SE461063B - Identitetskort med ic-komponent samt baerelement foer en ic-komponent laempad att inbyggas i ett kort - Google Patents

Identitetskort med ic-komponent samt baerelement foer en ic-komponent laempad att inbyggas i ett kort

Info

Publication number
SE461063B
SE461063B SE8201825A SE8201825A SE461063B SE 461063 B SE461063 B SE 461063B SE 8201825 A SE8201825 A SE 8201825A SE 8201825 A SE8201825 A SE 8201825A SE 461063 B SE461063 B SE 461063B
Authority
SE
Sweden
Prior art keywords
component
card
support element
contact surfaces
film
Prior art date
Application number
SE8201825A
Other languages
English (en)
Swedish (sv)
Other versions
SE8201825L (sv
Inventor
J Hoppe
Y Haghiri-Tehrani
Original Assignee
Gao Ges Automation Org
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from DE19813111516 external-priority patent/DE3111516A1/de
Priority claimed from DE19818108609 external-priority patent/DE8108609U1/de
Application filed by Gao Ges Automation Org filed Critical Gao Ges Automation Org
Publication of SE8201825L publication Critical patent/SE8201825L/xx
Publication of SE461063B publication Critical patent/SE461063B/sv

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
    • H01L23/488—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
    • H01L23/498—Leads, i.e. metallisations or lead-frames on insulating substrates, e.g. chip carriers
    • H01L23/49855—Leads, i.e. metallisations or lead-frames on insulating substrates, e.g. chip carriers for flat-cards, e.g. credit cards
    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
    • G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
    • G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
    • G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
    • G06K19/07—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
    • G06K19/077—Constructional details, e.g. mounting of circuits in the carrier
    • G06K19/07743—External electrical contacts
    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
    • G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
    • G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
    • G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
    • G06K19/07—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
    • G06K19/077—Constructional details, e.g. mounting of circuits in the carrier
    • G06K19/07745—Mounting details of integrated circuit chips
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10S283/00—Printed matter
    • Y10S283/904—Credit card
SE8201825A 1981-03-24 1982-03-23 Identitetskort med ic-komponent samt baerelement foer en ic-komponent laempad att inbyggas i ett kort SE461063B (sv)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
DE19813111516 DE3111516A1 (de) 1981-03-24 1981-03-24 "ausweiskarte mit ic-baustein"
DE19818108609 DE8108609U1 (de) 1981-03-24 1981-03-24 "ausweiskarte mit ic-baustein"

Publications (2)

Publication Number Publication Date
SE8201825L SE8201825L (sv) 1982-09-25
SE461063B true SE461063B (sv) 1989-12-18

Family

ID=25792091

Family Applications (1)

Application Number Title Priority Date Filing Date
SE8201825A SE461063B (sv) 1981-03-24 1982-03-23 Identitetskort med ic-komponent samt baerelement foer en ic-komponent laempad att inbyggas i ett kort

Country Status (7)

Country Link
US (2) US4550248A (fr)
CH (1) CH659800A5 (fr)
FR (1) FR2502816B1 (fr)
GB (1) GB2095175B (fr)
IT (1) IT1191174B (fr)
NL (1) NL191959B (fr)
SE (1) SE461063B (fr)

Families Citing this family (50)

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DE3151408C1 (de) * 1981-12-24 1983-06-01 GAO Gesellschaft für Automation und Organisation mbH, 8000 München Ausweiskarte mit einem IC-Baustein
GB2146815A (en) * 1983-09-17 1985-04-24 Ibm Electronic fund transfer systems
GB2146814A (en) * 1983-09-17 1985-04-24 Ibm Electronic fund transfer systems
JPS6084686A (ja) * 1983-10-17 1985-05-14 Toshiba Corp 情報記録媒体の記録方式
DE3338597A1 (de) * 1983-10-24 1985-05-02 GAO Gesellschaft für Automation und Organisation mbH, 8000 München Datentraeger mit integriertem schaltkreis und verfahren zur herstellung desselben
JPS60176186A (ja) * 1984-02-23 1985-09-10 Omron Tateisi Electronics Co Ｉｃカ−ドシステム
DE3420051A1 (de) * 1984-05-29 1985-12-05 GAO Gesellschaft für Automation und Organisation mbH, 8000 München Datentraeger mit ic-baustein und verfahren zur herstellung eines derartigen datentraegers
US4677528A (en) * 1984-05-31 1987-06-30 Motorola, Inc. Flexible printed circuit board having integrated circuit die or the like affixed thereto
JPS6141262A (ja) * 1984-07-31 1986-02-27 Omron Tateisi Electronics Co 音声記録可能なカ−ド
JPS6191790A (ja) * 1984-10-12 1986-05-09 カシオ計算機株式会社 カ−ド照合装置
JPS61157990A (ja) * 1984-12-29 1986-07-17 Kyodo Printing Co Ltd Ｉｃカ−ド
CH661808A5 (fr) * 1985-01-21 1987-08-14 Lupa Finances Carte munie d'un microprocesseur et/ou d'au moins une memoire electronique.
JPS625367U (fr) * 1985-03-16 1987-01-13
FR2579798B1 (fr) * 1985-04-02 1990-09-28 Ebauchesfabrik Eta Ag Procede de fabrication de modules electroniques pour cartes a microcircuits et modules obtenus selon ce procede
FR2580416B1 (fr) * 1985-04-12 1987-06-05 Radiotechnique Compelec Procede et dispositif pour fabriquer une carte d'identification electronique
JPS61188871U (fr) * 1985-05-16 1986-11-25
US5203078A (en) * 1985-07-17 1993-04-20 Ibiden Co., Ltd. Printed wiring board for IC cards
JPH0679878B2 (ja) * 1985-09-24 1994-10-12 カシオ計算機株式会社 Ｉｃカ−ド
JPS6295660A (ja) * 1985-10-21 1987-05-02 Omron Tateisi Electronics Co Ｉｃカ−ドを用いたサインリ−ド／ライトシステム
US4825056A (en) * 1985-11-21 1989-04-25 Kabushiki Kaisha Toshiba Thin-film electromagnetic transducer
NL8503410A (nl) * 1985-12-11 1987-07-01 Philips Nv Inrichting voor het overdragen van informatie tussen een elektronische geheugenkaart en een dataverwerkende eenheid.
US4755661A (en) * 1986-01-10 1988-07-05 Ruebsam Herrn H Connection of electronic components in a card
US4742215A (en) * 1986-05-07 1988-05-03 Personal Computer Card Corporation IC card system
US4783598A (en) * 1986-09-10 1988-11-08 Teles Computer Products, Inc. Optically coupled interface for portable semi-conductor data media
US4855583A (en) * 1987-08-17 1989-08-08 Figgie International, Inc. Structure and method of making combination proximity/insertion identification cards
FR2620586A1 (fr) * 1987-09-14 1989-03-17 Em Microelectronic Marin Sa Procede de fabrication de modules electroniques, notamment pour cartes a microcircuits
EP0311434A3 (fr) * 1987-10-09 1990-05-09 The De La Rue Company Plc Carte de circuit intégré
FR2631200B1 (fr) * 1988-05-09 1991-02-08 Bull Cp8 Circuit imprime souple, notamment pour carte a microcircuits electroniques, et carte incorporant un tel circuit
JP2559849B2 (ja) * 1989-05-23 1996-12-04 三菱電機株式会社 Ｉｃカード
US5244840A (en) * 1989-05-23 1993-09-14 Mitsubishi Denki Kabushiki Kaisha Method for manufacturing an encapsulated IC card having a molded frame and a circuit board
JP3169965B2 (ja) * 1992-08-12 2001-05-28 沖電気工業株式会社 Ｉｃカード
US5689136A (en) * 1993-08-04 1997-11-18 Hitachi, Ltd. Semiconductor device and fabrication method
EP0772155A1 (fr) * 1995-05-19 1997-05-07 Dai Nippon Printing Co., Ltd. Carte optique avec module c.i.
US5817207A (en) 1995-10-17 1998-10-06 Leighton; Keith R. Radio frequency identification card and hot lamination process for the manufacture of radio frequency identification cards
DE19602821C1 (de) 1996-01-26 1997-06-26 Siemens Ag Verfahren zur Herstellung einer Datenkarte
US5812942A (en) * 1996-09-24 1998-09-22 Motorola, Inc. Balanced differential radio receiver and method of operation
US5815020A (en) * 1996-09-24 1998-09-29 Motorola, Inc. Balance differential receiver
US6431453B1 (en) * 1997-05-20 2002-08-13 Dynetics Engineering Corporation, Inc. Automated card insertion system with card multireader and method
EP0890928A3 (fr) * 1997-07-10 2001-06-13 Sarnoff Corporation Appareil de transmission et identification à distance d'un objet codé électroniquement
FR2794265B1 (fr) * 1999-05-25 2003-09-19 Gemplus Card Int Procede de fabrication de cartes a puce a contact avec dielectrique bas cout
US6557766B1 (en) * 1999-10-01 2003-05-06 Keith R. Leighton Hot lamination method for a hybrid radio frequency optical memory card converting sheets into a web process
US6601771B2 (en) * 2001-04-09 2003-08-05 Smart Card Integrators, Inc. Combined smartcard and magnetic-stripe card and reader and associated method
WO2004047084A2 (fr) * 2002-11-18 2004-06-03 Storcard, Inc. Carte de transaction securisee a grand volume de stockage
WO2006118255A1 (fr) * 2005-04-28 2006-11-09 Toyo Boseki Kabushiki Kaisha Film de polyester thermoliable, procede de production de cartes a circuit integre ou d’etiquettes a circuit integre a l’aide de ce film, et cartes et etiquettes a circuit integre
US7810718B2 (en) * 2005-05-12 2010-10-12 Cubic Corporation Variable thickness data card body
DE102005058101B4 (de) * 2005-12-05 2019-04-25 Smartrac Ip B.V. Chipkarte und Verfahren zur Herstellung einer Chipkarte
US20070185820A1 (en) * 2006-02-08 2007-08-09 Talker Albert I Multi-account security verification system with a virtual account and linked multiple real accounts
USD729808S1 (en) * 2013-03-13 2015-05-19 Nagrastar Llc Smart card interface
USD780763S1 (en) * 2015-03-20 2017-03-07 Nagrastar Llc Smart card interface
MY188509A (en) * 2015-11-13 2021-12-17 Linxens Holding Process for manufacturing a non-opaque layer for a multilayer structure comprising a window, and a multilayer with such a non-opaque layer

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Publication number Priority date Publication date Assignee Title
GB1209901A (en) * 1967-01-11 1970-10-21 British Telecomm Res Ltd Improvements relating to the mounting of integrated circuit assemblies
US3746932A (en) * 1970-12-28 1973-07-17 Texas Instruments Inc Panel board systems and components therefor
DE2124887C3 (de) * 1971-05-19 1980-04-17 Philips Patentverwaltung Gmbh, 2000 Hamburg Elektrisches Bauelement, vorzugsweise Halbleiterbauelement, mit Folienkontaktierung
US3762464A (en) * 1971-12-29 1973-10-02 Japan Engineering And Trading Heat exchanger
US4004133A (en) * 1974-12-30 1977-01-18 Rca Corporation Credit card containing electronic circuit
US4222516A (en) * 1975-12-31 1980-09-16 Compagnie Internationale Pour L'informatique Cii-Honeywell Bull Standardized information card
FR2337381A1 (fr) * 1975-12-31 1977-07-29 Honeywell Bull Soc Ind Carte portative pour systeme de traitement de signaux electriques et procede de fabrication de cette carte
US4105156A (en) * 1976-09-06 1978-08-08 Dethloff Juergen Identification system safeguarded against misuse
DE7832695U1 (de) * 1978-11-03 1980-04-10 Bosch-Siemens Hausgeraete Gmbh, 7000 Stuttgart Temperaturfuehler
FR2486685B1 (fr) * 1980-07-09 1985-10-31 Labo Electronique Physique Carte de paiement electronique et procede de realisation
DE3029939A1 (de) * 1980-08-07 1982-03-25 GAO Gesellschaft für Automation und Organisation mbH, 8000 München Ausweiskarte mit ic-baustein und verfahren zu ihrer herstellung
US4501960A (en) * 1981-06-22 1985-02-26 Motorola, Inc. Micropackage for identification card

Also Published As

Publication number Publication date
US4550248A (en) 1985-10-29
FR2502816B1 (fr) 1986-02-21
IT8267356A0 (it) 1982-03-19
GB2095175A (en) 1982-09-29
NL8200979A (nl) 1982-10-18
SE8201825L (sv) 1982-09-25
US4587413A (en) 1986-05-06
GB2095175B (en) 1984-11-21
CH659800A5 (de) 1987-02-27
IT1191174B (it) 1988-02-24
NL191959B (nl) 1996-07-01
FR2502816A1 (fr) 1982-10-01

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