PT2426231T - Fonte de evaporação por arco e método para fabricar filme utilizando a mesma - Google Patents

Fonte de evaporação por arco e método para fabricar filme utilizando a mesma

Info

Publication number
PT2426231T
PT2426231T PT10769458T PT10769458T PT2426231T PT 2426231 T PT2426231 T PT 2426231T PT 10769458 T PT10769458 T PT 10769458T PT 10769458 T PT10769458 T PT 10769458T PT 2426231 T PT2426231 T PT 2426231T
Authority
PT
Portugal
Prior art keywords
same
evaporation source
arc evaporation
manufacturing film
film
Prior art date
Application number
PT10769458T
Other languages
English (en)
Inventor
Shinichi Tanifuji
Kenji Yamamoto
Hirofumi Fujii
Yoshinori Kurokawa
Original Assignee
Kobe Steel Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Kobe Steel Ltd filed Critical Kobe Steel Ltd
Publication of PT2426231T publication Critical patent/PT2426231T/pt

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
    • C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
    • C23C14/24—Vacuum evaporation
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
    • C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
    • C23C14/24—Vacuum evaporation
    • C23C14/32—Vacuum evaporation by explosion; by evaporation and subsequent ionisation of the vapours, e.g. ion-plating
    • C23C14/325—Electric arc evaporation
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
    • C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
    • C23C14/24—Vacuum evaporation
    • C23C14/32—Vacuum evaporation by explosion; by evaporation and subsequent ionisation of the vapours, e.g. ion-plating
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
    • C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
    • C23C14/54—Controlling or regulating the coating process
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
    • H01J37/32—Gas-filled discharge tubes
    • H01J37/32009—Arrangements for generation of plasma specially adapted for examination or treatment of objects, e.g. plasma sources
    • H01J37/32055—Arc discharge
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
    • H01J37/32—Gas-filled discharge tubes
    • H01J37/32431—Constructional details of the reactor
    • H01J37/3266—Magnetic control means
    • H01J37/32669—Particular magnets or magnet arrangements for controlling the discharge
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
    • H01J37/32—Gas-filled discharge tubes
    • H01J37/34—Gas-filled discharge tubes operating with cathodic sputtering
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
    • H01J37/32—Gas-filled discharge tubes
    • H01J37/34—Gas-filled discharge tubes operating with cathodic sputtering
    • H01J37/3411—Constructional aspects of the reactor
    • H01J37/345—Magnet arrangements in particular for cathodic sputtering apparatus

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Plasma & Fusion (AREA)
  • Analytical Chemistry (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Materials Engineering (AREA)
  • Mechanical Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Physical Vapour Deposition (AREA)
PT10769458T 2009-04-28 2010-04-14 Fonte de evaporação por arco e método para fabricar filme utilizando a mesma PT2426231T (pt)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2009109305 2009-04-28
JP2010024315A JP5649308B2 (ja) 2009-04-28 2010-02-05 成膜速度が速いアーク式蒸発源及びこのアーク式蒸発源を用いた皮膜の製造方法

Publications (1)

Publication Number Publication Date
PT2426231T true PT2426231T (pt) 2019-02-14

Family

ID=43031916

Family Applications (1)

Application Number Title Priority Date Filing Date
PT10769458T PT2426231T (pt) 2009-04-28 2010-04-14 Fonte de evaporação por arco e método para fabricar filme utilizando a mesma

Country Status (11)

Country Link
US (1) US9200360B2 (pt)
EP (1) EP2426231B1 (pt)
JP (1) JP5649308B2 (pt)
KR (1) KR101374488B1 (pt)
CN (1) CN102348828B (pt)
BR (1) BRPI1014361B1 (pt)
CA (1) CA2758137C (pt)
IL (2) IL215964A (pt)
PT (1) PT2426231T (pt)
TW (1) TWI507555B (pt)
WO (1) WO2010125756A1 (pt)

Families Citing this family (15)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20130327642A1 (en) 2011-02-23 2013-12-12 Kabushiki Kaisha Kobe Seiko Sho (Kobe Steel, Ltd.) Arc evaporation source
JP5081315B2 (ja) * 2011-02-23 2012-11-28 株式会社神戸製鋼所 アーク式蒸発源
JP5081320B2 (ja) * 2011-02-23 2012-11-28 株式会社神戸製鋼所 アーク式蒸発源
JP5081327B1 (ja) * 2011-04-25 2012-11-28 株式会社神戸製鋼所 アーク式蒸発源
JP5644676B2 (ja) * 2011-05-26 2014-12-24 三菱マテリアル株式会社 アークイオンプレーティング装置および成膜方法
JP5644675B2 (ja) * 2011-05-26 2014-12-24 三菱マテリアル株式会社 アークイオンプレーティング装置および成膜方法
JP5652348B2 (ja) * 2011-07-22 2015-01-14 三菱マテリアル株式会社 アークイオンプレーティング装置
JP6009171B2 (ja) * 2012-02-14 2016-10-19 東京エレクトロン株式会社 基板処理装置
JP5946337B2 (ja) 2012-06-20 2016-07-06 株式会社神戸製鋼所 アーク式蒸発源
WO2014115733A1 (ja) * 2013-01-22 2014-07-31 日新電機株式会社 プラズマ装置、それを用いたカーボン薄膜の製造方法およびコーティング方法
BR102013031138B1 (pt) 2013-12-03 2020-10-27 Mahle International Gmbh anel de pistão
JP6403269B2 (ja) * 2014-07-30 2018-10-10 株式会社神戸製鋼所 アーク蒸発源
CN109267018B (zh) * 2017-07-18 2021-12-17 平高集团有限公司 一种快速等离子体镀膜方法及装置
CN112048701B (zh) * 2020-07-28 2022-11-29 温州职业技术学院 一种多磁场集成阴极弧源
CN114481046A (zh) * 2022-01-26 2022-05-13 纳狮新材料有限公司 电弧蒸发装置

Family Cites Families (19)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS54120696A (en) 1978-03-10 1979-09-19 Takeda Chem Ind Ltd Glucosamine derivative and its preparation
US4600489A (en) * 1984-01-19 1986-07-15 Vac-Tec Systems, Inc. Method and apparatus for evaporation arc stabilization for non-permeable targets utilizing permeable stop ring
WO1987005948A1 (en) * 1986-04-04 1987-10-08 Regents Of The University Of Minnesota Arc coating of refractory metal compounds
JPS63446U (pt) * 1986-06-19 1988-01-05
JP3221892B2 (ja) * 1991-09-20 2001-10-22 帝国ピストンリング株式会社 ピストンリング及びその製造法
JPH063446U (ja) * 1992-05-09 1994-01-18 株式会社佐竹製作所 揺動選別籾摺機の操作装置
JPH063446A (ja) 1992-06-23 1994-01-11 Meidensha Corp 位置センサ
JPH07180043A (ja) 1993-12-22 1995-07-18 Nissin Electric Co Ltd マルチアーク放電方式のイオンプレーティング装置
GB9615548D0 (en) * 1996-07-24 1996-09-04 Univ Nanyang Cathode arc source and graphite target
TWI242049B (en) 1999-01-14 2005-10-21 Kobe Steel Ltd Vacuum arc evaporation source and vacuum arc vapor deposition apparatus
JP3728140B2 (ja) 1999-05-21 2005-12-21 株式会社神戸製鋼所 アーク蒸発源及び真空蒸着装置
JP4371569B2 (ja) 2000-12-25 2009-11-25 信越化学工業株式会社 マグネトロンスパッタ装置とそれを用いたフォトマスクブランクの製造方法
JP2004523658A (ja) * 2001-03-27 2004-08-05 フンダシオン テクニケル 大きい表面領域を有するターゲットのための強力な磁気ガイドを伴うアーク蒸着装置
DE10256417A1 (de) * 2002-12-02 2004-06-09 Pvt Plasma Und Vakuum Technik Gmbh Lichtbogenverdampfungsvorrichtung
WO2004057642A2 (de) * 2002-12-19 2004-07-08 Unaxis Balzers Aktiengesellschaft Vacuumarcquelle mit magnetfelderzeugungseinrichtung
US7211138B2 (en) * 2003-02-07 2007-05-01 Kabushiki Kaisha Kobe Seiko Sho (Kobe Steel, Ltd.) Hard film, method of forming the same and target for hard film formation
JP4548666B2 (ja) * 2005-08-26 2010-09-22 株式会社不二越 アーク式イオンプレーティング装置用蒸発源
WO2007068768A1 (es) * 2005-12-16 2007-06-21 Fundacion Tekniker Máquina de evaporación catódica
WO2008125397A1 (de) * 2007-04-17 2008-10-23 Sulzer Metaplas Gmbh Vakuum lichtbogenverdampfungsquelle, sowie eine lichtbogenverdampfungskammer mit einer vakuum lichtbogenverdampfungsquelle

Also Published As

Publication number Publication date
BRPI1014361A2 (pt) 2016-10-11
CN102348828B (zh) 2013-10-30
CN102348828A (zh) 2012-02-08
IL215964A (en) 2017-09-28
IL215964A0 (en) 2012-01-31
JP5649308B2 (ja) 2015-01-07
US9200360B2 (en) 2015-12-01
KR20120000106A (ko) 2012-01-03
BRPI1014361B1 (pt) 2019-10-01
JP2010275625A (ja) 2010-12-09
IL239069A0 (en) 2015-07-30
TW201111528A (en) 2011-04-01
WO2010125756A1 (ja) 2010-11-04
CA2758137C (en) 2014-07-08
EP2426231A1 (en) 2012-03-07
EP2426231B1 (en) 2019-01-23
TWI507555B (zh) 2015-11-11
KR101374488B1 (ko) 2014-03-13
CA2758137A1 (en) 2010-11-04
EP2426231A4 (en) 2016-01-13
US20120037493A1 (en) 2012-02-16

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