RU2003133438A - Способ изготовления элементов схем для электронных приборов - Google Patents
Способ изготовления элементов схем для электронных приборов Download PDFInfo
- Publication number
- RU2003133438A RU2003133438A RU2003133438/09A RU2003133438A RU2003133438A RU 2003133438 A RU2003133438 A RU 2003133438A RU 2003133438/09 A RU2003133438/09 A RU 2003133438/09A RU 2003133438 A RU2003133438 A RU 2003133438A RU 2003133438 A RU2003133438 A RU 2003133438A
- Authority
- RU
- Russia
- Prior art keywords
- layer
- metal foil
- stage
- substrate
- composition obtained
- Prior art date
Links
- 238000004519 manufacturing process Methods 0.000 title claims abstract 3
- 238000000034 method Methods 0.000 claims abstract 13
- 239000011888 foil Substances 0.000 claims abstract 9
- 239000002184 metal Substances 0.000 claims abstract 9
- 229910052751 metal Inorganic materials 0.000 claims abstract 9
- 239000000758 substrate Substances 0.000 claims abstract 9
- 239000000203 mixture Substances 0.000 claims abstract 7
- 150000001875 compounds Chemical class 0.000 claims abstract 5
- 239000011248 coating agent Substances 0.000 claims abstract 4
- 238000000576 coating method Methods 0.000 claims abstract 4
- 239000002904 solvent Substances 0.000 claims abstract 3
- 239000007788 liquid Substances 0.000 claims abstract 2
- 239000010410 layer Substances 0.000 claims 10
- 238000001035 drying Methods 0.000 claims 3
- 239000004593 Epoxy Substances 0.000 claims 2
- 239000004848 polyfunctional curative Substances 0.000 claims 2
- 229930185605 Bisphenol Natural products 0.000 claims 1
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims 1
- 239000002253 acid Substances 0.000 claims 1
- 150000001408 amides Chemical class 0.000 claims 1
- 150000001412 amines Chemical class 0.000 claims 1
- 150000008064 anhydrides Chemical class 0.000 claims 1
- IISBACLAFKSPIT-UHFFFAOYSA-N bisphenol A Chemical compound C=1C=C(O)C=CC=1C(C)(C)C1=CC=C(O)C=C1 IISBACLAFKSPIT-UHFFFAOYSA-N 0.000 claims 1
- 239000011889 copper foil Substances 0.000 claims 1
- GYZLOYUZLJXAJU-UHFFFAOYSA-N diglycidyl ether Chemical compound C1OC1COCC1CO1 GYZLOYUZLJXAJU-UHFFFAOYSA-N 0.000 claims 1
- 239000000975 dye Substances 0.000 claims 1
- 125000003700 epoxy group Chemical group 0.000 claims 1
- 150000002148 esters Chemical class 0.000 claims 1
- 239000000945 filler Substances 0.000 claims 1
- 150000002460 imidazoles Chemical class 0.000 claims 1
- 239000005011 phenolic resin Substances 0.000 claims 1
- 229920001568 phenolic resin Polymers 0.000 claims 1
- 239000011347 resin Substances 0.000 claims 1
- 229920005989 resin Polymers 0.000 claims 1
- 239000013008 thixotropic agent Substances 0.000 claims 1
- 239000000463 material Substances 0.000 abstract 3
- 239000003795 chemical substances by application Substances 0.000 abstract 1
- 238000010438 heat treatment Methods 0.000 abstract 1
- 238000007373 indentation Methods 0.000 abstract 1
- 239000007787 solid Substances 0.000 abstract 1
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/46—Manufacturing multilayer circuits
- H05K3/4644—Manufacturing multilayer circuits by building the multilayer layer by layer, i.e. build-up multilayer circuits
- H05K3/4652—Adding a circuit layer by laminating a metal foil or a preformed metal foil pattern
- H05K3/4655—Adding a circuit layer by laminating a metal foil or a preformed metal foil pattern by using a laminate characterized by the insulating layer
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/46—Manufacturing multilayer circuits
- H05K3/4644—Manufacturing multilayer circuits by building the multilayer layer by layer, i.e. build-up multilayer circuits
- H05K3/4652—Adding a circuit layer by laminating a metal foil or a preformed metal foil pattern
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/07—Treatments involving liquids, e.g. plating, rinsing
- H05K2203/0756—Uses of liquids, e.g. rinsing, coating, dissolving
- H05K2203/0759—Forming a polymer layer by liquid coating, e.g. a non-metallic protective coating or an organic bonding layer
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T29/00—Metal working
- Y10T29/49—Method of mechanical manufacture
- Y10T29/49002—Electrical device making
- Y10T29/49117—Conductor or circuit manufacturing
- Y10T29/49124—On flat or curved insulated base, e.g., printed circuit, etc.
- Y10T29/49126—Assembling bases
Landscapes
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Laminated Bodies (AREA)
- Application Of Or Painting With Fluid Materials (AREA)
- Epoxy Resins (AREA)
- Ceramic Capacitors (AREA)
- Magnetic Ceramics (AREA)
- Compositions Of Oxide Ceramics (AREA)
- Piezo-Electric Or Mechanical Vibrators, Or Delay Or Filter Circuits (AREA)
- Design And Manufacture Of Integrated Circuits (AREA)
- Apparatuses And Processes For Manufacturing Resistors (AREA)
- Adhesives Or Adhesive Processes (AREA)
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CH944/01 | 2001-05-21 | ||
| CH9442001 | 2001-05-21 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| RU2003133438A true RU2003133438A (ru) | 2005-05-10 |
Family
ID=4549641
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| RU2003133438/09A RU2003133438A (ru) | 2001-05-21 | 2002-05-15 | Способ изготовления элементов схем для электронных приборов |
Country Status (13)
| Country | Link |
|---|---|
| US (1) | US20040216838A1 (https=) |
| EP (1) | EP1389408B1 (https=) |
| JP (1) | JP2004532116A (https=) |
| KR (1) | KR100893716B1 (https=) |
| CN (1) | CN1311722C (https=) |
| AT (1) | ATE279090T1 (https=) |
| BR (1) | BR0209971A (https=) |
| CA (1) | CA2449198A1 (https=) |
| DE (1) | DE50201239D1 (https=) |
| IL (1) | IL158699A0 (https=) |
| NO (1) | NO20035058L (https=) |
| RU (1) | RU2003133438A (https=) |
| WO (1) | WO2002096171A1 (https=) |
Families Citing this family (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US7666938B2 (en) * | 2004-12-03 | 2010-02-23 | Henkel Corporation | Nanoparticle silica filled benzoxazine compositions |
| US8029889B1 (en) | 2004-12-03 | 2011-10-04 | Henkel Corporation | Prepregs, towpregs and preforms |
| TWI294757B (en) * | 2005-07-06 | 2008-03-11 | Delta Electronics Inc | Circuit board with a through hole wire, and forming method thereof |
| US7404725B2 (en) * | 2006-07-03 | 2008-07-29 | Hall David R | Wiper for tool string direct electrical connection |
| KR101750836B1 (ko) * | 2015-10-14 | 2017-06-27 | 대덕전자 주식회사 | 캐비티 회로기판 제조방법 |
Family Cites Families (17)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CH470344A (de) * | 1966-12-02 | 1969-03-31 | Ciba Geigy | Verfahren zur Herstellung von neuen Addukten aus Polypoxiden und Polyaminen |
| US4330659A (en) * | 1980-10-06 | 1982-05-18 | Ciba-Geigy Corporation | Modified amine hardener systems |
| US4500582A (en) * | 1981-05-26 | 1985-02-19 | Ciba-Geigy Corporation | Modified amine hardener systems |
| US4540750A (en) * | 1984-09-24 | 1985-09-10 | Ciba-Geigy Corporation | Diethyl toluene diamine hardener systems |
| GB8630392D0 (en) * | 1986-12-19 | 1987-01-28 | Prestwick Circuits Ltd | Producing printed circuit boards |
| JPH02177596A (ja) * | 1988-12-28 | 1990-07-10 | Somar Corp | 多層配線板の製造方法 |
| CA2006809A1 (en) * | 1988-12-28 | 1990-06-28 | Toru Shirose | Laminate film having a thermosetting resin layer and use thereof for forming electrically insulating layer over conducting surface |
| JPH02178042A (ja) * | 1988-12-28 | 1990-07-11 | Somar Corp | 熱硬化性樹脂フイルム |
| EP0379464B1 (de) * | 1989-01-16 | 1993-02-10 | Ciba-Geigy Ag | Araliphatische Sulfoniumsalze und deren Verwendung |
| GB2259812B (en) * | 1991-09-06 | 1996-04-24 | Toa Gosei Chem Ind | Method for making multilayer printed circuit board having blind holes and resin-coated copper foil used for the method |
| TW237466B (https=) * | 1992-07-21 | 1995-01-01 | Giba Gerigy Ag | |
| JPH0722741A (ja) * | 1993-07-01 | 1995-01-24 | Japan Gore Tex Inc | カバーレイフィルム及びカバーレイフィルム被覆回路基板 |
| US6016598A (en) * | 1995-02-13 | 2000-01-25 | Akzo Nobel N.V. | Method of manufacturing a multilayer printed wire board |
| JP3084352B2 (ja) * | 1995-08-28 | 2000-09-04 | 太陽インキ製造株式会社 | 銅箔ラミネート方式ビルドアップ用絶縁樹脂組成物とこれを用いた多層プリント配線板の製造方法 |
| TW331698B (en) * | 1996-06-18 | 1998-05-11 | Hitachi Chemical Co Ltd | Multi-layered printed circuit board |
| US5837355A (en) * | 1996-11-07 | 1998-11-17 | Sumitomo Bakelite Company Limited | Multilayer printed circuit board and process for producing and using the same |
| TW399398B (en) * | 1998-01-07 | 2000-07-21 | Taiyo Ink Seizo K K | Liquid thermosetting filling composition and method for permanently filling holes in printed circuit board by the use thereof |
-
2002
- 2002-05-15 KR KR1020037014617A patent/KR100893716B1/ko not_active Expired - Fee Related
- 2002-05-15 AT AT02758197T patent/ATE279090T1/de not_active IP Right Cessation
- 2002-05-15 RU RU2003133438/09A patent/RU2003133438A/ru not_active Application Discontinuation
- 2002-05-15 CA CA002449198A patent/CA2449198A1/en not_active Abandoned
- 2002-05-15 BR BR0209971-3A patent/BR0209971A/pt not_active Application Discontinuation
- 2002-05-15 IL IL15869902A patent/IL158699A0/xx unknown
- 2002-05-15 US US10/478,546 patent/US20040216838A1/en not_active Abandoned
- 2002-05-15 EP EP02758197A patent/EP1389408B1/de not_active Expired - Lifetime
- 2002-05-15 DE DE50201239T patent/DE50201239D1/de not_active Expired - Lifetime
- 2002-05-15 WO PCT/EP2002/005348 patent/WO2002096171A1/de not_active Ceased
- 2002-05-15 JP JP2002592694A patent/JP2004532116A/ja active Pending
- 2002-05-15 CN CNB028104196A patent/CN1311722C/zh not_active Expired - Fee Related
-
2003
- 2003-11-13 NO NO20035058A patent/NO20035058L/no not_active Application Discontinuation
Also Published As
| Publication number | Publication date |
|---|---|
| JP2004532116A (ja) | 2004-10-21 |
| NO20035058D0 (no) | 2003-11-13 |
| EP1389408A1 (de) | 2004-02-18 |
| KR100893716B1 (ko) | 2009-04-17 |
| KR20040005957A (ko) | 2004-01-16 |
| IL158699A0 (en) | 2004-05-12 |
| CA2449198A1 (en) | 2002-11-28 |
| NO20035058L (no) | 2003-11-13 |
| CN1511434A (zh) | 2004-07-07 |
| ATE279090T1 (de) | 2004-10-15 |
| US20040216838A1 (en) | 2004-11-04 |
| WO2002096171A1 (de) | 2002-11-28 |
| DE50201239D1 (de) | 2004-11-11 |
| BR0209971A (pt) | 2004-04-06 |
| EP1389408B1 (de) | 2004-10-06 |
| CN1311722C (zh) | 2007-04-18 |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| FA93 | Acknowledgement of application withdrawn (no request for examination) |
Effective date: 20091224 |