CN108987340A - 扇状晶片的加工方法 - Google Patents
扇状晶片的加工方法 Download PDFInfo
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Abstract
提供扇状晶片的加工方法,能够有效加工大口径晶片,该方法按与将晶片分割成4等分的1/4晶片的形状相适的加工进给量来进行加工,包含:信息收集步骤,在将按规定的朝向定位了晶体取向的1/4晶片保持在卡盘工作台的保持面上时,对外周的圆弧位置不同的1/4晶片的4个图案的形状和与4个图案的形状对应的加工进给量的信息进行收集;图案选择步骤,将按规定的朝向定位了晶体取向的1/4晶片保持在卡盘工作台的保持面上,计算将1/4晶片的两个边作为纵横边的正方形的区域,通过摄像单元对各边进行拍摄而搜索有无目标图案,根据有无目标图案来选择符合4个图案中的哪个图案;加工步骤,对所保持的1/4晶片按与所选择的图案对应的加工进给量沿着分割预定线进行加工。
Description
技术领域
本发明涉及将半导体晶片、光器件晶片等晶片分割成4等分的扇状晶片的加工方法。
背景技术
正面形成有多个半导体器件的硅晶片、形成有LED等多个光器件的蓝宝石晶片、SiC晶片等晶片形成为圆板状。
各器件由互相垂直的多条分割预定线(间隔道)划分而成,沿着分割预定线利用切削刀具进行切削(切削装置),或者利用激光束通过烧蚀加工或内部加工而形成改质层(激光加工装置),将晶片分割成各个器件芯片。
近年来,因器件芯片的小型化和晶片的大口径化而存在每张晶片的加工时间变长的趋势。因此,例如有时选择如下工序:将1张晶片分割成4等分,通过不同的加工装置对各个部分进行加工。在该情况下,由于能够连续地将芯片传向下一道工序,因此具有使工序整体有效地进行的效果。
专利文献1:日本特开2002-39725号公报
但是,存在如下问题:在切割将1张晶片进行4等分而得的1/4晶片(扇状晶片)的情况下,当不是与1/4晶片的形状对应的加工进给量时,无法缩短加工时间。
发明内容
本发明是鉴于这样的问题点而完成的,其目的在于,提供能够有效地对大口径晶片进行加工的晶片的加工方法。
根据本发明,提供扇状晶片的加工方法,在沿着分割预定线对扇状的1/4晶片进行加工时,按照与该1/4晶片的形状相适的加工进给量来进行加工,该扇状的1/4晶片是将圆板状的晶片沿着该分割预定线分割成4等分而得的,该圆板状的晶片在由互相垂直的多条该分割预定线划分出的正面的各个区域中分别形成有器件,并且在外周具有表示晶体取向的凹口,该扇状晶片的加工方法的特征在于,具有如下的步骤:信息收集步骤,在将按照规定的朝向定位了该晶体取向的该1/4晶片保持在卡盘工作台的保持面上的情况下,对外周的圆弧位置不同的该1/4晶片的4个图案的形状和与该4个图案的形状对应的加工进给量的信息进行收集;晶片单元形成步骤,将该1/4晶片的背面粘贴在外周部安装于环状框架的划片带上而形成晶片单元;保持步骤,在实施了该晶片单元形成步骤之后,将该晶片单元的该1/4晶片隔着划片带吸引保持在加工装置的卡盘工作台上;对准步骤,在实施了该保持步骤之后,通过该加工装置的摄像单元对该1/4晶片进行拍摄,根据形成在该器件上的目标图案使在第1方向上延伸的该分割预定线排列在加工进给方向上;图案选择步骤,在实施了该对准步骤之后,选择保持在该卡盘工作台上的该1/4晶片符合该4个图案中的哪个图案;以及加工步骤,在实施了该图案选择步骤之后,对保持在该卡盘工作台上的该1/4晶片按照与该选择的图案对应的该加工进给量沿着该分割预定线进行加工。
优选该图案选择步骤包含如下的步骤:目标图案检测步骤,计算将该1/4晶片的两个边作为纵边和横边的正方形的区域,通过该摄像单元在该正方形的4个边的各边的中央对该器件中的目标图案进行搜索,从该1/4晶片的两个边检测出该目标图案;以及选择步骤,根据检测出该目标图案的边的位置,选择该1/4晶片在被分割成4等分之前的XY垂直坐标系中符合晶片的第1象限、第2象限、第3象限、第4象限中的哪个象限。
根据本发明的加工方法,起到了如下效果:不需要形状识别用的识别大区域的专用的装置,能够通过检测目标图案来推断1/4晶片的朝向,能够自动地使加工进给量最优化。
附图说明
图1是切削装置的立体图。
图2的(A)~(D)是示出1/4晶片的4个图案的晶片单元的俯视图。
图3是示意性地示出加工进给量的晶片单元的俯视图。
图4是对图案选择步骤进行说明的晶片单元的俯视图。
标号说明
2:切削装置;10:卡盘工作台;11A~11D:1/4晶片;13:分割预定线;14:切削单元;15:器件;17:凹口;21A~21D:晶片单元;23a、23b:加工进给量;25:虚拟正方形;27a、27b:边;27c、27d:虚拟正方形的边;29:目标图案搜索区域;38:摄像单元。
具体实施方式
以下,参照附图对本发明的实施方式进行详细地说明。参照图1,示出了本发明的实施方式的切削装置的立体图。切削装置2具有支承基台4,在支承基台4的上表面形成有在X轴方向(加工进给方向)上较长的矩形状的开口4a。
在该开口4a内设置有X轴移动工作台6、使该X轴移动工作台6在X轴方向上移动的X轴移动机构(未图示)以及覆盖X轴移动机构的防尘防滴罩8。该X轴移动机构具有与X轴方向平行的一对X轴导轨(未图示),在X轴导轨上以能够滑动方式安装有X轴移动工作台6。
在X轴移动工作台6的下表面侧设置有螺母部(未图示),与X轴导轨平行的X轴滚珠丝杠(未图示)与该螺母部螺合。在X轴滚珠丝杠的一端部连结有X轴脉冲电动机(未图示)。当利用X轴脉冲电动机使X轴滚珠丝杠旋转时,移动工作台6沿着X轴导轨在X轴方向上移动。
在X轴移动工作台6上设置有用于吸引、保持被加工物的卡盘工作台10。卡盘工作台10与电动机等旋转驱动源(未图示)连结,绕与Z轴方向(铅直方向)大致平行的旋转轴进行旋转。另外,卡盘工作台10通过上述的X轴移动机构在X轴方向上进行加工进给。
卡盘工作台10的正面(上表面)是对被加工物进行吸引、保持的保持面10a。该保持面10a通过形成于卡盘工作台10的内部的流路(未图示)与吸引源(未图示)连接。在卡盘工作台10的周围设置有用于固定被加工物的夹具10b。
被加工物例如是半导体晶片,其粘贴在保持于环状框架的带上,与环状框架一体地进行处理。当使用环状框架和带对被加工物进行处理时,能够保护该被加工物免受搬运时产生的冲击等。此外,当对该带进行扩展时,能够对切削加工后的被加工物进行分割或扩大分割后的芯片的间隔。另外,也可以不使用环状框架和带,以单体的形式对被加工物进行切削加工。
在装置基台4的与开口4a分开的前方的角部设置有从装置基台4向侧方突出的突出部12。在突出部12的内部形成有空间,在该空间中设置有可升降的盒升降器16。在盒升降器16的上表面载置有能够收纳多个被加工物的盒18。
在接近开口4a的位置设置有将上述的被加工物向卡盘工作台10搬运的搬运单元(未图示)。被搬运单元从盒18取出的被加工物被载置在卡盘工作台10的保持面10a上。
在装置基台4的上表面上以向开口4a的上方伸出的方式配置有支承构造20,该支承构造20对切削被加工物的切削单元14进行支承。在支承构造20的前表面上部设置有切削单元移动机构22,该切削单元移动机构22使切削单元14在Y轴方向(分度进给方向)和Z轴方向上移动。
切削单元移动机构22具有配置于支承构造20的前表面并且与Y轴方向平行的一对Y轴导轨24。在Y轴导轨24上以能够滑动的方式安装有构成切削单元移动机构22的Y轴移动板26。在Y轴移动板26的背面侧(后表面侧)设置有螺母部(未图示),与Y轴导轨24平行的Y轴滚珠丝杠28与该螺母部螺合。
在Y轴滚珠丝杠28的一端部连结有Y轴脉冲电动机(未图示)。当通过Y轴脉冲电动机使Y轴滚珠丝杠28旋转时,Y轴移动板26沿着Y轴导轨24在Y轴方向上移动。
在Y轴移动板26的正面(前表面)上设置有与Z轴方向平行的一对Z轴导轨30。在Z轴导轨30上以能够滑动的方式安装有Z轴移动板32。
在Z轴移动板32的背面侧(后表面侧)设置有螺母部(未图示),与Z轴导轨30平行的Z轴滚珠丝杠34与该螺母部螺合。在Z轴滚珠丝杠34的一端部连结有Z轴脉冲电动机36。如果通过Z轴脉冲电动机36使Z轴滚珠丝杠34旋转,则Z轴移动板32沿着Z轴导轨30在Z轴方向上移动。
在Z轴移动板32的下部固定有摄像单元38和对被加工物进行加工的切削单元14。如果通过切削单元移动机构22使Y轴移动板26在Y轴方向上移动,则切削单元14和摄像单元38被分度进给,如果使Z轴移动板32在Z轴方向上移动,则切削单元14和摄像单元38进行升降。
40是清洗单元,被切削单元14实施了切削加工的被加工物被搬运机构(未图示)从卡盘工作台10搬运到清洗单元40。清洗单元40具有旋转工作台42,该旋转工作台42将被加工物吸引保持在筒状的清洗空间内。在旋转工作台42的下部连结有使旋转工作台42以规定的速度进行旋转的电动机等旋转驱动源。
在旋转工作台42的上方配设有喷射喷嘴44,该喷射喷嘴44朝向被加工物喷射清洗用的流体(具有代表性的是将水和空气混合后的双流体)。当一边使保持着被加工物的旋转工作台42旋转一边从喷射喷嘴44喷射清洗用的流体时,能够对切削加工后的被加工物进行清洗。被清洗单元40清洗后的被加工物通过搬运机构(未图示)收纳在盒18内。
在本发明的实施方式的扇状晶片的加工方法中,首先,使用图1所示的切削装置2将圆板状的晶片分割成4等分。众所周知,在晶片的正面上在由互相垂直的多条分割线划分出的各区域中分别形成有器件,在晶片的外周形成有表示晶片的晶体取向的凹口。
当将晶片分割成4等分时,晶片在XY直角坐标系中被分割成第1象限的晶片11A、第2象限的晶片11B、第3象限的晶片11C以及第4象限的晶片11D。
参照图2,示出了将分割成4份后的扇状晶片的背面粘贴在外周部安装于环状框架F的划片带T上而得的晶片单元21A、21B、21C、21D的俯视图。
图2的(A)是将第1象限的1/4晶片11A借助划片带T支承于环状框架F而得的晶片单元21A的俯视图,图2的(B)是将第2象限的1/4晶片11B支承于环状框架F而得的晶片单元21B的俯视图。
图2的(C)是将第3象限的1/4晶片11C支承于环状框架F而得的晶片单元21C的俯视图,图2的(D)是将第4象限的1/4晶片11D支承于环状框架F而得的晶片单元21D的俯视图。
如图2所示,1/4晶片11A~11D有4个图案,在图示的实施方式中,第3象限的1/4晶片11C和第4象限的1/4晶片11D具有在凹口17部分被分割的凹口17的碎片。
在本发明的实施方式的扇状晶片的加工方法中,实施如下的信息收集步骤:在将按照规定的朝向定位了晶体取向的1/4晶片11A~11D保持在卡盘工作台10的保持面10a上的情况下,对外周的圆弧的位置不同的1/4晶片(扇状晶片)的4个图案的形状和与该4个图案的形状对应的加工进给量的信息进行收集。
在将晶片的晶体取向按照规定的朝向定位的状态下实施该信息收集步骤是因为摄像单元38对形成在器件15上的目标图案进行检测的检测精度被限定在离晶体取向10°左右,因此,需要形成图2所示那样的将1/4晶片的4个图案的形状11A~11D在分割成4份的状态下借助划片带T支承于环状框架F的4种晶片单元21A~21D。
在1/4晶片11A~11D的加工开始之前,该信息收集步骤预先进行收集并将信息储存于加工装置的控制器的存储器中。参照图3对预先收集的加工进给量进行说明。
晶片单元21A是将第1象限的1/4晶片11A借助划片带T支承于环状框架F而得的晶片单元,对在1/4晶片11A的第1方向上延伸的分割预定线13进行加工时的加工量23a被设定成随着在Y轴方向上行进而沿着圆弧逐渐减小,将该设定的加工量23a的值储存于控制器的存储器。
对在第2方向上延伸的分割预定线13进行加工时的加工量也被假设为将卡盘工作台10绕逆时针方向旋转90°而进行加工,将在第2方向上延伸的分割预定线13的加工量23b设定成随着在分度进给方向上行进而沿着圆弧逐渐减小,将该加工量23b的信息储存于控制器的存储器。
关于第2象限的1/4晶片11B、第3象限的1/4晶片11C以及第4象限的1/4晶片11D,也将与1/4晶片的形状对应的加工进给量的信息储存于控制器的存储器。
在以下的说明中,主要对将第1象限的1/4晶片11A借助划片带T支承于环状框架F的方式的晶片单元21A进行说明。在本实施方式的扇状晶片的加工方法中,在实施了晶片单元形成步骤和信息收集步骤之后,实施如下的保持步骤:将晶片单元21A的1/4晶片11A隔着划片带T吸引保持在切削装置2的卡盘工作台10上。
在以这种方式将1/4晶片11A隔着划片带T吸引保持在卡盘工作台10上的状态下,实施如下的对准步骤:通过切削装置2的摄像单元38对1/4晶片11A进行拍摄,根据形成在各器件15上的目标图案使在第1方向上延伸的分割预定线13排列在加工进给方向(X轴方向)上。
在该对准步骤中,使卡盘工作台10旋转θ度以使得将在X轴方向上分离的器件15中的目标图案连接起来的直线与X轴方向平行,使切削单元14按照相邻的分割预定线的中心与目标图案之间的距离在Y轴方向上移动,将待切削的分割预定线13与切削单元14的切削刀具排列在X轴方向上。
在实施了对准步骤之后,实施如下的图案选择步骤:选择所保持的1/4晶片符合4个图案中的哪个图案。如图4所示,在该图案选择步骤中,计算包含1/4晶片11A的垂直的两个边27a、27b在内的正方形25。
边27c和27d是虚拟地描绘出的正方形25的其他的两个边。在以这种方式虚拟地计算出正方形25之后,在各边27a~27d的大致中央部分设定目标图案搜索区域29。
通过摄像单元38对设定于各边27a~27d的目标图案搜索区域29进行拍摄,确认有无目标图案。在边27a和27b的目标图案搜索区域29中,确认为具有设定于器件15的目标图案。
另一方面,在设定于虚拟的边27c、27d的目标图案搜索区域29中,由于在该目标图案搜索区域29中不存在器件,因此检测为没有目标图案。根据该检测结果,图4所示的1/4晶片11A被选择为第1象限的晶片11A(图案选择步骤)。
关于第2象限的1/4晶片11B、第3象限的1/4晶片11C以及第4象限的1/4晶片11D,也通过同样的方法来选择图案。在图4中箭头X1表示加工进给方向,箭头Y1表示分度进给方向。
即,图案选择步骤包含如下的步骤:目标图案检测步骤,计算将1/4晶片的两个边作为纵边和横边的正方形25的区域,通过该摄像单元38在正方形25的4个边27a~27d的大致中央部分对器件中的目标图案进行搜索,从1/4晶片的两个边检测出目标图案;以及选择步骤,根据检测出目标图案的边的位置,选择1/4晶片在被分割成4等分之前的晶片的XY垂直坐标系中符合晶片的第1象限、第2象限、第3象限、第4象限中的哪个象限。
在实施了图案选择步骤之后,实施如下的加工步骤:通过切削单元14的切削刀具对保持在卡盘工作台10上的1/4晶片按照与所选择的图案对应的加工进给量沿着分割预定线13进行切削。
在该加工步骤中,由于与4个图案的形状对应的加工进给量的信息预先在信息收集步骤中被储存于控制器的存储器,因此能够自动地对加工进给量进行最优化,能够实施高效的加工。
在上述实施方式中,通过切削装置2的切削刀具对1/4晶片(扇状晶片)11A~11D进行切削,但也可以代替切削装置2而采用激光加工装置,沿着分割预定线13照射激光束而实施烧蚀加工或者实施在晶片内部形成改质层的内部加工。
Claims (4)
1.一种扇状晶片的加工方法,在沿着分割预定线对扇状的1/4晶片进行加工时,按照与该1/4晶片的形状相适的加工进给量来进行加工,该扇状的1/4晶片是将圆板状的晶片沿着该分割预定线分割成4等分而得的,该圆板状的晶片在由互相垂直的多条该分割预定线划分出的正面的各个区域中分别形成有器件,并且在外周具有表示晶体取向的凹口,该扇状晶片的加工方法的特征在于,具有如下的步骤:
信息收集步骤,在将按照规定的朝向定位了该晶体取向的该1/4晶片保持在卡盘工作台的保持面上的情况下,对外周的圆弧位置不同的该1/4晶片的4个图案的形状和与该4个图案的形状对应的加工进给量的信息进行收集;
晶片单元形成步骤,将该1/4晶片的背面粘贴在外周部安装于环状框架的划片带上而形成晶片单元;
保持步骤,在实施了该晶片单元形成步骤之后,将该晶片单元的该1/4晶片隔着划片带吸引保持在加工装置的卡盘工作台上;
对准步骤,在实施了该保持步骤之后,通过该加工装置的摄像单元对该1/4晶片进行拍摄,根据形成在该器件上的目标图案使在第1方向上延伸的该分割预定线排列在加工进给方向上;
图案选择步骤,在实施了该对准步骤之后,选择保持在该卡盘工作台上的该1/4晶片符合该4个图案中的哪个图案;以及
加工步骤,在实施了该图案选择步骤之后,对保持在该卡盘工作台上的该1/4晶片按照与该选择的图案对应的该加工进给量沿着该分割预定线进行加工。
2.根据权利要求1所述的扇状晶片的加工方法,其中,
该图案选择步骤包含如下的步骤:
目标图案检测步骤,计算将该1/4晶片的两个边作为纵边和横边的正方形的区域,通过该摄像单元在该正方形的4个边的各边的中央对该器件中的目标图案进行搜索,从该1/4晶片的两个边检测出该目标图案;以及
选择步骤,根据检测出该目标图案的边的位置,选择该1/4晶片在被分割成4等分之前的XY垂直坐标系中符合晶片的第1象限、第2象限、第3象限、第4象限中的哪个象限。
3.根据权利要求1所述的扇状晶片的加工方法,其中,
在该加工步骤中,通过切削装置的切削刀具来切削该分割预定线。
4.根据权利要求1所述的扇状晶片的加工方法,其中,
在该加工步骤中,沿着该分割预定线照射激光束而进行加工。
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