PT2483700T - Dispositivo para condicionamento de chips semicondutores e processo de teste com emprego do dispositivo - Google Patents

Dispositivo para condicionamento de chips semicondutores e processo de teste com emprego do dispositivo

Info

Publication number
PT2483700T
PT2483700T PT107570921T PT10757092T PT2483700T PT 2483700 T PT2483700 T PT 2483700T PT 107570921 T PT107570921 T PT 107570921T PT 10757092 T PT10757092 T PT 10757092T PT 2483700 T PT2483700 T PT 2483700T
Authority
PT
Portugal
Prior art keywords
test method
semiconductor chips
conditioning semiconductor
conditioning
chips
Prior art date
Application number
PT107570921T
Other languages
English (en)
Inventor
Reitinger Klemens
Original Assignee
Ers Electronic Gmbh
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Ers Electronic Gmbh filed Critical Ers Electronic Gmbh
Publication of PT2483700T publication Critical patent/PT2483700T/pt

Links

Classifications

    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
    • G01R31/28—Testing of electronic circuits, e.g. by signal tracer
    • G01R31/2851—Testing of integrated circuits [IC]
    • G01R31/2855—Environmental, reliability or burn-in testing
    • G01R31/2872—Environmental, reliability or burn-in testing related to electrical or environmental aspects, e.g. temperature, humidity, vibration, nuclear radiation
    • G01R31/2874—Environmental, reliability or burn-in testing related to electrical or environmental aspects, e.g. temperature, humidity, vibration, nuclear radiation related to temperature
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/49002—Electrical device making
    • Y10T29/49117—Conductor or circuit manufacturing
    • Y10T29/49124—On flat or curved insulated base, e.g., printed circuit, etc.
    • Y10T29/4913—Assembling to base an electrical component, e.g., capacitor, etc.
    • Y10T29/49139—Assembling to base an electrical component, e.g., capacitor, etc. by inserting component lead or terminal into base aperture
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/53—Means to assemble or disassemble
    • Y10T29/5313—Means to assemble electrical device

Landscapes

  • Engineering & Computer Science (AREA)
  • Environmental & Geological Engineering (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • General Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Health & Medical Sciences (AREA)
  • Toxicology (AREA)
  • Testing Of Individual Semiconductor Devices (AREA)
  • Tests Of Electronic Circuits (AREA)
PT107570921T 2009-10-02 2010-09-22 Dispositivo para condicionamento de chips semicondutores e processo de teste com emprego do dispositivo PT2483700T (pt)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
DE102009045291A DE102009045291A1 (de) 2009-10-02 2009-10-02 Vorrichtung zur Konditionierung von Halbleiterchips und Testverfahren unter Verwendung der Vorrichtung

Publications (1)

Publication Number Publication Date
PT2483700T true PT2483700T (pt) 2017-03-29

Family

ID=43304084

Family Applications (1)

Application Number Title Priority Date Filing Date
PT107570921T PT2483700T (pt) 2009-10-02 2010-09-22 Dispositivo para condicionamento de chips semicondutores e processo de teste com emprego do dispositivo

Country Status (9)

Country Link
US (1) US9599662B2 (pt)
EP (1) EP2483700B1 (pt)
JP (1) JP5829610B2 (pt)
KR (1) KR101791886B1 (pt)
CN (1) CN102667511B (pt)
DE (1) DE102009045291A1 (pt)
ES (1) ES2622570T3 (pt)
PT (1) PT2483700T (pt)
WO (1) WO2011039087A1 (pt)

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JP5942459B2 (ja) * 2012-02-14 2016-06-29 セイコーエプソン株式会社 ハンドラー、及び部品検査装置
WO2014094901A1 (en) 2012-12-21 2014-06-26 Telefonaktiebolaget L M Ericsson (Publ) An electronic load module and a method and a system therefor
US10781518B2 (en) * 2014-12-11 2020-09-22 Applied Materials, Inc. Gas cooled electrostatic chuck (ESC) having a gas channel formed therein and coupled to a gas box on both ends of the gas channel
KR102138879B1 (ko) * 2015-11-13 2020-07-29 주식회사 아이에스시 테스트 모듈 및 이를 포함하는 반도체 소자 테스트 장치
JP6256523B2 (ja) * 2016-05-16 2018-01-10 セイコーエプソン株式会社 ハンドラー、及び部品検査装置
JP6256526B2 (ja) * 2016-05-25 2018-01-10 セイコーエプソン株式会社 ハンドラー、及び部品検査装置
DE102018105353B3 (de) * 2018-03-08 2019-01-03 Helmuth Heigl Kontaktiereinheit für einen Testhandler zum Durchführen von Funktionstests an Halbleiterelementen
TWI687695B (zh) * 2019-06-21 2020-03-11 利亙通國際有限公司 自動測試系統之功能擴充升級的方法
CN112834899A (zh) * 2020-12-30 2021-05-25 广州奥松电子有限公司 一种芯片检测装置

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Also Published As

Publication number Publication date
KR101791886B1 (ko) 2017-11-20
US20120311858A1 (en) 2012-12-13
WO2011039087A1 (de) 2011-04-07
CN102667511B (zh) 2015-06-24
JP5829610B2 (ja) 2015-12-09
DE102009045291A1 (de) 2011-04-07
CN102667511A (zh) 2012-09-12
EP2483700A1 (de) 2012-08-08
US9599662B2 (en) 2017-03-21
ES2622570T3 (es) 2017-07-06
KR20120104197A (ko) 2012-09-20
EP2483700B1 (de) 2016-12-21
JP2013506819A (ja) 2013-02-28

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