SE467551B - Apparat foer maetning av arktjocklek - Google Patents

Apparat foer maetning av arktjocklek

Info

Publication number
SE467551B
SE467551B SE8902579A SE8902579A SE467551B SE 467551 B SE467551 B SE 467551B SE 8902579 A SE8902579 A SE 8902579A SE 8902579 A SE8902579 A SE 8902579A SE 467551 B SE467551 B SE 467551B
Authority
SE
Sweden
Prior art keywords
sensor
magnetic field
measured
sheet
thickness
Prior art date
Application number
SE8902579A
Other languages
English (en)
Swedish (sv)
Other versions
SE8902579L (sv
SE8902579D0 (sv
Inventor
S Ichikawa
Original Assignee
Meisan Kk
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Meisan Kk filed Critical Meisan Kk
Publication of SE8902579D0 publication Critical patent/SE8902579D0/xx
Publication of SE8902579L publication Critical patent/SE8902579L/
Publication of SE467551B publication Critical patent/SE467551B/sv

Links

Classifications

    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01B—MEASURING LENGTH, THICKNESS OR SIMILAR LINEAR DIMENSIONS; MEASURING ANGLES; MEASURING AREAS; MEASURING IRREGULARITIES OF SURFACES OR CONTOURS
    • G01B21/00—Measuring arrangements or details thereof, where the measuring technique is not covered by the other groups of this subclass, unspecified or not relevant
    • G01B21/02—Measuring arrangements or details thereof, where the measuring technique is not covered by the other groups of this subclass, unspecified or not relevant for measuring length, width, or thickness
    • G01B21/08—Measuring arrangements or details thereof, where the measuring technique is not covered by the other groups of this subclass, unspecified or not relevant for measuring length, width, or thickness for measuring thickness
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01B—MEASURING LENGTH, THICKNESS OR SIMILAR LINEAR DIMENSIONS; MEASURING ANGLES; MEASURING AREAS; MEASURING IRREGULARITIES OF SURFACES OR CONTOURS
    • G01B7/00—Measuring arrangements characterised by the use of electric or magnetic techniques
    • G01B7/02—Measuring arrangements characterised by the use of electric or magnetic techniques for measuring length, width or thickness
    • G01B7/023—Measuring arrangements characterised by the use of electric or magnetic techniques for measuring length, width or thickness for measuring distance between sensor and object
SE8902579A 1988-10-12 1989-07-20 Apparat foer maetning av arktjocklek SE467551B (sv)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP63256459A JPH0648185B2 (ja) 1988-10-12 1988-10-12 シート厚さ測定装置

Publications (3)

Publication Number Publication Date
SE8902579D0 SE8902579D0 (sv) 1989-07-20
SE8902579L SE8902579L (sv) 1990-04-13
SE467551B true SE467551B (sv) 1992-08-03

Family

ID=17292932

Family Applications (1)

Application Number Title Priority Date Filing Date
SE8902579A SE467551B (sv) 1988-10-12 1989-07-20 Apparat foer maetning av arktjocklek

Country Status (5)

Country Link
US (1) US5001356A (de)
JP (1) JPH0648185B2 (de)
DE (1) DE3929469C2 (de)
FI (1) FI96137C (de)
SE (1) SE467551B (de)

Families Citing this family (28)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5355083A (en) * 1988-11-16 1994-10-11 Measurex Corporation Non-contact sensor and method using inductance and laser distance measurements for measuring the thickness of a layer of material overlaying a substrate
US5485082A (en) * 1990-04-11 1996-01-16 Micro-Epsilon Messtechnik Gmbh & Co. Kg Method of calibrating a thickness measuring device and device for measuring or monitoring the thickness of layers, tapes, foils, and the like
DE9206076U1 (de) * 1992-05-07 1993-09-09 Hermann Gmbh Co Heinrich Etikettiermaschine
IT1263789B (it) * 1993-01-22 1996-08-29 Alessandro Masotti Metodo e apparecchio comprendente due sensori magnetici ed un misuratore laser per misurare lo spessore di un film
JP3548196B2 (ja) * 1993-06-21 2004-07-28 キヤノン株式会社 画像形成装置
US5466143A (en) * 1993-09-29 1995-11-14 Oshikiri Machinery Ltd. Dough sheet former with closed loop control
EP0651231B1 (de) * 1993-10-29 1997-06-18 Ferag AG Verfahren und Vorrichtung zur Messung der Dicke von Druckereierzeugnissen, wie Zeitungen, Zeitschriften und Teilen hiervon
DE4402463C2 (de) * 1994-01-28 1998-01-29 Amepa Eng Gmbh Vorrichtung zur diskontinuierlichen Erfassung der Dicke einer Schicht auf einer Metallschmelze
US5569835A (en) * 1994-08-10 1996-10-29 Ultrasonic Arrays, Inc. Reference wire compensation method and apparatus
US5617645A (en) * 1995-05-02 1997-04-08 William R. W. Wick Non-contact precision measurement system
JPH08313223A (ja) * 1995-05-16 1996-11-29 Ls Electro Galvanizing Co 移動ストリップを監視する方法と装置
JP3024338U (ja) * 1995-11-02 1996-05-21 株式会社エレム ア−ス端子を有するプラグ
US5805291A (en) * 1996-08-14 1998-09-08 Systronics, Inc. Traversing thickness measurement apparatus and related method
JP3844857B2 (ja) * 1997-09-30 2006-11-15 株式会社東芝 厚さ検知装置
US6580519B1 (en) 1999-03-16 2003-06-17 William R. W. Wick Method and apparatus for determining the alignment of rotational bodies
WO2001029504A1 (de) * 1999-10-18 2001-04-26 Micro-Epsilon Messtechnik Gmbh & Co. Kg Sensor zum berührenden vermessen von materialien
US6433541B1 (en) 1999-12-23 2002-08-13 Kla-Tencor Corporation In-situ metalization monitoring using eddy current measurements during the process for removing the film
US6707540B1 (en) 1999-12-23 2004-03-16 Kla-Tencor Corporation In-situ metalization monitoring using eddy current and optical measurements
TWI241398B (en) * 2000-03-28 2005-10-11 Toshiba Corp Eddy current loss measuring sensor, film thickness measuring device, film thickness measuring method and recording medium
US6608495B2 (en) * 2001-03-19 2003-08-19 Applied Materials, Inc. Eddy-optic sensor for object inspection
US6966816B2 (en) * 2001-05-02 2005-11-22 Applied Materials, Inc. Integrated endpoint detection system with optical and eddy current monitoring
US6937350B2 (en) * 2001-06-29 2005-08-30 Massachusetts Institute Of Technology Apparatus and methods for optically monitoring thickness
US6811466B1 (en) * 2001-12-28 2004-11-02 Applied Materials, Inc. System and method for in-line metal profile measurement
US20040061873A1 (en) * 2002-09-26 2004-04-01 Davis Brett L. Method and apparatus for detecting media thickness
US6961133B2 (en) * 2003-08-29 2005-11-01 The Boeing Company Method and apparatus for non-contact thickness measurement
DE502005003829D1 (de) * 2005-01-13 2008-06-05 Plast Control Gmbh Vorrichtung und Verfahren zur kapazitiven Vermessung von Materialien
US8337278B2 (en) * 2007-09-24 2012-12-25 Applied Materials, Inc. Wafer edge characterization by successive radius measurements
DE102011107771B4 (de) * 2011-04-15 2013-10-17 Micro-Epsilon Messtechnik Gmbh & Co. Kg Vorrichtung und Verfahren zur Dickenmessung eines Messobjekts

Family Cites Families (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE3221379A1 (de) * 1982-06-05 1983-12-08 M.A.N.- Roland Druckmaschinen AG, 6050 Offenbach Messvorrichtung fuer bogendicken in der transportbahn von boegen bei papierverarbeitungsmaschinen
DE3523414A1 (de) * 1985-06-29 1987-01-02 Deuta Werke Gmbh Verfahren und vorrichtung zum messen insbesondere der dicke oder breite von koerpern, insbesondere von platten, folien, strangprofilen oder dergleichen
US4849694A (en) * 1986-10-27 1989-07-18 Nanometrics, Incorporated Thickness measurements of thin conductive films
DE3701558A1 (de) * 1987-01-21 1988-08-04 Buehler Ag Geb Vorrichtung zum bestimmen der schichtdicke

Also Published As

Publication number Publication date
FI96137B (fi) 1996-01-31
SE8902579L (sv) 1990-04-13
FI893921A0 (fi) 1989-08-21
DE3929469C2 (de) 2001-06-13
JPH02103408A (ja) 1990-04-16
US5001356A (en) 1991-03-19
FI893921A (fi) 1990-04-13
SE8902579D0 (sv) 1989-07-20
DE3929469A1 (de) 1990-04-19
JPH0648185B2 (ja) 1994-06-22
FI96137C (fi) 1996-05-10

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