PL2953757T3 - Metody i aparatura do czyszczenia dyszy lutowniczej - Google Patents
Metody i aparatura do czyszczenia dyszy lutowniczejInfo
- Publication number
- PL2953757T3 PL2953757T3 PL13811424T PL13811424T PL2953757T3 PL 2953757 T3 PL2953757 T3 PL 2953757T3 PL 13811424 T PL13811424 T PL 13811424T PL 13811424 T PL13811424 T PL 13811424T PL 2953757 T3 PL2953757 T3 PL 2953757T3
- Authority
- PL
- Poland
- Prior art keywords
- soldering
- cleaning
- sound source
- nozzle
- soldering nozzle
- Prior art date
Links
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B08—CLEANING
- B08B—CLEANING IN GENERAL; PREVENTION OF FOULING IN GENERAL
- B08B3/00—Cleaning by methods involving the use or presence of liquid or steam
- B08B3/04—Cleaning involving contact with liquid
- B08B3/10—Cleaning involving contact with liquid with additional treatment of the liquid or of the object being cleaned, e.g. by heat, by electricity or by vibration
- B08B3/12—Cleaning involving contact with liquid with additional treatment of the liquid or of the object being cleaned, e.g. by heat, by electricity or by vibration by sonic or ultrasonic vibrations
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B08—CLEANING
- B08B—CLEANING IN GENERAL; PREVENTION OF FOULING IN GENERAL
- B08B7/00—Cleaning by methods not provided for in a single other subclass or a single group in this subclass
- B08B7/02—Cleaning by methods not provided for in a single other subclass or a single group in this subclass by distortion, beating, or vibration of the surface to be cleaned
- B08B7/026—Using sound waves
- B08B7/028—Using ultrasounds
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K1/00—Soldering, e.g. brazing, or unsoldering
- B23K1/08—Soldering by means of dipping in molten solder
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K1/00—Soldering, e.g. brazing, or unsoldering
- B23K1/08—Soldering by means of dipping in molten solder
- B23K1/085—Wave soldering
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K3/00—Tools, devices or special appurtenances for soldering, e.g. brazing, or unsoldering, not specially adapted for particular methods
- B23K3/06—Solder feeding devices; Solder melting pans
- B23K3/0646—Solder baths
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K3/00—Tools, devices or special appurtenances for soldering, e.g. brazing, or unsoldering, not specially adapted for particular methods
- B23K3/08—Auxiliary devices therefor
Landscapes
- Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- Electric Connection Of Electric Components To Printed Circuits (AREA)
- Molten Solder (AREA)
- Cleaning By Liquid Or Steam (AREA)
Applications Claiming Priority (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| DE102013100473.3A DE102013100473A1 (de) | 2013-01-17 | 2013-01-17 | Verfahren und Vorrichtung zum Reinigen einer Lötdüse |
| PCT/EP2013/076625 WO2014111213A2 (de) | 2013-01-17 | 2013-12-13 | Verfahren und vorrichtung zum reinigen einer lötdüse |
| EP13811424.4A EP2953757B1 (de) | 2013-01-17 | 2013-12-13 | Verfahren und lötvorrichtung mit einer vorrichtung zum reinigen einer lötdüse unter verwendung von einer schallquelle |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| PL2953757T3 true PL2953757T3 (pl) | 2018-11-30 |
Family
ID=49876572
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| PL13811424T PL2953757T3 (pl) | 2013-01-17 | 2013-12-13 | Metody i aparatura do czyszczenia dyszy lutowniczej |
Country Status (9)
| Country | Link |
|---|---|
| US (1) | US20150343546A1 (pl) |
| EP (1) | EP2953757B1 (pl) |
| CN (1) | CN105163890B (pl) |
| DE (1) | DE102013100473A1 (pl) |
| DK (1) | DK2953757T5 (pl) |
| ES (1) | ES2683052T3 (pl) |
| HU (1) | HUE040094T2 (pl) |
| PL (1) | PL2953757T3 (pl) |
| WO (1) | WO2014111213A2 (pl) |
Families Citing this family (19)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101980738A (zh) | 2008-02-07 | 2011-02-23 | 华盛顿大学 | 圆周气雾设备 |
| EP2680913B1 (en) | 2011-03-03 | 2020-05-06 | Impel NeuroPharma Inc. | Nasal drug delivery device |
| CN107376071B (zh) | 2011-05-09 | 2021-07-09 | 英倍尔药业股份有限公司 | 用于将化合物递送到使用者的上部嗅觉区的喷嘴 |
| HK1222358A1 (zh) | 2013-04-28 | 2017-06-30 | Impel Neuropharma Inc. | 医用单位剂量容器 |
| CN105379443B (zh) * | 2013-07-10 | 2018-09-28 | 富士机械制造株式会社 | 吸嘴清洗时间管理装置及管理方法 |
| US9884406B2 (en) | 2014-01-15 | 2018-02-06 | Flow International Corporation | High-pressure waterjet cutting head systems, components and related methods |
| US10596717B2 (en) | 2015-07-13 | 2020-03-24 | Flow International Corporation | Methods of cutting fiber reinforced polymer composite workpieces with a pure waterjet |
| EP3341059B1 (en) | 2015-09-10 | 2022-03-02 | Impel NeuroPharma Inc. | In-line nasal delivery device |
| EP3210779B1 (en) | 2016-02-25 | 2018-12-12 | OCE-Technologies B.V. | Jetting device |
| US10286424B2 (en) * | 2016-04-26 | 2019-05-14 | Ethicon Llc | Ultrasonic cleaning of surgical instrument |
| DE102017114801A1 (de) * | 2017-07-03 | 2019-01-03 | Ersa Gmbh | Verfahren zum Betreiben einer Lötanlage |
| DE102017114954B4 (de) | 2017-07-05 | 2024-11-28 | Ersa Gmbh | Verfahren zum Betreiben einer Lötvorrichtung, Lötvorrichtung |
| US11571532B2 (en) | 2017-11-21 | 2023-02-07 | Impel Pharmaceuticals Inc. | Intranasal device with dip tube |
| US11395887B2 (en) | 2017-11-21 | 2022-07-26 | Impel Pharmaceuticals Inc. | Intranasal device with inlet interface |
| EP3735223A4 (en) | 2018-01-05 | 2021-10-13 | Impel Neuropharma Inc. | INTRANASAL ADMINISTRATION OF OLANZAPINE BY A PRECISION OLFACTORY DEVICE |
| BR112020013744A8 (pt) | 2018-01-05 | 2022-10-18 | Impel Neuropharma Inc | Dispensação intranasal de di-hidroergotamina por dispositivo olfativo de precisão |
| JP2021532098A (ja) | 2018-07-19 | 2021-11-25 | インペル ニューロファーマ インコーポレイテッド | パーキンソン病の治療のためのレボドパおよびドーパデカルボキシラーゼ阻害剤の呼吸管路送達 |
| CN113473967B (zh) | 2019-01-03 | 2022-09-09 | 英倍尔制药公司 | 经鼻药物递送装置 |
| AU2020277313A1 (en) | 2019-05-17 | 2022-01-20 | Impel Pharmaceuticals Inc. | Single-use nasal delivery device |
Family Cites Families (31)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US3430332A (en) * | 1966-04-01 | 1969-03-04 | Electrovert Mfg Co Ltd | Production line soldering with application of ultrasonic energy directing to molten solder |
| JPS537386B2 (pl) * | 1972-03-31 | 1978-03-17 | ||
| US3795358A (en) * | 1972-12-11 | 1974-03-05 | Ibm | Immersion solder leveling apparatus using ultrasonic cavitation |
| US3945618A (en) * | 1974-08-01 | 1976-03-23 | Branson Ultrasonics Corporation | Sonic apparatus |
| JPS54148137A (en) * | 1978-05-15 | 1979-11-20 | Hitachi Ltd | Plating apparatus |
| DE3218338A1 (de) * | 1982-05-14 | 1983-11-17 | Royonic Elektronik Produktionsmaschinen GmbH, 8057 Eching | Loetverfahren und -vorrichtung |
| DE8408427U1 (de) | 1984-03-20 | 1985-07-18 | Robert Bosch Gmbh, 7000 Stuttgart | Lötgerät zum maschinellen Löten von Werkstücken |
| US5113882A (en) * | 1990-08-28 | 1992-05-19 | Electrovert Ltd. | Method of cleaning workpieces with a potentially flammable or explosive liquid and drying in the tunnel |
| JPH04274399A (ja) * | 1991-03-01 | 1992-09-30 | Matsushita Electric Ind Co Ltd | 電子部品装着装置 |
| DE4133645A1 (de) | 1991-10-11 | 1993-04-15 | Ernst Hohnerlein | Verfahren zum loeten und loetkolben zur durchfuehrung dieses verfahrens |
| US5156324A (en) * | 1992-03-17 | 1992-10-20 | Electrovert Lgd | Solder apparatus with dual hollow wave nozzles |
| JP2651558B2 (ja) * | 1993-04-30 | 1997-09-10 | 黒田電気株式会社 | 超音波はんだ付装置 |
| JPH0831703A (ja) * | 1994-07-11 | 1996-02-02 | Matsushita Electric Ind Co Ltd | 電子部品の超音波半田付け装置 |
| DE4432402C2 (de) * | 1994-08-30 | 1998-07-02 | Ersa Loettechnik Gmbh | Schwall-Lötdüse zum flußmittelfreien Löten |
| JPH1157572A (ja) * | 1997-08-14 | 1999-03-02 | Matsushita Electric Ind Co Ltd | 接着剤塗布装置 |
| KR100409201B1 (ko) * | 1999-09-01 | 2003-12-11 | 주식회사 포스코 | 전자기 초음파 진동을 이용한 노즐막힘 방지장치 및 그 방법 |
| JP2002248437A (ja) * | 2001-02-26 | 2002-09-03 | Kao Corp | 超音波洗浄装置及びその方法 |
| NL1017843C2 (nl) * | 2001-04-12 | 2002-10-22 | Vitronics Soltec B V | Inrichting voor selectief solderen. |
| JP2003031535A (ja) * | 2001-07-11 | 2003-01-31 | Mitsubishi Electric Corp | 半導体製造装置の超音波洗浄方法 |
| JP3876167B2 (ja) * | 2002-02-13 | 2007-01-31 | 川崎マイクロエレクトロニクス株式会社 | 洗浄方法および半導体装置の製造方法 |
| KR100459710B1 (ko) * | 2002-04-15 | 2004-12-04 | 삼성전자주식회사 | 웨이퍼 세정 장비 |
| TWI220393B (en) * | 2002-04-30 | 2004-08-21 | Asm Assembly Automation Ltd | Ultrasonic cleaning module |
| JP4428014B2 (ja) * | 2003-02-25 | 2010-03-10 | パナソニック電工株式会社 | 超音波生体洗浄装置 |
| SG185136A1 (en) * | 2003-04-11 | 2012-11-29 | Nikon Corp | Cleanup method for optics in immersion lithography |
| DE102004053337A1 (de) * | 2004-11-04 | 2006-05-11 | Steag Hama Tech Ag | Verfahren und Vorrichtung zum Behandeln von Substraten und Düseneinheit hierfür |
| CN101181842A (zh) * | 2006-11-14 | 2008-05-21 | 珠海天威技术开发有限公司 | 喷墨打印机墨盒回收方法 |
| US20080142037A1 (en) * | 2006-12-19 | 2008-06-19 | Dempski James L | Apparatus and method for cleaning liquid dispensing equipment |
| EP2135700B1 (en) * | 2008-06-18 | 2013-05-22 | Henkel AG & Co. KGaA | Method and apparatus for automated servicing of a welding torch head |
| US8440937B2 (en) * | 2008-12-11 | 2013-05-14 | GM Global Technology Operations LLC | Self-cleaning welding nozzle |
| DE202009002666U1 (de) * | 2009-02-26 | 2009-04-30 | Ersa Gmbh | Vorrichtung zur Reinigung und/oder Aktivierung von Lötdüsen |
| DE202011050852U1 (de) * | 2011-07-28 | 2011-09-07 | Seho Systemtechnik Gmbh | Lötdüse für eine Miniwellenlötvorrichtung und Miniwellenlötvorrichtung mit einer solchen Lötdüse |
-
2013
- 2013-01-17 DE DE102013100473.3A patent/DE102013100473A1/de not_active Withdrawn
- 2013-12-13 ES ES13811424.4T patent/ES2683052T3/es active Active
- 2013-12-13 CN CN201380070853.6A patent/CN105163890B/zh active Active
- 2013-12-13 US US14/761,231 patent/US20150343546A1/en not_active Abandoned
- 2013-12-13 WO PCT/EP2013/076625 patent/WO2014111213A2/de not_active Ceased
- 2013-12-13 HU HUE13811424A patent/HUE040094T2/hu unknown
- 2013-12-13 EP EP13811424.4A patent/EP2953757B1/de active Active
- 2013-12-13 PL PL13811424T patent/PL2953757T3/pl unknown
- 2013-12-13 DK DK13811424.4T patent/DK2953757T5/en active
Also Published As
| Publication number | Publication date |
|---|---|
| WO2014111213A3 (de) | 2014-10-23 |
| DE102013100473A1 (de) | 2014-07-17 |
| EP2953757B1 (de) | 2018-05-23 |
| DK2953757T5 (en) | 2018-09-10 |
| WO2014111213A2 (de) | 2014-07-24 |
| DK2953757T3 (en) | 2018-08-20 |
| CN105163890A (zh) | 2015-12-16 |
| ES2683052T3 (es) | 2018-09-24 |
| CN105163890B (zh) | 2019-05-07 |
| EP2953757A2 (de) | 2015-12-16 |
| US20150343546A1 (en) | 2015-12-03 |
| HUE040094T2 (hu) | 2019-02-28 |
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