JP6997008B2 - 平板型ループヒートパイプ - Google Patents
平板型ループヒートパイプ Download PDFInfo
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- JP6997008B2 JP6997008B2 JP2018033585A JP2018033585A JP6997008B2 JP 6997008 B2 JP6997008 B2 JP 6997008B2 JP 2018033585 A JP2018033585 A JP 2018033585A JP 2018033585 A JP2018033585 A JP 2018033585A JP 6997008 B2 JP6997008 B2 JP 6997008B2
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- JP
- Japan
- Prior art keywords
- wick
- flow path
- condenser
- flat plate
- working fluid
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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Classifications
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F28—HEAT EXCHANGE IN GENERAL
- F28D—HEAT-EXCHANGE APPARATUS, NOT PROVIDED FOR IN ANOTHER SUBCLASS, IN WHICH THE HEAT-EXCHANGE MEDIA DO NOT COME INTO DIRECT CONTACT
- F28D15/00—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies
- F28D15/02—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes
- F28D15/04—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes with tubes having a capillary structure
- F28D15/043—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes with tubes having a capillary structure forming loops, e.g. capillary pumped loops
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F28—HEAT EXCHANGE IN GENERAL
- F28D—HEAT-EXCHANGE APPARATUS, NOT PROVIDED FOR IN ANOTHER SUBCLASS, IN WHICH THE HEAT-EXCHANGE MEDIA DO NOT COME INTO DIRECT CONTACT
- F28D15/00—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies
- F28D15/02—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes
- F28D15/0233—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes the conduits having a particular shape, e.g. non-circular cross-section, annular
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F28—HEAT EXCHANGE IN GENERAL
- F28D—HEAT-EXCHANGE APPARATUS, NOT PROVIDED FOR IN ANOTHER SUBCLASS, IN WHICH THE HEAT-EXCHANGE MEDIA DO NOT COME INTO DIRECT CONTACT
- F28D15/00—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies
- F28D15/02—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes
- F28D15/0266—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes with separate evaporating and condensing chambers connected by at least one conduit; Loop-type heat pipes; with multiple or common evaporating or condensing chambers
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F28—HEAT EXCHANGE IN GENERAL
- F28D—HEAT-EXCHANGE APPARATUS, NOT PROVIDED FOR IN ANOTHER SUBCLASS, IN WHICH THE HEAT-EXCHANGE MEDIA DO NOT COME INTO DIRECT CONTACT
- F28D15/00—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies
- F28D15/02—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes
- F28D15/04—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes with tubes having a capillary structure
- F28D15/046—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes with tubes having a capillary structure characterised by the material or the construction of the capillary structure
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F28—HEAT EXCHANGE IN GENERAL
- F28F—DETAILS OF HEAT-EXCHANGE AND HEAT-TRANSFER APPARATUS, OF GENERAL APPLICATION
- F28F21/00—Constructions of heat-exchange apparatus characterised by the selection of particular materials
- F28F21/08—Constructions of heat-exchange apparatus characterised by the selection of particular materials of metal
- F28F21/089—Coatings, claddings or bonding layers made from metals or metal alloys
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F28—HEAT EXCHANGE IN GENERAL
- F28F—DETAILS OF HEAT-EXCHANGE AND HEAT-TRANSFER APPARATUS, OF GENERAL APPLICATION
- F28F3/00—Plate-like or laminated elements; Assemblies of plate-like or laminated elements
- F28F3/08—Elements constructed for building-up into stacks, e.g. capable of being taken apart for cleaning
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F28—HEAT EXCHANGE IN GENERAL
- F28F—DETAILS OF HEAT-EXCHANGE AND HEAT-TRANSFER APPARATUS, OF GENERAL APPLICATION
- F28F3/00—Plate-like or laminated elements; Assemblies of plate-like or laminated elements
- F28F3/08—Elements constructed for building-up into stacks, e.g. capable of being taken apart for cleaning
- F28F3/086—Elements constructed for building-up into stacks, e.g. capable of being taken apart for cleaning having one or more openings therein forming tubular heat-exchange passages
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F28—HEAT EXCHANGE IN GENERAL
- F28F—DETAILS OF HEAT-EXCHANGE AND HEAT-TRANSFER APPARATUS, OF GENERAL APPLICATION
- F28F3/00—Plate-like or laminated elements; Assemblies of plate-like or laminated elements
- F28F3/12—Elements constructed in the shape of a hollow panel, e.g. with channels
-
- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06F—ELECTRIC DIGITAL DATA PROCESSING
- G06F1/00—Details not covered by groups G06F3/00 - G06F13/00 and G06F21/00
- G06F1/16—Constructional details or arrangements
- G06F1/20—Cooling means
- G06F1/203—Cooling means for portable computers, e.g. for laptops
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/42—Fillings or auxiliary members in containers or encapsulations selected or arranged to facilitate heating or cooling
- H01L23/427—Cooling by change of state, e.g. use of heat pipes
Landscapes
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Thermal Sciences (AREA)
- Mechanical Engineering (AREA)
- General Engineering & Computer Science (AREA)
- Life Sciences & Earth Sciences (AREA)
- Sustainable Development (AREA)
- Cooling Or The Like Of Electrical Apparatus (AREA)
- Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
Description
なお、添付図面は、理解を容易にするために構成要素を拡大して示している場合がある。構成要素の寸法比率は実際のものと、または別の図面中のものと異なる場合がある。また、平面図や断面図では、理解を容易にするためにハッチングを付しているが、一部の構成要素のハッチングを省略している場合がある。
図3(a)~図3(c)に示す金属層41~43(44~46)は、例えば厚さが100μmの銅層を、例えばウエットエッチングにより所定の形状にパターニングすることで作成される。
次に、本実施形態に係る平板型ループヒートパイプの実装構造について、図1や図6を用いて説明する。
電子機器100は、筐体101と、筐体101に収容された配線基板110とを有している。配線基板110は、図示しない支持部により、筐体101の内面101aから離間した位置に配設されている。配線基板110の上面には、発熱部品111が実装されている。発熱部品111は、例えば、CPU(Central Processing Unit)やGPU(Graphics Processing Unit)等の半導体装置、等である。
(1)平板型ループヒートパイプ10は、作動流体Cを気化させる蒸発器11と、作動流体C(蒸気Cv)を液化する凝縮器13と、蒸発器11と凝縮器13とを接続する蒸気管12と、凝縮器13と蒸発器11とを接続し、内部にウィック14tを有する液管14とを有している。凝縮器13は、蒸気管12と液管14とを接続する流路13rが形成された流路部13Aと、流路13rに接すると共に、流路13rから平面方向に延びるウィック13tを有するウィック部13Bとを有している。ウィック部13Bに折り曲げ位置BPが設定され、その折り曲げ位置BPにおいて平板型ループヒートパイプ10が折り曲げられる。ウィック部13Bの内部のウィック13tは、支柱として機能するため、凝縮器13における流路が潰れ難く、折り曲げの影響を受け難い。このため、作動流体Cの流路21を確保できる。
尚、上記実施形態は、以下の態様で実施してもよい。
・上記実施形態に対し、凝縮器13のウィック部13Bに含まれるウィック13tの構成を適宜変更してもよい。
・上記実施形態及び上記変形例の一部を適宜公知の構成で置き換えても良い。また、上記実施形態及び上記変形例は、適宜その一部又は全部を他の形態、変形例と組み合わせてもよい。
12 蒸気管
13 凝縮器
13A 流路部
13B ウィック部
13t ウィック(第2のウィック)
13r 流路
14 液管
14t ウィック(第1のウィック)
C 作動流体
Claims (4)
- 作動流体を気化させる蒸発器と、
作動流体を液化する凝縮器と、
前記蒸発器と前記凝縮器とを接続する蒸気管と、
前記凝縮器と前記蒸発器とを接続し、内部に第1のウィックを有する液管と、
を有し、
前記凝縮器は、
内部に前記蒸気管と前記液管とを接続する流路が形成された流路部と、
内部に、前記流路に接すると共に前記流路から平面方向に延び、前記第1のウィックと接続された第2のウィックを有するウィック部と、
を有し、
前記凝縮器は、前記ウィック部にて平板を起こす方向に折り曲げられていること、
を特徴とする平板型ループヒートパイプ。 - 前記第1のウィックは、前記第2のウィックよりも前記液化した作動流体に対して生じる毛細管力が高いことを特徴とする請求項1に記載の平板型ループヒートパイプ。
- 前記蒸発器、前記蒸気管、前記凝縮器、及び前記液管は、一対の最外金属層と、前記一対の最外金属層の間に積層された複数の中間金属層からなることを特徴とする請求項1又は2に記載の平板型ループヒートパイプ。
- 前記第2のウィックは、隣接する前記中間金属層に形成され、平面視において互いに直交する方向に延びる溝を有することを特徴とする請求項3に記載の平板型ループヒートパイプ。
Priority Applications (5)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2018033585A JP6997008B2 (ja) | 2018-02-27 | 2018-02-27 | 平板型ループヒートパイプ |
US16/277,855 US11143461B2 (en) | 2018-02-27 | 2019-02-15 | Flat loop heat pipe |
CN201910129806.3A CN110195988B (zh) | 2018-02-27 | 2019-02-21 | 平板型环路热管 |
EP19158948.0A EP3531054B1 (en) | 2018-02-27 | 2019-02-22 | Flat loop heat pipe |
US17/485,132 US20220011055A1 (en) | 2018-02-27 | 2021-09-24 | Flat loop heat pipe |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2018033585A JP6997008B2 (ja) | 2018-02-27 | 2018-02-27 | 平板型ループヒートパイプ |
Publications (2)
Publication Number | Publication Date |
---|---|
JP2019148374A JP2019148374A (ja) | 2019-09-05 |
JP6997008B2 true JP6997008B2 (ja) | 2022-01-17 |
Family
ID=65529587
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2018033585A Active JP6997008B2 (ja) | 2018-02-27 | 2018-02-27 | 平板型ループヒートパイプ |
Country Status (4)
Country | Link |
---|---|
US (2) | US11143461B2 (ja) |
EP (1) | EP3531054B1 (ja) |
JP (1) | JP6997008B2 (ja) |
CN (1) | CN110195988B (ja) |
Families Citing this family (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN116007417B (zh) * | 2022-03-18 | 2024-05-28 | 山东大学 | 一种梭形阵列翅片蒸发器及其环路热管 |
CN115993065B (zh) * | 2022-03-18 | 2024-05-14 | 山东大学 | 一种鱼骨状微通道蒸发器及其环路热管 |
CN115876010B (zh) * | 2022-03-18 | 2024-05-10 | 山东大学 | 一种组合形成的环路热管 |
CN116007416B (zh) * | 2022-03-18 | 2024-05-10 | 山东大学 | 一种歧管蒸发器环路热管 |
Citations (4)
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JP2005106313A (ja) | 2003-09-29 | 2005-04-21 | Nec Toshiba Space Systems Ltd | ループヒートパイプ用蒸発器 |
JP2006261472A (ja) | 2005-03-18 | 2006-09-28 | Sony Corp | 熱輸送装置、電子機器及び熱輸送装置の製造方法 |
JP2008281275A (ja) | 2007-05-10 | 2008-11-20 | Toshiba Corp | ループヒートパイプ、冷却装置、電子機器 |
JP3170065U (ja) | 2011-06-20 | 2011-09-01 | 奇▲こう▼科技股▲ふん▼有限公司 | 板型ヒートパイプの構造 |
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-
2018
- 2018-02-27 JP JP2018033585A patent/JP6997008B2/ja active Active
-
2019
- 2019-02-15 US US16/277,855 patent/US11143461B2/en active Active
- 2019-02-21 CN CN201910129806.3A patent/CN110195988B/zh active Active
- 2019-02-22 EP EP19158948.0A patent/EP3531054B1/en active Active
-
2021
- 2021-09-24 US US17/485,132 patent/US20220011055A1/en not_active Abandoned
Patent Citations (4)
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JP2005106313A (ja) | 2003-09-29 | 2005-04-21 | Nec Toshiba Space Systems Ltd | ループヒートパイプ用蒸発器 |
JP2006261472A (ja) | 2005-03-18 | 2006-09-28 | Sony Corp | 熱輸送装置、電子機器及び熱輸送装置の製造方法 |
JP2008281275A (ja) | 2007-05-10 | 2008-11-20 | Toshiba Corp | ループヒートパイプ、冷却装置、電子機器 |
JP3170065U (ja) | 2011-06-20 | 2011-09-01 | 奇▲こう▼科技股▲ふん▼有限公司 | 板型ヒートパイプの構造 |
Also Published As
Publication number | Publication date |
---|---|
JP2019148374A (ja) | 2019-09-05 |
EP3531054B1 (en) | 2021-07-28 |
CN110195988B (zh) | 2022-08-02 |
US20190264989A1 (en) | 2019-08-29 |
CN110195988A (zh) | 2019-09-03 |
US11143461B2 (en) | 2021-10-12 |
US20220011055A1 (en) | 2022-01-13 |
EP3531054A1 (en) | 2019-08-28 |
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