SE383230B - Integrerad kretsanordning innefattande tva felteffekttransistorer med isolerat styre och en grindisolatorskyddsanordning. - Google Patents

Integrerad kretsanordning innefattande tva felteffekttransistorer med isolerat styre och en grindisolatorskyddsanordning.

Info

Publication number
SE383230B
SE383230B SE7304212A SE7304212A SE383230B SE 383230 B SE383230 B SE 383230B SE 7304212 A SE7304212 A SE 7304212A SE 7304212 A SE7304212 A SE 7304212A SE 383230 B SE383230 B SE 383230B
Authority
SE
Sweden
Prior art keywords
integrated circuit
gate insulator
power transistors
field power
device including
Prior art date
Application number
SE7304212A
Other languages
English (en)
Swedish (sv)
Inventor
G W Steudel
Original Assignee
Rca Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Rca Corp filed Critical Rca Corp
Publication of SE383230B publication Critical patent/SE383230B/xx

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L27/00—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
    • H01L27/02—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having potential barriers; including integrated passive circuit elements having potential barriers
    • H01L27/0203—Particular design considerations for integrated circuits
    • H01L27/0248—Particular design considerations for integrated circuits for electrical or thermal protection, e.g. electrostatic discharge [ESD] protection
    • H01L27/0251—Particular design considerations for integrated circuits for electrical or thermal protection, e.g. electrostatic discharge [ESD] protection for MOS devices
    • H01L27/0255—Particular design considerations for integrated circuits for electrical or thermal protection, e.g. electrostatic discharge [ESD] protection for MOS devices using diodes as protective elements
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L27/00—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
    • H01L27/02—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having potential barriers; including integrated passive circuit elements having potential barriers
    • H01L27/04—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having potential barriers; including integrated passive circuit elements having potential barriers the substrate being a semiconductor body
    • H01L27/08—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having potential barriers; including integrated passive circuit elements having potential barriers the substrate being a semiconductor body including only semiconductor components of a single kind
    • H01L27/085—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having potential barriers; including integrated passive circuit elements having potential barriers the substrate being a semiconductor body including only semiconductor components of a single kind including field-effect components only
    • H01L27/088—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having potential barriers; including integrated passive circuit elements having potential barriers the substrate being a semiconductor body including only semiconductor components of a single kind including field-effect components only the components being field-effect transistors with insulated gate
    • H01L27/092—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having potential barriers; including integrated passive circuit elements having potential barriers the substrate being a semiconductor body including only semiconductor components of a single kind including field-effect components only the components being field-effect transistors with insulated gate complementary MIS field-effect transistors
    • H01L27/0927—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having potential barriers; including integrated passive circuit elements having potential barriers the substrate being a semiconductor body including only semiconductor components of a single kind including field-effect components only the components being field-effect transistors with insulated gate complementary MIS field-effect transistors comprising a P-well only in the substrate

Landscapes

  • Engineering & Computer Science (AREA)
  • Power Engineering (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Metal-Oxide And Bipolar Metal-Oxide Semiconductor Integrated Circuits (AREA)
  • Amplifiers (AREA)
SE7304212A 1972-03-27 1973-03-26 Integrerad kretsanordning innefattande tva felteffekttransistorer med isolerat styre och en grindisolatorskyddsanordning. SE383230B (sv)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US23848672A 1972-03-27 1972-03-27

Publications (1)

Publication Number Publication Date
SE383230B true SE383230B (sv) 1976-03-01

Family

ID=22898111

Family Applications (1)

Application Number Title Priority Date Filing Date
SE7304212A SE383230B (sv) 1972-03-27 1973-03-26 Integrerad kretsanordning innefattande tva felteffekttransistorer med isolerat styre och en grindisolatorskyddsanordning.

Country Status (9)

Country Link
US (1) US3712995A (xx)
JP (1) JPS5422277B2 (xx)
CA (1) CA959171A (xx)
DE (1) DE2313312A1 (xx)
FR (1) FR2177994B1 (xx)
GB (1) GB1359979A (xx)
IT (1) IT980654B (xx)
MY (1) MY7500146A (xx)
SE (1) SE383230B (xx)

Families Citing this family (61)

* Cited by examiner, † Cited by third party
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US3916430A (en) * 1973-03-14 1975-10-28 Rca Corp System for eliminating substrate bias effect in field effect transistor circuits
US3913125A (en) * 1973-06-11 1975-10-14 Gte Laboratories Inc Negative impedance converter
US4015147A (en) * 1974-06-26 1977-03-29 International Business Machines Corporation Low power transmission line terminator
US3955210A (en) * 1974-12-30 1976-05-04 International Business Machines Corporation Elimination of SCR structure
US4099074A (en) * 1975-03-06 1978-07-04 Sharp Kabushiki Kaisha Touch sensitive electronic switching circuitry for electronic wristwatches
US3967295A (en) * 1975-04-03 1976-06-29 Rca Corporation Input transient protection for integrated circuit element
IN144541B (xx) * 1975-06-11 1978-05-13 Rca Corp
GB1559583A (en) * 1975-07-18 1980-01-23 Tokyo Shibaura Electric Co Complementary mosfet device and method of manufacturing the same
US4209713A (en) * 1975-07-18 1980-06-24 Tokyo Shibaura Electric Co., Ltd. Semiconductor integrated circuit device in which difficulties caused by parasitic transistors are eliminated
US4168442A (en) * 1975-07-18 1979-09-18 Tokyo Shibaura Electric Co., Ltd. CMOS FET device with abnormal current flow prevention
DE2539890B2 (de) * 1975-09-08 1978-06-01 Siemens Ag, 1000 Berlin Und 8000 Muenchen Schaltungsanordnung zum Schutz von Eingängen integrierter MOS-Schaltkreise
US4203126A (en) * 1975-11-13 1980-05-13 Siliconix, Inc. CMOS structure and method utilizing retarded electric field for minimum latch-up
JPS5286083A (en) * 1976-01-12 1977-07-16 Hitachi Ltd Production of complimentary isolation gate field effect transistor
JPS5299786A (en) * 1976-02-18 1977-08-22 Agency Of Ind Science & Technol Mos integrated circuit
US4037140A (en) * 1976-04-14 1977-07-19 Rca Corporation Protection circuit for insulated-gate field-effect transistors (IGFETS)
US4068278A (en) * 1976-05-27 1978-01-10 Williams Bruce T Overload protection circuit for amplifiers
US4066918A (en) * 1976-09-30 1978-01-03 Rca Corporation Protection circuitry for insulated-gate field-effect transistor (IGFET) circuits
US4240093A (en) * 1976-12-10 1980-12-16 Rca Corporation Integrated circuit device including both N-channel and P-channel insulated gate field effect transistors
CH621036B (fr) * 1977-02-28 Berney Sa Jean Claude Circuit integre pour piece d'horlogerie.
US4135955A (en) * 1977-09-21 1979-01-23 Harris Corporation Process for fabricating high voltage cmos with self-aligned guard rings utilizing selective diffusion and local oxidation
US4350906A (en) * 1978-06-23 1982-09-21 Rca Corporation Circuit with dual-purpose terminal
US4240042A (en) * 1979-04-05 1980-12-16 Rca Corporation Bandwidth limited large signal IC amplifier stage
JPS55136726A (en) * 1979-04-11 1980-10-24 Nec Corp High voltage mos inverter and its drive method
US4282556A (en) * 1979-05-21 1981-08-04 Rca Corporation Input protection device for insulated gate field effect transistor
US4296335A (en) * 1979-06-29 1981-10-20 General Electric Company High voltage standoff MOS driver circuitry
US4295176A (en) * 1979-09-04 1981-10-13 Bell Telephone Laboratories, Incorporated Semiconductor integrated circuit protection arrangement
US4342045A (en) * 1980-04-28 1982-07-27 Advanced Micro Devices, Inc. Input protection device for integrated circuits
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IT1211141B (it) * 1981-12-04 1989-09-29 Ates Componenti Elettron Circuito limitatore-trasduttore disegnali in alternata codificati in forma binaria, come stadio d'ingresso di un circuito integrato a igfet.
JPS58119670A (ja) * 1982-01-11 1983-07-16 Nissan Motor Co Ltd 半導体装置
GB2128021A (en) * 1982-09-13 1984-04-18 Standard Microsyst Smc CMOS structure including deep region and process for fabrication
JPS60767A (ja) * 1983-06-17 1985-01-05 Hitachi Ltd 半導体装置
JPS6027145A (ja) * 1983-07-25 1985-02-12 Hitachi Ltd 半導体集積回路装置
US4605980A (en) * 1984-03-02 1986-08-12 Zilog, Inc. Integrated circuit high voltage protection
US4745450A (en) * 1984-03-02 1988-05-17 Zilog, Inc. Integrated circuit high voltage protection
JPS60254651A (ja) * 1984-05-30 1985-12-16 Mitsubishi Electric Corp Ｃｍｏｓ回路の入力保護回路
US4626882A (en) * 1984-07-18 1986-12-02 International Business Machines Corporation Twin diode overvoltage protection structure
JPS6153761A (ja) * 1984-08-24 1986-03-17 Hitachi Ltd 半導体装置
US4739437A (en) * 1986-10-22 1988-04-19 Siemens-Pacesetter, Inc. Pacemaker output switch protection
JPS63305545A (ja) * 1987-06-05 1988-12-13 Hitachi Ltd 半導体集積回路装置
IT1226438B (it) * 1988-07-05 1991-01-15 Sgs Thomson Microelectronics Circuito elettronico con dispositivo di protezione da variazioni di tensione della batteria di alimentazione.
US4890143A (en) * 1988-07-28 1989-12-26 General Electric Company Protective clamp for MOS gated devices
IT1227104B (it) * 1988-09-27 1991-03-15 Sgs Thomson Microelectronics Circuito integrato autoprotetto da inversioni di polarita' della batteria di alimentazione
US4922371A (en) * 1988-11-01 1990-05-01 Teledyne Semiconductor ESD protection circuit for MOS integrated circuits
US5032742A (en) * 1989-07-28 1991-07-16 Dallas Semiconductor Corporation ESD circuit for input which exceeds power supplies in normal operation
JP3124144B2 (ja) * 1993-01-27 2001-01-15 株式会社東芝 半導体装置
JPH0888323A (ja) * 1994-09-19 1996-04-02 Nippondenso Co Ltd 半導体集積回路装置
KR960015900A (ko) * 1994-10-06 1996-05-22 반도체 장치 및 그 제조방법
US5844370A (en) 1996-09-04 1998-12-01 Micron Technology, Inc. Matrix addressable display with electrostatic discharge protection
US6410964B1 (en) * 1998-03-31 2002-06-25 Nec Corporation Semiconductor device capable of preventing gate oxide film from damage by plasma process and method of manufacturing the same
US6184557B1 (en) * 1999-01-28 2001-02-06 National Semiconductor Corporation I/O circuit that utilizes a pair of well structures as resistors to delay an ESD event and as diodes for ESD protection
TW495952B (en) * 2001-07-09 2002-07-21 Taiwan Semiconductor Mfg Electrostatic discharge protection device
JP2008085188A (ja) * 2006-09-28 2008-04-10 Sanyo Electric Co Ltd 絶縁ゲート型半導体装置
JP5511124B2 (ja) * 2006-09-28 2014-06-04 セミコンダクター・コンポーネンツ・インダストリーズ・リミテッド・ライアビリティ・カンパニー 絶縁ゲート型半導体装置
JP5337470B2 (ja) * 2008-04-21 2013-11-06 セミコンダクター・コンポーネンツ・インダストリーズ・リミテッド・ライアビリティ・カンパニー 絶縁ゲート型半導体装置
US8482029B2 (en) * 2011-05-27 2013-07-09 Infineon Technologies Austria Ag Semiconductor device and integrated circuit including the semiconductor device
CN110828564B (zh) 2018-08-13 2022-04-08 香港科技大学 具有半导体性栅极的场效应晶体管
JP2021010286A (ja) * 2019-07-03 2021-01-28 ローム株式会社 駆動回路
JP7515857B2 (ja) 2020-05-26 2024-07-16 株式会社不二工機 排水ポンプ

Also Published As

Publication number Publication date
CA959171A (en) 1974-12-10
MY7500146A (en) 1975-12-31
DE2313312A1 (de) 1973-10-11
IT980654B (it) 1974-10-10
GB1359979A (en) 1974-07-17
FR2177994A1 (xx) 1973-11-09
US3712995A (en) 1973-01-23
FR2177994B1 (xx) 1977-09-02
JPS4916391A (xx) 1974-02-13
JPS5422277B2 (xx) 1979-08-06

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