RU2005137166A - Охлаждающее устройство пластинчатого типа для предотвращения высыхания - Google Patents
Охлаждающее устройство пластинчатого типа для предотвращения высыхания Download PDFInfo
- Publication number
- RU2005137166A RU2005137166A RU2005137166/12A RU2005137166A RU2005137166A RU 2005137166 A RU2005137166 A RU 2005137166A RU 2005137166/12 A RU2005137166/12 A RU 2005137166/12A RU 2005137166 A RU2005137166 A RU 2005137166A RU 2005137166 A RU2005137166 A RU 2005137166A
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- RU
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- Prior art keywords
- section
- refrigerant
- liquid refrigerant
- cooling device
- transfer section
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Classifications
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- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F28—HEAT EXCHANGE IN GENERAL
- F28D—HEAT-EXCHANGE APPARATUS, NOT PROVIDED FOR IN ANOTHER SUBCLASS, IN WHICH THE HEAT-EXCHANGE MEDIA DO NOT COME INTO DIRECT CONTACT
- F28D15/00—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies
- F28D15/02—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F28—HEAT EXCHANGE IN GENERAL
- F28F—DETAILS OF HEAT-EXCHANGE AND HEAT-TRANSFER APPARATUS, OF GENERAL APPLICATION
- F28F3/00—Plate-like or laminated elements; Assemblies of plate-like or laminated elements
- F28F3/12—Elements constructed in the shape of a hollow panel, e.g. with channels
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B82—NANOTECHNOLOGY
- B82Y—SPECIFIC USES OR APPLICATIONS OF NANOSTRUCTURES; MEASUREMENT OR ANALYSIS OF NANOSTRUCTURES; MANUFACTURE OR TREATMENT OF NANOSTRUCTURES
- B82Y30/00—Nanotechnology for materials or surface science, e.g. nanocomposites
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F28—HEAT EXCHANGE IN GENERAL
- F28D—HEAT-EXCHANGE APPARATUS, NOT PROVIDED FOR IN ANOTHER SUBCLASS, IN WHICH THE HEAT-EXCHANGE MEDIA DO NOT COME INTO DIRECT CONTACT
- F28D15/00—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies
- F28D15/02—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes
- F28D15/0233—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes the conduits having a particular shape, e.g. non-circular cross-section, annular
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F28—HEAT EXCHANGE IN GENERAL
- F28D—HEAT-EXCHANGE APPARATUS, NOT PROVIDED FOR IN ANOTHER SUBCLASS, IN WHICH THE HEAT-EXCHANGE MEDIA DO NOT COME INTO DIRECT CONTACT
- F28D15/00—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies
- F28D15/02—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes
- F28D15/0266—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes with separate evaporating and condensing chambers connected by at least one conduit; Loop-type heat pipes; with multiple or common evaporating or condensing chambers
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/42—Fillings or auxiliary members in containers or encapsulations selected or arranged to facilitate heating or cooling
- H01L23/427—Cooling by change of state, e.g. use of heat pipes
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/46—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids
- H01L23/473—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids by flowing liquids
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F25—REFRIGERATION OR COOLING; COMBINED HEATING AND REFRIGERATION SYSTEMS; HEAT PUMP SYSTEMS; MANUFACTURE OR STORAGE OF ICE; LIQUEFACTION SOLIDIFICATION OF GASES
- F25B—REFRIGERATION MACHINES, PLANTS OR SYSTEMS; COMBINED HEATING AND REFRIGERATION SYSTEMS; HEAT PUMP SYSTEMS
- F25B2339/00—Details of evaporators; Details of condensers
- F25B2339/02—Details of evaporators
- F25B2339/021—Evaporators in which refrigerant is sprayed on a surface to be cooled
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F28—HEAT EXCHANGE IN GENERAL
- F28F—DETAILS OF HEAT-EXCHANGE AND HEAT-TRANSFER APPARATUS, OF GENERAL APPLICATION
- F28F2245/00—Coatings; Surface treatments
- F28F2245/02—Coatings; Surface treatments hydrophilic
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F28—HEAT EXCHANGE IN GENERAL
- F28F—DETAILS OF HEAT-EXCHANGE AND HEAT-TRANSFER APPARATUS, OF GENERAL APPLICATION
- F28F2245/00—Coatings; Surface treatments
- F28F2245/04—Coatings; Surface treatments hydrophobic
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F28—HEAT EXCHANGE IN GENERAL
- F28F—DETAILS OF HEAT-EXCHANGE AND HEAT-TRANSFER APPARATUS, OF GENERAL APPLICATION
- F28F2270/00—Thermal insulation; Thermal decoupling
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/30—Technical effects
- H01L2924/301—Electrical effects
- H01L2924/3011—Impedance
Landscapes
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Thermal Sciences (AREA)
- General Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Chemical & Material Sciences (AREA)
- Sustainable Development (AREA)
- Life Sciences & Earth Sciences (AREA)
- Computer Hardware Design (AREA)
- Nanotechnology (AREA)
- Power Engineering (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Crystallography & Structural Chemistry (AREA)
- Materials Engineering (AREA)
- Composite Materials (AREA)
- Cooling Or The Like Of Electrical Apparatus (AREA)
- Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
Claims (8)
1. Охлаждающее устройство пластинчатого типа, содержащее корпус пластинчатой формы, в котором сформирован контур циркуляции жидкости; и хладагент, способный изменять свое фазовое состояние, циркулирующий вдоль контура циркуляции внутри корпуса, при этом контур циркуляции внутри корпуса содержит испарительную секцию, сформированную на одном конце контура циркуляции, которая, по меньшей мере, частично заполнена жидким хладагентом посредством эффекта капиллярности и хладагент, заправленный в жидком состоянии, переходит в газообразное состояние благодаря воздействию тепла, переданного от внешнего источника тепла; секцию переноса газообразного хладагента, сформированную рядом с испарительной секцией, при этом газообразный хладагент переносится через секцию переноса газообразного хладагента, и секция переноса газообразного хладагента имеет, по меньшей мере, одну полость для удержания газообразного хладагента, который не был сконденсирован; секцию переноса жидкого хладагента, сформированную рядом с конденсационной секцией и теплоизолированную от испарительной секции, при этом жидкий хладагент переносится по направлению к испарительной секции; и теплоизоляционную секцию для теплоизоляции испарительной секции, по меньшей мере, от части секции переноса жидкого хладагента.
2. Охлаждающее устройство по п.1, в котором, по меньшей мере, часть секции переноса жидкого хладагента содержит секцию хранения жидкого хладагента для хранения хладагента в жидком состоянии.
3. Охлаждающее устройство по п.2, в котором, по меньшей мере, часть секции переноса жидкого хладагента содержит ряд секций хранения жидкого хладагента.
4. Охлаждающее устройство по п.2, в котором секция хранения жидкого хладагента содержит микроканал, поверхностное натяжение которого установлено больше, чем сила тяготения.
5. Охлаждающее устройство по п.1, в котором сечение профиля микроканала испарительной секции и/или секции переноса жидкого хладагента уменьшается от секции переноса жидкого хладагента, контактирующей с конденсационной секцией, к испарительной секции, контактирующей с секцией переноса газообразного хладагента.
6. Охлаждающее устройство по п.1, в котором конденсационная секция имеет, по меньшей мере, одну вторую полость.
7. Охлаждающее устройство по п.1, в котором секция переноса жидкого хладагента имеет, по меньшей мере, одну третью полость.
8. Охлаждающее устройство по п.1, в котором гидрофильное покрытие выполнено на поверхностях секции переноса жидкого хладагента и испарительной секции, и гидрофобное покрытие выполнено на поверхностях секции переноса газообразного хладагента и конденсационной секции.
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
KR10-2003-0035078 | 2003-05-31 | ||
KR10-2003-0035078A KR100505279B1 (ko) | 2003-05-31 | 2003-05-31 | 드라이 아웃이 방지된 박판형 냉각장치 |
Publications (1)
Publication Number | Publication Date |
---|---|
RU2005137166A true RU2005137166A (ru) | 2006-06-10 |
Family
ID=36659730
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
RU2005137166/12A RU2005137166A (ru) | 2003-05-31 | 2003-10-28 | Охлаждающее устройство пластинчатого типа для предотвращения высыхания |
Country Status (9)
Country | Link |
---|---|
US (1) | US20060157227A1 (ru) |
EP (1) | EP1639301A1 (ru) |
JP (1) | JP2006526128A (ru) |
KR (1) | KR100505279B1 (ru) |
CN (1) | CN100447991C (ru) |
AU (1) | AU2003273115A1 (ru) |
BR (1) | BR0318323A (ru) |
RU (1) | RU2005137166A (ru) |
WO (1) | WO2004106822A1 (ru) |
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US6437981B1 (en) * | 2000-11-30 | 2002-08-20 | Harris Corporation | Thermally enhanced microcircuit package and method of forming same |
US6976527B2 (en) * | 2001-07-17 | 2005-12-20 | The Regents Of The University Of California | MEMS microcapillary pumped loop for chip-level temperature control |
JP2003042672A (ja) * | 2001-07-31 | 2003-02-13 | Denso Corp | 沸騰冷却装置 |
KR100414860B1 (ko) * | 2001-08-29 | 2004-01-13 | (주)아이큐리랩 | 박판형 냉각장치 |
JP4032954B2 (ja) * | 2002-07-05 | 2008-01-16 | ソニー株式会社 | 冷却装置、電子機器装置、音響装置及び冷却装置の製造方法 |
US7188484B2 (en) * | 2003-06-09 | 2007-03-13 | Lg Electronics Inc. | Heat dissipating structure for mobile device |
-
2003
- 2003-05-31 KR KR10-2003-0035078A patent/KR100505279B1/ko not_active IP Right Cessation
- 2003-10-28 JP JP2005500269A patent/JP2006526128A/ja active Pending
- 2003-10-28 RU RU2005137166/12A patent/RU2005137166A/ru not_active Application Discontinuation
- 2003-10-28 EP EP03754299A patent/EP1639301A1/en not_active Withdrawn
- 2003-10-28 WO PCT/KR2003/002281 patent/WO2004106822A1/en active Application Filing
- 2003-10-28 AU AU2003273115A patent/AU2003273115A1/en not_active Abandoned
- 2003-10-28 CN CNB2003801103289A patent/CN100447991C/zh not_active Expired - Fee Related
- 2003-10-28 BR BRPI0318323-8A patent/BR0318323A/pt not_active IP Right Cessation
- 2003-10-28 US US10/559,042 patent/US20060157227A1/en not_active Abandoned
Also Published As
Publication number | Publication date |
---|---|
WO2004106822A1 (en) | 2004-12-09 |
KR20040103151A (ko) | 2004-12-08 |
CN1781007A (zh) | 2006-05-31 |
US20060157227A1 (en) | 2006-07-20 |
KR100505279B1 (ko) | 2005-07-29 |
AU2003273115A1 (en) | 2005-01-21 |
BR0318323A (pt) | 2006-07-18 |
CN100447991C (zh) | 2008-12-31 |
EP1639301A1 (en) | 2006-03-29 |
JP2006526128A (ja) | 2006-11-16 |
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Legal Events
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FA94 | Acknowledgement of application withdrawn (non-payment of fees) |
Effective date: 20080219 |