RU2010137002A - Легированные теллуриды олова для термоэлектрических применений - Google Patents

Легированные теллуриды олова для термоэлектрических применений Download PDF

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Publication number
RU2010137002A
RU2010137002A RU2010137002/05A RU2010137002A RU2010137002A RU 2010137002 A RU2010137002 A RU 2010137002A RU 2010137002/05 A RU2010137002/05 A RU 2010137002/05A RU 2010137002 A RU2010137002 A RU 2010137002A RU 2010137002 A RU2010137002 A RU 2010137002A
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RU
Russia
Prior art keywords
semiconductor material
elements
generator
peltier module
thermoelectric generator
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RU2010137002/05A
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English (en)
Russian (ru)
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Франк ХААСС (DE)
Франк ХААСС
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Басф Се (De)
Басф Се
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Application filed by Басф Се (De), Басф Се filed Critical Басф Се (De)
Publication of RU2010137002A publication Critical patent/RU2010137002A/ru

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    • CCHEMISTRY; METALLURGY
    • C01INORGANIC CHEMISTRY
    • C01BNON-METALLIC ELEMENTS; COMPOUNDS THEREOF; METALLOIDS OR COMPOUNDS THEREOF NOT COVERED BY SUBCLASS C01C
    • C01B19/00Selenium; Tellurium; Compounds thereof
    • C01B19/002Compounds containing, besides selenium or tellurium, more than one other element, with -O- and -OH not being considered as anions
    • CCHEMISTRY; METALLURGY
    • C01INORGANIC CHEMISTRY
    • C01BNON-METALLIC ELEMENTS; COMPOUNDS THEREOF; METALLOIDS OR COMPOUNDS THEREOF NOT COVERED BY SUBCLASS C01C
    • C01B19/00Selenium; Tellurium; Compounds thereof
    • C01B19/007Tellurides or selenides of metals
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00Details of semiconductor or other solid state devices
    • H01L23/34Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/38Cooling arrangements using the Peltier effect
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10NELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10N10/00Thermoelectric devices comprising a junction of dissimilar materials, i.e. devices exhibiting Seebeck or Peltier effects
    • H10N10/01Manufacture or treatment
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10NELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10N10/00Thermoelectric devices comprising a junction of dissimilar materials, i.e. devices exhibiting Seebeck or Peltier effects
    • H10N10/80Constructional details
    • H10N10/85Thermoelectric active materials
    • H10N10/851Thermoelectric active materials comprising inorganic compositions
    • H10N10/852Thermoelectric active materials comprising inorganic compositions comprising tellurium, selenium or sulfur
    • CCHEMISTRY; METALLURGY
    • C01INORGANIC CHEMISTRY
    • C01PINDEXING SCHEME RELATING TO STRUCTURAL AND PHYSICAL ASPECTS OF SOLID INORGANIC COMPOUNDS
    • C01P2006/00Physical properties of inorganic compounds
    • C01P2006/40Electric properties
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001Technical content checked by a classifier
    • H01L2924/0002Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
    • YGENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02PCLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
    • Y02P20/00Technologies relating to chemical industry
    • Y02P20/10Process efficiency
    • Y02P20/129Energy recovery, e.g. by cogeneration, H2recovery or pressure recovery turbines

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  • Chemical & Material Sciences (AREA)
  • Organic Chemistry (AREA)
  • Inorganic Chemistry (AREA)
  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Manufacturing & Machinery (AREA)
  • Powder Metallurgy (AREA)
  • Compositions Of Oxide Ceramics (AREA)
RU2010137002/05A 2008-02-07 2009-02-05 Легированные теллуриды олова для термоэлектрических применений RU2010137002A (ru)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
EP08151149.5 2008-02-07
EP08151149 2008-02-07

Publications (1)

Publication Number Publication Date
RU2010137002A true RU2010137002A (ru) 2012-03-20

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RU2010137002/05A RU2010137002A (ru) 2008-02-07 2009-02-05 Легированные теллуриды олова для термоэлектрических применений

Country Status (9)

Country Link
US (1) US8772622B2 (enExample)
EP (1) EP2250126A2 (enExample)
JP (1) JP5468554B2 (enExample)
KR (1) KR20110004362A (enExample)
CN (1) CN101965313A (enExample)
CA (1) CA2715040A1 (enExample)
RU (1) RU2010137002A (enExample)
TW (1) TW200950165A (enExample)
WO (1) WO2009098248A2 (enExample)

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* Cited by examiner, † Cited by third party
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US8716589B2 (en) * 2006-03-16 2014-05-06 Basf Aktiengesellschaft Doped lead tellurides for thermoelectric applications
SG174453A1 (en) 2009-03-24 2011-10-28 Basf Se Self-organising thermoelectric materials
US8871175B2 (en) * 2010-10-01 2014-10-28 The Boeing Company Nanomaterial having tunable infrared absorption characteristics and associated method of manufacture
CN102496676B (zh) * 2011-11-18 2014-09-10 遵义师范学院 铌掺杂铋-锑系低温热电材料及其制备方法
KR102001062B1 (ko) 2012-01-16 2019-10-01 삼성전자주식회사 나노복합체형 열전재료, 이를 포함하는 열전모듈과 열전장치
KR101442018B1 (ko) * 2013-04-10 2014-09-24 국방과학연구소 알칼리 및 알칼리 토금속이 첨가된 화합물 및 이 화합물을 합성하여 제조되는 열전재료
KR101760834B1 (ko) 2015-10-07 2017-08-01 서울대학교산학협력단 칼코겐화합물 열전소재 및 이를 포함하는 열전소자
CN113165873A (zh) * 2018-12-04 2021-07-23 住友化学株式会社 化合物和热电转换材料
WO2020116388A1 (ja) * 2018-12-04 2020-06-11 住友化学株式会社 化合物及び熱電変換材料
CN111517292A (zh) * 2020-04-30 2020-08-11 西华大学 一种碲化锡基热电材料及其制备方法
TWI792310B (zh) * 2021-05-13 2023-02-11 國立中興大學 高效能熱電材料

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US3880674A (en) * 1970-01-20 1975-04-29 Rockwell International Corp Thermoelectric elements and devices and process therefor
US4076572A (en) 1973-07-05 1978-02-28 Hughes Aircraft Company Crystal growth and anneal of lead tin telluride by recrystallization from a heterogeneous system
US5439528A (en) 1992-12-11 1995-08-08 Miller; Joel Laminated thermo element
CN1034252C (zh) * 1993-05-06 1997-03-12 莎莫波尼克株式会社 热电式冷却装置、其所用半导体制备方法及热电式冷冻机
JPH077186A (ja) * 1993-06-16 1995-01-10 Idemitsu Material Kk 熱電変換材料の製造法
US5448109B1 (en) 1994-03-08 1997-10-07 Tellurex Corp Thermoelectric module
AU6783598A (en) 1997-03-31 1998-10-22 Research Triangle Institute Thin-film thermoelectric device and fabrication method of same
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JP2002026405A (ja) * 2000-07-03 2002-01-25 Sanyo Electric Co Ltd 熱電材料の製造方法、熱電材料及び熱電材料製造装置
WO2003096438A2 (en) * 2002-05-08 2003-11-20 Massachusetts Institute Of Technology Self-assembled quantum dot superlattice thermoelectric materials and devices
CN100452466C (zh) * 2003-09-12 2009-01-14 密歇根州州立大学托管委员会 热电材料及其制备方法、热电元件以及从热能生成电流的方法
WO2006085929A2 (en) * 2004-06-14 2006-08-17 Delphi Technologies, Inc. Thermoelectric materials comprising nanoscale inclusions to enhance seebeck coefficient
JP4630012B2 (ja) 2004-06-30 2011-02-09 財団法人電力中央研究所 鉛・テルル系熱電材料および熱電素子
DE102005027680A1 (de) 2005-06-15 2006-12-28 Fraunhofer-Gesellschaft zur Förderung der angewandten Forschung e.V. Verfahren zur Herstellung eines aus einem thermoelektrischen Trägermaterial mit thermischen Streuzentren bestehenden thermoelektrischen Werkstoffes und thermoelektrischer Werkstoff
WO2007104603A2 (de) 2006-03-16 2007-09-20 Basf Se Blei-germanium-telluride fuer thermoelektrische anwendungen
US8716589B2 (en) * 2006-03-16 2014-05-06 Basf Aktiengesellschaft Doped lead tellurides for thermoelectric applications
KR100904588B1 (ko) * 2007-07-05 2009-06-25 삼성전자주식회사 코어/쉘 형태의 나노와이어를 제조하는 방법, 그에 의해제조된 나노와이어 및 이를 포함하는 나노와이어 소자
JP5027061B2 (ja) * 2008-06-16 2012-09-19 株式会社東海理化電機製作所 スイッチ装置
RU2011138927A (ru) 2009-02-25 2013-04-10 Басф Се Способ изготовления гибких металлических контактов

Also Published As

Publication number Publication date
KR20110004362A (ko) 2011-01-13
CN101965313A (zh) 2011-02-02
TW200950165A (en) 2009-12-01
WO2009098248A2 (de) 2009-08-13
WO2009098248A3 (de) 2010-02-25
EP2250126A2 (de) 2010-11-17
US20110012069A1 (en) 2011-01-20
CA2715040A1 (en) 2009-08-13
JP2011514666A (ja) 2011-05-06
JP5468554B2 (ja) 2014-04-09
US8772622B2 (en) 2014-07-08

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