SG10201804290UA - Processing method for sector-shaped wafer piece - Google Patents
Processing method for sector-shaped wafer pieceInfo
- Publication number
- SG10201804290UA SG10201804290UA SG10201804290UA SG10201804290UA SG10201804290UA SG 10201804290U A SG10201804290U A SG 10201804290UA SG 10201804290U A SG10201804290U A SG 10201804290UA SG 10201804290U A SG10201804290U A SG 10201804290UA SG 10201804290U A SG10201804290U A SG 10201804290UA
- Authority
- SG
- Singapore
- Prior art keywords
- wafer piece
- processing
- quarter
- patterns
- processing method
- Prior art date
Links
- 238000003672 processing method Methods 0.000 title abstract 4
- 238000003384 imaging method Methods 0.000 abstract 2
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/70—Manufacture or treatment of devices consisting of a plurality of solid state components formed in or on a common substrate or of parts thereof; Manufacture of integrated circuit devices or of parts thereof
- H01L21/77—Manufacture or treatment of devices consisting of a plurality of solid state components or integrated circuits formed in, or on, a common substrate
- H01L21/78—Manufacture or treatment of devices consisting of a plurality of solid state components or integrated circuits formed in, or on, a common substrate with subsequent division of the substrate into plural individual devices
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
- H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67132—Apparatus for placing on an insulating substrate, e.g. tape
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67242—Apparatus for monitoring, sorting or marking
- H01L21/67259—Position monitoring, e.g. misposition detection or presence detection
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/68—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for positioning, orientation or alignment
- H01L21/681—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for positioning, orientation or alignment using optical controlling means
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L21/6835—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support
- H01L21/6836—Wafer tapes, e.g. grinding or dicing support tapes
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L21/6838—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping with gripping and holding devices using a vacuum; Bernoulli devices
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/70—Manufacture or treatment of devices consisting of a plurality of solid state components formed in or on a common substrate or of parts thereof; Manufacture of integrated circuit devices or of parts thereof
- H01L21/71—Manufacture of specific parts of devices defined in group H01L21/70
- H01L21/76—Making of isolation regions between components
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L22/00—Testing or measuring during manufacture or treatment; Reliability measurements, i.e. testing of parts without further processing to modify the parts as such; Structural arrangements therefor
- H01L22/20—Sequence of activities consisting of a plurality of measurements, corrections, marking or sorting steps
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/544—Marks applied to semiconductor devices or parts, e.g. registration marks, alignment structures, wafer maps
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/005—Processes
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67092—Apparatus for mechanical treatment
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2221/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof covered by H01L21/00
- H01L2221/67—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere
- H01L2221/683—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L2221/68304—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support
- H01L2221/68327—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support used during dicing or grinding
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2223/00—Details relating to semiconductor or other solid state devices covered by the group H01L23/00
- H01L2223/544—Marks applied to semiconductor devices or parts
- H01L2223/54426—Marks applied to semiconductor devices or parts for alignment
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2223/00—Details relating to semiconductor or other solid state devices covered by the group H01L23/00
- H01L2223/544—Marks applied to semiconductor devices or parts
- H01L2223/54453—Marks applied to semiconductor devices or parts for use prior to dicing
- H01L2223/5446—Located in scribe lines
Landscapes
- Engineering & Computer Science (AREA)
- Computer Hardware Design (AREA)
- Power Engineering (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Manufacturing & Machinery (AREA)
- General Physics & Mathematics (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- Dicing (AREA)
- Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
- Laser Beam Processing (AREA)
- Mechanical Treatment Of Semiconductor (AREA)
- Processing Of Stones Or Stones Resemblance Materials (AREA)
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2017108969A JP6896337B2 (ja) | 2017-06-01 | 2017-06-01 | 扇状ウェーハ片の加工方法 |
Publications (1)
Publication Number | Publication Date |
---|---|
SG10201804290UA true SG10201804290UA (en) | 2019-01-30 |
Family
ID=64460713
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
SG10201804290UA SG10201804290UA (en) | 2017-06-01 | 2018-05-21 | Processing method for sector-shaped wafer piece |
Country Status (7)
Country | Link |
---|---|
US (1) | US10424512B2 (zh) |
JP (1) | JP6896337B2 (zh) |
KR (1) | KR102457882B1 (zh) |
CN (1) | CN108987340B (zh) |
MY (1) | MY190519A (zh) |
SG (1) | SG10201804290UA (zh) |
TW (1) | TWI754742B (zh) |
Families Citing this family (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP6908464B2 (ja) * | 2016-09-15 | 2021-07-28 | 株式会社荏原製作所 | 基板加工方法および基板加工装置 |
Family Cites Families (8)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH09148275A (ja) * | 1995-11-17 | 1997-06-06 | Disco Abrasive Syst Ltd | 大口径ウェーハのダイシングシステム |
JP4451970B2 (ja) | 2000-07-27 | 2010-04-14 | 株式会社ディスコ | 被加工物輪郭認識装置を含むダイシング機 |
JP2008060164A (ja) * | 2006-08-29 | 2008-03-13 | Disco Abrasive Syst Ltd | ウエーハのレーザー加工方法 |
JP6066673B2 (ja) * | 2012-11-05 | 2017-01-25 | 株式会社ディスコ | ウエーハの加工方法 |
JP2014093444A (ja) * | 2012-11-05 | 2014-05-19 | Disco Abrasive Syst Ltd | ウエーハの加工方法 |
JP6066672B2 (ja) * | 2012-11-05 | 2017-01-25 | 株式会社ディスコ | ウエーハの加工方法 |
JP2015103674A (ja) * | 2013-11-25 | 2015-06-04 | 豊田合成株式会社 | Iii族窒化物半導体発光素子の製造方法 |
JP6716263B2 (ja) * | 2016-01-22 | 2020-07-01 | 株式会社ディスコ | ウエーハの加工方法 |
-
2017
- 2017-06-01 JP JP2017108969A patent/JP6896337B2/ja active Active
-
2018
- 2018-04-26 TW TW107114209A patent/TWI754742B/zh active
- 2018-05-21 SG SG10201804290UA patent/SG10201804290UA/en unknown
- 2018-05-21 MY MYPI2018701956A patent/MY190519A/en unknown
- 2018-05-24 KR KR1020180058889A patent/KR102457882B1/ko active IP Right Grant
- 2018-05-30 CN CN201810537138.3A patent/CN108987340B/zh active Active
- 2018-05-31 US US15/994,661 patent/US10424512B2/en active Active
Also Published As
Publication number | Publication date |
---|---|
KR102457882B1 (ko) | 2022-10-21 |
KR20180131970A (ko) | 2018-12-11 |
TWI754742B (zh) | 2022-02-11 |
JP2018206882A (ja) | 2018-12-27 |
US10424512B2 (en) | 2019-09-24 |
CN108987340B (zh) | 2023-11-14 |
US20180350681A1 (en) | 2018-12-06 |
TW201903865A (zh) | 2019-01-16 |
CN108987340A (zh) | 2018-12-11 |
JP6896337B2 (ja) | 2021-06-30 |
MY190519A (en) | 2022-04-26 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
LT3311947T (lt) | Skaidrių ruošinių lazerinio apdirbimo, naudojant spindulių pluošto dėmes be simetrijos ašių, būdas | |
WO2017081029A3 (de) | Automatisches detektieren und robotergestütztes bearbeiten von oberflächendefekten | |
MY189802A (en) | Laser processing apparatus | |
MX2018001284A (es) | Navegacion robotica utilizando mapeo semantico. | |
WO2015073391A3 (en) | Laser processing of a bed of powdered material with variable masking | |
EP4233775A3 (en) | Methods and devices for table pose tracking using fiducial markers | |
WO2017024322A3 (en) | Methods of forming and methods of repairing earth-boring tools | |
MX2016007441A (es) | Dispositivo de produccion generativa y procedimiento para el funcionamiento del mismo. | |
MX371461B (es) | Programa de cálculo de ruta, aparato de procesamiento, método de cálculo de ruta, herramienta, y artículo procesado. | |
CN105149419B (zh) | Ccd多点微孔重复定位加工系统和方法 | |
MX2016012387A (es) | Sistema de medicion tridimensional para linea marcada para adherir suela a la parte superior y metodo de medicion tridimensional para el mismo. | |
MX2018015894A (es) | Maquina herramienta, metodo de fabricacion de objeto maquinado y sistema de maquinacion. | |
FR3052380B1 (fr) | Procede et machine de fabrication de pieces par la technique des procedes additifs par voie pateuse | |
MX364492B (es) | Método y sistema para ajustar el patrón de luz para formación de imágenes de luz estructurada. | |
SG10201803285XA (en) | Plasma processing apparatus | |
SG10201804290UA (en) | Processing method for sector-shaped wafer piece | |
PH12019500621A1 (en) | Operation object processing method and apparatus | |
SG11202100609UA (en) | Systems and methods for workpiece processing using neutral atom beams | |
MY192114A (en) | Sheet material forming | |
MX365395B (es) | Análisis de huella por compensación para seleccionar líneas candidatas para prospección sísmica. | |
MX2020013102A (es) | Metodo para la localizacion automatica de posiciones de una pluralidad de sensores inalambricos en un vehiculo y un aparato para lo mismo. | |
SG11202109959TA (en) | Multi-station semiconductor processing with independently adjustable pedestals | |
EP3098675A3 (en) | System and method for automated part inspection | |
ITUA20163092A1 (it) | Procedimento e impianto per la lavorazione di formaggi a base di pasta filata e relativa macchina formatrice. | |
MX2016012534A (es) | Metodo mejorado implementado por computadora para definir los puntos de desarrollo de elementos de soporte de un objeto realizado por medio de un proceso estereolitografico. |