉勘察研究院有限公司 | 抽水蓄能电站动态监测监控与仿真培训系统及其实现方法 |
US11138358B2 (en) * | 2017-09-29 | 2021-10-05 | Texas Instruments Incorporated | Simulation and analysis of circuit designs |
US11379633B2 (en) * | 2019-06-05 | 2022-07-05 | X Development Llc | Cascading models for optimization of fabrication and design of a physical device |
US20220350254A1 (en) * | 2019-07-03 | 2022-11-03 | Asml Netherlands B.V. | Method for applying a deposition model in a semiconductor manufacturing process |
KR20220046598A (ko) | 2019-08-16 | 2022-04-14 | 도쿄엘렉트론가부시키가이샤 | 확률 중심 결함 교정을 위한 방법 및 공정 |
CN111523160B (zh) * | 2020-05-06 | 2024-02-02 | 全芯智造技术有限公司 | 用于仿真集成电路的方法和设备以及计算机可读介质 |
Citations (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US5754826A (en) * | 1995-08-04 | 1998-05-19 | Synopsys, Inc. | CAD and simulation system for targeting IC designs to multiple fabrication processes |
US5923567A (en) * | 1996-04-10 | 1999-07-13 | Altera Corporation | Method and device for test vector analysis |
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US5256561A (en) * | 1991-12-20 | 1993-10-26 | Abbott Laboratories | Monoclonal antibody to HIV-2 and uses thereof |
US5539652A (en) * | 1995-02-07 | 1996-07-23 | Hewlett-Packard Company | Method for manufacturing test simulation in electronic circuit design |
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US20010051856A1 (en) | 2000-01-26 | 2001-12-13 | Xinhui Niu | Caching of intra-layer calculations for rapid rigorous coupled-wave analyses |
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US6768983B1 (en) * | 2000-11-28 | 2004-07-27 | Timbre Technologies, Inc. | System and method for real-time library generation of grating profiles |
US6433878B1 (en) * | 2001-01-29 | 2002-08-13 | Timbre Technology, Inc. | Method and apparatus for the determination of mask rules using scatterometry |
US6609086B1 (en) * | 2002-02-12 | 2003-08-19 | Timbre Technologies, Inc. | Profile refinement for integrated circuit metrology |
US7136796B2 (en) * | 2002-02-28 | 2006-11-14 | Timbre Technologies, Inc. | Generation and use of integrated circuit profile-based simulation information |
-
2002
- 2002-02-28 US US10/087,069 patent/US7136796B2/en active Active
-
2003
- 2003-02-25 TW TW092103977A patent/TWI273457B/zh not_active IP Right Cessation
- 2003-02-27 SG SG200300820A patent/SG102707A1/en unknown
- 2003-02-27 EP EP03251192A patent/EP1341225A2/en not_active Withdrawn
- 2003-02-28 JP JP2003053312A patent/JP2003324041A/ja active Pending
- 2003-02-28 KR KR10-2003-0012705A patent/KR100525567B1/ko not_active IP Right Cessation
-
2006
- 2006-11-09 US US11/595,358 patent/US7580823B2/en not_active Expired - Lifetime
-
2007
- 2007-09-26 JP JP2007250026A patent/JP4838217B2/ja not_active Expired - Fee Related
-
2010
- 2010-12-27 JP JP2010290350A patent/JP2011082562A/ja active Pending
Patent Citations (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US5754826A (en) * | 1995-08-04 | 1998-05-19 | Synopsys, Inc. | CAD and simulation system for targeting IC designs to multiple fabrication processes |
US5923567A (en) * | 1996-04-10 | 1999-07-13 | Altera Corporation | Method and device for test vector analysis |
US6197605B1 (en) * | 1996-04-10 | 2001-03-06 | Altera Corporation | Method and device for test vector analysis |
Also Published As
Publication number | Publication date |
---|---|
US20030163295A1 (en) | 2003-08-28 |
JP2003324041A (ja) | 2003-11-14 |
EP1341225A2 (en) | 2003-09-03 |
US7136796B2 (en) | 2006-11-14 |
KR20030071575A (ko) | 2003-09-03 |
TWI273457B (en) | 2007-02-11 |
US7580823B2 (en) | 2009-08-25 |
JP2011082562A (ja) | 2011-04-21 |
JP4838217B2 (ja) | 2011-12-14 |
JP2008028418A (ja) | 2008-02-07 |
US20070118349A1 (en) | 2007-05-24 |
KR100525567B1 (ko) | 2005-11-03 |
TW200304079A (en) | 2003-09-16 |
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