AU2003273115A1 - Cooling device of thin plate type for preventing dry-out - Google Patents
Cooling device of thin plate type for preventing dry-outInfo
- Publication number
- AU2003273115A1 AU2003273115A1 AU2003273115A AU2003273115A AU2003273115A1 AU 2003273115 A1 AU2003273115 A1 AU 2003273115A1 AU 2003273115 A AU2003273115 A AU 2003273115A AU 2003273115 A AU2003273115 A AU 2003273115A AU 2003273115 A1 AU2003273115 A1 AU 2003273115A1
- Authority
- AU
- Australia
- Prior art keywords
- cooling device
- thin plate
- plate type
- preventing dry
- dry
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Abandoned
Links
Classifications
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F28—HEAT EXCHANGE IN GENERAL
- F28F—DETAILS OF HEAT-EXCHANGE AND HEAT-TRANSFER APPARATUS, OF GENERAL APPLICATION
- F28F3/00—Plate-like or laminated elements; Assemblies of plate-like or laminated elements
- F28F3/12—Elements constructed in the shape of a hollow panel, e.g. with channels
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F28—HEAT EXCHANGE IN GENERAL
- F28D—HEAT-EXCHANGE APPARATUS, NOT PROVIDED FOR IN ANOTHER SUBCLASS, IN WHICH THE HEAT-EXCHANGE MEDIA DO NOT COME INTO DIRECT CONTACT
- F28D15/00—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies
- F28D15/02—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B82—NANOTECHNOLOGY
- B82Y—SPECIFIC USES OR APPLICATIONS OF NANOSTRUCTURES; MEASUREMENT OR ANALYSIS OF NANOSTRUCTURES; MANUFACTURE OR TREATMENT OF NANOSTRUCTURES
- B82Y30/00—Nanotechnology for materials or surface science, e.g. nanocomposites
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F28—HEAT EXCHANGE IN GENERAL
- F28D—HEAT-EXCHANGE APPARATUS, NOT PROVIDED FOR IN ANOTHER SUBCLASS, IN WHICH THE HEAT-EXCHANGE MEDIA DO NOT COME INTO DIRECT CONTACT
- F28D15/00—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies
- F28D15/02—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes
- F28D15/0233—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes the conduits having a particular shape, e.g. non-circular cross-section, annular
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F28—HEAT EXCHANGE IN GENERAL
- F28D—HEAT-EXCHANGE APPARATUS, NOT PROVIDED FOR IN ANOTHER SUBCLASS, IN WHICH THE HEAT-EXCHANGE MEDIA DO NOT COME INTO DIRECT CONTACT
- F28D15/00—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies
- F28D15/02—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes
- F28D15/0266—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes with separate evaporating and condensing chambers connected by at least one conduit; Loop-type heat pipes; with multiple or common evaporating or condensing chambers
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/42—Fillings or auxiliary members in containers or encapsulations selected or arranged to facilitate heating or cooling
- H01L23/427—Cooling by change of state, e.g. use of heat pipes
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/46—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids
- H01L23/473—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids by flowing liquids
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F25—REFRIGERATION OR COOLING; COMBINED HEATING AND REFRIGERATION SYSTEMS; HEAT PUMP SYSTEMS; MANUFACTURE OR STORAGE OF ICE; LIQUEFACTION SOLIDIFICATION OF GASES
- F25B—REFRIGERATION MACHINES, PLANTS OR SYSTEMS; COMBINED HEATING AND REFRIGERATION SYSTEMS; HEAT PUMP SYSTEMS
- F25B2339/00—Details of evaporators; Details of condensers
- F25B2339/02—Details of evaporators
- F25B2339/021—Evaporators in which refrigerant is sprayed on a surface to be cooled
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F28—HEAT EXCHANGE IN GENERAL
- F28F—DETAILS OF HEAT-EXCHANGE AND HEAT-TRANSFER APPARATUS, OF GENERAL APPLICATION
- F28F2245/00—Coatings; Surface treatments
- F28F2245/02—Coatings; Surface treatments hydrophilic
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F28—HEAT EXCHANGE IN GENERAL
- F28F—DETAILS OF HEAT-EXCHANGE AND HEAT-TRANSFER APPARATUS, OF GENERAL APPLICATION
- F28F2245/00—Coatings; Surface treatments
- F28F2245/04—Coatings; Surface treatments hydrophobic
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F28—HEAT EXCHANGE IN GENERAL
- F28F—DETAILS OF HEAT-EXCHANGE AND HEAT-TRANSFER APPARATUS, OF GENERAL APPLICATION
- F28F2270/00—Thermal insulation; Thermal decoupling
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/30—Technical effects
- H01L2924/301—Electrical effects
- H01L2924/3011—Impedance
Landscapes
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- General Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- Thermal Sciences (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Chemical & Material Sciences (AREA)
- Life Sciences & Earth Sciences (AREA)
- Sustainable Development (AREA)
- Computer Hardware Design (AREA)
- Nanotechnology (AREA)
- Power Engineering (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Crystallography & Structural Chemistry (AREA)
- Materials Engineering (AREA)
- Composite Materials (AREA)
- Cooling Or The Like Of Electrical Apparatus (AREA)
- Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
Applications Claiming Priority (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
KR10-2003-0035078A KR100505279B1 (en) | 2003-05-31 | 2003-05-31 | Cooling device of thin plate type for preventing dry-out |
KR10-2003-0035078 | 2003-05-31 | ||
PCT/KR2003/002281 WO2004106822A1 (en) | 2003-05-31 | 2003-10-28 | Cooling device of thin plate type for preventing dry-out |
Publications (1)
Publication Number | Publication Date |
---|---|
AU2003273115A1 true AU2003273115A1 (en) | 2005-01-21 |
Family
ID=36659730
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
AU2003273115A Abandoned AU2003273115A1 (en) | 2003-05-31 | 2003-10-28 | Cooling device of thin plate type for preventing dry-out |
Country Status (9)
Country | Link |
---|---|
US (1) | US20060157227A1 (en) |
EP (1) | EP1639301A1 (en) |
JP (1) | JP2006526128A (en) |
KR (1) | KR100505279B1 (en) |
CN (1) | CN100447991C (en) |
AU (1) | AU2003273115A1 (en) |
BR (1) | BR0318323A (en) |
RU (1) | RU2005137166A (en) |
WO (1) | WO2004106822A1 (en) |
Families Citing this family (64)
Publication number | Priority date | Publication date | Assignee | Title |
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KR100659582B1 (en) * | 2004-12-10 | 2006-12-20 | 한국전자통신연구원 | Loop type micro heat transport device |
JP2007120399A (en) * | 2005-10-27 | 2007-05-17 | Konica Minolta Medical & Graphic Inc | Micro fluid chip and micro comprehensive analysis system |
US20070151708A1 (en) * | 2005-12-30 | 2007-07-05 | Touzov Igor V | Heat pipes with self assembled compositions |
WO2007102498A1 (en) * | 2006-03-06 | 2007-09-13 | Tokyo University Of Science Educational Foundation Administrative Organization | Method of ebullient cooling, ebullient cooling apparatus, flow channel structure and application product thereof |
US7824075B2 (en) | 2006-06-08 | 2010-11-02 | Lighting Science Group Corporation | Method and apparatus for cooling a lightbulb |
US8042606B2 (en) * | 2006-08-09 | 2011-10-25 | Utah State University Research Foundation | Minimal-temperature-differential, omni-directional-reflux, heat exchanger |
WO2008050894A1 (en) * | 2006-10-27 | 2008-05-02 | Canon Kabushiki Kaisha | Heat transfer controlling mechanism and fuel cell system having the heat transfer controlling mechanism |
KR100912538B1 (en) * | 2007-12-04 | 2009-08-18 | 한국전자통신연구원 | The flat plate type micro heat transport device |
ITTV20080145A1 (en) * | 2008-11-14 | 2010-05-15 | Uniheat Srl | CLOSED OSCILLATING HEAT PIPE SYSTEM IN POLYMERIC MATERIAL |
DE202009019071U1 (en) * | 2009-02-17 | 2016-03-17 | Gudrun Stemke | Evaporator and cooler using such evaporator |
WO2010123210A2 (en) * | 2009-04-21 | 2010-10-28 | 주식회사 유나티앤이 | Photovoltaic module with cooling device and manufacturing method of cooling device |
WO2010124025A2 (en) * | 2009-04-21 | 2010-10-28 | Duke University | Thermal diode device and methods |
WO2010150064A1 (en) | 2009-05-18 | 2010-12-29 | Huawei Technologies Co. Ltd. | Heat spreading device and method therefore |
WO2010145074A1 (en) * | 2009-06-17 | 2010-12-23 | 华为技术有限公司 | Heat dissipation device and radio frequency module with same |
US20110024085A1 (en) * | 2009-07-28 | 2011-02-03 | Huang Yu-Po | Heat pipe and method for manufacturing the same |
FR2950134B1 (en) * | 2009-09-14 | 2011-12-09 | Commissariat Energie Atomique | THERMAL EXCHANGE DEVICE WITH ENHANCED CONVECTIVE BOILING AND IMPROVED EFFICIENCY |
TW201128154A (en) * | 2010-02-12 | 2011-08-16 | Micro Base Technology Corp | Cooling and heat-dissipation system, and cooling device thereof |
JP5714836B2 (en) * | 2010-04-17 | 2015-05-07 | モレックス インコーポレイテドMolex Incorporated | Heat transport unit, electronic board, electronic equipment |
KR101205715B1 (en) * | 2010-05-24 | 2012-11-28 | 한국과학기술원 | Heat spreader with flat plate and manufacturing method thereof |
TW201040479A (en) * | 2010-07-21 | 2010-11-16 | Asia Vital Components Co Ltd | Heat plate driven by pressure difference |
TWI436019B (en) * | 2010-07-21 | 2014-05-01 | Asia Vital Components Co Ltd | The structure of the heat siphon plate is improved |
TWI423015B (en) * | 2010-07-21 | 2014-01-11 | Asia Vital Components Co Ltd | Pressure gradient driven thin plate type low pressure heat siphon plate |
DE102011015097B4 (en) * | 2011-03-15 | 2013-10-24 | Asia Vital Components Co., Ltd. | Cooling unit with hydrophilic compound layer |
JPWO2013005622A1 (en) * | 2011-07-07 | 2015-02-23 | 日本電気株式会社 | Cooling device and manufacturing method thereof |
JP2013069740A (en) * | 2011-09-21 | 2013-04-18 | Nec Corp | Flat plate type cooling device and usage of the same |
WO2013051587A1 (en) * | 2011-10-04 | 2013-04-11 | 日本電気株式会社 | Flat-plate cooling device and method for using same |
US9506699B2 (en) * | 2012-02-22 | 2016-11-29 | Asia Vital Components Co., Ltd. | Heat pipe structure |
US8842435B2 (en) | 2012-05-15 | 2014-09-23 | Toyota Motor Engineering & Manufacturing North America, Inc. | Two-phase heat transfer assemblies and power electronics incorporating the same |
JP6070036B2 (en) * | 2012-10-05 | 2017-02-01 | 富士通株式会社 | Loop thermosyphon and electronic equipment |
US20140246176A1 (en) * | 2013-03-04 | 2014-09-04 | Asia Vital Components Co., Ltd. | Heat dissipation structure |
JP6121854B2 (en) * | 2013-09-18 | 2017-04-26 | 東芝ホームテクノ株式会社 | Sheet-type heat pipe or personal digital assistant |
JP6183090B2 (en) * | 2013-09-18 | 2017-08-23 | 富士通株式会社 | Heat pipe and heat pipe manufacturing method |
JP6146484B2 (en) * | 2013-12-13 | 2017-06-14 | 富士通株式会社 | Loop-type heat pipe, manufacturing method thereof, and electronic device |
JP6121893B2 (en) | 2013-12-24 | 2017-04-26 | 東芝ホームテクノ株式会社 | Sheet type heat pipe |
JP6206389B2 (en) | 2014-04-08 | 2017-10-04 | トヨタ自動車株式会社 | heat pipe |
JP6101728B2 (en) * | 2015-03-30 | 2017-03-22 | 株式会社フジクラ | Vapor chamber |
JP2017035953A (en) * | 2015-08-07 | 2017-02-16 | 株式会社フジクラ | Vehicular air conditioner |
WO2017104819A1 (en) * | 2015-12-18 | 2017-06-22 | 株式会社フジクラ | Vapor chamber |
US10353445B2 (en) * | 2016-04-11 | 2019-07-16 | Qualcomm Incorporated | Multi-phase heat dissipating device for an electronic device |
US10746474B2 (en) | 2016-04-11 | 2020-08-18 | Qualcomm Incorporated | Multi-phase heat dissipating device comprising piezo structures |
JP6648824B2 (en) * | 2016-05-23 | 2020-02-14 | 富士通株式会社 | Loop heat pipe, method for manufacturing the same, and electronic equipment |
US10568240B2 (en) * | 2016-06-30 | 2020-02-18 | Ford Global Technologies, Llc | Coolant flow distribution using coating materials |
JPWO2018043442A1 (en) * | 2016-08-30 | 2019-06-24 | パナソニックIpマネジメント株式会社 | Cooling device and electronic device using the same |
EP3510849B1 (en) * | 2017-02-03 | 2023-08-30 | Hewlett-Packard Development Company, L.P. | Thermal control with vapor and isolation chambers |
US10760672B2 (en) * | 2017-03-29 | 2020-09-01 | Ford Global Technologies, Llc | Coolant system pressure drop reduction |
JP6863058B2 (en) * | 2017-05-09 | 2021-04-21 | 富士通株式会社 | Heat pipes and electronic devices |
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CN109671688B (en) * | 2017-10-16 | 2020-08-28 | 中车株洲电力机车研究所有限公司 | Refrigerant phase change cold plate |
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JP6997008B2 (en) * | 2018-02-27 | 2022-01-17 | 新光電気工業株式会社 | Flat plate loop heat pipe |
JP7015197B2 (en) * | 2018-03-26 | 2022-02-02 | 新光電気工業株式会社 | Loop type heat pipe and its manufacturing method |
CN110440619A (en) * | 2018-05-04 | 2019-11-12 | 泰硕电子股份有限公司 | Communicated the joint temperature-uniforming plate assemblies of multiple temperature-uniforming plates with extending capillary layer |
CN110440618A (en) * | 2018-05-04 | 2019-11-12 | 泰硕电子股份有限公司 | The circuit temperature-uniforming plate that liquid, vapour separate |
US20190353431A1 (en) * | 2018-05-18 | 2019-11-21 | Microsoft Technology Licensing, Llc | Two-phase thermodynamic system having compensational wick geometry to enhance fluid flow |
US11181323B2 (en) | 2019-02-21 | 2021-11-23 | Qualcomm Incorporated | Heat-dissipating device with interfacial enhancements |
CN109764706B (en) * | 2019-03-12 | 2024-04-26 | 山东省科学院能源研究所 | Microchannel heat exchanger structure with spray pipe and working method |
CN110243217B (en) * | 2019-05-05 | 2020-06-26 | 山东大学 | Flat plate type loop heat pipe evaporator with enclosed liquid storage chamber |
TWI716932B (en) * | 2019-07-10 | 2021-01-21 | 汎海科技股份有限公司 | Dissapating plate, manufactuing method therefor and electronic device having the same |
WO2022099089A1 (en) * | 2020-11-05 | 2022-05-12 | Deeia, Inc. | Loop thermosyphon devices and systems, and related methods |
US11812582B2 (en) * | 2020-11-09 | 2023-11-07 | Baidu Usa Llc | Symmetrical cold plate design |
FI20215154A1 (en) * | 2021-02-15 | 2022-08-16 | Teknologian Tutkimuskeskus Vtt Oy | Heat dissipation apparatus |
WO2023049763A1 (en) * | 2021-09-21 | 2023-03-30 | Sharfi Benjamin K | Dual conduction thermal solution |
CN114916193B (en) * | 2022-04-24 | 2024-01-09 | 大连保税区金宝至电子有限公司 | Method for conveying liquid against gravity and heat dissipating device |
WO2024092617A1 (en) * | 2022-11-03 | 2024-05-10 | Nokia Shanghai Bell Co., Ltd. | Heat exchange apparatus and manufacturing method thereof |
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US4392362A (en) * | 1979-03-23 | 1983-07-12 | The Board Of Trustees Of The Leland Stanford Junior University | Micro miniature refrigerators |
JP3549933B2 (en) * | 1995-01-27 | 2004-08-04 | 住友精密工業株式会社 | Plate fin type element cooler |
JPH11307704A (en) * | 1998-04-27 | 1999-11-05 | Denso Corp | Boiling and cooling device |
JP2000049265A (en) * | 1998-07-31 | 2000-02-18 | Denso Corp | Boiling cooler |
JP2001227852A (en) * | 2000-02-16 | 2001-08-24 | Komatsu Ltd | Thermal insulating panel |
WO2002014774A2 (en) * | 2000-08-17 | 2002-02-21 | Ocean Power Corporation | Heat exchange element with hydrophilic evaporator surface |
US6437981B1 (en) * | 2000-11-30 | 2002-08-20 | Harris Corporation | Thermally enhanced microcircuit package and method of forming same |
US6976527B2 (en) * | 2001-07-17 | 2005-12-20 | The Regents Of The University Of California | MEMS microcapillary pumped loop for chip-level temperature control |
JP2003042672A (en) * | 2001-07-31 | 2003-02-13 | Denso Corp | Ebullient cooling device |
KR100414860B1 (en) * | 2001-08-29 | 2004-01-13 | (주)아이큐리랩 | Cooling device of thin plate type |
JP4032954B2 (en) * | 2002-07-05 | 2008-01-16 | ソニー株式会社 | COOLING DEVICE, ELECTRONIC DEVICE DEVICE, SOUND DEVICE, AND COOLING DEVICE MANUFACTURING METHOD |
US7188484B2 (en) * | 2003-06-09 | 2007-03-13 | Lg Electronics Inc. | Heat dissipating structure for mobile device |
-
2003
- 2003-05-31 KR KR10-2003-0035078A patent/KR100505279B1/en not_active IP Right Cessation
- 2003-10-28 EP EP03754299A patent/EP1639301A1/en not_active Withdrawn
- 2003-10-28 JP JP2005500269A patent/JP2006526128A/en active Pending
- 2003-10-28 US US10/559,042 patent/US20060157227A1/en not_active Abandoned
- 2003-10-28 WO PCT/KR2003/002281 patent/WO2004106822A1/en active Application Filing
- 2003-10-28 CN CNB2003801103289A patent/CN100447991C/en not_active Expired - Fee Related
- 2003-10-28 AU AU2003273115A patent/AU2003273115A1/en not_active Abandoned
- 2003-10-28 BR BRPI0318323-8A patent/BR0318323A/en not_active IP Right Cessation
- 2003-10-28 RU RU2005137166/12A patent/RU2005137166A/en not_active Application Discontinuation
Also Published As
Publication number | Publication date |
---|---|
JP2006526128A (en) | 2006-11-16 |
CN100447991C (en) | 2008-12-31 |
KR100505279B1 (en) | 2005-07-29 |
RU2005137166A (en) | 2006-06-10 |
EP1639301A1 (en) | 2006-03-29 |
BR0318323A (en) | 2006-07-18 |
US20060157227A1 (en) | 2006-07-20 |
WO2004106822A1 (en) | 2004-12-09 |
CN1781007A (en) | 2006-05-31 |
KR20040103151A (en) | 2004-12-08 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
MK6 | Application lapsed section 142(2)(f)/reg. 8.3(3) - pct applic. not entering national phase |