JPS61181134A - Cleansing apparatus - Google Patents
Cleansing apparatusInfo
- Publication number
- JPS61181134A JPS61181134A JP2086285A JP2086285A JPS61181134A JP S61181134 A JPS61181134 A JP S61181134A JP 2086285 A JP2086285 A JP 2086285A JP 2086285 A JP2086285 A JP 2086285A JP S61181134 A JPS61181134 A JP S61181134A
- Authority
- JP
- Japan
- Prior art keywords
- cleaning
- ultrasonic
- workpiece
- liquid
- casing
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 238000001035 drying Methods 0.000 claims abstract description 13
- 238000004140 cleaning Methods 0.000 claims description 63
- 239000007788 liquid Substances 0.000 abstract description 29
- 230000001680 brushing effect Effects 0.000 abstract 1
- 239000000126 substance Substances 0.000 abstract 1
- 238000004506 ultrasonic cleaning Methods 0.000 description 11
- 230000000694 effects Effects 0.000 description 6
- 238000002347 injection Methods 0.000 description 6
- 239000007924 injection Substances 0.000 description 6
- 235000012431 wafers Nutrition 0.000 description 4
- 238000007599 discharging Methods 0.000 description 3
- 238000000034 method Methods 0.000 description 3
- 239000004065 semiconductor Substances 0.000 description 3
- 238000011109 contamination Methods 0.000 description 2
- JBRZTFJDHDCESZ-UHFFFAOYSA-N AsGa Chemical compound [As]#[Ga] JBRZTFJDHDCESZ-UHFFFAOYSA-N 0.000 description 1
- 229910001218 Gallium arsenide Inorganic materials 0.000 description 1
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 1
- 230000005540 biological transmission Effects 0.000 description 1
- 239000000919 ceramic Substances 0.000 description 1
- 239000011521 glass Substances 0.000 description 1
- 238000011086 high cleaning Methods 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 238000005459 micromachining Methods 0.000 description 1
- 230000003287 optical effect Effects 0.000 description 1
- 239000003960 organic solvent Substances 0.000 description 1
- 229910052710 silicon Inorganic materials 0.000 description 1
- 239000010703 silicon Substances 0.000 description 1
- 239000002904 solvent Substances 0.000 description 1
- 239000007921 spray Substances 0.000 description 1
- 239000000758 substrate Substances 0.000 description 1
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
- H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
- H01L21/302—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to change their surface-physical characteristics or shape, e.g. etching, polishing, cutting
- H01L21/304—Mechanical treatment, e.g. grinding, polishing, cutting
- H01L21/3046—Mechanical treatment, e.g. grinding, polishing, cutting using blasting, e.g. sand-blasting
Landscapes
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Cleaning In General (AREA)
- Cleaning Or Drying Semiconductors (AREA)
Abstract
Description
【発明の詳細な説明】
〔発明の利用分野〕
本発明は、洗浄装置に係り、例えば半導体部品、光学部
品等の表面に付着した異物を除去するのに好適な洗浄装
置に関するものである。DETAILED DESCRIPTION OF THE INVENTION [Field of Application of the Invention] The present invention relates to a cleaning device, and more particularly, to a cleaning device suitable for removing foreign matter adhering to the surfaces of semiconductor components, optical components, etc., for example.
従来の洗浄装置としては、特公昭５６−４４７８８号公
報に記載のように、半導体ウェハのごとき表面が平滑な
被洗浄物に対して、その上面に液体を流し、その薄い液
層を介して超音波洗浄を行う超音波発生面が設けられる
ようにしている。A conventional cleaning device, as described in Japanese Patent Publication No. 56-44788, involves pouring a liquid onto the top surface of an object to be cleaned, such as a semiconductor wafer, which has a smooth surface, and applying ultraviolet light through the thin liquid layer. An ultrasonic generating surface for performing sonic cleaning is provided.
しかし、被洗浄物に凹凸の加工が施されていたシ、トレ
イ上に設置された被洗浄物をトレイ毎洗浄するような超
音波を伝達すべき媒体である液体が、超音波発生面と被
洗浄物との間に存在できないような形状の場合について
は、配慮されていなかった。However, if the object to be cleaned has been processed with unevenness, the liquid, which is the medium to which the ultrasonic waves should be transmitted when cleaning the object placed on a tray, may be difficult to contact between the ultrasonic generation surface and the surface of the object. No consideration was given to the case of a shape that would not allow it to exist between the cleaning object and the cleaning object.
一方、水中及び有機溶媒中に被洗浄物を浸漬し、その洗
浄槽に超音波振動子を取り付け、もしくは洗浄槽内に超
音波振動子を位置させ、被洗浄物表面の付着異物を超音
波のエネルギーで除去する超音波洗浄装置も公知である
。On the other hand, the object to be cleaned is immersed in water or an organic solvent, and an ultrasonic transducer is attached to the cleaning tank, or the ultrasonic transducer is placed in the cleaning tank, and foreign matter adhering to the surface of the object to be cleaned is removed using ultrasonic waves. Ultrasonic cleaning devices that remove with energy are also known.
しかし、この湿式の超音波洗浄装置では、洗浄能力に限
界があるため、多段に超音波洗浄槽を通過させる必要が
あシ、かつ後工程で乾燥といった別作業が必要となる。However, this wet-type ultrasonic cleaning device has a limited cleaning ability, so it is necessary to pass through ultrasonic cleaning tanks in multiple stages, and additional work such as drying is required in the post-process.
また、ブラシや高圧ジェットによるスクラバ洗浄におい
ては、微細な加工溝中の微小異物や、粘着性のある付着
物の除去等には不向きであったものである。Further, scrubber cleaning using a brush or high-pressure jet is not suitable for removing minute foreign matter in minute grooves or sticky deposits.
本発明は、微細加工が施された部分を有する複雑な表面
の被洗浄物に対して、十分に清浄化可能な洗浄装置の提
供を、その目的とするものである。SUMMARY OF THE INVENTION An object of the present invention is to provide a cleaning device capable of sufficiently cleaning an object having a complicated surface having a micro-machined part.
本発明に係る洗浄装置の構成は、回転ブラシ洗浄、高圧
ジェット洗浄ならびに、リンス及びスピン乾燥等を行え
るようにした洗浄装置において、そのワーク支持台の周
囲を覆う筒状の外囲体に、超音波振動子を配設したもの
である。The cleaning device according to the present invention has a structure in which a cleaning device capable of performing rotating brush cleaning, high-pressure jet cleaning, rinsing, spin drying, etc. It is equipped with a sonic vibrator.
さらに補足すると、次のとおシである。To add more information, the following points are true.
本発明は、主として微細な溝等に付着残留した異物を除
去し、かつ、スクラバ洗浄で異物を除去し易くするため
の湿式の超音波洗浄機能、さらに、被洗浄物の平滑表面
部の清浄化のためのブラシスクラバ及び被洗浄物全体を
清浄化する高圧ジェット機能を有するようにしたもので
ある。また、乾燥としては、ワーク支持台を高速回転す
ることにより、遠心力によって、付着した水分もしくは
溶媒を除去することができ、したがって湿式の洗浄装置
に係るものとして小形化が図れ、かつ異物の付着状態に
適合した洗浄方法によって、その異物は除去されるよう
にしたものである。このように、表面に複雑な微細加工
が施こされた板状の部品の洗浄に有効な装置としたもの
である。The present invention mainly provides a wet ultrasonic cleaning function for removing foreign matter stuck and remaining in minute grooves, etc., and making it easier to remove foreign matter by scrubber cleaning, and also for cleaning smooth surfaces of objects to be cleaned. It has a brush scrubber for cleaning and a high-pressure jet function to clean the entire object to be cleaned. In addition, for drying, by rotating the workpiece support at high speed, adhering moisture or solvent can be removed by centrifugal force. Therefore, it is possible to reduce the size of wet cleaning equipment, and it is possible to remove foreign matter from adhering to it. The foreign matter is removed by a cleaning method appropriate to the situation. In this way, the apparatus is effective for cleaning plate-shaped parts whose surfaces have been subjected to complex micromachining.
本発明に係る洗浄装置の一実施例を、第１図及び第２図
により説明する。An embodiment of the cleaning device according to the present invention will be described with reference to FIGS. 1 and 2.
第１図は、本発明の一実施例に係る洗浄装置の、その超
音波洗浄時をあわせ示す断面図、第２図は、そのスクラ
バ洗浄時の内部概略説明開披図である。FIG. 1 is a sectional view showing a cleaning device according to an embodiment of the present invention during ultrasonic cleaning, and FIG. 2 is an open view schematically explaining the interior of the cleaning device during scrubber cleaning.
すなわち、本実施例に係るものは、ワーク支持台６と、
そのワーク支持台６の周囲に筒状の外囲体１、さらに、
その外囲体１に取シ付けられた超音波振動子７ａ、７ｂ
、７ｃからなるものである。That is, the one according to the present embodiment includes a workpiece support stand 6,
A cylindrical outer envelope 1 is placed around the workpiece support 6, and further,
Ultrasonic transducers 7a and 7b attached to the outer envelope 1
, 7c.
なお、超音波振動子の数は、図のごとく３個に限定され
るものではなく、取り付は位置も外囲体１の下部に限る
ものではない。Note that the number of ultrasonic transducers is not limited to three as shown in the figure, and the mounting position is not limited to the lower part of the envelope 1.
そして、前記の外囲体１中に超音波のエネルギーを伝達
させる液３を充填する注液ノズル２、その液３を排出し
ブラシスクラバ洗浄を行うための、ブラシアーム１０ａ
を有するブラシ１０、ブラシスクラバ洗浄時及びり７１
時に必要な液１１ａを供給するリンスノズル１１、さら
に、高圧ジェット洗浄を行なうためのジェットノズル１
３、ワーク支持台６を高速回転させ、トＬ／イ５及び被
洗浄物に係るワーク４上に残留した液を遠心力で除去す
る際に乾燥効果を高めるガス噴射ノズル１２などが、外
囲体１の上部もしくはワーク支持台６の付近に設置され
、必要時に、ワーク支持台６の上部に移動し、洗浄、乾
燥を行うようにしたものである。A liquid injection nozzle 2 for filling the liquid 3 for transmitting ultrasonic energy into the outer envelope 1, and a brush arm 10a for discharging the liquid 3 and cleaning the brush scrubber.
A brush 10 having a brush scrubber during cleaning and a brush 71
A rinse nozzle 11 for supplying the liquid 11a necessary for cleaning, and a jet nozzle 1 for performing high-pressure jet cleaning.
3. A gas injection nozzle 12, etc., which increases the drying effect when rotating the workpiece support table 6 at high speed and removing residual liquid on the tray L/I 5 and the workpiece 4 related to the object to be cleaned by centrifugal force, is installed in the outer circumference. It is installed on the top of the body 1 or near the workpiece support 6, and is moved to the top of the workpiece support 6 for cleaning and drying when necessary.
しかして、例えば、ワーク４は、平滑な表面上に微細な
加工が施こされたようなものであり、ワーク４を載せ固
定するトレイ５は、適宜、ワーク４の形状に合った受は
加工が施されてワーク固定ができるようになっておシ、
そのトレイ５の裏面は、トレイ５とワーク４ごと、真空
でワーク支持台６に固定できるよう真空経路溝５ａが設
けられている。For example, the workpiece 4 has a smooth surface that has been finely machined, and the tray 5 on which the workpiece 4 is placed and fixed is appropriately machined with a receiver that matches the shape of the workpiece 4. It is now possible to fix the workpiece.
A vacuum path groove 5a is provided on the back surface of the tray 5 so that the tray 5 and the workpiece 4 can be fixed to the workpiece support base 6 under vacuum.
また、ワーク支持台６は、真空吸引孔６ａが中央部にあ
り、さらに、回転用シャフト９及び真空用シャツ）９ａ
と、液密にシール及び嵌合されているものである。Further, the workpiece support table 6 has a vacuum suction hole 6a in the center, and further includes a rotating shaft 9 and a vacuum shirt 9a.
and are sealed and fitted in a liquid-tight manner.
上記の外囲体１は、上下駆動用シャフト８に固定され、
各洗浄種類により、回転用シャフト９と液密にシールさ
れながら上下移動をするように形成されているものであ
る。The above-mentioned outer enclosure 1 is fixed to the vertical drive shaft 8,
Depending on the type of cleaning, it is formed to move up and down while being sealed liquid-tightly with the rotating shaft 9.
なお、２ａ、１３ａは洗浄液を示し、１４は液排出口で
ある。Note that 2a and 13a represent cleaning liquids, and 14 is a liquid outlet.
次に、上記の構成に係るものの作動を説明する。Next, the operation of the device having the above configuration will be explained.
まず、超音波による洗浄においては、外囲体１を上方へ
移動し、液排出口１４に接続される排出バルブを閉じ、
注液ノズル２から洗浄液２ａをワーク４の上方まで充た
すよう吐出する。この際、予め真空吸引でワーク４を固
定しておくものである。First, in ultrasonic cleaning, the envelope 1 is moved upward, the discharge valve connected to the liquid discharge port 14 is closed,
The cleaning liquid 2a is discharged from the liquid injection nozzle 2 so as to fill the upper part of the workpiece 4. At this time, the workpiece 4 is fixed in advance by vacuum suction.
さらに超音波振動子７ａ、７ｂ、７ｃを起動させ、液３
を介し超音・波エネルギーによりワーク４の洗浄を行う
ものである。Furthermore, the ultrasonic transducers 7a, 7b, and 7c are activated, and the liquid 3
The work 4 is cleaned using ultrasonic/wave energy through the .
ここで、超音波のエネルギーがワーク４に均等に伝達さ
れるよう、ワーク支持台６を回転させ、もしくは外囲体
１を上下させることは、少しも洗浄効率を阻害するもの
ではない。Here, rotating the workpiece support base 6 or moving the envelope 1 up and down so that the ultrasonic energy is evenly transmitted to the workpiece 4 does not impede the cleaning efficiency in the slightest.
上記のようにして、超音波による洗浄を行ったのち、液
排出口１４に接続された排出パルプを開き、液３を排出
し、外囲体１を下方へ移動する。After performing ultrasonic cleaning as described above, the discharge pulp connected to the liquid discharge port 14 is opened, the liquid 3 is discharged, and the envelope 1 is moved downward.
そして、ワーク４は、まだワーク支持台６にトレイ５ご
と真空によって固定されたままとし、外囲体１の上部も
しくはワーク支持台６の付近に設置されたブラシ１０を
、ブラシアーム１０ａによりワーク４上に密着させる。Then, the workpiece 4 is still fixed to the workpiece support stand 6 along with the tray 5 by vacuum, and the brush 10 installed on the upper part of the enclosure 1 or near the workpiece support stand 6 is moved by the brush arm 10a to the workpiece 4. Stick it on top.
この際、ワーク４は、ワーク支持台６を回転させること
により、ブラシ１０と、その全数が全面接触し、ワーク
４の表面平滑部の洗浄を主に行うものである。At this time, the entire surface of the workpiece 4 is brought into contact with the brushes 10 by rotating the workpiece support base 6, and the smooth surfaces of the workpiece 4 are mainly cleaned.
ブラシ１０の回転と同時あるいは、適宜短い時間的間隔
をおき、リンスノズル１１よシ洗浄用の液１１ａをワー
ク４上に吐出する。The cleaning liquid 11a is discharged onto the workpiece 4 through the rinse nozzle 11 at the same time as the brush 10 rotates or at appropriately short intervals.
次に、ブラシ１０をワーク４上よシ引きはなし、液１１
の吐出を止める。Next, remove the brush 10 from the workpiece 4 and remove the liquid 11.
stop discharging.
さらに、高圧ジェット用に係るジェットノズル１３をワ
ーク４の上方部に位置させ、ワーク支持台６を回転させ
たまま、洗浄液１３ａを高圧で噴射させ、ワーク４上を
洗浄する。この場合、ワーク支持台６０回転数は限定さ
れるものでもなく、ジェットノズル１３をトレイ５上に
全面もしくは半面分だけ、装置上部で反復動作をくシ返
すことにより、洗浄効果を上げることが可能である。Further, a jet nozzle 13 for high-pressure jetting is positioned above the workpiece 4, and the cleaning liquid 13a is jetted at high pressure while the workpiece support base 6 is rotated to clean the workpiece 4 top. In this case, the number of rotations of the workpiece support table 60 is not limited, and the cleaning effect can be increased by repeatedly moving the jet nozzle 13 over the entire surface or half of the tray 5 at the top of the device. It is.
高圧ジェット洗浄後、場合によっては、リンスノズル１
１からリンス用の液１１ａを吐出しながら、最終すすぎ
を行うものである。After high-pressure jet cleaning, in some cases, rinse nozzle 1
The final rinse is performed while discharging the rinsing liquid 11a from the rinsing liquid 11a.
次に、リンス用の液１１ａを止め、ワーク支持台６を高
速回転させ、ワーク４及びトレイ５上に残った液を遠心
力で除去し、乾燥を行うものである。この際、乾燥効率
を上げるため、回転数をさらに上げることや、ガス噴射
ノズル１２から乾燥したガスをワーク４及びトレイ５上
に吹き付けることも有効な手段である。Next, the rinsing liquid 11a is stopped, the workpiece support table 6 is rotated at high speed, and the liquid remaining on the workpiece 4 and tray 5 is removed by centrifugal force, thereby drying the workpiece 4 and the tray 5. At this time, in order to increase the drying efficiency, it is effective to further increase the rotation speed or to spray dry gas onto the workpiece 4 and the tray 5 from the gas injection nozzle 12.
乾燥終了後、ワーク支持台６の回転を止め、さらに真空
吸引を止め、一連の当該洗浄装置による洗浄を終了する
ものである。After the drying is completed, the rotation of the work support table 6 is stopped, and furthermore, the vacuum suction is stopped, and the series of cleaning by the cleaning device is completed.
ここで、超音波振動子７ａ、７ｂ、７Ｇから発振される
周波数は限定されるものではなく、また超音波振動子？
ａ、７ｂ、７ｃを、ともに同一周波数とする必要はない
ものであり、さらに、周波数を時間的間隔をもって変え
ることも何ら問題はないものである。Here, the frequencies oscillated from the ultrasonic transducers 7a, 7b, and 7G are not limited, and the ultrasonic transducers?
It is not necessary that a, 7b, and 7c all have the same frequency, and there is no problem in changing the frequencies at time intervals.
上記実施例に係る装置においては、外囲体１の上下を行
い、・超音波洗浄、スクラバ及び乾燥に適した外囲体１
の位置を決定しているが、ワーク支持台６を、外囲体１
内でシャフトを介し上下することも、当該装置による洗
浄効果を左右するものではない。また、洗浄用の液は、
ワーク４の汚染状態により、適宜に選定することも有効
な洗浄手段となるものである。In the apparatus according to the above embodiment, the outer enclosure 1 is moved up and down, and the outer enclosure 1 is suitable for ultrasonic cleaning, scrubber and drying.
The position of the workpiece support 6 is determined by the outer body 1.
The fact that the device is moved up and down via a shaft does not affect the cleaning effectiveness of the device. In addition, the cleaning liquid is
It is also an effective cleaning means to select an appropriate cleaning method depending on the contamination state of the workpiece 4.
また、外囲体１の形状は、超音波の伝達及びブラシ、高
圧ジェットによるスクラバ洗浄、さらに高速回転乾燥時
の飛散液滴による再汚染まで考慮した形状が望ましく、
図に示す形状に限るものではない。In addition, the shape of the outer envelope 1 is desirably a shape that takes into account transmission of ultrasonic waves, scrubber cleaning by brushes and high-pressure jets, and recontamination by scattered droplets during high-speed rotation drying.
It is not limited to the shape shown in the figure.
しかして、その外囲体によって、超音波洗浄槽を兼ねて
いるので、これらを総合する洗浄エリアが一つであるた
め、全体として小形化が可能で、生産性がよく、低価格
のものを得ることができるものである。However, since the outer body also serves as an ultrasonic cleaning tank, there is one cleaning area that combines all of these, making it possible to downsize the entire unit, improve productivity, and create a low-cost product. It is something that can be obtained.
さらに、当該装置の各部材質は、耐久性、ならびに使用
される洗浄液により選定されるもので、その選定によシ
、本発明に係るものの作用、効果に影響を与えるもので
はなく、各部シール構造も同様に選択されるものである
。Furthermore, the materials of each part of the device are selected depending on the durability and the cleaning liquid used, and the selection does not affect the operation or effect of the present invention, and the seal structure of each part is also selected. They are similarly selected.
上記に加え、被洗浄物としては、トレ・イ５を必要とせ
ず、直接、ワーク支持台６上に固定可能なものであれば
、当該装置での洗浄に支障をきたすものでもなく、例え
ば、シリコンウエノ・、ガリウムーヒ素ウェハ等の半導
体ウェハ、さらにガラス板状の基板、セラミック板等を
、直接、載置することも可能で、また、載置し難い凹凸
状の例えばレンズ等も、ワーク支持台６の形状変更によ
り、どのような被洗浄物形状にも規制されるものではな
い。In addition to the above, as long as the object to be cleaned does not require the tray 5 and can be directly fixed on the workpiece support 6, it will not interfere with cleaning with the device, for example, Semiconductor wafers such as silicon wafers and gallium-arsenide wafers, as well as glass plate-like substrates, ceramic plates, etc., can be directly placed on the workpiece, and uneven surfaces such as lenses that are difficult to place can also be supported. Changing the shape of the table 6 does not limit the shape of the object to be cleaned.
本実施例によれば、表面平滑部に微細な加工が施こされ
た被洗浄物に対し、超音波による液中洗浄、さらにブラ
シ及び高圧ジェットによるスクラバ洗浄、高速ワーク回
転による乾燥と、全て一つの洗浄エリア内で完了でき、
超音波洗浄後、ワーク４の移動にともなう気中汚染等の
危険性も排除でき、高洗浄性が期待できるものである。According to this embodiment, for an object to be cleaned whose smooth surface has been finely processed, submerged cleaning using ultrasonic waves, scrubber cleaning using a brush and high-pressure jet, and drying using high-speed workpiece rotation are all carried out in one step. Can be completed within one cleaning area,
After ultrasonic cleaning, the risk of airborne contamination due to movement of the workpiece 4 can be eliminated, and high cleaning performance can be expected.
また、洗浄エリアが一つであるため装置とじて小形化が
可能となる効果がある。Further, since there is only one cleaning area, there is an effect that the apparatus can be combined and downsized.
本発明によるときは、微細加工が施された部分を有する
複雑な表面の被洗浄物に対して、十分に清浄化可能な洗
浄装置を提供することができるものであって、実用的効
果にすぐれた発明ということができる。According to the present invention, it is possible to provide a cleaning device that can sufficiently clean an object to be cleaned that has a complicated surface that has a micro-machined part, and has excellent practical effects. It can be said that it is a new invention.
第１図は、本発明の一実施例に係る洗浄装置の、その超
音波洗浄時をあわせ示す断面図、第２図は、そのスクラ
バ洗浄時の内部概略説明開披図である。
１・・・外囲体、２・・・注液ノズル、３・・・液、４
・・・ワーク、５・・・トレイ、５ａ・・・真空経路溝
、６・・・ワーク支持台、６ａ・・・真空吸引孔、７ａ
、７ｂ、７ｃ・・・超音波振動子、８・・・上下駆動用
シャフト、９・・・回転用シャフト、９ａ・・・真空用
シャフト、１０・・・ブラシ、１０ａ・・・ブラシアー
ム、１１・・・リンスノズル、１２・・・ガス噴射ノズ
ル、１３・・・ジェットノズル、１４・・・液排出口。FIG. 1 is a sectional view showing a cleaning device according to an embodiment of the present invention during ultrasonic cleaning, and FIG. 2 is an open view schematically explaining the interior of the cleaning device during scrubber cleaning. 1... Outer enclosure, 2... Liquid injection nozzle, 3... Liquid, 4
... Work, 5... Tray, 5a... Vacuum path groove, 6... Work support stand, 6a... Vacuum suction hole, 7a
, 7b, 7c... Ultrasonic vibrator, 8... Vertical drive shaft, 9... Rotation shaft, 9a... Vacuum shaft, 10... Brush, 10a... Brush arm, 11... Rinse nozzle, 12... Gas injection nozzle, 13... Jet nozzle, 14... Liquid discharge port.
Claims (1)
ス及びスピン乾燥等を行えるようにした洗浄装置におい
て、そのワーク支持台の周囲を覆う筒状の外囲体に、超
音波振動子を配設したことを特徴とする洗浄装置。 ２、特許請求の範囲第１項記載のものにおいて、ワーク
支持台は、その中央部に真空吸引孔を設けるとともに、
回転用シャフト、真空用シャフトが液密にシール及び嵌
合されるようにしたものである洗浄装置。[Claims] 1. In a cleaning device capable of performing rotating brush cleaning, high-pressure jet cleaning, rinsing, spin drying, etc., ultrasonic vibration is applied to a cylindrical envelope surrounding the workpiece support base. A cleaning device characterized by having a child. 2. In the item described in claim 1, the workpiece support is provided with a vacuum suction hole in the center thereof, and
A cleaning device in which a rotating shaft and a vacuum shaft are sealed and fitted in a liquid-tight manner.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2086285A JPS61181134A (en) | 1985-02-07 | 1985-02-07 | Cleansing apparatus |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2086285A JPS61181134A (en) | 1985-02-07 | 1985-02-07 | Cleansing apparatus |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS61181134A true JPS61181134A (en) | 1986-08-13 |
Family
ID=12038940
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2086285A Pending JPS61181134A (en) | 1985-02-07 | 1985-02-07 | Cleansing apparatus |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS61181134A (en) |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH02252238A (en) * | 1989-03-25 | 1990-10-11 | Tokyo Electron Ltd | Cleaning equipment for substrate |
| US5975098A (en) * | 1995-12-21 | 1999-11-02 | Dainippon Screen Mfg. Co., Ltd. | Apparatus for and method of cleaning substrate |
| JP2007194367A (en) * | 2006-01-18 | 2007-08-02 | Tokyo Seimitsu Co Ltd | Washing apparatus, and dicing equipment provided therewith |
Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5919329A (en) * | 1982-07-23 | 1984-01-31 | Hitachi Ltd | Cleaning method and device thereof |
| JPS59195649A (en) * | 1983-04-21 | 1984-11-06 | Nec Corp | Device for washing photomask |
-
1985
- 1985-02-07 JP JP2086285A patent/JPS61181134A/en active Pending
Patent Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5919329A (en) * | 1982-07-23 | 1984-01-31 | Hitachi Ltd | Cleaning method and device thereof |
| JPS59195649A (en) * | 1983-04-21 | 1984-11-06 | Nec Corp | Device for washing photomask |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH02252238A (en) * | 1989-03-25 | 1990-10-11 | Tokyo Electron Ltd | Cleaning equipment for substrate |
| US5975098A (en) * | 1995-12-21 | 1999-11-02 | Dainippon Screen Mfg. Co., Ltd. | Apparatus for and method of cleaning substrate |
| JP2007194367A (en) * | 2006-01-18 | 2007-08-02 | Tokyo Seimitsu Co Ltd | Washing apparatus, and dicing equipment provided therewith |
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