TWI220393B - Ultrasonic cleaning module - Google Patents

Abstract

The invention provides an ultrasonic cleaning module and a method for cleaning singulated electronic packages. The module comprises a cutting chuck having a surface with a plurality of cutting recesses defined in it for enabling a cutting device to separate individual electronic packages from a substrate having a plurality of electronic packages on the surface of the chuck. A pulsator nozzle is supported above the chuck and the separated electronic packages on the chuck such that the pulsator nozzle may emit fluid toward the packages. An ultrasonic generator is associated with the nozzle that is adapted to ultrasonically energize fluid that passes through the nozzle to enhance cleaning of the packages.

Description

1220393 V. Description of the invention (1) [Technical field to which the invention belongs] The present invention relates to a cleaning device and method for cleaning divided semiconductors or electronic packaging components, and particularly to a method for spraying divided semiconductors with a cleaning liquid. Or electronic packaging components cleaning device and method. [Previous technology] In most semiconductor production technologies, some individual electronic packages, such as semiconductor chip scale package (CSP), are To form on a single substrate. The individual electronic package components mentioned above must be cut and separated before use. A method of dividing a substrate is to cut the above-mentioned substrate using a grain cutting, during which the above-mentioned substrate is fixed on a cutting chuck. Each substrate is typically composed of an array of integrated circuit devices or sections of multiple arrays, which can be called panels. These panels can be placed on the substrate at equal intervals, about 3 to 5 groups. The electronic packaging components obtained after the dicing process still need to undergo further cleaning, rinsing and drying processes. The above-mentioned system ^ — Maintain the relevant position and positioning of the cut electronic packaging components. = 4 The electronic packaging components must not be tilted and partially overlapped, so as to avoid processing difficulties in the subsequent assembly process. One of the commonly used methods for cleaning and drying the cut substrate is to complete it with a pressurized water nozzle and an air blower. The cut substrate is on a fixed plate and the surface of the fixed plate is porous. Sexual material =. gas

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V. Description of the invention (2) The cleaning of the nozzle will cause a complex groove in the circuit substrate of the device, and the immersion wave groove is extremely long and difficult to dry. It is suitable for cleaning the heart. Cleaning. On the device. The cut substrate is dried. Grooves of the substrate Cut substrates (termarks) & when the humidity control material is dry. In addition, it is manufactured during flushing. The other is fixed and cleaned. This typically results in a traditional ultrasonic electronic device with an ultrasonic wave. The material is flushed and chipped by fast nozzles later. Because of the effect of conveying and washing, it will be cut when it is pressed, and it will be difficult to press. Therefore, it will be difficult to fix the system. On the sonic structure, the frequency of the above-mentioned superconducting process pollutants may not be the application of the gravitational force that has been removed from a handle and the above-mentioned already rotated motion, on the 'water mark (wa surface. Wash. It will cause the cut base system to cause the design and cutting of the substrate in the shadow pressure space. It is complex and time consuming. Also, the carrier of the cut base such as wire bonding can be added by adding The pressurized water is thrown out anyway, but the clearance between the bottom of the clear and the formation of pollutants is increased. The positioning method of the above method is to make it covered in a nest. However, the setting needs to consume a long time in the cleaning solution. The third way of driving the wave groove is that the vacuum device rotates solidly, and is washed, and then the vacuum suction is restricted by passing through the above device. The final substrate is the standard substrate washing And the need to shorten the process of improving the process. Therefore, 'To achieve a complete cleaning process towards the production time of sub-micron water roots, [Product Summary] In view of the above invention, Φ Du, Shiwen, in order to' monthly wash multiple electrons Sealing the parts, the present invention attempts to provide an improved module and method for attracting dual 1U electric modules, which eliminates the

1220393 V. Description of the invention (3) Problems with the previous technology. Net mold: According to a viewpoint, the present invention provides a kind of ultrasonic washing package I. The first net module includes:-cutting chuck, the above-mentioned cutting is-cutting device, borrow] :::: 2 above it In order to make the cutting chuck into several electronic devices; _! Vibrate $ ^ The surface of the substrate is divided into individual sprayed substrates that have been sprayed eight times above the cutting disc, and by this, the vibration element is also on the cutting chuck Above. In addition, -Zhao Li, and Shi Chao ejected energetic liquid from electronic packaging components through vibration, crying, spraying, and vibrator nozzles, which combined with each other. The liquid flow will be generated by the ultrasonic generator with a plurality of energy: the second aspect, * invention is to provide-a kind of electronic package with the above-mentioned electric two ", the substrate forms a plurality of electronic packaging elements, electronic packaging elements, 70 pieces The method includes: placing a plurality of materials on the chuck: on: the surface of the cutting chuck; ® fixing the above-mentioned electronic packaging component, 1 on the door 2 and the earth substrate as a plurality of individual mounting components 俜 fixed I if the substrate and the above-mentioned individual plurality of electronic seals are fastened to the above-mentioned cutting chuck; the above-mentioned plurality of electronic arrays = the output is as follows: the liquid container is used to supply ultrasonic energy to flow through the nozzle of the vibrator Many differential photos = descriptions in the embodiments, the present invention may be understood to a certain extent. In addition to the above detailed description, which is shown in the scope of the appended claims, the present invention can also be widely 1220393

Ground is implemented in other embodiments. However, it is not intended to limit the scope of the present invention covered by the present invention within the spirit disclosed by the present invention. [Embodiment] The above is only the scope of patent application of the preferred embodiment of the present invention; For equivalent changes or modifications, the first figure should be a plan view of a vacuum cutting chuck 13 for fixing the substrate. The vacuum cutting chuck 13 described above includes cutting grooves 22 in a horizontal and vertical pattern. The groove 22 allows a cutting (not shown in the figure) to cut a substrate having a plurality of electronic packaging components. The arrangement of the cutting grooves 22 described above is designed based on the arrangement of the electronic packaging components on the undivided substrate 28. The vacuum cutting chuck 13 has a plurality of vacuum holes 27 on its surface. Among them, the above-mentioned plurality of vacuum holes 27 are located under the plurality of electronic packaging components, in order to fix the individual packaging components after the splitting process 丨 on the vacuum cutting chuck 丨 3 The second picture is a three-electronic package A plan view of the vacuum-cut chuck 13 of the element's undivided substrate 28. The third figure shows the plan view of the prior art cleaning equipment. The above-mentioned cleaning equipment is I-pressurized < water spraying, which is used to clean Xiao Fenggan, a farmer, which has a plurality of electronic packaging components, which have been cut. The above-mentioned cut base material 1 is fixed on a nested tray 2 and is covered with a porous material 3. Among them, the upper wetting nozzle 6 and the lower wetting nozzle 7 may spray pressurized water on the substrate 1, and thereafter, the upper air nozzle 4 and the lower air nozzle 5 may blow dry the substrate. Regardless of ~, this drying process can produce water vapor, and the above-mentioned process

Page 9 1220393 V. Description of the invention (5) ---- The process will increase the humidity in the environment and affect the drying time of the cut substrate. The stack tray 2 described above has a stack design, which uses a plurality of partition walls to fix the cut substrates. The plurality of partition walls described above can hold the cut substrate 1 but may interrupt the spraying of water. After the cut substrate 1 is partially covered by a plurality of partition walls, it will lead to good results. The fourth figure is a plan view of a cleaning device of the prior art. The above-mentioned flocculation cleaning device is a method in which a cut substrate 1 is immersed in an ultrasonic cleaning tank 11. The ultrasonic cleaning tank 11 contains a cleaning liquid. The cut base material 1 is fixed on the sun-lifter 9 and is covered by an upper cover 8. The above-mentioned conveying system is located on an ultrasonic transducer 10, and each of the above-mentioned components is within an ultrasonic cleaning tank " filled with cleaning solution 12. Because there are many: the processing procedure will generate debris or contaminated dust in the ultrasonic cleaning tank " of it: to maintain a good and clean deionized water circulation is required ^ This type of tank immersion is not efficient and requires Spend a lot of time to do two, = work and maintenance. The above-mentioned technology is not suitable for most of the super 2 and driving frequencies. Among them, the above-mentioned ultrasonic frequency is about 40 kHz, because the 2 f frequency is close to the resonance frequency of the electronic wire bonding, the impact may be on A wire-bonded electronic device on the cut substrate 1 is produced. As shown in the fifth figure, it is a size drawing of a cleaning device of the prior art. The cleaning device described in the first embodiment uses a centrifugal cleaning method to clean the cut substrate 1 fixed on the second disk. The above-mentioned cut substrate 1 is fixed on a carrier 29, wherein the above-mentioned carrier 29 is sequentially fixed on a

V. Description of the invention (6) Above the centrifugal platform 30. The pressurized water nozzle 6 generates a water jet, thereby rinsing the cut substrate fixed on the carrier 29! Among them, the above-mentioned cut substrate 1 is fixed on the carrier 29 in a vacuum adsorption manner. Thereafter, the above-mentioned centrifugal platform 30 will be rotated in a determined direction 31 to dry the cut substrate 1. In any case, the above-mentioned rinsing and rotating steps will cause the cut substrate 1 to cause contamination and watermarks. The driving force provided by the cut substrate 1 determined by the true * f according to the determined direction 31 provides a driving force, which is a method in which the K debris on the cut substrate i spreads out, among which is the method described above. This will result in the table "According to a preferred embodiment of the present invention, as shown in the sixth figure, the outline of the ultrasonic cleaning module for cleaning the cut substrate i is shown in the figure. The cleaned substrate is cleaned by: ^ Eight: Material 1 includes a plurality of electronic packaging components, two substrates 28, 1 and 4 with a plurality of electronic packaging components are fixed by cutting the auxiliary chuck 13 to fix the substrate 28, 1. The above-mentioned cut-to-disc package: d enables the cutting chuck 13 to become, the base of the device surface is divided into a number: the surface of the number chuck can be set by a flexible material, 2, and Working force: It: The effect of fixing the surface of the cutting chuck 13 on the cutting chuck 13. In addition, the electric movement of 70 pieces and the surface of the cutting chuck 13 can be used to increase the material of ^ Friction of electronic packaging components == 1220393 V. Description of the invention (7) The friction cleaning system of packaging components is When the cut fruit has gone, '... the substrate 1 is along the cutting clip: the individual electronic packaging components of the substrate 1 are cut by dividing the plurality of electronic packaging components from the substrate, and the individual electronic packaging components can be attracted by the true moxibustion of the vacuum device While staying fixed on the cutting chuck 13. The above-mentioned vacuum, the vacuum holes on the second ′ make it possible to cut the electric im: from the substrate ，, which can fix the entire substrate with electronic packaging components. Thereafter, the substrate 28 Divided into individual electronic packaging components, the individual packaging components can be fixed on the cutting chuck 3. A vibrator nozzle 14 is located above the cutting chuck 13 and is on the cut base of the cutting chuck 13. On the divided electronic packaging element, the vibrator nozzle 14 can emit a liquid with energy toward the above-mentioned electronic packaging element. An ultrasonic generator 17 and the vibrator nozzle 14 can be combined with each other, wherein, The liquid flow flowing through the vibrator nozzle 14 will generate energy through the ultrasonic generator 17. The above-mentioned ultrasonic generator 17 operates at an ultrasonic frequency, and its ultrasonic frequency can pass through the liquid flow Flow energy at the mouth. When the deionized water is in the open state, the deionized water 24 can pass through the vibrator nozzle (for example, the W-357P-50 pulsator nozzle from Honda Electronics Co Ltd). When the shaker nozzle "sprays deionized water on the cut substrate 1, the above-mentioned shaker nozzle can be moved back and forth above the cutting chuck 13". The above-mentioned vibrator nozzle 14 is inclined to form an angle with the vertical direction. Page 12 1220393 V. Description of the invention (8), the preferred angle is less than 30 degrees, and the vibrator nozzle 14 is preferably above the cut substrate 1. Distance 16 series is 5 to 20 mm. A flow sensor 19 & bit flow transmitter 18 can be used for liquid flow detection. The preferable range of the above-mentioned liquid flow rate is 3.5 liters per minute or more. Therefore, the preferred design of the flow & sensor 19 and the digital flow transmitter 18 is to detect a minimum flow of 3.5 litres per minute before the start signal is used to activate the ultrasonic generator. The above-mentioned deionized water 24 can flow out through the vibrator nozzle 14 having an ultrasonic generator 17, wherein the ultrasonic frequency is about several hundred kHz. A preferred ultrasonic frequency is about 40 kHz, which is a typical resonance frequency away from wire bonding in electronic devices. The ultrasonic energy will be transmitted to the water molecules in the thin sheet of deionized water 24, which is ejected from the vibrator nozzle 14 and has ultrasonic energy. When the cut substrate 丨 is brought to the bottom of the spray path, a par α wash to remove sub-micron to micron-level particles will be generated, and in this way, the particles formed during the substrate cutting process will be removed. . After the cleaning process, the supply of deionized water was turned off. A gas drying ° can be air knives or air nozzles. The gas dryer 15 is on the cutting chuck Η with the cut substrate! The upper and lower sides are shifted t 'and a gas is sprayed toward the cut substrate i, thereby blowing off water remaining on the surface of the cut substrate 丨. > Obviously, according to the description in the above embodiment, the present invention may have some modifications and differences. Therefore, it needs to be understood within the scope of the appended claims. In addition to the above detailed description, the present invention can be widely implemented in other embodiments. The above is only the preferred embodiment of the present invention. 1220393 V. Description of the invention (9) It is not intended to limit the scope of patent application of the present invention; any other equivalent changes or modifications made without departing from the spirit disclosed by the present invention , Should be included in the scope of patent application below.

Page 14 1220393 Brief description of the drawings [Simplified description of the drawings] The first diagram is a plan view of a vacuum cutting chuck for fixing a substrate; the second diagram is an undivided substrate containing three electronic packaging components on The plan view of the vacuum cutting chuck thereon. The third figure is a plan view of a cleaning device of the prior art. The above cleaning device uses a pressurized water nozzle to clean and air dry the cut and cut bases of a plurality of electronic arrays. material;,

The fourth figure is a plan view of a cleaning device of the prior art. The above-mentioned cleaning device is a soaked substrate in an ultrasonic cleaning tank, wherein the ultrasonic cleaning tank contains a cleaning liquid; the fifth image is a Isometric drawing of the cleaning equipment of the prior art. The above cleaning equipment uses a centrifugal cleaning method to clean the cut substrate fixed on the vacuum chuck; the sixth image is an ultrasonic washing for cleaning the cut substrate The schematic diagram of the cleaning module; and the seventh diagram is an application schematic diagram of the ultrasonic cleaning module for cleaning the cut substrate. [Representative symbols for main parts]

1 Cut substrate 2 Stacked pallets ^ 3 Porous material 4 Upper air nozzle 5 Lower air nozzle 6 Upper wetting nozzle

Page 15 1220393 Brief description of the drawing 7 Lower wetting nozzle 8 Upper cover 9 Transporter 10 Ultrasonic transducer 11 Ultrasonic cleaning tank 12 Cleaning liquid 13 Cutting chuck 14 Vibrator nozzle 15 Gas dryer 16 Distance 17 Ultrasonic generator 18 Digital flow transmitter 19 Flow sensor 20 Deionized water valve 21 Controller 22 Cutting groove 24 Deionized water 25 Direction of deionized water 27 Vacuum hole 28 Substrate 29 Carrier 30 Centrifugal platform 31 Determined direction

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Claims (1)

Sixth, the scope of application for patents1. An ultrasonic cleaning module, which includes a cutting chuck; several cutting grooves divide the individual electricity on the cutting material; A plurality of electronic packages, in which the 7 vibrator nozzle on the cutting disk, the vibrator nozzle position: upper: middle = the plurality of electronic packaging components are also in ==-liquid and nozzle can be directed toward the plurality The electronic packaging components eject each other and enter the supersonic generator: the supersonic generator, the supersonic generator, the wave generator and the vibrator nozzle 2 bite straightly and give the liquid energy to flow out through the vibrator nozzle. The ultrasonic cleaning module described in the Qi / Λ / circle item 1 further includes water remaining on the plurality of electronic packaging components away from the plurality of electronic packaging components. In other words, the application of the ultrasonic cleaning module described in item 2 of the 'V Special, Yan. Wai', wherein the roll dryer is an air knife or a gas nozzle. 1220393 VI. Scope of patent application Liquid flow rate is about 3.5 litres per minute or more. Among them, which among which, among which, the ultrasonic cleaning mold is thin as described in item 1 of the patent application scope, and the liquid system is deionized water. 8. · According to the ultrasonic cleaning module described in item 1 of the scope of patent application, the ultrasonic frequency generated by the ultrasonic generator is about several hundred kilohertz. 9 · Ultrasonic cleaning as described in item 8 of the scope of patent application, the ultrasonic frequency is about 400 kHz. The ultrasonic cleaning module described in the first item of the scope of the patent application, and the surface of the τ ϊ ί 盘 ί disk is made of an elastomer material to increase 1 " fixation and clean the substrate. η. The ultrasonic cleaning module described in item 1 of the scope of patent application, which is more n it ^ ^ ^ i urgent tooling 1 to hunt and fix by vacuum suction to fix a plurality of hair package components in the cutting disk. on. The ultrasonic cleaning module described in the straight patent scope of item 11 includes at least one vacuum hole on the cutting chuck, wherein the? is cut before cutting the plurality of electronic packaging components on a 2 substrate. Its #t has the entire substrate of the plurality of electronic packaging components, and Γ is divided into individual ones of the plurality of electronic packaging components, and still < 13 ϋ the plurality of electronic packaging components are on the chuck. Several • Subs: J has J several electronic packaging components-general substrates to form the multiple cleaning method of the multiple electronic packaging components, sub-seal; Yuan; cattle toilet: the general substrate of sub-packages to form the A plurality of electronic seals and a method for cleaning the plurality of electronic seal elements include: placing a substrate having the plurality of electronic seal elements on a surface of a peeling plate 1220393 VI. Patent application scope on a surface of a chuck; fixing the substrate Material on the cutting chuck; dividing the substrate into the individual plurality of electric substrates and the plurality of electronic packaging element discs; and spraying a liquid stream through the vibrator nozzle on the electronic sealing element And start an ultrasonic generation amount to the liquid flowing out through the nozzle of the vibrator. 14. The method for forming the plurality of electronic packages, pens, and agricultural components from a general substrate with components as described in item 13 of the scope of the patent application, further comprising providing a cutting chuck and the plurality of electronic packaging components. The gas flow is used to blow away from the plurality of electronic seal bodies. 15 · The method for forming the plurality of electronic packages and electronic packaging components from a general base material with components as described in item 13 of the patent scope of the patent, further comprising providing a cutting chuck and the plurality of electronic packaging components. The gas flow is generated by an air knife or a gas nozzle. 16 · The method of forming the plurality of electronic package components and electronic package components from a substrate with components as described in item 13 of the scope of patent application, where The vibrator is inclined to form an angle, and the angle is less than 3017. According to the sub-packaged component described in item 13 of the scope of the patent application, it is fixed to the plurality of devices divided by the cutting clip. The supply of ultrasonic energy has a plurality of electronic packages 70 pieces and cleaning the plurality of spray gas flows in this step, wherein the liquid remaining on the spray element has a plurality of electronic seal components and cleaning the plurality of spray gas flows in In this step, the spray is set. There are multiple components and nozzles and sags. There are a plurality of electronic packages, electronic packages, Page 19 1220393 VI. Scope of patent application The vibrator nozzle is 5 to 20 meals for each electronic package component. Said from having a plurality of electronic packaging elements and the flow of the liquid, said from having a plurality of electronic packaging elements and the liquid system as described above, from having a plurality of electronic packaging elements and the According to the sonic generator, the plurality of electronic packaging components and the ultrasonic frequency are used to clean the plurality of electrical packagings. The cleaning of the plurality of electrical packagings is about cleaning of the plurality of ionized water per minute of the electronic packaging. The method of forming a plurality of electronic package components by cleaning the plurality of electronic packages with a plurality of 400 kilohertz ^ pieces of general electronic substrates generated by cleaning the plurality of electronic packages with the plurality of electronic packages, the distance above the sub-package components is about 18 · The method for forming a plurality of electronic packaging components with a general base material of 70 items under the scope of patent application No. 13 has a clock of 3.5 litres or more. 1 9 · If the general base material of 70 items in the scope of the patent application is used to form the plurality of electronic packaging components, 2 ·· If the general base material of the 70 items in the scope of patent application is 13 to form the multiple electronic packages The component method has a sound wave frequency of about several hundred kilohertz. 2 j · The method of forming the plurality of electronic packaging components as the base material of the patent application scope item 20, 22 · As described in the patent application scope item 13 from the general having 70 electronic packaging components in general The substrate forms the plurality of electronic packaging components and the method of cleaning the plurality of electronic packaging components, wherein the step of dividing the substrate further includes cutting the substrate fixed on the cutting chuck to form the individual plurality. Steps of electronic packaging components. 2 3 · Having multiple electronic packages as described in item 22 of the patent application scope 1220393 VI. A general base material for a patent application file forming the plurality of electronic packaging components and a method for cleaning the plurality of electronic packaging components, further comprising a substrate fixed on the cutting chuck and the divided plurality In an electronic array step, the cutting chuck is used to fix the substrate and the plurality of electronic packaging components on the cutting chuck by vacuum suction. 24. The method of forming the plurality of electronic packaging components and cleaning the plurality of electronic packaging components from a general substrate having a plurality of electronic sealing components as described in item 13 of the scope of the patent application, further comprising The cutting chuck slides the substrate to frictionally clean the substrate. 25. The method of forming the plurality of electronic packaging components and cleaning the plurality of electronic packaging components from a general substrate having a plurality of electronic packaging components as described in item 24 of the scope of the patent application, wherein the surface of the cutting chuck is Made of an elastomeric material. ‘