SG10202004805XA - Optical axis adjusting method for laser processing apparatus - Google Patents

Optical axis adjusting method for laser processing apparatus

Info

Publication number
SG10202004805XA
SG10202004805XA SG10202004805XA SG10202004805XA SG10202004805XA SG 10202004805X A SG10202004805X A SG 10202004805XA SG 10202004805X A SG10202004805X A SG 10202004805XA SG 10202004805X A SG10202004805X A SG 10202004805XA SG 10202004805X A SG10202004805X A SG 10202004805XA
Authority
SG
Singapore
Prior art keywords
processing apparatus
optical axis
laser processing
adjusting method
axis adjusting
Prior art date
Application number
SG10202004805XA
Other languages
English (en)
Inventor
Kumazawa Satoshi
Nayuki Masatoshi
Original Assignee
Disco Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Disco Corp filed Critical Disco Corp
Publication of SG10202004805XA publication Critical patent/SG10202004805XA/en

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/36—Removing material
    • B23K26/38—Removing material by boring or cutting
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
    • B23K26/035—Aligning the laser beam
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
    • B23K26/04—Automatically aligning, aiming or focusing the laser beam, e.g. using the back-scattered light
    • B23K26/042—Automatically aligning the laser beam
    • B23K26/043—Automatically aligning the laser beam along the beam path, i.e. alignment of laser beam axis relative to laser beam apparatus
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
    • B23K26/06—Shaping the laser beam, e.g. by masks or multi-focusing
    • B23K26/064—Shaping the laser beam, e.g. by masks or multi-focusing by means of optical elements, e.g. lenses, mirrors or prisms
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/08—Devices involving relative movement between laser beam and workpiece
    • B23K26/083—Devices involving movement of the workpiece in at least one axial direction
    • B23K26/0853—Devices involving movement of the workpiece in at least in two axial directions, e.g. in a plane
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/08—Devices involving relative movement between laser beam and workpiece
    • B23K26/0869—Devices involving movement of the laser head in at least one axial direction
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/36—Removing material
    • B23K26/40—Removing material taking account of the properties of the material involved
    • B23K26/402—Removing material taking account of the properties of the material involved involving non-metallic material, e.g. isolators
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/50—Working by transmitting the laser beam through or within the workpiece
    • B23K26/57—Working by transmitting the laser beam through or within the workpiece the laser beam entering a face of the workpiece from which it is transmitted through the workpiece material to work on a different workpiece face, e.g. for effecting removal, fusion splicing, modifying or reforming
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/70—Auxiliary operations or equipment
    • B23K26/702—Auxiliary equipment
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/70—Auxiliary operations or equipment
    • B23K26/702—Auxiliary equipment
    • B23K26/705—Beam measuring device
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01M—TESTING STATIC OR DYNAMIC BALANCE OF MACHINES OR STRUCTURES; TESTING OF STRUCTURES OR APPARATUS, NOT OTHERWISE PROVIDED FOR
    • G01M11/00—Testing of optical apparatus; Testing structures by optical methods not otherwise provided for
    • G01M11/08—Testing mechanical properties
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67242—Apparatus for monitoring, sorting or marking
    • H01L21/67259—Position monitoring, e.g. misposition detection or presence detection
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67092—Apparatus for mechanical treatment
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/6835—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support
    • H01L21/6836—Wafer tapes, e.g. grinding or dicing support tapes
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/6838—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping with gripping and holding devices using a vacuum; Bernoulli devices
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2221/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof covered by H01L21/00
    • H01L2221/67—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere
    • H01L2221/683—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L2221/68304—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support
    • H01L2221/68327—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support used during dicing or grinding
SG10202004805XA 2019-05-23 2020-05-22 Optical axis adjusting method for laser processing apparatus SG10202004805XA (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2019097059A JP7285694B2 (ja) 2019-05-23 2019-05-23 レーザー加工装置の光軸調整方法

Publications (1)

Publication Number Publication Date
SG10202004805XA true SG10202004805XA (en) 2020-12-30

Family

ID=73052397

Family Applications (1)

Application Number Title Priority Date Filing Date
SG10202004805XA SG10202004805XA (en) 2019-05-23 2020-05-22 Optical axis adjusting method for laser processing apparatus

Country Status (6)

Country Link
US (1) US11577339B2 (ja)
JP (1) JP7285694B2 (ja)
CN (1) CN111975218A (ja)
DE (1) DE102020206407A1 (ja)
SG (1) SG10202004805XA (ja)
TW (1) TWI829930B (ja)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE102022114646A1 (de) 2022-06-10 2023-12-21 Trumpf Laser Gmbh Verfahren und Vorrichtung zum Verarbeiten mindestens eines Teilbereichs eines Schichtsystems

Family Cites Families (27)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS632581A (ja) * 1986-06-19 1988-01-07 Nikon Corp レ−ザビ−ム調整装置
US5011282A (en) 1989-11-16 1991-04-30 Amada Company, Limited Laser beam path alignment apparatus for laser processing machines
JPH1158052A (ja) * 1997-08-26 1999-03-02 Nippon Steel Corp レーザ加工装置
JP2005118815A (ja) * 2003-10-16 2005-05-12 Hitachi Via Mechanics Ltd レーザ加工方法およびレーザ加工装置
EP1750153A1 (de) * 2005-08-02 2007-02-07 TRUMPF Maschinen Grüsch AG Vorrichtung zur Neigungsverstellung eines Spiegels einer Laserbearbeitungsmaschine
JP2007175744A (ja) * 2005-12-28 2007-07-12 Yamazaki Mazak Corp レーザ加工機における光路軸の調整装置
JP4938339B2 (ja) 2006-04-04 2012-05-23 株式会社ディスコ レーザー加工装置
CN101104223B (zh) * 2006-07-10 2012-05-23 彩霸阳光株式会社 激光加工装置
JP5007090B2 (ja) * 2006-09-11 2012-08-22 株式会社ディスコ レーザー加工方法
JP2008207210A (ja) * 2007-02-26 2008-09-11 Disco Abrasive Syst Ltd レーザー光線照射装置およびレーザー加工機
JP2008212999A (ja) * 2007-03-06 2008-09-18 Disco Abrasive Syst Ltd レーザー加工装置
JP5011072B2 (ja) * 2007-11-21 2012-08-29 株式会社ディスコ レーザー加工装置
JP2009283566A (ja) * 2008-05-20 2009-12-03 Disco Abrasive Syst Ltd ウエーハのレーザー加工方法およびレーザー加工装置
JP2011173141A (ja) 2010-02-24 2011-09-08 Hitachi High-Technologies Corp レーザ加工位置アライメント方法、レーザ加工方法、及びレーザ加工装置並びにソーラパネル製造方法
JP2011253866A (ja) * 2010-06-01 2011-12-15 Disco Abrasive Syst Ltd 分割方法
JP5788749B2 (ja) * 2011-09-15 2015-10-07 株式会社ディスコ レーザー加工装置
JP5908705B2 (ja) * 2011-11-30 2016-04-26 株式会社ディスコ レーザー加工装置
JP5931537B2 (ja) * 2012-03-28 2016-06-08 東レエンジニアリング株式会社 レーザの光軸アライメント方法およびそれを用いたレーザ加工装置
JP6062315B2 (ja) * 2013-04-24 2017-01-18 株式会社ディスコ ウエーハの加工方法
JP6262039B2 (ja) * 2014-03-17 2018-01-17 株式会社ディスコ 板状物の加工方法
JP6301203B2 (ja) * 2014-06-02 2018-03-28 株式会社ディスコ チップの製造方法
JP2017152569A (ja) * 2016-02-25 2017-08-31 株式会社ディスコ ウエーハの加工方法
US11471976B2 (en) 2016-03-10 2022-10-18 Hamamatsu Photonics K.K. Laser light radiation device and laser light radiation method
JP6633429B2 (ja) 2016-03-11 2020-01-22 株式会社ディスコ レーザー加工装置
CN109564275B (zh) * 2016-08-10 2022-12-09 三菱电机株式会社 光轴调整机构
JP6882045B2 (ja) * 2017-04-13 2021-06-02 株式会社ディスコ 集光点位置検出方法
JP6955893B2 (ja) * 2017-04-25 2021-10-27 株式会社ディスコ レーザー加工装置の高さ位置検出ユニットの評価用治具及びレーザー加工装置の高さ位置検出ユニットの評価方法

Also Published As

Publication number Publication date
CN111975218A (zh) 2020-11-24
JP2020189323A (ja) 2020-11-26
TWI829930B (zh) 2024-01-21
JP7285694B2 (ja) 2023-06-02
US11577339B2 (en) 2023-02-14
US20200368845A1 (en) 2020-11-26
DE102020206407A1 (de) 2020-11-26
TW202044367A (zh) 2020-12-01

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