CN102281701A - 一种led灯上的立体拉伸螺旋状线路板及其制作方法 - Google Patents

一种led灯上的立体拉伸螺旋状线路板及其制作方法 Download PDF

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CN102281701A
CN102281701A CN2011102335650A CN201110233565A CN102281701A CN 102281701 A CN102281701 A CN 102281701A CN 2011102335650 A CN2011102335650 A CN 2011102335650A CN 201110233565 A CN201110233565 A CN 201110233565A CN 102281701 A CN102281701 A CN 102281701A
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helical form
circuit board
wiring board
emitting diode
dimensional extension
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吴广毅
相少艾
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Priority to CN2011102335650A priority Critical patent/CN102281701A/zh
Priority to US13/279,268 priority patent/US20130044470A1/en
Priority to EP11187975A priority patent/EP2559930A1/en
Publication of CN102281701A publication Critical patent/CN102281701A/zh
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    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V21/00—Supporting, suspending, or attaching arrangements for lighting devices; Hand grips
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21K—NON-ELECTRIC LIGHT SOURCES USING LUMINESCENCE; LIGHT SOURCES USING ELECTROCHEMILUMINESCENCE; LIGHT SOURCES USING CHARGES OF COMBUSTIBLE MATERIAL; LIGHT SOURCES USING SEMICONDUCTOR DEVICES AS LIGHT-GENERATING ELEMENTS; LIGHT SOURCES NOT OTHERWISE PROVIDED FOR
    • F21K9/00—Light sources using semiconductor devices as light-generating elements, e.g. using light-emitting diodes [LED] or lasers
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21K—NON-ELECTRIC LIGHT SOURCES USING LUMINESCENCE; LIGHT SOURCES USING ELECTROCHEMILUMINESCENCE; LIGHT SOURCES USING CHARGES OF COMBUSTIBLE MATERIAL; LIGHT SOURCES USING SEMICONDUCTOR DEVICES AS LIGHT-GENERATING ELEMENTS; LIGHT SOURCES NOT OTHERWISE PROVIDED FOR
    • F21K9/00—Light sources using semiconductor devices as light-generating elements, e.g. using light-emitting diodes [LED] or lasers
    • F21K9/90—Methods of manufacture
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0277—Bendability or stretchability details
    • H05K1/0278—Rigid circuit boards or rigid supports of circuit boards locally made bendable, e.g. by removal or replacement of material
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21Y—INDEXING SCHEME ASSOCIATED WITH SUBCLASSES F21K, F21L, F21S and F21V, RELATING TO THE FORM OR THE KIND OF THE LIGHT SOURCES OR OF THE COLOUR OF THE LIGHT EMITTED
    • F21Y2103/00—Elongate light sources, e.g. fluorescent tubes
    • F21Y2103/10—Elongate light sources, e.g. fluorescent tubes comprising a linear array of point-like light-generating elements
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21Y—INDEXING SCHEME ASSOCIATED WITH SUBCLASSES F21K, F21L, F21S and F21V, RELATING TO THE FORM OR THE KIND OF THE LIGHT SOURCES OR OF THE COLOUR OF THE LIGHT EMITTED
    • F21Y2103/00—Elongate light sources, e.g. fluorescent tubes
    • F21Y2103/30—Elongate light sources, e.g. fluorescent tubes curved
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21Y—INDEXING SCHEME ASSOCIATED WITH SUBCLASSES F21K, F21L, F21S and F21V, RELATING TO THE FORM OR THE KIND OF THE LIGHT SOURCES OR OF THE COLOUR OF THE LIGHT EMITTED
    • F21Y2107/00—Light sources with three-dimensionally disposed light-generating elements
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21Y—INDEXING SCHEME ASSOCIATED WITH SUBCLASSES F21K, F21L, F21S and F21V, RELATING TO THE FORM OR THE KIND OF THE LIGHT SOURCES OR OF THE COLOUR OF THE LIGHT EMITTED
    • F21Y2115/00—Light-generating elements of semiconductor light sources
    • F21Y2115/10—Light-emitting diodes [LED]
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/03—Use of materials for the substrate
    • H05K1/05—Insulated conductive substrates, e.g. insulated metal substrate
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09009—Substrate related
    • H05K2201/09063—Holes or slots in insulating substrate not used for electrical connections
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10007—Types of components
    • H05K2201/10106—Light emitting diode [LED]
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/30—Details of processes not otherwise provided for in H05K2203/01 - H05K2203/17
    • H05K2203/302—Bending a rigid substrate; Breaking rigid substrates by bending
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/49002—Electrical device making
    • Y10T29/49117—Conductor or circuit manufacturing
    • Y10T29/49124—On flat or curved insulated base, e.g., printed circuit, etc.

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  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • General Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Optics & Photonics (AREA)
  • Manufacturing & Machinery (AREA)
  • Fastening Of Light Sources Or Lamp Holders (AREA)

Abstract

本发明公开了一种LED灯上的立体拉伸螺旋状线路板及其制作方法，包括经拉伸后的立体螺旋状PCB线路板，所述的PCB线路板包括底盘和贴片安装部；所述的贴片安装部上安装有贴片发光二级管。本发明具能使发光二极管贴片投射到灯罩上的光线均匀，使用寿命长，成本低，可靠性好的特点。

Description

一种LED灯上的立体拉伸螺旋状线路板及其制作方法
技术领域
本发明涉及一种LED灯上的立体拉伸螺旋状线路板及其制作方法。
背景技术
目前的LED灯普遍采用平面型线路板，在其上插装灯珠或者安装发光二极管贴片。相对于灯珠而言，为了使其发光均匀，通常采用宝塔形的插法，但是对于发光二极管贴片就只能是平面安装，此种安装方式使其投射到灯罩上的光线不均匀，解决发光二极管贴片发光不均匀的问题成为本发明的重点。
发明内容
本发明的目的在于提供一种LED灯上的立体拉伸螺旋状线路板及其制作方法，本发明具能使发光二极管贴片发光均匀，使用寿命长，成本低，可靠性好的特点。
为了达到上述目的，本发明的技术方案是：
一种LED灯上的立体拉伸螺旋状线路板，包括经拉伸后的立体螺旋状PCB线路板，所述的PCB线路板包括底盘和贴片安装部；所述的贴片安装部上安装有贴片发光二级管。
所述的PCB线路板采用环氧线路板或铝基线路板中的一种。
所述的贴片安装部上安装有卡件，卡件之间安装有支柱。
一种LED灯上的立体拉伸螺旋状线路板的制作方法，包括如下步骤：首先将线路板上刻出螺旋状连续刻断线槽，并在螺旋状连续刻断线槽之间焊接安装贴片发光二级管，然后直接拉住线路板中心并上提，将线路板沿螺旋状连续刻断线槽直接拉伸成立体螺旋状线路板。
 
本发明的有益效果是：本发明具能使发光二极管贴片投射到灯罩上的光线均匀，使用寿命长，成本低，可靠性好的特点。
附图说明
图1是本发明的结构示意图。
具体实施方式
 
实施例1
如图1所示，本实施例的一种LED灯上的立体拉伸螺旋状线路板，包括将平面螺旋状PCB线路板经拉伸后的立体螺旋状PCB线路板1，所述的PCB线路板1包括底盘2和贴片安装部3；PCB线路板1可采用环氧线路板或铝基线路板。所述的贴片安装部3上安装有贴片发光二级管4。底盘2跟灯体外壳内壁卡合固定。为了加固本体1的牢度，可以在贴片安装部3安装卡件5，通过在卡件5间安装支柱6来提供牢度。本实施例的LED灯上的立体拉伸螺旋状线路板的制作方法为：首先将线路板上刻出螺旋状连续刻断线槽，并在螺旋状连续刻断线槽之间焊接安装贴片发光二级管4，然后直接拉住线路板中心并上提，将线路板沿螺旋状连续刻断线槽直接拉伸成立体螺旋状线路板。本发明具能使发光二极管贴片投射到灯罩上的光线均匀，使用寿命长，成本低，可靠性好的特点。

Claims (4)

1.一种LED灯上的立体拉伸螺旋状线路板，其特征在于：包括经拉伸后的立体螺旋状PCB线路板（1），所述的PCB线路板（1）包括底盘（2）和贴片安装部（3）；所述的贴片安装部（3）上安装有贴片发光二级管（4）。
2.如权利要求1所述的一种LED灯上的立体拉伸螺旋状线路板，其特征在于：所述的所述的PCB线路板（1）采用环氧线路板或铝基线路板中的一种。
3.如权利要求1所述的一种LED灯上的立体拉伸螺旋状线路板，其特征在于：所述的贴片安装部（3）上安装有卡件（5），卡件（5）之间安装有支柱（6）。
4.一种如权利要求1所述的LED灯上的立体拉伸螺旋状线路板的制作方法，其特征在于包括如下步骤：首先将线路板上刻出螺旋状连续刻断线槽，并在螺旋状连续刻断线槽之间焊接安装贴片发光二级管，然后直接拉住线路板中心并上提，将线路板沿螺旋状连续刻断线槽直接拉伸成立体螺旋状线路板。
CN2011102335650A 2011-08-16 2011-08-16 一种led灯上的立体拉伸螺旋状线路板及其制作方法 Pending CN102281701A (zh)

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CN2011102335650A CN102281701A (zh) 2011-08-16 2011-08-16 一种led灯上的立体拉伸螺旋状线路板及其制作方法
US13/279,268 US20130044470A1 (en) 2011-08-16 2011-10-22 Three-dimensional tensile and helical circuit board for light-emitting diode lamp and manufacturing method thereof
EP11187975A EP2559930A1 (en) 2011-08-16 2011-11-04 Three-dimensional tensile and helical circuit board for light-emitting diode lamp and manufacturing method thereof

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CN104565902A (zh) * 2014-10-09 2015-04-29 上海鼎晖科技股份有限公司 一种螺旋式led灯
CN104747926A (zh) * 2013-12-26 2015-07-01 上海顿格电子贸易有限公司 一种发光二极管发光灯泡及其安装方法

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HK1207250A2 (zh) * 2014-10-15 2016-01-22 新照明設計有限公司 號 封裝用基板、立體 封裝、具有該立體 封裝的燈泡及其製作方法
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CN104747926A (zh) * 2013-12-26 2015-07-01 上海顿格电子贸易有限公司 一种发光二极管发光灯泡及其安装方法
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CN104565902A (zh) * 2014-10-09 2015-04-29 上海鼎晖科技股份有限公司 一种螺旋式led灯

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Application publication date: 20111214