SG10202006580TA - Polymer, composition, molded article, cured product, and laminate - Google Patents

Polymer, composition, molded article, cured product, and laminate

Info

Publication number
SG10202006580TA
SG10202006580TA SG10202006580TA SG10202006580TA SG10202006580TA SG 10202006580T A SG10202006580T A SG 10202006580TA SG 10202006580T A SG10202006580T A SG 10202006580TA SG 10202006580T A SG10202006580T A SG 10202006580TA SG 10202006580T A SG10202006580T A SG 10202006580TA
Authority
SG
Singapore
Prior art keywords
laminate
polymer
composition
molded article
cured product
Prior art date
Application number
SG10202006580TA
Other languages
English (en)
Inventor
Ryouyuu Hifumi
Toshiaki Kadota
Nobuyuki Miyaki
Shintarou Fujitomi
Yasutaka Yoshida
Ryouji Tatara
Original Assignee
Jsr Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Jsr Corp filed Critical Jsr Corp
Publication of SG10202006580TA publication Critical patent/SG10202006580TA/en

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G73/00—Macromolecular compounds obtained by reactions forming a linkage containing nitrogen with or without oxygen or carbon in the main chain of the macromolecule, not provided for in groups C08G12/00 - C08G71/00
    • C08G73/02—Polyamines
    • C08G73/0273—Polyamines containing heterocyclic moieties in the main chain
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G65/00—Macromolecular compounds obtained by reactions forming an ether link in the main chain of the macromolecule
    • C08G65/34—Macromolecular compounds obtained by reactions forming an ether link in the main chain of the macromolecule from hydroxy compounds or their metallic derivatives
    • C08G65/38—Macromolecular compounds obtained by reactions forming an ether link in the main chain of the macromolecule from hydroxy compounds or their metallic derivatives derived from phenols
    • C08G65/40—Macromolecular compounds obtained by reactions forming an ether link in the main chain of the macromolecule from hydroxy compounds or their metallic derivatives derived from phenols from phenols (I) and other compounds (II), e.g. OH-Ar-OH + X-Ar-X, where X is halogen atom, i.e. leaving group
    • C08G65/4006—(I) or (II) containing elements other than carbon, oxygen, hydrogen or halogen as leaving group (X)
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B27/00—Layered products comprising a layer of synthetic resin
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B27/00—Layered products comprising a layer of synthetic resin
    • B32B27/28—Layered products comprising a layer of synthetic resin comprising synthetic resins not wholly covered by any one of the sub-groups B32B27/30 - B32B27/42
    • B32B27/281—Layered products comprising a layer of synthetic resin comprising synthetic resins not wholly covered by any one of the sub-groups B32B27/30 - B32B27/42 comprising polyimides
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B27/00—Layered products comprising a layer of synthetic resin
    • B32B27/28—Layered products comprising a layer of synthetic resin comprising synthetic resins not wholly covered by any one of the sub-groups B32B27/30 - B32B27/42
    • B32B27/285—Layered products comprising a layer of synthetic resin comprising synthetic resins not wholly covered by any one of the sub-groups B32B27/30 - B32B27/42 comprising polyethers
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G65/00—Macromolecular compounds obtained by reactions forming an ether link in the main chain of the macromolecule
    • C08G65/34—Macromolecular compounds obtained by reactions forming an ether link in the main chain of the macromolecule from hydroxy compounds or their metallic derivatives
    • C08G65/38—Macromolecular compounds obtained by reactions forming an ether link in the main chain of the macromolecule from hydroxy compounds or their metallic derivatives derived from phenols
    • C08G65/40—Macromolecular compounds obtained by reactions forming an ether link in the main chain of the macromolecule from hydroxy compounds or their metallic derivatives derived from phenols from phenols (I) and other compounds (II), e.g. OH-Ar-OH + X-Ar-X, where X is halogen atom, i.e. leaving group
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G65/00—Macromolecular compounds obtained by reactions forming an ether link in the main chain of the macromolecule
    • C08G65/34—Macromolecular compounds obtained by reactions forming an ether link in the main chain of the macromolecule from hydroxy compounds or their metallic derivatives
    • C08G65/38—Macromolecular compounds obtained by reactions forming an ether link in the main chain of the macromolecule from hydroxy compounds or their metallic derivatives derived from phenols
    • C08G65/40—Macromolecular compounds obtained by reactions forming an ether link in the main chain of the macromolecule from hydroxy compounds or their metallic derivatives derived from phenols from phenols (I) and other compounds (II), e.g. OH-Ar-OH + X-Ar-X, where X is halogen atom, i.e. leaving group
    • C08G65/4012—Other compound (II) containing a ketone group, e.g. X-Ar-C(=O)-Ar-X for polyetherketones
    • C08G65/4031—(I) or (II) containing nitrogen
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G65/00—Macromolecular compounds obtained by reactions forming an ether link in the main chain of the macromolecule
    • C08G65/34—Macromolecular compounds obtained by reactions forming an ether link in the main chain of the macromolecule from hydroxy compounds or their metallic derivatives
    • C08G65/38—Macromolecular compounds obtained by reactions forming an ether link in the main chain of the macromolecule from hydroxy compounds or their metallic derivatives derived from phenols
    • C08G65/40—Macromolecular compounds obtained by reactions forming an ether link in the main chain of the macromolecule from hydroxy compounds or their metallic derivatives derived from phenols from phenols (I) and other compounds (II), e.g. OH-Ar-OH + X-Ar-X, where X is halogen atom, i.e. leaving group
    • C08G65/4012—Other compound (II) containing a ketone group, e.g. X-Ar-C(=O)-Ar-X for polyetherketones
    • C08G65/4031—(I) or (II) containing nitrogen
    • C08G65/4037—(I) or (II) containing nitrogen in ring structure, e.g. pyridine group
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G65/00—Macromolecular compounds obtained by reactions forming an ether link in the main chain of the macromolecule
    • C08G65/34—Macromolecular compounds obtained by reactions forming an ether link in the main chain of the macromolecule from hydroxy compounds or their metallic derivatives
    • C08G65/38—Macromolecular compounds obtained by reactions forming an ether link in the main chain of the macromolecule from hydroxy compounds or their metallic derivatives derived from phenols
    • C08G65/40—Macromolecular compounds obtained by reactions forming an ether link in the main chain of the macromolecule from hydroxy compounds or their metallic derivatives derived from phenols from phenols (I) and other compounds (II), e.g. OH-Ar-OH + X-Ar-X, where X is halogen atom, i.e. leaving group
    • C08G65/4012—Other compound (II) containing a ketone group, e.g. X-Ar-C(=O)-Ar-X for polyetherketones
    • C08G65/4043—(I) or (II) containing oxygen other than as phenol or carbonyl group
    • C08G65/405—(I) or (II) containing oxygen other than as phenol or carbonyl group in ring structure, e.g. phenolphtalein
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G65/00—Macromolecular compounds obtained by reactions forming an ether link in the main chain of the macromolecule
    • C08G65/34—Macromolecular compounds obtained by reactions forming an ether link in the main chain of the macromolecule from hydroxy compounds or their metallic derivatives
    • C08G65/38—Macromolecular compounds obtained by reactions forming an ether link in the main chain of the macromolecule from hydroxy compounds or their metallic derivatives derived from phenols
    • C08G65/40—Macromolecular compounds obtained by reactions forming an ether link in the main chain of the macromolecule from hydroxy compounds or their metallic derivatives derived from phenols from phenols (I) and other compounds (II), e.g. OH-Ar-OH + X-Ar-X, where X is halogen atom, i.e. leaving group
    • C08G65/4081—Macromolecular compounds obtained by reactions forming an ether link in the main chain of the macromolecule from hydroxy compounds or their metallic derivatives derived from phenols from phenols (I) and other compounds (II), e.g. OH-Ar-OH + X-Ar-X, where X is halogen atom, i.e. leaving group forming cyclic polymers or oligomers
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G73/00—Macromolecular compounds obtained by reactions forming a linkage containing nitrogen with or without oxygen or carbon in the main chain of the macromolecule, not provided for in groups C08G12/00 - C08G71/00
    • C08G73/02—Polyamines
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K5/00—Use of organic ingredients
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K5/00—Use of organic ingredients
    • C08K5/0008—Organic ingredients according to more than one of the "one dot" groups of C08K5/01 - C08K5/59
    • C08K5/0025—Crosslinking or vulcanising agents; including accelerators
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L63/00—Compositions of epoxy resins; Compositions of derivatives of epoxy resins
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L71/00—Compositions of polyethers obtained by reactions forming an ether link in the main chain; Compositions of derivatives of such polymers
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L71/00—Compositions of polyethers obtained by reactions forming an ether link in the main chain; Compositions of derivatives of such polymers
    • C08L71/08—Polyethers derived from hydroxy compounds or from their metallic derivatives
    • C08L71/10—Polyethers derived from hydroxy compounds or from their metallic derivatives from phenols
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L71/00—Compositions of polyethers obtained by reactions forming an ether link in the main chain; Compositions of derivatives of such polymers
    • C08L71/08—Polyethers derived from hydroxy compounds or from their metallic derivatives
    • C08L71/10—Polyethers derived from hydroxy compounds or from their metallic derivatives from phenols
    • C08L71/12—Polyphenylene oxides
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L79/00—Compositions of macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing nitrogen with or without oxygen or carbon only, not provided for in groups C08L61/00 - C08L77/00
    • C08L79/02—Polyamines
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L79/00—Compositions of macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing nitrogen with or without oxygen or carbon only, not provided for in groups C08L61/00 - C08L77/00
    • C08L79/04—Polycondensates having nitrogen-containing heterocyclic rings in the main chain; Polyhydrazides; Polyamide acids or similar polyimide precursors
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09D—COATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
    • C09D163/00—Coating compositions based on epoxy resins; Coating compositions based on derivatives of epoxy resins
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09D—COATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
    • C09D171/00—Coating compositions based on polyethers obtained by reactions forming an ether link in the main chain; Coating compositions based on derivatives of such polymers
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09D—COATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
    • C09D179/00—Coating compositions based on macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing nitrogen, with or without oxygen, or carbon only, not provided for in groups C09D161/00 - C09D177/00
    • C09D179/02—Polyamines
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G73/00—Macromolecular compounds obtained by reactions forming a linkage containing nitrogen with or without oxygen or carbon in the main chain of the macromolecule, not provided for in groups C08G12/00 - C08G71/00
    • C08G73/06—Polycondensates having nitrogen-containing heterocyclic rings in the main chain of the macromolecule
    • C08G73/0622—Polycondensates containing six-membered rings, not condensed with other rings, with nitrogen atoms as the only ring hetero atoms
    • C08G73/0633—Polycondensates containing six-membered rings, not condensed with other rings, with nitrogen atoms as the only ring hetero atoms with only two nitrogen atoms in the ring
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L2201/00—Properties
    • C08L2201/08—Stabilised against heat, light or radiation or oxydation
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02E—REDUCTION OF GREENHOUSE GAS [GHG] EMISSIONS, RELATED TO ENERGY GENERATION, TRANSMISSION OR DISTRIBUTION
    • Y02E60/00—Enabling technologies; Technologies with a potential or indirect contribution to GHG emissions mitigation
    • Y02E60/30—Hydrogen technology
    • Y02E60/50—Fuel cells

Landscapes

  • Chemical & Material Sciences (AREA)
  • Organic Chemistry (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Health & Medical Sciences (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Materials Engineering (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Wood Science & Technology (AREA)
  • Crystallography & Structural Chemistry (AREA)
  • Addition Polymer Or Copolymer, Post-Treatments, Or Chemical Modifications (AREA)
  • Laminated Bodies (AREA)
  • Compositions Of Macromolecular Compounds (AREA)
SG10202006580TA 2016-04-20 2017-04-05 Polymer, composition, molded article, cured product, and laminate SG10202006580TA (en)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2016084840 2016-04-20
JP2016089870 2016-04-27
JP2016148944 2016-07-28

Publications (1)

Publication Number Publication Date
SG10202006580TA true SG10202006580TA (en) 2020-08-28

Family

ID=60115952

Family Applications (3)

Application Number Title Priority Date Filing Date
SG10202006578WA SG10202006578WA (en) 2016-04-20 2017-04-05 Polymer, composition, molded article, cured product, and laminate
SG10202006580TA SG10202006580TA (en) 2016-04-20 2017-04-05 Polymer, composition, molded article, cured product, and laminate
SG11201809285YA SG11201809285YA (en) 2016-04-20 2017-04-05 Polymer, composition, molded article, cured product, and laminate

Family Applications Before (1)

Application Number Title Priority Date Filing Date
SG10202006578WA SG10202006578WA (en) 2016-04-20 2017-04-05 Polymer, composition, molded article, cured product, and laminate

Family Applications After (1)

Application Number Title Priority Date Filing Date
SG11201809285YA SG11201809285YA (en) 2016-04-20 2017-04-05 Polymer, composition, molded article, cured product, and laminate

Country Status (7)

Country Link
US (2) US11505651B2 (zh)
EP (3) EP3770202B1 (zh)
KR (1) KR102267304B1 (zh)
CN (2) CN113861407B (zh)
SG (3) SG10202006578WA (zh)
TW (2) TWI738763B (zh)
WO (1) WO2017183461A1 (zh)

Families Citing this family (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP6866737B2 (ja) * 2016-04-20 2021-04-28 Jsr株式会社 重合体、組成物及び成形体
JP6922364B2 (ja) * 2016-07-28 2021-08-18 Jsr株式会社 重合体、組成物及び成形体
US11582860B2 (en) * 2017-09-15 2023-02-14 Jsr Corporation Circuit board
JP7136119B2 (ja) * 2017-11-08 2022-09-13 日産化学株式会社 トリアジン環含有重合体およびそれを含む組成物
JP7306449B2 (ja) * 2019-03-01 2023-07-11 Jsr株式会社 高周波回路用積層体、フレキシブルプリント基板、及び積層体捲回体
WO2020217699A1 (ja) * 2019-04-25 2020-10-29 Jsr株式会社 感光性樹脂組成物
JP2021172756A (ja) * 2020-04-27 2021-11-01 味の素株式会社 樹脂組成物
CN114561011B (zh) * 2022-03-10 2023-11-03 哈尔滨工业大学 一种自乳化离子型水性聚酰胺酰亚胺及其制备方法、碳纤维上浆剂及其制备方法和应用
WO2024053282A1 (ja) * 2022-09-09 2024-03-14 Jsr株式会社 重合体、組成物、硬化物、積層体及び電子部品

Family Cites Families (69)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3166521A (en) * 1962-03-06 1965-01-19 Du Pont Polymers of aminopyrimidines and process therefor
FR2019511A1 (zh) * 1968-09-30 1970-07-03 Procter & Gamble
US3644285A (en) * 1970-10-12 1972-02-22 Research Corp Polyaromatic pyrazines
US3981832A (en) * 1971-02-11 1976-09-21 Fokker-V.F.W. B.V. Fire-protecting epoxy resins
US3814757A (en) * 1971-04-13 1974-06-04 Du Pont Diamino substituted dicyano pyrazines and process
JPS5638617B2 (zh) * 1972-06-12 1981-09-08
JPS5630182B2 (zh) 1973-02-02 1981-07-13
JPS5122904A (ja) 1974-08-20 1976-02-24 Mitsubishi Heavy Ind Ltd Datsukikisukurabaa
CH606253A5 (zh) * 1977-01-07 1978-10-31 Ciba Geigy Ag
US4151313A (en) * 1977-03-11 1979-04-24 Hitachi, Ltd. Method for production of printed circuits by electroless metal plating employing a solid solution of metal oxides of titanium, nickel, and antimony as a masking material
SU858316A1 (ru) 1979-12-17 1985-11-30 Новосибирский институт органической химии СО АН СССР 2,5-Ди-( @ -аминофенил)пиримидин как мономер дл синтеза полиимидов,способ его получени и полиимиды на его основе в качестве термостойкого материала
JPS6185439A (ja) * 1984-10-03 1986-05-01 Showa Denko Kk ポリ−２−アミノピリミジン
US4931487A (en) * 1988-03-04 1990-06-05 Dow Chemical Company Chain extenders for polyurethanes
US5089571A (en) * 1990-12-04 1992-02-18 The Dow Chemical Company Regenerated, high molecular weight, thermoplastic resins and process for regenerating thermoplastic resins
JPH0565352A (ja) 1991-09-09 1993-03-19 Mitsubishi Gas Chem Co Inc 熱硬化性シアナート化合物変性ポリフエニレンエーテル樹脂フイルムの製造方法
DE4237768A1 (en) * 1991-11-12 1993-05-13 Ciba Geigy Ag New polyarylene ether derivs. with reduced viscosity - used to prepare moulded bodies, foils, fibres and membranes, as matrix resins, adhesives or coating agents or as polymer additives
US5464923A (en) * 1994-10-19 1995-11-07 Hoechst Celanese Corporation Polymer compositions containing substituted biphenyl pyrazines
JP4153060B2 (ja) * 1997-09-25 2008-09-17 日本曹達株式会社 ピラジン環を主鎖に有するポリエステル系化合物、その製造方法および高分子色素
JP2001301088A (ja) 2000-04-24 2001-10-30 Jsr Corp 積層フィルムおよびその積層フィルムを用いたプリント基板
JP4467816B2 (ja) 2001-02-27 2010-05-26 株式会社日立製作所 低誘電正接樹脂組成物、硬化性フィルム、硬化物およびそれを用いた電気部品とその製法
US7115681B2 (en) * 2001-07-09 2006-10-03 Kaneka Corporation Resin composition
US6869715B2 (en) 2002-11-23 2005-03-22 Gkss-Forschungszentrum Geesthacht, Gmbh Ion conductive membrane for electrochemical application
JP4211378B2 (ja) 2002-12-13 2009-01-21 ソニー株式会社 キャパシタ素子
KR101117063B1 (ko) 2003-06-19 2012-04-16 가부시끼가이샤 히다치 세이사꾸쇼 에폭시 화합물 및 경화 에폭시 수지 제품
US7820314B2 (en) * 2003-07-27 2010-10-26 Basf Fuel Cell Research Gmbh Proton-conducting membrane and use thereof
JP2005290317A (ja) * 2004-04-05 2005-10-20 Teijin Ltd 剛直系複素環高分子組成物
JP4999285B2 (ja) 2005-05-24 2012-08-15 上野製薬株式会社 液晶ポリエステル樹脂組成物
JP2007262191A (ja) 2006-03-28 2007-10-11 Nippon Steel Chem Co Ltd 難燃硬化性樹脂組成物
JP2008039703A (ja) 2006-08-09 2008-02-21 Sumitomo Bakelite Co Ltd 電磁気特性測定治具及び電磁気特性の測定方法
JP4963628B2 (ja) 2007-05-15 2012-06-27 住友化学株式会社 高分子フィルム積層体及びその製造方法、並びに、高分子フィルム積層体を用いたフレキシブル配線板。
JP5198105B2 (ja) 2008-03-25 2013-05-15 日本メクトロン株式会社 多層フレキシブルプリント配線板の製造方法
JP4613977B2 (ja) 2008-04-28 2011-01-19 日立化成工業株式会社 薄層石英ガラスクロスを含むプリプレグ、およびそれを用いた配線板
JP2010031231A (ja) * 2008-06-30 2010-02-12 Jsr Corp 新規な芳香族化合物および含窒素芳香環を有するポリアリーレン系共重合体
KR101733459B1 (ko) 2009-05-07 2017-05-10 닛산 가가쿠 고교 가부시키 가이샤 트리아진환 함유 중합체 및 그것을 포함하는 막 형성용 조성물
TWI498408B (zh) 2009-07-14 2015-09-01 Ajinomoto Kk Attached film with copper foil
US8222403B2 (en) * 2009-11-12 2012-07-17 The United States Of America, As Represented By The Secretary Of The Navy Heteroaromatic phthalonitriles
CN102753604B (zh) * 2010-01-04 2015-01-21 罗地亚经营管理公司 多胺及其制造方法
CN102656956B (zh) 2010-07-26 2015-02-18 日本梅克特隆株式会社 柔性印刷电路板及其制造方法
JP5630182B2 (ja) 2010-09-27 2014-11-26 株式会社デンソー エポキシ樹脂組成物およびエポキシ樹脂／ポリエーテルスルホン複合体
JP5598258B2 (ja) 2010-10-28 2014-10-01 日産化学工業株式会社 トリアジン環含有重合体含有高屈折率膜を備える電子デバイス
TWI393495B (zh) 2010-12-03 2013-04-11 Adv Flexible Circuits Co Ltd 訊號傳輸電路板之特性阻抗精度控制結構
KR101935062B1 (ko) 2010-12-27 2019-01-03 주식회사 쿠라레 회로 기판 및 그 제조 방법
US9006339B2 (en) * 2011-05-10 2015-04-14 Basf Se Mechanically stabilized polyazoles comprising at least one polyvinyl alcohol
WO2013027732A1 (ja) 2011-08-23 2013-02-28 日本ゼオン株式会社 硬化性樹脂組成物、フィルム、プリプレグ、積層体、硬化物、及び複合体
JP5834251B2 (ja) 2011-11-22 2015-12-16 パナソニックＩｐマネジメント株式会社 フレキシブル金属張基材、フレキシブル金属張基材の製造方法、プリント配線板、多層フレキシブルプリント配線板、及びフレックスリジッドプリント配線板
WO2013080929A1 (ja) 2011-12-01 2013-06-06 Jsr株式会社 多層レジストプロセスに用いられるレジスト下層膜形成用組成物、レジスト下層膜及びその形成方法、並びにパターン形成方法
KR20140110954A (ko) 2011-12-22 2014-09-17 다이요 잉키 세이조 가부시키가이샤 드라이 필름 및 그것을 사용한 프린트 배선판, 프린트 배선판의 제조 방법, 및 플립 칩 실장 기판
US8981036B2 (en) * 2012-08-02 2015-03-17 The United States Of America, As Represented By The Secretary Of The Navy Synthesis of and curing additives for phthalonitriles
JP2014070111A (ja) 2012-09-28 2014-04-21 Nippon Zeon Co Ltd 絶縁体、絶縁膜、積層体および積層体の製造方法
CN103102488B (zh) * 2013-02-07 2014-10-15 江西师范大学 含联嘧啶结构的高介电常数聚酰亚胺及其制备方法
JP2014185309A (ja) * 2013-02-21 2014-10-02 Jsr Corp 重合体の製造方法および重合体
KR102138174B1 (ko) 2013-03-22 2020-07-27 나믹스 가부시끼가이샤 수지 조성물, 그리고, 그것에 의한 접착 필름, 커버레이 필름, 층간 접착제
JP6235787B2 (ja) 2013-03-29 2017-11-22 東レ・デュポン株式会社 高周波回路基板用カバーレイ
CN105683255B (zh) * 2013-10-04 2018-05-29 三菱化学株式会社 聚合物、有机电致发光元件用组合物、有机电致发光元件、有机el显示装置和有机el照明
JP6515811B2 (ja) 2013-12-24 2019-05-22 日産化学株式会社 トリアジン系重合体含有組成物
CN103801501B (zh) 2014-01-20 2016-04-20 中国科学院长春应用化学研究所 挠性无胶覆铜板及其制备方法
JP6388483B2 (ja) 2014-03-13 2018-09-12 東レ・デュポン株式会社 高周波回路基板用カバーレイ及びフレキシブルフラットケーブル用基材
JP6429267B2 (ja) 2014-04-28 2018-11-28 Jsr株式会社 重合体
JP6432156B2 (ja) * 2014-04-28 2018-12-05 Jsr株式会社 重合体組成物、重合体ペレット、成形体及びフィルム
JP6206445B2 (ja) 2014-07-25 2017-10-04 Jsr株式会社 回路基板用樹脂基板、回路基板用樹脂組成物および回路基板
JP2016087799A (ja) 2014-10-29 2016-05-23 東レ・デュポン株式会社 高周波回路基板用の長尺状積層体及びその製造方法
TW201640963A (zh) 2015-01-13 2016-11-16 Hitachi Chemical Co Ltd 柔性印刷電路板用樹脂膜、帶樹脂的金屬箔、覆蓋層膜、接合片及柔性印刷電路板
JP6566023B2 (ja) * 2015-03-11 2019-08-28 Jsr株式会社 重合体、樹脂組成物及び樹脂成形体
US10066068B2 (en) * 2015-07-07 2018-09-04 Jeffrey L. Katz Polymeric ion conductor with improved thermal characteristics
JP6590568B2 (ja) 2015-07-22 2019-10-16 株式会社カネカ 絶縁性フィルム、絶縁性フィルムの製造方法、および金属張積層板の製造方法
JP6927665B2 (ja) 2015-12-25 2021-09-01 日東電工株式会社 配線回路基板
JP6888308B2 (ja) 2016-02-04 2021-06-16 Jsr株式会社 樹脂組成物、重合体の製造方法及び成形体
JP6971580B2 (ja) 2016-02-12 2021-11-24 株式会社カネカ 多層ポリイミドフィルム、およびフレキシブル金属張積層板
WO2017209208A1 (ja) 2016-06-02 2017-12-07 日立化成株式会社 積層体の製造方法

Also Published As

Publication number Publication date
TWI738763B (zh) 2021-09-11
TW202140616A (zh) 2021-11-01
CN113861407B (zh) 2024-02-20
EP3447081B1 (en) 2021-03-31
EP3766919A1 (en) 2021-01-20
US20220235179A1 (en) 2022-07-28
US11505651B2 (en) 2022-11-22
KR20180136950A (ko) 2018-12-26
KR102267304B1 (ko) 2021-06-21
TWI768995B (zh) 2022-06-21
WO2017183461A1 (ja) 2017-10-26
TW201807017A (zh) 2018-03-01
EP3447081A1 (en) 2019-02-27
CN109071804B (zh) 2022-01-11
CN113861407A (zh) 2021-12-31
SG10202006578WA (en) 2020-08-28
EP3770202B1 (en) 2024-02-21
EP3766919B1 (en) 2024-02-21
EP3447081A4 (en) 2020-03-18
SG11201809285YA (en) 2018-11-29
EP3770202A1 (en) 2021-01-27
CN109071804A (zh) 2018-12-21
US20190055357A1 (en) 2019-02-21

Similar Documents

Publication Publication Date Title
SG10202006578WA (en) Polymer, composition, molded article, cured product, and laminate
EP3187539A4 (en) Thermoplastic resin composition and molded article employing same
EP3178870A4 (en) Fibre-reinforced thermoplastic resin moulding material, and fibre-reinforced thermoplastic resin moulded article
EP3342827A4 (en) THERMOPLASTIC RESIN COMPOSITION AND FORMAL PRODUCTS MANUFACTURED THEREFROM
EP3219755A4 (en) Thermoplastic resin composition and molded product produced therefrom
EP3037474A4 (en) Thermoplastic resin composition and thermoplastic resin molded article prepared therefrom
EP3342826A4 (en) THERMOPLASTIC RESIN COMPOSITION AND MOLDED ARTICLE PRODUCED THEREFROM
EP3168262A4 (en) Thermoplastic resin composition and molded article thereof
EP3121229A4 (en) Vinyl chloride resin composition for powder molding, vinyl chloride resin molded article, and laminate
EP3689950A4 (en) COMPOSITION OF RESIN FOR PRE-IMPREGNATE, PRE-IMPREGNATE AND MOLDED ARTICLE
IL248841A0 (en) Thermoplastic resin composition and mold-produced article thereof
EP3284787A4 (en) RESIN COMPOSITION AND MOLDED ARTICLE THEREOF
EP3222670A4 (en) Thermoplastic resin composition and molded product comprising same
EP3492510A4 (en) POLYMER, COMPOSITION, MOLDED ARTICLE, CURED AND LAMINATE PRODUCT
EP3689951A4 (en) PREPREG RESIN COMPOSITION, PREPREG AND MOLDED ARTICLES
EP3342822A4 (en) POLYMER RESIN COMPOSITION AND ASSOCIATED MOLDED PRODUCT
EP3162856A4 (en) Resin composition and molded article thereof
EP3228664A4 (en) Thermoplastic resin composition and molded product
EP3214126A4 (en) Thermoplastic resin composition and molded article comprising same
EP3327086A4 (en) Resin composition and molded article
EP3257896A4 (en) Block copolymer composition, molding material, resin composition, and molded article
EP3231843A4 (en) Automobile-use thermoplastic resin composition, and automobile-use molded product manufactured therefrom
EP3235871A4 (en) Polyamide resin composition and molded article thereof
EP3205695A4 (en) Surface physical property modifier composition, thermoplastic resin composition containing same, and resin molded article therefrom
EP3121226A4 (en) Thermoplastic resin composition and resin molded article