RU2017143143A - Светоизлучающее устройство - Google Patents

Светоизлучающее устройство Download PDF

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RU2017143143A
RU2017143143A RU2017143143A RU2017143143A RU2017143143A RU 2017143143 A RU2017143143 A RU 2017143143A RU 2017143143 A RU2017143143 A RU 2017143143A RU 2017143143 A RU2017143143 A RU 2017143143A RU 2017143143 A RU2017143143 A RU 2017143143A
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light emitting
emitting device
wire
section
groove
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RU2017143143A
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RU2744813C2 (ru
RU2017143143A3 (ru
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Мотоказу ЯМАДА
Тадааки МИЯТА
Наоки МОРИ
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Нитиа Корпорейшн
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    • H—ELECTRICITY
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    • H01L33/00—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/48—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
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    • H01L33/00—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/48—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
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    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21S—NON-PORTABLE LIGHTING DEVICES; SYSTEMS THEREOF; VEHICLE LIGHTING DEVICES SPECIALLY ADAPTED FOR VEHICLE EXTERIORS
    • F21S4/00—Lighting devices or systems using a string or strip of light sources
    • F21S4/20—Lighting devices or systems using a string or strip of light sources with light sources held by or within elongate supports
    • F21S4/22—Lighting devices or systems using a string or strip of light sources with light sources held by or within elongate supports flexible or deformable, e.g. into a curved shape
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    • F21S—NON-PORTABLE LIGHTING DEVICES; SYSTEMS THEREOF; VEHICLE LIGHTING DEVICES SPECIALLY ADAPTED FOR VEHICLE EXTERIORS
    • F21S4/00—Lighting devices or systems using a string or strip of light sources
    • F21S4/20—Lighting devices or systems using a string or strip of light sources with light sources held by or within elongate supports
    • F21S4/22—Lighting devices or systems using a string or strip of light sources with light sources held by or within elongate supports flexible or deformable, e.g. into a curved shape
    • F21S4/24—Lighting devices or systems using a string or strip of light sources with light sources held by or within elongate supports flexible or deformable, e.g. into a curved shape of ribbon or tape form, e.g. LED tapes
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    • H01L27/00—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
    • H01L27/15—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components with at least one potential-jump barrier or surface barrier specially adapted for light emission
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    • H01L33/26—Materials of the light emitting region
    • H01L33/30—Materials of the light emitting region containing only elements of group III and group V of the periodic system
    • H01L33/32—Materials of the light emitting region containing only elements of group III and group V of the periodic system containing nitrogen
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    • H01L33/507—Wavelength conversion elements the elements being in intimate contact with parts other than the semiconductor body or integrated with parts other than the semiconductor body
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    • H01L33/62—Arrangements for conducting electric current to or from the semiconductor body, e.g. lead-frames, wire-bonds or solder balls
    • H—ELECTRICITY
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    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/18—Printed circuits structurally associated with non-printed electric components
    • H05K1/189—Printed circuits structurally associated with non-printed electric components characterised by the use of a flexible or folded printed circuit
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21Y—INDEXING SCHEME ASSOCIATED WITH SUBCLASSES F21K, F21L, F21S and F21V, RELATING TO THE FORM OR THE KIND OF THE LIGHT SOURCES OR OF THE COLOUR OF THE LIGHT EMITTED
    • F21Y2103/00—Elongate light sources, e.g. fluorescent tubes
    • F21Y2103/10—Elongate light sources, e.g. fluorescent tubes comprising a linear array of point-like light-generating elements
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21Y—INDEXING SCHEME ASSOCIATED WITH SUBCLASSES F21K, F21L, F21S and F21V, RELATING TO THE FORM OR THE KIND OF THE LIGHT SOURCES OR OF THE COLOUR OF THE LIGHT EMITTED
    • F21Y2115/00—Light-generating elements of semiconductor light sources
    • F21Y2115/10—Light-emitting diodes [LED]
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    • H01L2224/10—Bump connectors; Manufacturing methods related thereto
    • H01L2224/15—Structure, shape, material or disposition of the bump connectors after the connecting process
    • H01L2224/16—Structure, shape, material or disposition of the bump connectors after the connecting process of an individual bump connector
    • H01L2224/161—Disposition
    • H01L2224/16151—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/16221—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/16225—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
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    • H01L2224/73—Means for bonding being of different types provided for in two or more of groups H01L2224/10, H01L2224/18, H01L2224/26, H01L2224/34, H01L2224/42, H01L2224/50, H01L2224/63, H01L2224/71
    • H01L2224/732—Location after the connecting process
    • H01L2224/73201—Location after the connecting process on the same surface
    • H01L2224/73203—Bump and layer connectors
    • H01L2224/73204—Bump and layer connectors the bump connector being embedded into the layer connector
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    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/11—Printed elements for providing electric connections to or between printed circuits
    • H05K1/111—Pads for surface mounting, e.g. lay-out
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    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
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    • H05K2201/09—Shape and layout
    • H05K2201/09209—Shape and layout details of conductors
    • H05K2201/0929—Conductive planes
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    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10007—Types of components
    • H05K2201/10106—Light emitting diode [LED]

Claims (33)

1. Светоизлучающее устройство, содержащее:
подложку, включающую в себя
гибкую основу, простирающуюся в первом направлении, соответствующем продольному направлению этой подложки;
множество проводных участков, расположенных на упомянутой основе, и
желобковый участок, сформированный среди упомянутого множества проводных участков, отстоящих друг от друга, и включающий в себя первый желобковый участок, второй желобковый участок и третий желобковый участок, простирающийся в направлении, пересекающем первый желобковый участок и второй желобковый участок, причем первый желобковый участок и третий желобковый участок соединены друг с другом дугой, и второй желобковый участок и третий желобковый участок соединены друг с другом дугой;
светоизлучающий элемент, расположенный на подложке и электрически соединенный с упомянутым множеством проводных участков; и
уплотнительный полимерный элемент, уплотняющий светоизлучающий элемент и подложку, причем уплотнительный полимерный элемент расположен на третьем желобковом участке и отстоит от первого желобкового участка и второго желобкового участка.
2. Светоизлучающее устройство по п.1, причем первый желобковый участок простирается во втором направлении, пересекающем первое направление.
3. Светоизлучающее устройство по п.1, причем третий желобковый участок простирается в первом направлении.
4. Светоизлучающее устройство по п.3, причем уплотнительный полимерный элемент расположен в положении, отличающемся от положения первого желобкового участка в первом направлении.
5. Светоизлучающее устройство по п.1, причем первый желобковый участок и второй желобковый участок обеспечивают большую гибкость при изгибе во втором направлении, чем гибкость при изгибе на третьем желобковом участке.
6. Светоизлучающее устройство по п.1, причем светоизлучающий элемент отстоит от первого желобкового участка.
7. Светоизлучающее устройство по п.1, причем подложка включает в себя пару выводных участков, простирающихся в первом направлении, и эта пара выводных участков расположена с обоих концов гибкой основы.
8. Светоизлучающее устройство по п.1, причем подложка включает в себя отражающий слой, расположенный на упомянутом множестве проводных участков, и этот отражающий слой имеет участок отверстия, в котором расположен светоизлучающий элемент.
9. Светоизлучающее устройство по п.8, причем гибкая основа изготовлена из изолирующего материала, а отражающий слой изготовлен из кремнийорганической смолы.
10. Светоизлучающее устройство по п.1, причем светоизлучающий элемент установлен на подложке методом перевернутого кристалла.
11. Светоизлучающее устройство по п.10, причем продольное направление светоизлучающего элемента практически параллельно второму направлению.
12. Светоизлучающее устройство по п.10, дополнительно содержащее материал для подзаливки, нанесенный между светоизлучающим элементом и подложкой.
13. Светоизлучающее устройство по п.12, причем материал для подзаливки расположен на желобковом участке, на упомянутом множестве проводных участков и на отражающем слое.
14. Светоизлучающее устройство по п.12, причем материал для подзаливки обладает светоотражающей способностью.
15. Светоизлучающее устройство по п.1, причем радиус скругленного угла проводного участка составляет 100 мкм или более.
16. Светоизлучающее устройство по п.1, причем толщина гибкой основы составляет от 10 мкм до 100 мкм, а толщина проводного участка составляет от 8 мкм до 150 мкм.
17. Светоизлучающее устройство по п.1, причем уплотнительный полимерный элемент содержит преобразующий длину волны элемент.
18. Светоизлучающее устройство по п.1, причем
упомянутое множество проводных участков имеет первый проводной участок, второй проводной участок и третий проводной участок,
причем первый проводной участок соседствует со вторым проводным участком и третьим проводным участком,
второй проводной участок и третий проводной участок соседствуют друг с другом,
два желобковых участка сформированы между первым проводным участком, вторым проводным участком и третьим проводным участком, и
первый проводной участок включает в себя выступающий участок, который выступает к двум желобковым участкам в области, где пересекаются эти два островковых участка.
19. Светоизлучающее устройство по п.7, дополнительно содержащее
множество выставленных в первом направлении блоков, причем каждый из упомянутого множества блоков имеет множество из светоизлучающих элементов, включающее в себя упомянутый светоизлучающий элемент, причем
множество светоизлучающих элементов электрически соединены друг с другом в каждом из упомянутого множества блоков, и
упомянутая пара выводных участков соответственно соединена с каждым из упомянутого множества блоков.
RU2017143143A 2012-07-09 2013-07-08 Светоизлучающее устройство RU2744813C2 (ru)

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JP2012153421A JP5609925B2 (ja) 2012-07-09 2012-07-09 発光装置
JP2012-153421 2012-07-09

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RU2017143143A true RU2017143143A (ru) 2019-02-14
RU2017143143A3 RU2017143143A3 (ru) 2021-01-15
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US (4) US8916903B2 (ru)
EP (2) EP3789655B1 (ru)
JP (1) JP5609925B2 (ru)
KR (1) KR102091071B1 (ru)
CN (1) CN103545419B (ru)
BR (1) BR102013017491B1 (ru)
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