SE522531C2 - Metod och anordning för märkning av halvledare - Google Patents

Metod och anordning för märkning av halvledare

Info

Publication number
SE522531C2
SE522531C2 SE9904277A SE9904277A SE522531C2 SE 522531 C2 SE522531 C2 SE 522531C2 SE 9904277 A SE9904277 A SE 9904277A SE 9904277 A SE9904277 A SE 9904277A SE 522531 C2 SE522531 C2 SE 522531C2
Authority
SE
Sweden
Prior art keywords
pattern
code
wafer
exposure
variable
Prior art date
Application number
SE9904277A
Other languages
English (en)
Swedish (sv)
Other versions
SE9904277L (sv
SE9904277D0 (sv
Inventor
Torbjoern Sandstroem
Original Assignee
Micronic Laser Systems Ab
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Micronic Laser Systems Ab filed Critical Micronic Laser Systems Ab
Priority to SE9904277A priority Critical patent/SE522531C2/sv
Publication of SE9904277D0 publication Critical patent/SE9904277D0/xx
Priority to AU19092/01A priority patent/AU1909201A/en
Priority to US10/129,364 priority patent/US6813058B1/en
Priority to CNB008162018A priority patent/CN1227737C/zh
Priority to EP00982014A priority patent/EP1232526A1/en
Priority to JP2001540838A priority patent/JP2003515930A/ja
Priority to KR1020027006620A priority patent/KR100726054B1/ko
Priority to PCT/SE2000/002325 priority patent/WO2001039269A1/en
Publication of SE9904277L publication Critical patent/SE9904277L/xx
Publication of SE522531C2 publication Critical patent/SE522531C2/sv
Priority to US10/953,560 priority patent/US7211453B2/en
Priority to US11/378,266 priority patent/US20060161254A1/en
Priority to US11/980,432 priority patent/US7842525B2/en

Links

Classifications

    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/70—Microphotolithographic exposure; Apparatus therefor
    • G03F7/70483—Information management; Active and passive control; Testing; Wafer monitoring, e.g. pattern monitoring
    • G03F7/70491—Information management, e.g. software; Active and passive control, e.g. details of controlling exposure processes or exposure tool monitoring processes
    • G03F7/70541—Tagging, i.e. hardware or software tagging of features or components, e.g. using tagging scripts or tagging identifier codes for identification of chips, shots or wafers
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03B—APPARATUS OR ARRANGEMENTS FOR TAKING PHOTOGRAPHS OR FOR PROJECTING OR VIEWING THEM; APPARATUS OR ARRANGEMENTS EMPLOYING ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ACCESSORIES THEREFOR
    • G03B27/00—Photographic printing apparatus
    • G03B27/32—Projection printing apparatus, e.g. enlarger, copying camera
    • G03B27/44—Projection printing apparatus, e.g. enlarger, copying camera for multiple copying of the same original at the same time
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/70—Microphotolithographic exposure; Apparatus therefor
    • G03F7/70216—Mask projection systems
    • G03F7/70283—Mask effects on the imaging process
    • G03F7/70291—Addressable masks, e.g. spatial light modulators [SLMs], digital micro-mirror devices [DMDs] or liquid crystal display [LCD] patterning devices
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/70—Microphotolithographic exposure; Apparatus therefor
    • G03F7/70425—Imaging strategies, e.g. for increasing throughput or resolution, printing product fields larger than the image field or compensating lithography- or non-lithography errors, e.g. proximity correction, mix-and-match, stitching or double patterning
    • G03F7/7045—Hybrid exposures, i.e. multiple exposures of the same area using different types of exposure apparatus, e.g. combining projection, proximity, direct write, interferometric, UV, x-ray or particle beam
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/70—Microphotolithographic exposure; Apparatus therefor
    • G03F7/70425—Imaging strategies, e.g. for increasing throughput or resolution, printing product fields larger than the image field or compensating lithography- or non-lithography errors, e.g. proximity correction, mix-and-match, stitching or double patterning
    • G03F7/70466—Multiple exposures, e.g. combination of fine and coarse exposures, double patterning or multiple exposures for printing a single feature
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/70—Microphotolithographic exposure; Apparatus therefor
    • G03F7/70483—Information management; Active and passive control; Testing; Wafer monitoring, e.g. pattern monitoring
    • G03F7/7055—Exposure light control in all parts of the microlithographic apparatus, e.g. pulse length control or light interruption
    • G03F7/70575—Wavelength control, e.g. control of bandwidth, multiple wavelength, selection of wavelength or matching of optical components to wavelength
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L22/00—Testing or measuring during manufacture or treatment; Reliability measurements, i.e. testing of parts without further processing to modify the parts as such; Structural arrangements therefor
    • H01L22/30—Structural arrangements specially adapted for testing or measuring during manufacture or treatment, or specially adapted for reliability measurements
    • H01L22/34—Circuits for electrically characterising or monitoring manufacturing processes, e. g. whole test die, wafers filled with test structures, on-board-devices incorporated on each die, process control monitors or pad structures thereof, devices in scribe line
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/544—Marks applied to semiconductor devices or parts, e.g. registration marks, alignment structures, wafer maps
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/57—Protection from inspection, reverse engineering or tampering
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2223/00—Details relating to semiconductor or other solid state devices covered by the group H01L23/00
    • H01L2223/544—Marks applied to semiconductor devices or parts
    • H01L2223/54433—Marks applied to semiconductor devices or parts containing identification or tracking information
    • H01L2223/5444—Marks applied to semiconductor devices or parts containing identification or tracking information for electrical read out
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

Landscapes

  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Manufacturing & Machinery (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Automation & Control Theory (AREA)
  • Exposure And Positioning Against Photoresist Photosensitive Materials (AREA)
  • Exposure Of Semiconductors, Excluding Electron Or Ion Beam Exposure (AREA)
SE9904277A 1999-11-24 1999-11-24 Metod och anordning för märkning av halvledare SE522531C2 (sv)

Priority Applications (11)

Application Number Priority Date Filing Date Title
SE9904277A SE522531C2 (sv) 1999-11-24 1999-11-24 Metod och anordning för märkning av halvledare
PCT/SE2000/002325 WO2001039269A1 (en) 1999-11-24 2000-11-24 Method and apparatus for personalization of semiconductor
EP00982014A EP1232526A1 (en) 1999-11-24 2000-11-24 Method and apparatus for personalization of semiconductor
US10/129,364 US6813058B1 (en) 1999-11-24 2000-11-24 Method and apparatus for personalization of semiconductor
CNB008162018A CN1227737C (zh) 1999-11-24 2000-11-24 用于半导体器件个性化的装置与方法
AU19092/01A AU1909201A (en) 1999-11-24 2000-11-24 Method and apparatus for personalization of semiconductor
JP2001540838A JP2003515930A (ja) 1999-11-24 2000-11-24 半導体の個別化を行う方法および装置
KR1020027006620A KR100726054B1 (ko) 1999-11-24 2000-11-24 마이크로전자 소자의 설계 및 제조 방법, 칩-고유 정보 기록장치, 스탭퍼 제어 시스템, 칩-고유 정보를 가진 칩 설계 블록, 웨이퍼 상의 다이 개별화 방법 및 패턴 발생기의 위치 에러 수정 방법
US10/953,560 US7211453B2 (en) 1999-11-24 2004-09-30 Method and apparatus for personalization of semiconductor
US11/378,266 US20060161254A1 (en) 1999-11-24 2006-03-20 Method and apparatus for personalization of semiconductor
US11/980,432 US7842525B2 (en) 1999-11-24 2007-10-31 Method and apparatus for personalization of semiconductor

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
SE9904277A SE522531C2 (sv) 1999-11-24 1999-11-24 Metod och anordning för märkning av halvledare

Publications (3)

Publication Number Publication Date
SE9904277D0 SE9904277D0 (sv) 1999-11-24
SE9904277L SE9904277L (sv) 2001-05-25
SE522531C2 true SE522531C2 (sv) 2004-02-17

Family

ID=20417858

Family Applications (1)

Application Number Title Priority Date Filing Date
SE9904277A SE522531C2 (sv) 1999-11-24 1999-11-24 Metod och anordning för märkning av halvledare

Country Status (8)

Country Link
US (4) US6813058B1 (ja)
EP (1) EP1232526A1 (ja)
JP (1) JP2003515930A (ja)
KR (1) KR100726054B1 (ja)
CN (1) CN1227737C (ja)
AU (1) AU1909201A (ja)
SE (1) SE522531C2 (ja)
WO (1) WO2001039269A1 (ja)

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Also Published As

Publication number Publication date
SE9904277L (sv) 2001-05-25
AU1909201A (en) 2001-06-04
CN1227737C (zh) 2005-11-16
SE9904277D0 (sv) 1999-11-24
JP2003515930A (ja) 2003-05-07
US20050047543A1 (en) 2005-03-03
US7211453B2 (en) 2007-05-01
US7842525B2 (en) 2010-11-30
KR20020070440A (ko) 2002-09-09
CN1399796A (zh) 2003-02-26
US20080062389A1 (en) 2008-03-13
KR100726054B1 (ko) 2007-06-11
US6813058B1 (en) 2004-11-02
EP1232526A1 (en) 2002-08-21
US20060161254A1 (en) 2006-07-20
WO2001039269A1 (en) 2001-05-31

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