SG10201907142VA - Etching composition - Google Patents
Etching compositionInfo
- Publication number
- SG10201907142VA SG10201907142VA SG10201907142VA SG10201907142VA SG10201907142VA SG 10201907142V A SG10201907142V A SG 10201907142VA SG 10201907142V A SG10201907142V A SG 10201907142VA SG 10201907142V A SG10201907142V A SG 10201907142VA SG 10201907142V A SG10201907142V A SG 10201907142VA
- Authority
- SG
- Singapore
- Prior art keywords
- etching composition
- etching
- none
- organic solvent
- disclosure relates
- Prior art date
Links
- 238000005530 etching Methods 0.000 title abstract 3
- 239000000203 mixture Substances 0.000 title abstract 3
- 150000001409 amidines Chemical class 0.000 abstract 1
- 239000002738 chelating agent Substances 0.000 abstract 1
- 230000007797 corrosion Effects 0.000 abstract 1
- 238000005260 corrosion Methods 0.000 abstract 1
- 239000003112 inhibitor Substances 0.000 abstract 1
- 239000002184 metal Substances 0.000 abstract 1
- 239000003960 organic solvent Substances 0.000 abstract 1
- 239000007800 oxidant agent Substances 0.000 abstract 1
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 abstract 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
- H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
- H01L21/31—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to form insulating layers thereon, e.g. for masking or by using photolithographic techniques; After treatment of these layers; Selection of materials for these layers
- H01L21/3205—Deposition of non-insulating-, e.g. conductive- or resistive-, layers on insulating layers; After-treatment of these layers
- H01L21/321—After treatment
- H01L21/3213—Physical or chemical etching of the layers, e.g. to produce a patterned layer from a pre-deposited extensive layer
- H01L21/32133—Physical or chemical etching of the layers, e.g. to produce a patterned layer from a pre-deposited extensive layer by chemical means only
- H01L21/32134—Physical or chemical etching of the layers, e.g. to produce a patterned layer from a pre-deposited extensive layer by chemical means only by liquid etching only
-
- C—CHEMISTRY; METALLURGY
- C04—CEMENTS; CONCRETE; ARTIFICIAL STONE; CERAMICS; REFRACTORIES
- C04B—LIME, MAGNESIA; SLAG; CEMENTS; COMPOSITIONS THEREOF, e.g. MORTARS, CONCRETE OR LIKE BUILDING MATERIALS; ARTIFICIAL STONE; CERAMICS; REFRACTORIES; TREATMENT OF NATURAL STONE
- C04B41/00—After-treatment of mortars, concrete, artificial stone or ceramics; Treatment of natural stone
- C04B41/53—After-treatment of mortars, concrete, artificial stone or ceramics; Treatment of natural stone involving the removal of at least part of the materials of the treated article, e.g. etching, drying of hardened concrete
- C04B41/5338—Etching
- C04B41/5353—Wet etching, e.g. with etchants dissolved in organic solvents
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09K—MATERIALS FOR MISCELLANEOUS APPLICATIONS, NOT PROVIDED FOR ELSEWHERE
- C09K13/00—Etching, surface-brightening or pickling compositions
- C09K13/04—Etching, surface-brightening or pickling compositions containing an inorganic acid
- C09K13/06—Etching, surface-brightening or pickling compositions containing an inorganic acid with organic material
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23F—NON-MECHANICAL REMOVAL OF METALLIC MATERIAL FROM SURFACE; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL; MULTI-STEP PROCESSES FOR SURFACE TREATMENT OF METALLIC MATERIAL INVOLVING AT LEAST ONE PROCESS PROVIDED FOR IN CLASS C23 AND AT LEAST ONE PROCESS COVERED BY SUBCLASS C21D OR C22F OR CLASS C25
- C23F1/00—Etching metallic material by chemical means
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23F—NON-MECHANICAL REMOVAL OF METALLIC MATERIAL FROM SURFACE; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL; MULTI-STEP PROCESSES FOR SURFACE TREATMENT OF METALLIC MATERIAL INVOLVING AT LEAST ONE PROCESS PROVIDED FOR IN CLASS C23 AND AT LEAST ONE PROCESS COVERED BY SUBCLASS C21D OR C22F OR CLASS C25
- C23F1/00—Etching metallic material by chemical means
- C23F1/10—Etching compositions
- C23F1/14—Aqueous compositions
- C23F1/32—Alkaline compositions
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/02041—Cleaning
- H01L21/02057—Cleaning during device manufacture
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
- H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
- H01L21/302—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to change their surface-physical characteristics or shape, e.g. etching, polishing, cutting
- H01L21/306—Chemical or electrical treatment, e.g. electrolytic etching
- H01L21/30604—Chemical etching
Landscapes
- Chemical & Material Sciences (AREA)
- Engineering & Computer Science (AREA)
- Power Engineering (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- Manufacturing & Machinery (AREA)
- Materials Engineering (AREA)
- Chemical Kinetics & Catalysis (AREA)
- General Chemical & Material Sciences (AREA)
- Organic Chemistry (AREA)
- Mechanical Engineering (AREA)
- Metallurgy (AREA)
- Inorganic Chemistry (AREA)
- Ceramic Engineering (AREA)
- Structural Engineering (AREA)
- Cleaning Or Drying Semiconductors (AREA)
- Weting (AREA)
- ing And Chemical Polishing (AREA)
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US201461954698P | 2014-03-18 | 2014-03-18 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| SG10201907142VA true SG10201907142VA (en) | 2019-09-27 |
Family
ID=54141496
Family Applications (2)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| SG10201907142VA SG10201907142VA (en) | 2014-03-18 | 2015-03-17 | Etching composition |
| SG11201607700QA SG11201607700QA (en) | 2014-03-18 | 2015-03-17 | Etching composition |
Family Applications After (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| SG11201607700QA SG11201607700QA (en) | 2014-03-18 | 2015-03-17 | Etching composition |
Country Status (9)
| Country | Link |
|---|---|
| US (2) | US10490417B2 (he) |
| EP (1) | EP3119924A4 (he) |
| JP (1) | JP6550123B2 (he) |
| KR (1) | KR102330127B1 (he) |
| CN (2) | CN115044375A (he) |
| IL (1) | IL247843B (he) |
| SG (2) | SG10201907142VA (he) |
| TW (1) | TWI659088B (he) |
| WO (1) | WO2015142778A1 (he) |
Families Citing this family (30)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| SG10201907142VA (en) * | 2014-03-18 | 2019-09-27 | Fujifilm Electronic Materials Usa Inc | Etching composition |
| PL3417043T3 (pl) | 2016-02-18 | 2024-03-25 | Ecolab Usa Inc. | Zastosowanie rozpuszczalnika podczas mycia butelek z wykorzystaniem preparatów na bazie amidyny |
| WO2017155669A1 (en) | 2016-03-11 | 2017-09-14 | Fujifilm Planar Solutions, LLC | Advanced fluid processing methods and systems |
| WO2017208767A1 (ja) * | 2016-06-03 | 2017-12-07 | 富士フイルム株式会社 | 処理液、基板洗浄方法およびレジストの除去方法 |
| KR20180060489A (ko) * | 2016-11-29 | 2018-06-07 | 삼성전자주식회사 | 식각용 조성물 및 이를 이용한 반도체 장치 제조 방법 |
| KR20180068591A (ko) * | 2016-12-14 | 2018-06-22 | 삼성전자주식회사 | 식각용 조성물 및 이를 이용한 반도체 장치 제조 방법 |
| KR102373108B1 (ko) * | 2017-03-16 | 2022-03-10 | 동우 화인켐 주식회사 | 도전막 식각액 조성물 및 이를 이용한 반도체 소자의 제조 방법 |
| CN107359108A (zh) * | 2017-07-27 | 2017-11-17 | 成都海威华芯科技有限公司 | 一种半导体晶圆清洗方法 |
| KR102492733B1 (ko) | 2017-09-29 | 2023-01-27 | 삼성디스플레이 주식회사 | 구리 플라즈마 식각 방법 및 디스플레이 패널 제조 방법 |
| US10889757B2 (en) * | 2017-10-19 | 2021-01-12 | Fujifilm Electronic Materials U.S.A., Inc. | Etching compositions |
| CN107814494A (zh) * | 2017-12-13 | 2018-03-20 | 天津宝兴威科技股份有限公司 | 一种黄光制程用刻蚀液配方 |
| US10934484B2 (en) * | 2018-03-09 | 2021-03-02 | Versum Materials Us, Llc | Etching solution for selectively removing silicon-germanium alloy from a silicon-germanium/ germanium stack during manufacture of a semiconductor device |
| US11499236B2 (en) * | 2018-03-16 | 2022-11-15 | Versum Materials Us, Llc | Etching solution for tungsten word line recess |
| US11111435B2 (en) * | 2018-07-31 | 2021-09-07 | Versum Materials Us, Llc | Tungsten chemical mechanical planarization (CMP) with low dishing and low erosion topography |
| EP3891248A4 (en) | 2018-12-03 | 2022-01-19 | FUJIFILM Electronic Materials U.S.A, Inc. | ENGRAVING COMPOSITIONS |
| CN109666945A (zh) * | 2018-12-25 | 2019-04-23 | 广东富行洗涤剂科技有限公司 | 一种含硅镀层的碱性退镀液及退除方法 |
| JP2022519267A (ja) * | 2019-01-31 | 2022-03-22 | フジフイルム エレクトロニック マテリアルズ ユー．エス．エー．， インコーポレイテッド | エッチング組成物 |
| JP2022530669A (ja) | 2019-05-01 | 2022-06-30 | フジフイルム エレクトロニック マテリアルズ ユー．エス．エー．， インコーポレイテッド | エッチング組成物 |
| US11268025B2 (en) | 2019-06-13 | 2022-03-08 | Fujifilm Electronic Materials U.S.A., Inc. | Etching compositions |
| KR20220016516A (ko) * | 2019-07-05 | 2022-02-09 | 후지필름 가부시키가이샤 | 조성물, 키트, 기판의 처리 방법 |
| JP2022547312A (ja) * | 2019-09-10 | 2022-11-11 | フジフイルム エレクトロニック マテリアルズ ユー．エス．エー．， インコーポレイテッド | エッチング組成物 |
| JP2023507565A (ja) * | 2019-12-20 | 2023-02-24 | バーサム マテリアルズ ユーエス，リミティド ライアビリティ カンパニー | Ｃｏ／ｃｕ選択的ウェットエッチング液 |
| JP7449127B2 (ja) * | 2020-03-11 | 2024-03-13 | 株式会社Ｓｃｒｅｅｎホールディングス | 基板処理液、基板処理方法および基板処理装置 |
| CN111792853B (zh) * | 2020-07-22 | 2022-09-27 | 醴陵旗滨电子玻璃有限公司 | 一种玻璃的加工方法及超薄柔性玻璃 |
| US11728185B2 (en) | 2021-01-05 | 2023-08-15 | Applied Materials, Inc. | Steam-assisted single substrate cleaning process and apparatus |
| US11476124B2 (en) * | 2021-01-05 | 2022-10-18 | Taiwan Semiconductor Manufacturing Company Ltd. | Etchant for etching a cobalt-containing member in a semiconductor structure and method of etching a cobalt-containing member in a semiconductor structure |
| CN113589662B (zh) * | 2021-07-30 | 2022-07-12 | 浙江奥首材料科技有限公司 | 一种组合物、剥离液及其在剥离光刻胶或光刻胶残余物中的应用和剥离方法 |
| CN114989331B (zh) * | 2022-04-20 | 2024-02-02 | 万华化学集团股份有限公司 | 一种聚烯烃溶液螯合脱灰的方法 |
| TW202342700A (zh) * | 2022-04-20 | 2023-11-01 | 日商東京應化工業股份有限公司 | 蝕刻用組成物、使用其之蝕刻方法及電子零件之製造方法 |
| CN115678439B (zh) * | 2022-10-31 | 2024-04-23 | 上海应用技术大学 | 一种抑制铜钴电偶腐蚀的碱性抛光液及其制备方法 |
Family Cites Families (25)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US8092707B2 (en) * | 1997-04-30 | 2012-01-10 | 3M Innovative Properties Company | Compositions and methods for modifying a surface suited for semiconductor fabrication |
| US6099604A (en) * | 1997-08-21 | 2000-08-08 | Micron Technology, Inc. | Slurry with chelating agent for chemical-mechanical polishing of a semiconductor wafer and methods related thereto |
| US6717019B2 (en) | 2002-01-30 | 2004-04-06 | Air Products And Chemicals, Inc. | Glycidyl ether-capped acetylenic diol ethoxylate surfactants |
| US20050056810A1 (en) * | 2003-09-17 | 2005-03-17 | Jinru Bian | Polishing composition for semiconductor wafers |
| US7300480B2 (en) * | 2003-09-25 | 2007-11-27 | Rohm And Haas Electronic Materials Cmp Holdings, Inc. | High-rate barrier polishing composition |
| US7241725B2 (en) * | 2003-09-25 | 2007-07-10 | Rohm And Haas Electronic Materials Cmp Holdings, Inc. | Barrier polishing fluid |
| TWI339780B (en) | 2005-07-28 | 2011-04-01 | Rohm & Haas Elect Mat | Stripper |
| TW200722505A (en) | 2005-09-30 | 2007-06-16 | Rohm & Haas Elect Mat | Stripper |
| KR101444468B1 (ko) * | 2005-10-05 | 2014-10-30 | 어드밴스드 테크놀러지 머티리얼즈, 인코포레이티드 | 에칭후 잔류물을 제거하기 위한 산화성 수성 세정제 |
| US20090301996A1 (en) * | 2005-11-08 | 2009-12-10 | Advanced Technology Materials, Inc. | Formulations for removing cooper-containing post-etch residue from microelectronic devices |
| US20070131899A1 (en) | 2005-12-13 | 2007-06-14 | Jinru Bian | Composition for polishing semiconductor layers |
| ITMI20060258A1 (it) * | 2006-02-13 | 2007-08-14 | Abiogen Pharma Spa | Procedimento per la preparazione di 2-4 idrossi-3-morfolini-2-cicloesenone |
| US20070298611A1 (en) | 2006-06-27 | 2007-12-27 | Jinru Bian | Selective barrier slurry for chemical mechanical polishing |
| JP2008133529A (ja) * | 2006-08-29 | 2008-06-12 | Rohm & Haas Electronic Materials Llc | 剥離方法 |
| US8623236B2 (en) * | 2007-07-13 | 2014-01-07 | Tokyo Ohka Kogyo Co., Ltd. | Titanium nitride-stripping liquid, and method for stripping titanium nitride coating film |
| KR20110127244A (ko) | 2009-03-11 | 2011-11-24 | 후지필름 일렉트로닉 머티리얼스 유.에스.에이., 아이엔씨. | 표면 상의 잔류물을 제거하기 위한 세정 조성물 |
| WO2011094568A2 (en) * | 2010-01-29 | 2011-08-04 | Advanced Technology Materials, Inc. | Cleaning agent for semiconductor provided with metal wiring |
| US20110318928A1 (en) * | 2010-06-24 | 2011-12-29 | Jinru Bian | Polymeric Barrier Removal Polishing Slurry |
| EP2614122A4 (en) * | 2010-09-08 | 2014-01-15 | Basf Se | AQUEOUS CLEANSING COMPOSITIONS WITH N-SUBSTITUTED DIAZENIUM DIOXIDE AND / OR N'-HYDROXY DIAZENIUM OXIDE SALTS |
| WO2012048079A2 (en) | 2010-10-06 | 2012-04-12 | Advanced Technology Materials, Inc. | Composition and process for selectively etching metal nitrides |
| WO2013101907A1 (en) | 2011-12-28 | 2013-07-04 | Advanced Technology Materials, Inc. | Compositions and methods for selectively etching titanium nitride |
| US9070625B2 (en) | 2012-01-04 | 2015-06-30 | International Business Machines Corporation | Selective etch chemistry for gate electrode materials |
| EP2909912B1 (en) | 2012-10-19 | 2022-08-10 | WiTricity Corporation | Foreign object detection in wireless energy transfer systems |
| US9834746B2 (en) | 2013-10-21 | 2017-12-05 | Fujifilm Electronic Materials U.S.A., Inc. | Cleaning formulations for removing residues on surfaces |
| SG10201907142VA (en) * | 2014-03-18 | 2019-09-27 | Fujifilm Electronic Materials Usa Inc | Etching composition |
-
2015
- 2015-03-17 SG SG10201907142VA patent/SG10201907142VA/en unknown
- 2015-03-17 WO PCT/US2015/020863 patent/WO2015142778A1/en active Application Filing
- 2015-03-17 CN CN202210464158.9A patent/CN115044375A/zh active Pending
- 2015-03-17 US US14/659,663 patent/US10490417B2/en active Active
- 2015-03-17 SG SG11201607700QA patent/SG11201607700QA/en unknown
- 2015-03-17 JP JP2017501072A patent/JP6550123B2/ja active Active
- 2015-03-17 CN CN201580017552.6A patent/CN106460196A/zh active Pending
- 2015-03-17 KR KR1020167028792A patent/KR102330127B1/ko active IP Right Grant
- 2015-03-17 EP EP15765751.1A patent/EP3119924A4/en active Pending
- 2015-03-17 TW TW104108477A patent/TWI659088B/zh active
-
2016
- 2016-09-15 IL IL247843A patent/IL247843B/he active IP Right Grant
-
2019
- 2019-09-25 US US16/582,254 patent/US20200020545A1/en not_active Abandoned
Also Published As
| Publication number | Publication date |
|---|---|
| TW201542772A (zh) | 2015-11-16 |
| KR102330127B1 (ko) | 2021-11-23 |
| WO2015142778A1 (en) | 2015-09-24 |
| JP6550123B2 (ja) | 2019-07-24 |
| US20150267112A1 (en) | 2015-09-24 |
| US10490417B2 (en) | 2019-11-26 |
| CN115044375A (zh) | 2022-09-13 |
| JP2017513238A (ja) | 2017-05-25 |
| SG11201607700QA (en) | 2016-10-28 |
| EP3119924A4 (en) | 2017-11-29 |
| KR20160133550A (ko) | 2016-11-22 |
| TWI659088B (zh) | 2019-05-11 |
| US20200020545A1 (en) | 2020-01-16 |
| CN106460196A (zh) | 2017-02-22 |
| IL247843B (he) | 2020-07-30 |
| IL247843A0 (he) | 2016-11-30 |
| EP3119924A1 (en) | 2017-01-25 |
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