PH12021550814A1 - Cover tape for packing electronic component and package - Google Patents

Cover tape for packing electronic component and package

Info

Publication number
PH12021550814A1
PH12021550814A1 PH12021550814A PH12021550814A PH12021550814A1 PH 12021550814 A1 PH12021550814 A1 PH 12021550814A1 PH 12021550814 A PH12021550814 A PH 12021550814A PH 12021550814 A PH12021550814 A PH 12021550814A PH 12021550814 A1 PH12021550814 A1 PH 12021550814A1
Authority
PH
Philippines
Prior art keywords
cover tape
electronic component
layer
package
heat
Prior art date
Application number
PH12021550814A
Other languages
English (en)
Inventor
Masakuni Inoue
Yasunori Nagatsuka
Kazuki Tsukiyama
Hironori Hagio
Takaki Miyachi
Original Assignee
Dainippon Printing Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Dainippon Printing Co Ltd filed Critical Dainippon Printing Co Ltd
Publication of PH12021550814A1 publication Critical patent/PH12021550814A1/en

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B65—CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
    • B65D—CONTAINERS FOR STORAGE OR TRANSPORT OF ARTICLES OR MATERIALS, e.g. BAGS, BARRELS, BOTTLES, BOXES, CANS, CARTONS, CRATES, DRUMS, JARS, TANKS, HOPPERS, FORWARDING CONTAINERS; ACCESSORIES, CLOSURES, OR FITTINGS THEREFOR; PACKAGING ELEMENTS; PACKAGES
    • B65D73/00—Packages comprising articles attached to cards, sheets or webs
    • B65D73/02—Articles, e.g. small electrical components, attached to webs
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B27/00—Layered products comprising a layer of synthetic resin
    • B32B27/28—Layered products comprising a layer of synthetic resin comprising synthetic resins not wholly covered by any one of the sub-groups B32B27/30 - B32B27/42
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B65—CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
    • B65D—CONTAINERS FOR STORAGE OR TRANSPORT OF ARTICLES OR MATERIALS, e.g. BAGS, BARRELS, BOTTLES, BOXES, CANS, CARTONS, CRATES, DRUMS, JARS, TANKS, HOPPERS, FORWARDING CONTAINERS; ACCESSORIES, CLOSURES, OR FITTINGS THEREFOR; PACKAGING ELEMENTS; PACKAGES
    • B65D85/00—Containers, packaging elements or packages, specially adapted for particular articles or materials
    • B65D85/67—Containers, packaging elements or packages, specially adapted for particular articles or materials for web or tape-like material
    • B65D85/671—Containers, packaging elements or packages, specially adapted for particular articles or materials for web or tape-like material wound in flat spiral form

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Packaging Frangible Articles (AREA)
  • Packages (AREA)
  • Laminated Bodies (AREA)
PH12021550814A 2018-09-18 2021-04-13 Cover tape for packing electronic component and package PH12021550814A1 (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2018173796A JP6763421B2 (ja) 2018-09-18 2018-09-18 電子部品包装用カバーテープおよび包装体
PCT/JP2019/036300 WO2020059682A1 (ja) 2018-09-18 2019-09-17 電子部品包装用カバーテープおよび包装体

Publications (1)

Publication Number Publication Date
PH12021550814A1 true PH12021550814A1 (en) 2021-10-04

Family

ID=69887030

Family Applications (1)

Application Number Title Priority Date Filing Date
PH12021550814A PH12021550814A1 (en) 2018-09-18 2021-04-13 Cover tape for packing electronic component and package

Country Status (6)

Country Link
JP (1) JP6763421B2 (ja)
KR (1) KR102657425B1 (ja)
CN (1) CN112703157A (ja)
PH (1) PH12021550814A1 (ja)
TW (1) TWI805842B (ja)
WO (1) WO2020059682A1 (ja)

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2020204138A1 (ja) * 2019-04-03 2020-10-08 大日本印刷株式会社 電子部品包装用カバーテープおよび包装体
JP7524582B2 (ja) * 2020-03-31 2024-07-30 大日本印刷株式会社 成形体、転写シート及び成形体の製造方法

Family Cites Families (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS57131106A (en) * 1981-02-05 1982-08-13 Matsushita Electric Ind Co Ltd Synchronizing detecting device
JP2601273Y2 (ja) * 1993-05-14 1999-11-15 松下電器産業株式会社 チップ体搬送用カバーテープおよび電子部品連
JPH1095448A (ja) 1996-09-18 1998-04-14 Dainippon Printing Co Ltd キャリアテープ用蓋材
JP2001003014A (ja) * 1999-06-16 2001-01-09 Nitto Denko Corp チップ型電子部品キャリア用ボトムカバーテープ
JP4061136B2 (ja) * 2002-06-25 2008-03-12 大日本印刷株式会社 帯電防止積層体及びその製造方法、並びにテーピング包装用カバーテープ
JP2012214252A (ja) * 2010-09-30 2012-11-08 Sumitomo Bakelite Co Ltd 電子部品包装用カバーテープ
MY181505A (en) * 2013-07-09 2020-12-24 Sumitomo Bakelite Co Cover tape for packaging electronic part
WO2015029867A1 (ja) * 2013-09-02 2015-03-05 電気化学工業株式会社 カバーフィルムおよび電子部品包装体
JP5701350B2 (ja) * 2013-09-03 2015-04-15 日本マタイ株式会社 電子部品搬送用ボトムカバーテープ
CN106604816B (zh) * 2014-08-15 2020-07-24 电化株式会社 覆盖膜及使用其的电子部件包装体
CN109790345B (zh) * 2016-09-28 2021-02-12 住友电木株式会社 树脂组合物、外封带及电子组件用包装体

Also Published As

Publication number Publication date
JP6763421B2 (ja) 2020-09-30
TW202017820A (zh) 2020-05-16
CN112703157A (zh) 2021-04-23
KR102657425B1 (ko) 2024-04-16
JP2020045130A (ja) 2020-03-26
TWI805842B (zh) 2023-06-21
WO2020059682A1 (ja) 2020-03-26
KR20210060507A (ko) 2021-05-26

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