KR100893716B1 - 전자장치용 부품의 제조방법 - Google Patents

전자장치용 부품의 제조방법 Download PDF

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Publication number
KR100893716B1
KR100893716B1 KR1020037014617A KR20037014617A KR100893716B1 KR 100893716 B1 KR100893716 B1 KR 100893716B1 KR 1020037014617 A KR1020037014617 A KR 1020037014617A KR 20037014617 A KR20037014617 A KR 20037014617A KR 100893716 B1 KR100893716 B1 KR 100893716B1
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KR
South Korea
Prior art keywords
layer
metal foil
substrate material
coating
intermediate layer
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
KR1020037014617A
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English (en)
Korean (ko)
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KR20040005957A (ko
Inventor
에크만안더스브이.
스퇴젤리카르트
베크레트티에리
챤티에리
스투츠쿠르트
Original Assignee
훈츠만 어드밴스트 머티리얼스(스위처랜드)게엠베하
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
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Publication date
Application filed by 훈츠만 어드밴스트 머티리얼스(스위처랜드)게엠베하 filed Critical 훈츠만 어드밴스트 머티리얼스(스위처랜드)게엠베하
Publication of KR20040005957A publication Critical patent/KR20040005957A/ko
Application granted granted Critical
Publication of KR100893716B1 publication Critical patent/KR100893716B1/ko
Anticipated expiration legal-status Critical
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Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/46—Manufacturing multilayer circuits
    • H05K3/4644—Manufacturing multilayer circuits by building the multilayer layer by layer, i.e. build-up multilayer circuits
    • H05K3/4652—Adding a circuit layer by laminating a metal foil or a preformed metal foil pattern
    • H05K3/4655—Adding a circuit layer by laminating a metal foil or a preformed metal foil pattern by using a laminate characterized by the insulating layer
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/46—Manufacturing multilayer circuits
    • H05K3/4644—Manufacturing multilayer circuits by building the multilayer layer by layer, i.e. build-up multilayer circuits
    • H05K3/4652—Adding a circuit layer by laminating a metal foil or a preformed metal foil pattern
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/07—Treatments involving liquids, e.g. plating, rinsing
    • H05K2203/0756—Uses of liquids, e.g. rinsing, coating, dissolving
    • H05K2203/0759—Forming a polymer layer by liquid coating, e.g. a non-metallic protective coating or an organic bonding layer
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/49002—Electrical device making
    • Y10T29/49117—Conductor or circuit manufacturing
    • Y10T29/49124—On flat or curved insulated base, e.g., printed circuit, etc.
    • Y10T29/49126—Assembling bases

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Laminated Bodies (AREA)
  • Application Of Or Painting With Fluid Materials (AREA)
  • Epoxy Resins (AREA)
  • Ceramic Capacitors (AREA)
  • Magnetic Ceramics (AREA)
  • Compositions Of Oxide Ceramics (AREA)
  • Piezo-Electric Or Mechanical Vibrators, Or Delay Or Filter Circuits (AREA)
  • Design And Manufacture Of Integrated Circuits (AREA)
  • Apparatuses And Processes For Manufacturing Resistors (AREA)
  • Adhesives Or Adhesive Processes (AREA)
KR1020037014617A 2001-05-21 2002-05-15 전자장치용 부품의 제조방법 Expired - Fee Related KR100893716B1 (ko)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
CH944/01 2001-05-21
CH9442001 2001-05-21
PCT/EP2002/005348 WO2002096171A1 (de) 2001-05-21 2002-05-15 Verfahren zur herstellung von bauelementen für elektronische geräte

Publications (2)

Publication Number Publication Date
KR20040005957A KR20040005957A (ko) 2004-01-16
KR100893716B1 true KR100893716B1 (ko) 2009-04-17

Family

ID=4549641

Family Applications (1)

Application Number Title Priority Date Filing Date
KR1020037014617A Expired - Fee Related KR100893716B1 (ko) 2001-05-21 2002-05-15 전자장치용 부품의 제조방법

Country Status (13)

Country Link
US (1) US20040216838A1 (https=)
EP (1) EP1389408B1 (https=)
JP (1) JP2004532116A (https=)
KR (1) KR100893716B1 (https=)
CN (1) CN1311722C (https=)
AT (1) ATE279090T1 (https=)
BR (1) BR0209971A (https=)
CA (1) CA2449198A1 (https=)
DE (1) DE50201239D1 (https=)
IL (1) IL158699A0 (https=)
NO (1) NO20035058L (https=)
RU (1) RU2003133438A (https=)
WO (1) WO2002096171A1 (https=)

Families Citing this family (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US7666938B2 (en) * 2004-12-03 2010-02-23 Henkel Corporation Nanoparticle silica filled benzoxazine compositions
US8029889B1 (en) 2004-12-03 2011-10-04 Henkel Corporation Prepregs, towpregs and preforms
TWI294757B (en) * 2005-07-06 2008-03-11 Delta Electronics Inc Circuit board with a through hole wire, and forming method thereof
US7404725B2 (en) * 2006-07-03 2008-07-29 Hall David R Wiper for tool string direct electrical connection
KR101750836B1 (ko) * 2015-10-14 2017-06-27 대덕전자 주식회사 캐비티 회로기판 제조방법

Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP0275686A1 (en) * 1986-12-19 1988-07-27 Prestwick Circuits Limited Improved multi-layer printed circuit boards, and methods of manufacturing such boards
EP0377332A2 (en) * 1988-12-28 1990-07-11 Somar Corporation Laminate film having a thermosetting resin layer and use thereof for forming electrically insulating layer over conducting surface
DE19634016A1 (de) * 1995-08-28 1997-03-06 Taiyo Ink Mfg Co Ltd Isolierende Harzzusammensetzung zum Aufbau durch Laminieren von Kupferfolien und Verfahren zur Herstellung von Vielschicht-Platinen für gedruckte Schaltungen unter Verwendung der Zusammensetzung
US5837355A (en) 1996-11-07 1998-11-17 Sumitomo Bakelite Company Limited Multilayer printed circuit board and process for producing and using the same
US6016598A (en) 1995-02-13 2000-01-25 Akzo Nobel N.V. Method of manufacturing a multilayer printed wire board

Family Cites Families (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CH470344A (de) * 1966-12-02 1969-03-31 Ciba Geigy Verfahren zur Herstellung von neuen Addukten aus Polypoxiden und Polyaminen
US4330659A (en) * 1980-10-06 1982-05-18 Ciba-Geigy Corporation Modified amine hardener systems
US4500582A (en) * 1981-05-26 1985-02-19 Ciba-Geigy Corporation Modified amine hardener systems
US4540750A (en) * 1984-09-24 1985-09-10 Ciba-Geigy Corporation Diethyl toluene diamine hardener systems
JPH02177596A (ja) * 1988-12-28 1990-07-10 Somar Corp 多層配線板の製造方法
JPH02178042A (ja) * 1988-12-28 1990-07-11 Somar Corp 熱硬化性樹脂フイルム
EP0379464B1 (de) * 1989-01-16 1993-02-10 Ciba-Geigy Ag Araliphatische Sulfoniumsalze und deren Verwendung
GB2259812B (en) * 1991-09-06 1996-04-24 Toa Gosei Chem Ind Method for making multilayer printed circuit board having blind holes and resin-coated copper foil used for the method
TW237466B (https=) * 1992-07-21 1995-01-01 Giba Gerigy Ag
JPH0722741A (ja) * 1993-07-01 1995-01-24 Japan Gore Tex Inc カバーレイフィルム及びカバーレイフィルム被覆回路基板
TW331698B (en) * 1996-06-18 1998-05-11 Hitachi Chemical Co Ltd Multi-layered printed circuit board
TW399398B (en) * 1998-01-07 2000-07-21 Taiyo Ink Seizo K K Liquid thermosetting filling composition and method for permanently filling holes in printed circuit board by the use thereof

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP0275686A1 (en) * 1986-12-19 1988-07-27 Prestwick Circuits Limited Improved multi-layer printed circuit boards, and methods of manufacturing such boards
EP0377332A2 (en) * 1988-12-28 1990-07-11 Somar Corporation Laminate film having a thermosetting resin layer and use thereof for forming electrically insulating layer over conducting surface
US6016598A (en) 1995-02-13 2000-01-25 Akzo Nobel N.V. Method of manufacturing a multilayer printed wire board
DE19634016A1 (de) * 1995-08-28 1997-03-06 Taiyo Ink Mfg Co Ltd Isolierende Harzzusammensetzung zum Aufbau durch Laminieren von Kupferfolien und Verfahren zur Herstellung von Vielschicht-Platinen für gedruckte Schaltungen unter Verwendung der Zusammensetzung
US5837355A (en) 1996-11-07 1998-11-17 Sumitomo Bakelite Company Limited Multilayer printed circuit board and process for producing and using the same

Also Published As

Publication number Publication date
JP2004532116A (ja) 2004-10-21
NO20035058D0 (no) 2003-11-13
EP1389408A1 (de) 2004-02-18
KR20040005957A (ko) 2004-01-16
IL158699A0 (en) 2004-05-12
CA2449198A1 (en) 2002-11-28
NO20035058L (no) 2003-11-13
CN1511434A (zh) 2004-07-07
ATE279090T1 (de) 2004-10-15
RU2003133438A (ru) 2005-05-10
US20040216838A1 (en) 2004-11-04
WO2002096171A1 (de) 2002-11-28
DE50201239D1 (de) 2004-11-11
BR0209971A (pt) 2004-04-06
EP1389408B1 (de) 2004-10-06
CN1311722C (zh) 2007-04-18

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