KR100907366B1 - 감광성 에폭시 수지 접착제 조성물 및 그의 용도 - Google Patents
감광성 에폭시 수지 접착제 조성물 및 그의 용도 Download PDFInfo
- Publication number
- KR100907366B1 KR100907366B1 KR1020060034864A KR20060034864A KR100907366B1 KR 100907366 B1 KR100907366 B1 KR 100907366B1 KR 1020060034864 A KR1020060034864 A KR 1020060034864A KR 20060034864 A KR20060034864 A KR 20060034864A KR 100907366 B1 KR100907366 B1 KR 100907366B1
- Authority
- KR
- South Korea
- Prior art keywords
- epoxy resin
- photosensitive
- equivalent
- adhesive composition
- epoxy
- Prior art date
Links
Classifications
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
- C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
- C08G59/68—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the catalysts used
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
- C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
- C08G59/20—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the epoxy compounds used
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J163/00—Adhesives based on epoxy resins; Adhesives based on derivatives of epoxy resins
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
Landscapes
- Chemical & Material Sciences (AREA)
- Organic Chemistry (AREA)
- Health & Medical Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Medicinal Chemistry (AREA)
- Polymers & Plastics (AREA)
- Adhesives Or Adhesive Processes (AREA)
- Materials For Photolithography (AREA)
- Epoxy Resins (AREA)
Abstract
Description
Claims (7)
- 에폭시 수지 및 광-산 발생기를 포함하며, 에폭시 수지는 100 내지 300 g/당량의 에폭시 당량을 갖는 제1 다관능성 에폭시 수지와, 4,400 내지 10,000 g/당량의 에폭시 당량을 갖는 제2 다관능성 에폭시 수지를 포함하는, 감광성 에폭시 수지 접착제 조성물.
- 제1항에 있어서, 제1 다관능성 에폭시 수지가 150 내지 280 g/당량의 에폭시 당량을 갖는, 감광성 에폭시 수지 접착제 조성물.
- 제1항에 있어서, 제2 다관능성 에폭시 수지가 4,400 내지 9,000 g/당량의 에폭시 당량을 갖는, 감광성 에폭시 수지 접착제 조성물.
- 제1항에 있어서, 제1 다관능성 에폭시 수지와 제2 다관능성 에폭시 수지의 중량비가 5:95 내지 90:10인, 감광성 에폭시 수지 접착제 조성물.
- 제4항에 있어서, 제1 다관능성 에폭시 수지와 제2 다관능성 에폭시 수지의 중량비가 10:90 내지 60:40인, 감광성 에폭시 수지 접착제 조성물.
- 제5항에 있어서, 제1 다관능성 에폭시 수지와 제2 다관능성 에폭시 수지의 중량비가 10:90 내지 50:50인, 감광성 에폭시 수지 접착제 조성물.
- 제1항의 감광성 에폭시 수지 접착제 조성물을 포함하는 감광성 접착 필름.
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2005121754 | 2005-04-19 | ||
JPJP-P-2005-00121754 | 2005-04-19 |
Publications (2)
Publication Number | Publication Date |
---|---|
KR20060110217A KR20060110217A (ko) | 2006-10-24 |
KR100907366B1 true KR100907366B1 (ko) | 2009-07-10 |
Family
ID=36717067
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
KR1020060034864A KR100907366B1 (ko) | 2005-04-19 | 2006-04-18 | 감광성 에폭시 수지 접착제 조성물 및 그의 용도 |
Country Status (5)
Country | Link |
---|---|
US (2) | US20060234159A1 (ko) |
EP (1) | EP1714991B1 (ko) |
KR (1) | KR100907366B1 (ko) |
CN (1) | CN1854897A (ko) |
TW (1) | TWI344484B (ko) |
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
KR101377356B1 (ko) | 2012-12-26 | 2014-03-25 | 주식회사 두산 | 접착성이 우수한 에폭시 수지 조성물 및 이를 이용한 수지 복합 동박 |
WO2015080428A1 (ko) * | 2013-11-29 | 2015-06-04 | (주)엘지하우시스 | 접착 필름 형성용 조성물, 광경화전 가공용 점착 필름, 접착 필름 및 전자종이 표시장치 |
Families Citing this family (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
EP2333609A3 (en) * | 2005-07-05 | 2013-03-27 | Hitachi Chemical Company, Ltd. | Photosensitive adhesive composition, and obtained using the same, adhesive film, adhesive sheet, semiconductor wafer with adhesive layer, semiconductor device and electronic part |
CN101573868B (zh) * | 2006-12-28 | 2012-05-30 | 京瓷株式会社 | 弹性表面波装置及其制造方法 |
JP5615512B2 (ja) * | 2009-04-27 | 2014-10-29 | 日東電工株式会社 | 感光性樹脂組成物およびそれを用いたフレキシブル回路基板、ならびにその回路基板の製法 |
JP5445755B2 (ja) * | 2009-11-11 | 2014-03-19 | セイコーエプソン株式会社 | 液滴噴射ヘッドおよびその製造方法、並びに液滴噴射装置 |
DE102013109755A1 (de) | 2013-09-06 | 2015-03-12 | Rent A Scientist Gmbh | Leitfähiger Klebstoff |
Citations (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2003313274A (ja) * | 2002-04-25 | 2003-11-06 | Dainippon Ink & Chem Inc | 紫外線硬化型組成物及びこれを用いた光ディスク |
Family Cites Families (13)
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GB2137626B (en) * | 1983-03-31 | 1986-10-15 | Sericol Group Ltd | Water based photopolymerisable compositions and their use |
EP0209753B1 (en) * | 1985-06-26 | 1993-09-01 | Canon Kabushiki Kaisha | Active energy ray-curing resin composition |
JPS62277421A (ja) * | 1986-05-26 | 1987-12-02 | Matsushita Electric Works Ltd | 半導体封止用−液性封止材 |
DE3879278D1 (ko) * | 1987-06-05 | 1993-04-22 | Ciba-Geigy Ag, Basel, Ch | |
US5264325A (en) * | 1988-12-30 | 1993-11-23 | International Business Machines Corporation | Composition for photo imaging |
EP0430881A3 (en) | 1989-11-29 | 1991-10-23 | Ciba-Geigy Ag | Photochromic compounds, process for their preparation and their use |
US5144051A (en) * | 1990-05-29 | 1992-09-01 | Minnesota Mining And Manufacturing Company | Branched alkoxyphenyl iodonium salt photoinitiators |
US5252694A (en) * | 1992-01-22 | 1993-10-12 | Minnesota Mining And Manufacturing Company | Energy-polymerization adhesive, coating, film and process for making the same |
AU672337B2 (en) * | 1993-10-27 | 1996-09-26 | Nippon Paint Co., Ltd. | Curable resin composition for coating uses |
US5766277A (en) * | 1996-09-20 | 1998-06-16 | Minnesota Mining And Manufacturing Company | Coated abrasive article and method of making same |
EP1793421A3 (en) * | 1996-10-08 | 2007-08-01 | Hitachi Chemical Co., Ltd. | Semiconductor device, substrate for mounting a semiconductor chip, process for their production, adhesive, and double-sided adhesive film |
JP2002069159A (ja) * | 2000-08-30 | 2002-03-08 | Hitachi Ltd | 感光性エポキシ樹脂組成物 |
JP3893303B2 (ja) | 2002-03-29 | 2007-03-14 | 住友ベークライト株式会社 | 半導体パッケージの製造方法 |
-
2006
- 2006-04-07 US US11/399,515 patent/US20060234159A1/en not_active Abandoned
- 2006-04-11 EP EP06007613.0A patent/EP1714991B1/en active Active
- 2006-04-13 CN CNA2006100736472A patent/CN1854897A/zh active Pending
- 2006-04-17 TW TW095113613A patent/TWI344484B/zh active
- 2006-04-18 KR KR1020060034864A patent/KR100907366B1/ko active IP Right Grant
-
2007
- 2007-04-12 US US11/734,426 patent/US7695586B2/en not_active Expired - Fee Related
Patent Citations (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2003313274A (ja) * | 2002-04-25 | 2003-11-06 | Dainippon Ink & Chem Inc | 紫外線硬化型組成物及びこれを用いた光ディスク |
Cited By (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
KR101377356B1 (ko) | 2012-12-26 | 2014-03-25 | 주식회사 두산 | 접착성이 우수한 에폭시 수지 조성물 및 이를 이용한 수지 복합 동박 |
WO2014104739A1 (ko) * | 2012-12-26 | 2014-07-03 | 주식회사 두산 | 접착성이 우수한 에폭시 수지 조성물 및 이를 이용한 수지 복합 동박 |
WO2015080428A1 (ko) * | 2013-11-29 | 2015-06-04 | (주)엘지하우시스 | 접착 필름 형성용 조성물, 광경화전 가공용 점착 필름, 접착 필름 및 전자종이 표시장치 |
Also Published As
Publication number | Publication date |
---|---|
US20070181248A1 (en) | 2007-08-09 |
US20060234159A1 (en) | 2006-10-19 |
CN1854897A (zh) | 2006-11-01 |
TW200702414A (en) | 2007-01-16 |
US7695586B2 (en) | 2010-04-13 |
EP1714991A1 (en) | 2006-10-25 |
TWI344484B (en) | 2011-07-01 |
KR20060110217A (ko) | 2006-10-24 |
EP1714991B1 (en) | 2014-07-09 |
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