KR100505279B1 - 드라이 아웃이 방지된 박판형 냉각장치 - Google Patents

드라이 아웃이 방지된 박판형 냉각장치 Download PDF

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Publication number
KR100505279B1
KR100505279B1 KR10-2003-0035078A KR20030035078A KR100505279B1 KR 100505279 B1 KR100505279 B1 KR 100505279B1 KR 20030035078 A KR20030035078 A KR 20030035078A KR 100505279 B1 KR100505279 B1 KR 100505279B1
Authority
KR
South Korea
Prior art keywords
refrigerant
thin plate
liquid refrigerant
liquid
evaporator
Prior art date
Application number
KR10-2003-0035078A
Other languages
English (en)
Korean (ko)
Other versions
KR20040103151A (ko
Inventor
박지황
Original Assignee
아이큐리랩 홀딩스 리미티드
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority to KR10-2003-0035078A priority Critical patent/KR100505279B1/ko
Application filed by 아이큐리랩 홀딩스 리미티드 filed Critical 아이큐리랩 홀딩스 리미티드
Priority to US10/559,042 priority patent/US20060157227A1/en
Priority to PCT/KR2003/002281 priority patent/WO2004106822A1/en
Priority to AU2003273115A priority patent/AU2003273115A1/en
Priority to BRPI0318323-8A priority patent/BR0318323A/pt
Priority to EP03754299A priority patent/EP1639301A1/en
Priority to RU2005137166/12A priority patent/RU2005137166A/ru
Priority to JP2005500269A priority patent/JP2006526128A/ja
Priority to CNB2003801103289A priority patent/CN100447991C/zh
Publication of KR20040103151A publication Critical patent/KR20040103151A/ko
Application granted granted Critical
Publication of KR100505279B1 publication Critical patent/KR100505279B1/ko

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Classifications

    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28—HEAT EXCHANGE IN GENERAL
    • F28F—DETAILS OF HEAT-EXCHANGE AND HEAT-TRANSFER APPARATUS, OF GENERAL APPLICATION
    • F28F3/00—Plate-like or laminated elements; Assemblies of plate-like or laminated elements
    • F28F3/12—Elements constructed in the shape of a hollow panel, e.g. with channels
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28—HEAT EXCHANGE IN GENERAL
    • F28D—HEAT-EXCHANGE APPARATUS, NOT PROVIDED FOR IN ANOTHER SUBCLASS, IN WHICH THE HEAT-EXCHANGE MEDIA DO NOT COME INTO DIRECT CONTACT
    • F28D15/00—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies
    • F28D15/02—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B82—NANOTECHNOLOGY
    • B82Y—SPECIFIC USES OR APPLICATIONS OF NANOSTRUCTURES; MEASUREMENT OR ANALYSIS OF NANOSTRUCTURES; MANUFACTURE OR TREATMENT OF NANOSTRUCTURES
    • B82Y30/00—Nanotechnology for materials or surface science, e.g. nanocomposites
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28—HEAT EXCHANGE IN GENERAL
    • F28D—HEAT-EXCHANGE APPARATUS, NOT PROVIDED FOR IN ANOTHER SUBCLASS, IN WHICH THE HEAT-EXCHANGE MEDIA DO NOT COME INTO DIRECT CONTACT
    • F28D15/00—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies
    • F28D15/02—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes
    • F28D15/0233—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes the conduits having a particular shape, e.g. non-circular cross-section, annular
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28—HEAT EXCHANGE IN GENERAL
    • F28D—HEAT-EXCHANGE APPARATUS, NOT PROVIDED FOR IN ANOTHER SUBCLASS, IN WHICH THE HEAT-EXCHANGE MEDIA DO NOT COME INTO DIRECT CONTACT
    • F28D15/00—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies
    • F28D15/02—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes
    • F28D15/0266—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes with separate evaporating and condensing chambers connected by at least one conduit; Loop-type heat pipes; with multiple or common evaporating or condensing chambers
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/42—Fillings or auxiliary members in containers or encapsulations selected or arranged to facilitate heating or cooling
    • H01L23/427—Cooling by change of state, e.g. use of heat pipes
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/46—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids
    • H01L23/473—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids by flowing liquids
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F25—REFRIGERATION OR COOLING; COMBINED HEATING AND REFRIGERATION SYSTEMS; HEAT PUMP SYSTEMS; MANUFACTURE OR STORAGE OF ICE; LIQUEFACTION SOLIDIFICATION OF GASES
    • F25B—REFRIGERATION MACHINES, PLANTS OR SYSTEMS; COMBINED HEATING AND REFRIGERATION SYSTEMS; HEAT PUMP SYSTEMS
    • F25B2339/00—Details of evaporators; Details of condensers
    • F25B2339/02—Details of evaporators
    • F25B2339/021—Evaporators in which refrigerant is sprayed on a surface to be cooled
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28—HEAT EXCHANGE IN GENERAL
    • F28F—DETAILS OF HEAT-EXCHANGE AND HEAT-TRANSFER APPARATUS, OF GENERAL APPLICATION
    • F28F2245/00—Coatings; Surface treatments
    • F28F2245/02—Coatings; Surface treatments hydrophilic
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28—HEAT EXCHANGE IN GENERAL
    • F28F—DETAILS OF HEAT-EXCHANGE AND HEAT-TRANSFER APPARATUS, OF GENERAL APPLICATION
    • F28F2245/00—Coatings; Surface treatments
    • F28F2245/04—Coatings; Surface treatments hydrophobic
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28—HEAT EXCHANGE IN GENERAL
    • F28F—DETAILS OF HEAT-EXCHANGE AND HEAT-TRANSFER APPARATUS, OF GENERAL APPLICATION
    • F28F2270/00—Thermal insulation; Thermal decoupling
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/30—Technical effects
    • H01L2924/301—Electrical effects
    • H01L2924/3011—Impedance

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • General Engineering & Computer Science (AREA)
  • Thermal Sciences (AREA)
  • Mechanical Engineering (AREA)
  • Chemical & Material Sciences (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Sustainable Development (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Computer Hardware Design (AREA)
  • Power Engineering (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Nanotechnology (AREA)
  • Composite Materials (AREA)
  • Crystallography & Structural Chemistry (AREA)
  • Materials Engineering (AREA)
  • Cooling Or The Like Of Electrical Apparatus (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
KR10-2003-0035078A 2003-05-31 2003-05-31 드라이 아웃이 방지된 박판형 냉각장치 KR100505279B1 (ko)

Priority Applications (9)

Application Number Priority Date Filing Date Title
KR10-2003-0035078A KR100505279B1 (ko) 2003-05-31 2003-05-31 드라이 아웃이 방지된 박판형 냉각장치
PCT/KR2003/002281 WO2004106822A1 (en) 2003-05-31 2003-10-28 Cooling device of thin plate type for preventing dry-out
AU2003273115A AU2003273115A1 (en) 2003-05-31 2003-10-28 Cooling device of thin plate type for preventing dry-out
BRPI0318323-8A BR0318323A (pt) 2003-05-31 2003-10-28 dispositivo de arrefecimento do tipo placa fina
US10/559,042 US20060157227A1 (en) 2003-05-31 2003-10-28 Cooling device of thin plate type for preventing dry-out
EP03754299A EP1639301A1 (en) 2003-05-31 2003-10-28 Cooling device of thin plate type for preventing dry-out
RU2005137166/12A RU2005137166A (ru) 2003-05-31 2003-10-28 Охлаждающее устройство пластинчатого типа для предотвращения высыхания
JP2005500269A JP2006526128A (ja) 2003-05-31 2003-10-28 ドライアウトが防止された薄板型冷却装置
CNB2003801103289A CN100447991C (zh) 2003-05-31 2003-10-28 用于防止干燥的薄板类型的冷却装置

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
KR10-2003-0035078A KR100505279B1 (ko) 2003-05-31 2003-05-31 드라이 아웃이 방지된 박판형 냉각장치

Publications (2)

Publication Number Publication Date
KR20040103151A KR20040103151A (ko) 2004-12-08
KR100505279B1 true KR100505279B1 (ko) 2005-07-29

Family

ID=36659730

Family Applications (1)

Application Number Title Priority Date Filing Date
KR10-2003-0035078A KR100505279B1 (ko) 2003-05-31 2003-05-31 드라이 아웃이 방지된 박판형 냉각장치

Country Status (9)

Country Link
US (1) US20060157227A1 (ru)
EP (1) EP1639301A1 (ru)
JP (1) JP2006526128A (ru)
KR (1) KR100505279B1 (ru)
CN (1) CN100447991C (ru)
AU (1) AU2003273115A1 (ru)
BR (1) BR0318323A (ru)
RU (1) RU2005137166A (ru)
WO (1) WO2004106822A1 (ru)

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Also Published As

Publication number Publication date
US20060157227A1 (en) 2006-07-20
WO2004106822A1 (en) 2004-12-09
CN1781007A (zh) 2006-05-31
JP2006526128A (ja) 2006-11-16
CN100447991C (zh) 2008-12-31
AU2003273115A1 (en) 2005-01-21
BR0318323A (pt) 2006-07-18
KR20040103151A (ko) 2004-12-08
EP1639301A1 (en) 2006-03-29
RU2005137166A (ru) 2006-06-10

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