SE7506884L - Sett att framstella en komposition innehallande kisel-syre-kolbindningar - Google Patents
Sett att framstella en komposition innehallande kisel-syre-kolbindningarInfo
- Publication number
- SE7506884L SE7506884L SE7506884A SE7506884A SE7506884L SE 7506884 L SE7506884 L SE 7506884L SE 7506884 A SE7506884 A SE 7506884A SE 7506884 A SE7506884 A SE 7506884A SE 7506884 L SE7506884 L SE 7506884L
- Authority
- SE
- Sweden
- Prior art keywords
- preparing
- acid
- composition containing
- carbon bonds
- silic
- Prior art date
Links
Classifications
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
- C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
- C08G59/68—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the catalysts used
- C08G59/70—Chelates
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
- C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
- C08G59/40—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the curing agents used
- C08G59/4007—Curing agents not provided for by the groups C08G59/42 - C08G59/66
- C08G59/4085—Curing agents not provided for by the groups C08G59/42 - C08G59/66 silicon containing compounds
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
- C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
- C08G59/68—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the catalysts used
- C08G59/681—Metal alcoholates, phenolates or carboxylates
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K5/00—Use of organic ingredients
- C08K5/04—Oxygen-containing compounds
- C08K5/05—Alcohols; Metal alcoholates
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K5/00—Use of organic ingredients
- C08K5/04—Oxygen-containing compounds
- C08K5/09—Carboxylic acids; Metal salts thereof; Anhydrides thereof
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K5/00—Use of organic ingredients
- C08K5/04—Oxygen-containing compounds
- C08K5/10—Esters; Ether-esters
- C08K5/11—Esters; Ether-esters of acyclic polycarboxylic acids
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K5/00—Use of organic ingredients
- C08K5/54—Silicon-containing compounds
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L63/00—Compositions of epoxy resins; Compositions of derivatives of epoxy resins
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L83/00—Compositions of macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon only; Compositions of derivatives of such polymers
- C08L83/04—Polysiloxanes
Landscapes
- Chemical & Material Sciences (AREA)
- Health & Medical Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Medicinal Chemistry (AREA)
- Polymers & Plastics (AREA)
- Organic Chemistry (AREA)
- Compositions Of Macromolecular Compounds (AREA)
- Epoxy Resins (AREA)
- Silicon Polymers (AREA)
- Polyethers (AREA)
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US05/567,148 US3971747A (en) | 1975-04-11 | 1975-04-11 | Curable compositions |
Publications (1)
Publication Number | Publication Date |
---|---|
SE7506884L true SE7506884L (sv) | 1976-10-12 |
Family
ID=24265915
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
SE7506884A SE7506884L (sv) | 1975-04-11 | 1975-06-16 | Sett att framstella en komposition innehallande kisel-syre-kolbindningar |
Country Status (8)
Country | Link |
---|---|
US (1) | US3971747A (xx) |
JP (2) | JPS6043371B2 (xx) |
BE (1) | BE831761A (xx) |
DE (1) | DE2529116A1 (xx) |
FR (1) | FR2307016A1 (xx) |
IT (1) | IT1039312B (xx) |
NL (1) | NL7507672A (xx) |
SE (1) | SE7506884L (xx) |
Families Citing this family (48)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US4125510A (en) * | 1977-03-01 | 1978-11-14 | Dow Corning Corporation | Method of improving crack resistance of siloxane molding compositions |
JPS53111336A (en) * | 1977-03-11 | 1978-09-28 | Toray Ind Inc | Coating composition |
EP0003760B1 (en) * | 1978-02-02 | 1982-09-15 | E.I. Du Pont De Nemours And Company | Article suitable for use as bakeware with multi-layer nonstick coating |
US4202811A (en) * | 1978-06-21 | 1980-05-13 | Dow Corning Corporation | Siloxane-epoxy molding compound with improved crack resistance |
JPS5817537B2 (ja) * | 1979-06-25 | 1983-04-07 | 株式会社東芝 | エポキシ樹脂系組成物 |
CH652731A5 (en) * | 1979-06-21 | 1985-11-29 | Tokyo Shibaura Electric Co | Epoxy resin-based compositions |
JPS5817536B2 (ja) * | 1979-06-21 | 1983-04-07 | 株式会社東芝 | エポキシ樹脂系組成物 |
US4335367A (en) * | 1979-08-17 | 1982-06-15 | Tokyo Shibaura Denki Kabushiki Kaisha | Electrically insulated coil |
JPS5681906A (en) * | 1979-12-07 | 1981-07-04 | Toshiba Corp | Heat resisting electrical insulated coil |
JPS588701B2 (ja) * | 1980-04-03 | 1983-02-17 | 株式会社東芝 | エポキシ系樹脂組成物 |
US4332923A (en) * | 1980-10-23 | 1982-06-01 | Dow Corning Corporation | Composition for coating heat sensitive substrates |
JPS57501730A (xx) * | 1980-11-10 | 1982-09-24 | ||
US4359566A (en) * | 1981-01-15 | 1982-11-16 | Dow Corning Corporation | Silicone-epoxy coating compositions |
US4576999A (en) * | 1982-05-06 | 1986-03-18 | General Electric Company | Ultraviolet radiation-curable silicone release compositions with epoxy and/or acrylic functionality |
JPS59135217A (ja) * | 1982-12-21 | 1984-08-03 | Nippon Debukon Kk | 耐熱性グラウト材の製造法 |
JPS6018520A (ja) * | 1983-07-12 | 1985-01-30 | Shin Etsu Chem Co Ltd | 高透明エポキシ樹脂組成物の製造方法 |
JPS6076536A (ja) * | 1983-08-08 | 1985-05-01 | ゼネラル・エレクトリツク・カンパニイ | アルコキシ終端ポリジオルガノシロキサンの製造方法 |
JPS6071631A (ja) * | 1983-09-29 | 1985-04-23 | Toshiba Corp | 光硬化性組成物 |
JPS6086119A (ja) * | 1983-10-17 | 1985-05-15 | Hitachi Chem Co Ltd | 難燃性シリコ−ン変性エポキシ樹脂の製造方法 |
US4518631A (en) * | 1983-11-14 | 1985-05-21 | Dow Corning Corporation | Thixotropic curable coating compositions |
US4816496A (en) * | 1984-06-26 | 1989-03-28 | Kabushiki Kaisha Toshiba | Photocurable composition |
JPS60221702A (ja) * | 1985-01-23 | 1985-11-06 | Toray Ind Inc | 透明被覆層を有する成形体 |
JPS61189286A (ja) * | 1985-02-15 | 1986-08-22 | Shin Etsu Chem Co Ltd | 有機けい素化合物 |
US4623694A (en) | 1985-11-18 | 1986-11-18 | Dow Corning Corporation | Curable organosiloxane compositions containing an emulsified epoxide compound and elastomeric materials prepared therefrom |
JPH0737709B2 (ja) * | 1985-12-25 | 1995-04-26 | カンボウプラス株式会社 | 耐熱性シ−ト |
EP0279513A3 (en) * | 1987-02-14 | 1990-10-10 | Dow Corning Limited | Siloxane-polyester compositions |
DE3825678A1 (de) * | 1988-07-28 | 1990-02-01 | Wacker Chemie Gmbh | Reinigungs- und/oder konditioniermittel fuer glaskeramikoberflaechen, enthaltend organopolysiloxane |
JP2791438B2 (ja) * | 1988-09-09 | 1998-08-27 | 関西ペイント株式会社 | 樹脂組成物及びその硬化方法 |
US5523374A (en) * | 1992-12-03 | 1996-06-04 | Hercules Incorporated | Curable and cured organosilicon compositions |
JP3011617B2 (ja) * | 1994-08-11 | 2000-02-21 | 信越化学工業株式会社 | シリコーン−エポキシ樹脂組成物 |
DE19638630B4 (de) * | 1996-09-20 | 2004-11-18 | Siemens Ag | UV- und thermisch härtbare Gießharzformulierung und ihre Verwendung zum Unterfüllprozeß bei elektrischen und elektronischen Bauelementen |
US6465550B1 (en) | 2000-08-08 | 2002-10-15 | Dow Corning Corporation | Silicone composition and electrically conductive, cured silicone product |
TWI275189B (en) * | 2003-12-30 | 2007-03-01 | Osram Opto Semiconductors Gmbh | Radiation-emitting and/or radiation-receiving semiconductor component and method for producing such component |
US7834121B2 (en) * | 2004-09-15 | 2010-11-16 | Ppg Industries Ohio, Inc. | Silicone resin containing coating compositions, related coated substrates and methods |
JP4630032B2 (ja) * | 2004-10-04 | 2011-02-09 | 東レ・ダウコーニング株式会社 | ポリオルガノシロキサン及びそれを含む硬化性シリコーン組成物並びにその用途 |
US7329715B2 (en) * | 2005-04-18 | 2008-02-12 | Yazaki Corporation | Abrasion resistant coatings by siloxane oligomers |
DE102005041064B4 (de) * | 2005-08-30 | 2023-01-19 | OSRAM Opto Semiconductors Gesellschaft mit beschränkter Haftung | Oberflächenmontierbares optoelektronisches Bauelement und Verfahren zu dessen Herstellung |
US7915457B2 (en) * | 2005-09-26 | 2011-03-29 | Symrise Gmbh & Co. Kg | Intramolecular Prins reaction and catalysts suitable therefor |
JP4985920B2 (ja) * | 2006-06-16 | 2012-07-25 | Jsr株式会社 | 熱硬化性樹脂組成物および光半導体用接着剤 |
JP5177809B2 (ja) * | 2007-07-02 | 2013-04-10 | 日東化成株式会社 | 有機重合体用硬化触媒及びそれを含有する湿気硬化型組成物 |
WO2009004986A1 (ja) * | 2007-07-02 | 2009-01-08 | Nitto Kasei Co., Ltd. | 有機重合体用硬化触媒及びそれを含有する湿気硬化型組成物 |
JP5354511B2 (ja) * | 2007-07-12 | 2013-11-27 | 日東化成株式会社 | 有機重合体用硬化触媒およびそれを含有する湿気硬化型有機重合体組成物 |
JP5354143B2 (ja) * | 2007-07-12 | 2013-11-27 | 日東化成株式会社 | 有機重合体用硬化触媒及びそれを含有する湿気硬化型組成物 |
CN102027057A (zh) * | 2008-05-14 | 2011-04-20 | 汉高有限公司 | 可固化组合物及其应用 |
JP5099911B2 (ja) * | 2008-09-11 | 2012-12-19 | 日東電工株式会社 | 熱硬化性組成物及び光半導体装置 |
JP5170765B2 (ja) * | 2008-09-22 | 2013-03-27 | 日東電工株式会社 | 熱硬化性組成物及び光半導体装置 |
DE102009046254A1 (de) * | 2009-10-30 | 2011-05-19 | Wacker Chemie Ag | Verfahren zur Herstellung von (Hydroxymethyl)polysiloxanen |
DE102012022731A1 (de) * | 2012-11-21 | 2014-05-22 | Epg (Engineered Nanoproducts Germany) Ag | Hochabriebfeste Antikalkschichten mit hoher chemischer Beständigkeit |
Family Cites Families (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US3205197A (en) * | 1965-09-07 | Curing of organopolysiloxanes | ||
US3154597A (en) * | 1955-09-16 | 1964-10-27 | Devoe & Raynolds Co | Siloxane modified epoxide resins |
AU4608972A (en) * | 1971-09-16 | 1974-03-07 | Ciba-Geigy Ag | New polyepoxide-polysiloxane compounds processes for their manufacture and their use |
-
1975
- 1975-04-11 US US05/567,148 patent/US3971747A/en not_active Expired - Lifetime
- 1975-06-16 SE SE7506884A patent/SE7506884L/xx not_active Application Discontinuation
- 1975-06-23 IT IT24653/75A patent/IT1039312B/it active
- 1975-06-24 JP JP50078583A patent/JPS6043371B2/ja not_active Expired
- 1975-06-27 NL NL7507672A patent/NL7507672A/xx unknown
- 1975-06-30 DE DE19752529116 patent/DE2529116A1/de active Pending
- 1975-07-22 FR FR7522828A patent/FR2307016A1/fr not_active Withdrawn
- 1975-07-25 BE BE158636A patent/BE831761A/xx unknown
-
1985
- 1985-06-14 JP JP60129744A patent/JPS6151025A/ja active Granted
Also Published As
Publication number | Publication date |
---|---|
FR2307016A1 (fr) | 1976-11-05 |
IT1039312B (it) | 1979-12-10 |
BE831761A (fr) | 1976-01-26 |
US3971747A (en) | 1976-07-27 |
DE2529116A1 (de) | 1976-10-14 |
JPS51118728A (en) | 1976-10-18 |
JPS6151025A (ja) | 1986-03-13 |
NL7507672A (nl) | 1976-10-13 |
JPS6043371B2 (ja) | 1985-09-27 |
JPS632968B2 (xx) | 1988-01-21 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
NAV | Patent application has lapsed |
Ref document number: 7506884-1 |