PL3208523T3 - Podłoże stosowane do enkapsulacji led, trójwymiarowy element enkapsulacji led, żarówka zawierająca trójwymiarowy element enkapsulacji led i sposób ich wytwarzania - Google Patents

Podłoże stosowane do enkapsulacji led, trójwymiarowy element enkapsulacji led, żarówka zawierająca trójwymiarowy element enkapsulacji led i sposób ich wytwarzania

Info

Publication number
PL3208523T3
PL3208523T3 PL15851506T PL15851506T PL3208523T3 PL 3208523 T3 PL3208523 T3 PL 3208523T3 PL 15851506 T PL15851506 T PL 15851506T PL 15851506 T PL15851506 T PL 15851506T PL 3208523 T3 PL3208523 T3 PL 3208523T3
Authority
PL
Poland
Prior art keywords
led encapsulation
dimensional
bulb
manufacturing
dimensional led
Prior art date
Application number
PL15851506T
Other languages
English (en)
Inventor
Andrew YEUNG
Original Assignee
Sim Lighting Design Company Limited
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from CN201420596769.XU external-priority patent/CN204424304U/zh
Priority claimed from CN201420596768.5U external-priority patent/CN204176377U/zh
Priority claimed from CN201420597293.1U external-priority patent/CN204257694U/zh
Priority claimed from CN201420616660.8U external-priority patent/CN204240103U/zh
Priority claimed from CN201420615380.5U external-priority patent/CN204268119U/zh
Priority claimed from CN201510023423.XA external-priority patent/CN104595872A/zh
Priority claimed from CN201510023784.4A external-priority patent/CN104613346A/zh
Application filed by Sim Lighting Design Company Limited filed Critical Sim Lighting Design Company Limited
Publication of PL3208523T3 publication Critical patent/PL3208523T3/pl

Links

Classifications

    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21K—NON-ELECTRIC LIGHT SOURCES USING LUMINESCENCE; LIGHT SOURCES USING ELECTROCHEMILUMINESCENCE; LIGHT SOURCES USING CHARGES OF COMBUSTIBLE MATERIAL; LIGHT SOURCES USING SEMICONDUCTOR DEVICES AS LIGHT-GENERATING ELEMENTS; LIGHT SOURCES NOT OTHERWISE PROVIDED FOR
    • F21K9/00—Light sources using semiconductor devices as light-generating elements, e.g. using light-emitting diodes [LED] or lasers
    • F21K9/20—Light sources comprising attachment means
    • F21K9/23—Retrofit light sources for lighting devices with a single fitting for each light source, e.g. for substitution of incandescent lamps with bayonet or threaded fittings
    • F21K9/232—Retrofit light sources for lighting devices with a single fitting for each light source, e.g. for substitution of incandescent lamps with bayonet or threaded fittings specially adapted for generating an essentially omnidirectional light distribution, e.g. with a glass bulb
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21K—NON-ELECTRIC LIGHT SOURCES USING LUMINESCENCE; LIGHT SOURCES USING ELECTROCHEMILUMINESCENCE; LIGHT SOURCES USING CHARGES OF COMBUSTIBLE MATERIAL; LIGHT SOURCES USING SEMICONDUCTOR DEVICES AS LIGHT-GENERATING ELEMENTS; LIGHT SOURCES NOT OTHERWISE PROVIDED FOR
    • F21K9/00—Light sources using semiconductor devices as light-generating elements, e.g. using light-emitting diodes [LED] or lasers
    • F21K9/20—Light sources comprising attachment means
    • F21K9/23—Retrofit light sources for lighting devices with a single fitting for each light source, e.g. for substitution of incandescent lamps with bayonet or threaded fittings
    • F21K9/238—Arrangement or mounting of circuit elements integrated in the light source
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21K—NON-ELECTRIC LIGHT SOURCES USING LUMINESCENCE; LIGHT SOURCES USING ELECTROCHEMILUMINESCENCE; LIGHT SOURCES USING CHARGES OF COMBUSTIBLE MATERIAL; LIGHT SOURCES USING SEMICONDUCTOR DEVICES AS LIGHT-GENERATING ELEMENTS; LIGHT SOURCES NOT OTHERWISE PROVIDED FOR
    • F21K9/00—Light sources using semiconductor devices as light-generating elements, e.g. using light-emitting diodes [LED] or lasers
    • F21K9/90—Methods of manufacture
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V19/00—Fastening of light sources or lamp holders
    • F21V19/001—Fastening of light sources or lamp holders the light sources being semiconductors devices, e.g. LEDs
    • F21V19/0015—Fastening arrangements intended to retain light sources
    • F21V19/002—Fastening arrangements intended to retain light sources the fastening means engaging the encapsulation or the packaging of the semiconductor device
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V23/00—Arrangement of electric circuit elements in or on lighting devices
    • F21V23/001—Arrangement of electric circuit elements in or on lighting devices the elements being electrical wires or cables
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V29/00—Protecting lighting devices from thermal damage; Cooling or heating arrangements specially adapted for lighting devices or systems
    • F21V29/50—Cooling arrangements
    • F21V29/70—Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks
    • F21V29/80—Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks with pins or wires
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L25/00—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof
    • H01L25/03—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes
    • H01L25/04—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers
    • H01L25/075—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group H01L33/00
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L33/00—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/48—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0284—Details of three-dimensional rigid printed circuit boards
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V23/00—Arrangement of electric circuit elements in or on lighting devices
    • F21V23/06—Arrangement of electric circuit elements in or on lighting devices the elements being coupling devices, e.g. connectors
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21Y—INDEXING SCHEME ASSOCIATED WITH SUBCLASSES F21K, F21L, F21S and F21V, RELATING TO THE FORM OR THE KIND OF THE LIGHT SOURCES OR OF THE COLOUR OF THE LIGHT EMITTED
    • F21Y2115/00—Light-generating elements of semiconductor light sources
    • F21Y2115/10—Light-emitting diodes [LED]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10007—Types of components
    • H05K2201/10106—Light emitting diode [LED]
PL15851506T 2014-10-15 2015-10-15 Podłoże stosowane do enkapsulacji led, trójwymiarowy element enkapsulacji led, żarówka zawierająca trójwymiarowy element enkapsulacji led i sposób ich wytwarzania PL3208523T3 (pl)

Applications Claiming Priority (9)

Application Number Priority Date Filing Date Title
CN201420596769.XU CN204424304U (zh) 2014-10-15 2014-10-15 立体led封装
CN201420596768.5U CN204176377U (zh) 2014-10-15 2014-10-15 立体led封装的灯泡
CN201420597293.1U CN204257694U (zh) 2014-10-15 2014-10-15 Led封装基板
CN201420616660.8U CN204240103U (zh) 2014-10-23 2014-10-23 一种螺旋形led封装的灯泡
CN201420615380.5U CN204268119U (zh) 2014-10-23 2014-10-23 一种双螺旋形led封装的灯泡
CN201510023423.XA CN104595872A (zh) 2015-01-16 2015-01-16 一种螺旋形led封装的灯泡的制作方法
CN201510023784.4A CN104613346A (zh) 2015-01-16 2015-01-16 一种立体led封装的灯泡的制作方法
EP15851506.4A EP3208523B1 (en) 2014-10-15 2015-10-15 Substrate used for led encapsulation, three-dimensional led encapsulation, bulb comprising three-dimensional led encapsulation and manufacturing method therefor
PCT/CN2015/091970 WO2016058539A1 (zh) 2014-10-15 2015-10-15 Led封装用基板、立体led封装、具有该立体led封装的灯泡及其制作方法

Publications (1)

Publication Number Publication Date
PL3208523T3 true PL3208523T3 (pl) 2021-04-19

Family

ID=55082670

Family Applications (1)

Application Number Title Priority Date Filing Date
PL15851506T PL3208523T3 (pl) 2014-10-15 2015-10-15 Podłoże stosowane do enkapsulacji led, trójwymiarowy element enkapsulacji led, żarówka zawierająca trójwymiarowy element enkapsulacji led i sposób ich wytwarzania

Country Status (9)

Country Link
US (1) US10563824B2 (pl)
EP (1) EP3208523B1 (pl)
JP (2) JP2017532793A (pl)
AU (1) AU2015333293B2 (pl)
CA (1) CA2964421C (pl)
ES (1) ES2835831T3 (pl)
HK (1) HK1207250A2 (pl)
PL (1) PL3208523T3 (pl)
WO (1) WO2016058539A1 (pl)

Families Citing this family (20)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US7842662B2 (en) 2006-11-10 2010-11-30 Cara Therapeutics, Inc. Synthetic peptide amide dimers
WO2017028740A1 (zh) * 2015-08-14 2017-02-23 杨志强 Led封装用基板、led封装以及led灯泡
CN106151904A (zh) * 2016-08-24 2016-11-23 胡溢文 一种可卷绕灯丝的led灯及其制备工艺
EP3508036A1 (en) * 2016-09-05 2019-07-10 Signify Holding B.V. Led-filament and lighting device comprising the led-filament.
WO2018053519A1 (en) * 2016-09-19 2018-03-22 Dror Benshetrit Technologies for illumination
CN107887374A (zh) * 2016-09-30 2018-04-06 王定锋 一种带环形灯丝的立体led封装模组及制作方法
CN206301789U (zh) * 2016-09-30 2017-07-04 王定锋 一种带环形灯丝的立体led封装模组
CN106678573A (zh) * 2017-01-18 2017-05-17 广东英吉尔科技股份有限公司 一种锥体led灯丝的灯具及其制作方法
CN106764565B (zh) * 2017-01-26 2023-02-03 海宁市新宇光能科技有限公司 带小回转平台的低灯柱桩头led灯丝灯生产设备
CN107029562B (zh) * 2017-05-12 2020-04-07 大连理工大学 一种基于MXene的复合纳滤膜及其制备方法
CN107086265A (zh) * 2017-06-02 2017-08-22 厦门立达信绿色照明集团有限公司 发光二极管模组跟灯具装置
CN207246837U (zh) * 2017-09-07 2018-04-17 李立新 一种全罩大角度发光led灯泡
RU2686156C1 (ru) * 2018-03-15 2019-04-24 Закрытое акционерное общество "Инновационная фирма "ИРСЭТ-Центр" Светодиодная лампа
RU183730U1 (ru) * 2018-03-15 2018-10-02 Закрытое акционерное общество "Инновационная фирма "ИРСЭТ-Центр" Светодиодная лампа
CN108775556A (zh) * 2018-05-23 2018-11-09 宁波能亮光电科技有限公司 一种智慧城市led照明灯
CN108799863A (zh) 2018-06-23 2018-11-13 杭州思隽思科技有限公司 一种灯丝结构及具有该灯丝结构的灯泡
JP2022549024A (ja) * 2019-11-21 2022-11-22 シグニファイ ホールディング ビー ヴィ 発光デバイス
EP4115708A1 (en) * 2020-03-02 2023-01-11 Signify Holding B.V. Dimmable helix led filament arrangement and lamp
CN112097129A (zh) * 2020-08-31 2020-12-18 杭州杭科光电集团股份有限公司 颜色可控的led发光灯
US11828423B2 (en) * 2020-11-12 2023-11-28 Leedarson Lighting Co., Ltd Light bulb apparatus

Family Cites Families (44)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5927845A (en) * 1995-08-28 1999-07-27 Stantech Integrally formed linear light strip with light emitting diodes
US6580228B1 (en) * 2000-08-22 2003-06-17 Light Sciences Corporation Flexible substrate mounted solid-state light sources for use in line current lamp sockets
TW533750B (en) * 2001-11-11 2003-05-21 Solidlite Corp LED lamp
TW558804B (en) * 2002-04-16 2003-10-21 Yuan Lin Flexible light emitting device and the manufacturing method thereof
JP2004253328A (ja) * 2003-02-21 2004-09-09 Moriyama Sangyo Kk 発光装置及びｌｅｄモジュール
JP2011048924A (ja) * 2009-08-25 2011-03-10 Sea&Sea Sunpak Co Ltd Ｌｅｄ照明灯装置
TWM376709U (en) * 2009-09-02 2010-03-21 Liquidleds Lighting Corp Curved tubular LED lamp
TW201207315A (en) * 2010-08-05 2012-02-16 Liquidleds Lighting Corp Method for manufacturing LED light
CA2810658C (en) * 2010-09-08 2015-02-10 Zhejiang Ledison Optoelectronics Co., Ltd. Led light bulb and led light-emitting strip being capable of emitting 4.pi. light
EP2636938A1 (en) * 2010-11-04 2013-09-11 Panasonic Corporation Light emitting device, bulb-type lamp, and illuminating device
JP2012164518A (ja) * 2011-02-07 2012-08-30 Kodenshi Corp 広配向性照明装置とその製造方法
US8314566B2 (en) * 2011-02-22 2012-11-20 Quarkstar Llc Solid state lamp using light emitting strips
CN102281701A (zh) * 2011-08-16 2011-12-14 吴广毅 一种led灯上的立体拉伸螺旋状线路板及其制作方法
JP5992157B2 (ja) * 2011-10-03 2016-09-14 イビデン株式会社 電子部品実装基板、発光装置、及び照明装置
JP5981118B2 (ja) * 2011-10-03 2016-08-31 イビデン株式会社 電子部品実装基板、発光装置、及び照明装置
JP2013165040A (ja) * 2012-02-13 2013-08-22 Panasonic Corp ランプ、照明装置及び発光モジュール
JP5376102B1 (ja) * 2012-03-15 2013-12-25 パナソニック株式会社 Ｌｅｄ用基板、ｌｅｄモジュールおよびｌｅｄ電球
US9322543B2 (en) * 2012-04-13 2016-04-26 Cree, Inc. Gas cooled LED lamp with heat conductive submount
JP5864349B2 (ja) * 2012-04-20 2016-02-17 スタンレー電気株式会社 Ｌｅｄ電球
JP2013258180A (ja) * 2012-06-11 2013-12-26 Toshiba Lighting & Technology Corp Ｌｅｄモジュールおよび照明装置
EP2914900B1 (en) * 2012-11-02 2019-07-10 The Wand Lite Company Limited Lighting device
CN102927483A (zh) * 2012-11-20 2013-02-13 田茂福 一体化倒装型led照明组件
JP2014110301A (ja) * 2012-11-30 2014-06-12 Panasonic Corp 発光装置および照明用光源
US9528689B2 (en) * 2013-03-13 2016-12-27 Palo Alto Research Center Incorporated LED lighting device with cured structural support
US9115858B2 (en) * 2013-05-09 2015-08-25 Inspired LED, LLC Extended length flexible LED light strip system
CN103542377A (zh) * 2013-10-29 2014-01-29 广西桂林宇川光电科技有限公司 一种控制照明度的led灯泡
CN103700652A (zh) * 2013-12-02 2014-04-02 张晓峰 一种螺旋形led封装灯丝
US10066791B2 (en) * 2013-12-02 2018-09-04 Tiehan Ge Spiral LED filament and light bulb using spiral LED filament
CN203656627U (zh) * 2013-12-02 2014-06-18 张晓峰 一种螺旋形led灯丝的灯泡
CN203659854U (zh) 2013-12-02 2014-06-18 张晓峰 一种螺旋形led封装灯丝
CN103791286B (zh) * 2014-02-21 2017-03-29 中山星耀照明有限公司 线状led光源和线状led灯
CN203787425U (zh) * 2014-02-26 2014-08-20 深圳市瑞丰光电子股份有限公司 一种led灯丝及照明器
CN106461167A (zh) * 2014-03-10 2017-02-22 长寿灯泡有限责任公司 具有内部柔性散热器和电路的led灯泡
CN103915548B (zh) * 2014-04-11 2017-05-10 临安市新三联照明电器有限公司 一种led灯丝支架的基板
CN203850336U (zh) * 2014-05-23 2014-09-24 四川海金汇光电有限公司 高显色锥形螺旋体led封装灯丝
CN104075170A (zh) * 2014-07-11 2014-10-01 木林森股份有限公司 一种用于led灯条的led基板和大发光角的led灯条
CN104613346A (zh) * 2015-01-16 2015-05-13 新照明设计有限公司 一种立体led封装的灯泡的制作方法
CN204424304U (zh) 2014-10-15 2015-06-24 杨志强 立体led封装
CN204240103U (zh) 2014-10-23 2015-04-01 杨志强 一种螺旋形led封装的灯泡
CN204257694U (zh) 2014-10-15 2015-04-08 杨志强 Led封装基板
CN104595872A (zh) 2015-01-16 2015-05-06 新照明设计有限公司 一种螺旋形led封装的灯泡的制作方法
CN204268119U (zh) 2014-10-23 2015-04-15 杨志强 一种双螺旋形led封装的灯泡
CN204176377U (zh) * 2014-10-15 2015-02-25 杨志强 立体led封装的灯泡
US20170012177A1 (en) * 2015-07-09 2017-01-12 Cree, Inc. Led based lighting system

Also Published As

Publication number Publication date
US20170241597A1 (en) 2017-08-24
EP3208523A1 (en) 2017-08-23
JP2017532793A (ja) 2017-11-02
US10563824B2 (en) 2020-02-18
CA2964421C (en) 2021-05-18
AU2015333293B2 (en) 2018-12-20
ES2835831T3 (es) 2021-06-23
AU2015333293A1 (en) 2017-05-04
WO2016058539A1 (zh) 2016-04-21
HK1207250A2 (en) 2016-01-22
CA2964421A1 (en) 2016-04-21
EP3208523A4 (en) 2018-05-16
EP3208523B1 (en) 2020-09-02
JP2019117936A (ja) 2019-07-18

Similar Documents

Publication Publication Date Title
PL3208523T3 (pl) Podłoże stosowane do enkapsulacji led, trójwymiarowy element enkapsulacji led, żarówka zawierająca trójwymiarowy element enkapsulacji led i sposób ich wytwarzania
EP3379588A4 (en) Semiconductor device manufacturing method
GB2550055B (en) Method for manufacturing light-emitting device
GB2542542B (en) Vertical LED chip structure and manufacturing method therefor
EP3261136A4 (en) Light-emitting device and method for manufacturing same
EP3119163A4 (en) Electroluminescence element, illumination device, and method for manufacturing electroluminescence element
HK1199324A1 (en) Semiconductor light emitting device and method for manufacturing the same
EP3279924A4 (en) Semiconductor device manufacturing method
EP3376548A4 (en) LIGHT EMITTING DIODE DEVICE AND METHOD FOR MANUFACTURING SAME
EP2942818A4 (en) FAST ULTRAVIOLET LED AND METHOD FOR MANUFACTURING THE SAME
HK1199323A1 (en) Semiconductor light emitting device and method for manufacturing the same
HK1199146A1 (en) Semiconductor light emitting device and method for manufacturing the same
HK1199325A1 (en) Semiconductor light emitting device and method for manufacturing the same
EP3522239A4 (en) LIGHT-EMITTING SEMICONDUCTOR ELEMENT AND METHOD FOR PRODUCING A LIGHT-EMITTING SEMICONDUCTOR ELEMENT
EP2955762A4 (en) LIGHT-EMITTING SEMICONDUCTOR ELEMENT AND MANUFACTURING METHOD
EP3001776A4 (en) LIGHT EXTRACTION FOIL, METHOD FOR THE PRODUCTION THEREOF AND SURFACE-LIGHT-EMITTING BODY
EP3101160A4 (en) Semiconductor substrate manufacturing method
EP3276674A4 (en) Semiconductor light-emitting element
EP2953161A4 (en) ON A SECONDARY BATTERY MOUNTED SWITCHING SCHIP AND METHOD OF MANUFACTURING THEREOF
TWI563072B (en) Encapsulant for light module, method for manufacturing the same and light module comprising the same
EP3276676A4 (en) Semiconductor light-emitting element, and manufacturing method for same
EP3109909A4 (en) Method for manufacturing semiconductor light emitting device
EP3306694A4 (en) LIGHT-EMITTING ELEMENT AND METHOD FOR THE PRODUCTION THEREOF
EP3255683A4 (en) Light-emitting element and production method for light-emitting element
EP3101698A4 (en) Method for manufacturing semiconductor light emitting device