RU2009131070A - Способ изготовления переднего ппо электрода для применения в фотоэлектрическом приборе или тому подобном - Google Patents
Способ изготовления переднего ппо электрода для применения в фотоэлектрическом приборе или тому подобном Download PDFInfo
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- 238000000034 method Methods 0.000 title claims abstract 32
- 238000004519 manufacturing process Methods 0.000 title claims abstract 12
- 239000011521 glass Substances 0.000 claims abstract 30
- 239000000758 substrate Substances 0.000 claims abstract 30
- QVGXLLKOCUKJST-UHFFFAOYSA-N atomic oxygen Chemical compound [O] QVGXLLKOCUKJST-UHFFFAOYSA-N 0.000 claims abstract 18
- 239000001301 oxygen Substances 0.000 claims abstract 18
- 229910052760 oxygen Inorganic materials 0.000 claims abstract 18
- 239000007789 gas Substances 0.000 claims abstract 13
- 239000004065 semiconductor Substances 0.000 claims abstract 13
- XLOMVQKBTHCTTD-UHFFFAOYSA-N Zinc monoxide Chemical compound [Zn]=O XLOMVQKBTHCTTD-UHFFFAOYSA-N 0.000 claims abstract 12
- XKRFYHLGVUSROY-UHFFFAOYSA-N Argon Chemical compound [Ar] XKRFYHLGVUSROY-UHFFFAOYSA-N 0.000 claims abstract 10
- 229910052782 aluminium Inorganic materials 0.000 claims abstract 10
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 claims abstract 10
- 239000000919 ceramic Substances 0.000 claims abstract 10
- 239000011787 zinc oxide Substances 0.000 claims abstract 6
- 229910004613 CdTe Inorganic materials 0.000 claims abstract 5
- 229910021417 amorphous silicon Inorganic materials 0.000 claims abstract 5
- 229910052786 argon Inorganic materials 0.000 claims abstract 5
- 238000005507 spraying Methods 0.000 claims abstract 5
- HCHKCACWOHOZIP-UHFFFAOYSA-N Zinc Chemical compound [Zn] HCHKCACWOHOZIP-UHFFFAOYSA-N 0.000 claims abstract 3
- 239000011701 zinc Substances 0.000 claims abstract 3
- 229910052725 zinc Inorganic materials 0.000 claims abstract 3
- 239000011248 coating agent Substances 0.000 claims 4
- 238000000576 coating method Methods 0.000 claims 4
- AMGQUBHHOARCQH-UHFFFAOYSA-N indium;oxotin Chemical compound [In].[Sn]=O AMGQUBHHOARCQH-UHFFFAOYSA-N 0.000 claims 4
- ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical compound [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 claims 1
- 229910052738 indium Inorganic materials 0.000 claims 1
- APFVFJFRJDLVQX-UHFFFAOYSA-N indium atom Chemical compound [In] APFVFJFRJDLVQX-UHFFFAOYSA-N 0.000 claims 1
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- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
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- C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
- C23C14/0021—Reactive sputtering or evaporation
- C23C14/0036—Reactive sputtering
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Abstract
1. Способ изготовления фотоэлектрического прибора, содержащий: ! обеспечение стеклянной подложки; ! распыление по меньшей мере одной керамической мишени в некоторой атмосфере для того, чтобы осадить на стеклянной подложке по существу прозрачный проводящий электрод, содержащий оксид цинка; ! при этом керамическая мишень содержит оксид цинка; ! при этом атмосфера, в которой распыляют мишень, содержит газообразные аргон и кислород и имеет отношение газообразного кислорода ко всему газу от 0,00001 до 0,0025; и ! использование стеклянной подложки с по меньшей мере упомянутым электродом на ней при изготовлении фотоэлектрического прибора, который включает в себя по меньшей мере одну полупроводниковую пленку. ! 2. Способ по п.1, в котором упомянутое использование стеклянной подложки с по меньшей мере упомянутым электродом на ней при изготовлении фотоэлектрического прибора содержит соединение стеклянной подложки с другой стеклянной подложкой с по меньшей мере упомянутыми электродом и полупроводниковой пленкой между ними. ! 3. Способ по п.1, в котором полупроводниковая пленка содержит аморфный кремний или CdTe. ! 4. Способ по п.1, в котором фотоэлектрический прибор дополнительно содержит тыльный электрод и/или отражатель, расположенный между по меньшей мере другой стеклянной подложкой и полупроводниковой пленкой. ! 5. Способ по п.1, в котором электрод дополнительно содержит алюминий, и при этом электрод содержит больше цинка, чем алюминия, и имеет поверхностное сопротивление (Rs) меньшее, чем примерно 50 ом/квадрат. ! 6. Способ по п.1, в котором электрод имеет поверхностное сопротивление (Rs) не большее, чем примерно 15 ом/квадрат. ! 7. �
Claims (30)
1. Способ изготовления фотоэлектрического прибора, содержащий:
обеспечение стеклянной подложки;
распыление по меньшей мере одной керамической мишени в некоторой атмосфере для того, чтобы осадить на стеклянной подложке по существу прозрачный проводящий электрод, содержащий оксид цинка;
при этом керамическая мишень содержит оксид цинка;
при этом атмосфера, в которой распыляют мишень, содержит газообразные аргон и кислород и имеет отношение газообразного кислорода ко всему газу от 0,00001 до 0,0025; и
использование стеклянной подложки с по меньшей мере упомянутым электродом на ней при изготовлении фотоэлектрического прибора, который включает в себя по меньшей мере одну полупроводниковую пленку.
2. Способ по п.1, в котором упомянутое использование стеклянной подложки с по меньшей мере упомянутым электродом на ней при изготовлении фотоэлектрического прибора содержит соединение стеклянной подложки с другой стеклянной подложкой с по меньшей мере упомянутыми электродом и полупроводниковой пленкой между ними.
3. Способ по п.1, в котором полупроводниковая пленка содержит аморфный кремний или CdTe.
4. Способ по п.1, в котором фотоэлектрический прибор дополнительно содержит тыльный электрод и/или отражатель, расположенный между по меньшей мере другой стеклянной подложкой и полупроводниковой пленкой.
5. Способ по п.1, в котором электрод дополнительно содержит алюминий, и при этом электрод содержит больше цинка, чем алюминия, и имеет поверхностное сопротивление (Rs) меньшее, чем примерно 50 ом/квадрат.
6. Способ по п.1, в котором электрод имеет поверхностное сопротивление (Rs) не большее, чем примерно 15 ом/квадрат.
7. Способ по п.1, в котором электрод дополнительно содержит алюминий, и содержание алюминия в электроде и/или мишени составляет от примерно 1-5%.
8. Способ по п.1, в котором электрод непосредственно контактирует со стеклянной подложкой.
9. Способ по п.1, дополнительно содержащий этап формирования противоотражающего покрытия на стеклянной подложке так, что это противоотражающее покрытие размещают между стеклянной подложкой и электродом.
10. Способ по п.1, в котором атмосфера, в которой распыляют мишень, имеет отношение газообразного кислорода ко всему газу от 0,0001 до 0,002.
11. Способ по п.1, в котором атмосфера, в которой распыляют мишень, имеет отношение газообразного кислорода ко всему газу от 0,0001 до 0,0015.
12. Способ изготовления электрода для использования в электронном приборе, содержащий:
обеспечение стеклянной подложки;
распыление по меньшей мере одной керамической мишени в некоторой атмосфере для того, чтобы осадить на стеклянной подложке по существу прозрачный проводящий электрод, содержащий оксид цинка;
при этом керамическая мишень содержит оксид цинка; и
при этом атмосфера, в которой распыляют мишень, содержит газообразные аргон и кислород и имеет отношение газообразного кислорода ко всему газу от 0,00001 до 0,0025.
13. Способ по п.12, дополнительно содержащий обеспечение полупроводниковой пленки, содержащей аморфный кремний или CdTe, прилегающей к электроду.
14. Способ по п.12, в котором электрод дополнительно содержит алюминий, и при этом электрод содержит больше цинка, чем алюминия, и имеет поверхностное сопротивление (Rs) меньшее, чем примерно 50 ом/квадрат.
15. Способ по п.12, в котором электрод дополнительно содержит алюминий, и содержание алюминия в электроде и/или мишени составляет от примерно 1-5%.
16. Способ по п.12, в котором атмосфера, в которой распыляют мишень, имеет отношение газообразного кислорода ко всему газу от 0,0001 до 0,002.
17. Способ по п.12, в котором атмосфера, в которой распыляют мишень, имеет отношение газообразного кислорода ко всему газу от 0,0001 до 0,0015.
18. Способ изготовления фотоэлектрического прибора, содержащий:
обеспечение стеклянной подложки;
распыление по меньшей мере одной керамической мишени в некоторой атмосфере для того, чтобы осадить на стеклянной подложке по существу прозрачный проводящий электрод, содержащий оксид индия-олова;
при этом керамическая мишень содержит оксид индия-олова;
при этом атмосфера, в которой распыляют мишень, содержит газообразные аргон и кислород и имеет отношение газообразного кислорода ко всему газу от 0,003 до 0,017; и
использование стеклянной подложки с по меньшей мере упомянутым электродом на ней при изготовлении фотоэлектрического прибора, который включает в себя по меньшей мере одну полупроводниковую пленку.
19. Способ по п.18, в котором упомянутое использование стеклянной подложки с по меньшей мере упомянутым электродом на ней при изготовлении фотоэлектрического прибора содержит соединение стеклянной подложки с другой стеклянной подложкой с по меньшей мере упомянутыми электродом и полупроводниковой пленкой между ними.
20. Способ по п.18, в котором полупроводниковая пленка содержит аморфный кремний или CdTe.
21. Способ по п.18, в котором электрод имеет поверхностное сопротивление (Rs) меньшее, чем примерно 50 ом/квадрат.
22. Способ по п.18, в котором электрод непосредственно контактирует со стеклянной подложкой.
23. Способ по п.18, дополнительно содержащий формирования противоотражающего покрытия на стеклянной подложке так, что это противоотражающее покрытие размещают между стеклянной подложкой и электродом.
24. Способ по п.18, в котором атмосфера, в которой распыляют мишень, имеет отношение газообразного кислорода ко всему газу от 0,004 до 0,016.
25. Способ по п.18, в котором атмосфера, в которой распыляют мишень, имеет отношение газообразного кислорода ко всему газу от 0,005 до 0,015.
26. Способ изготовления электрода для использования в электронном приборе, содержащий:
обеспечение стеклянной подложки;
распыление по меньшей мере одной керамической мишени в некоторой атмосфере для того, чтобы осадить на стеклянной подложке по существу прозрачный проводящий электрод, содержащий оксид индия-олова;
при этом керамическая мишень содержит оксид индия-олова; и
при этом атмосфера, в которой распыляют мишень, содержит газообразные аргон и кислород и имеет отношение газообразного кислорода ко всему газу от 0,003 до 0,017.
27. Способ по п.26, дополнительно содержащий обеспечение полупроводниковой пленки, содержащей аморфный кремний или CdTe, прилегающей к электроду.
28. Способ по п.26, в котором атмосфера, в которой распыляют мишень, имеет отношение газообразного кислорода ко всему газу от 0,004 до 0,016.
29. Способ по п.26, в котором атмосфера, в которой распыляют мишень, имеет отношение газообразного кислорода ко всему газу от 0,008 до 0,014.
30. Способ по п.26, в котором мишень содержит больше индия, чем олова.
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US11/653,431 US20080169021A1 (en) | 2007-01-16 | 2007-01-16 | Method of making TCO front electrode for use in photovoltaic device or the like |
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EP (1) | EP2102916A2 (ru) |
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2007
- 2007-01-16 US US11/653,431 patent/US20080169021A1/en not_active Abandoned
- 2007-12-18 RU RU2009131070/28A patent/RU2009131070A/ru unknown
- 2007-12-18 EP EP07863023A patent/EP2102916A2/en not_active Withdrawn
- 2007-12-18 BR BRPI0721027-2A patent/BRPI0721027A2/pt not_active IP Right Cessation
- 2007-12-18 WO PCT/US2007/025784 patent/WO2008088543A2/en active Application Filing
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WO2008088543A3 (en) | 2008-12-24 |
US20080169021A1 (en) | 2008-07-17 |
EP2102916A2 (en) | 2009-09-23 |
WO2008088543A2 (en) | 2008-07-24 |
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