PH12017501262B1 - Anisotropic conductive film - Google Patents

Anisotropic conductive film

Info

Publication number
PH12017501262B1
PH12017501262B1 PH1/2017/501262A PH12017501262A PH12017501262B1 PH 12017501262 B1 PH12017501262 B1 PH 12017501262B1 PH 12017501262 A PH12017501262 A PH 12017501262A PH 12017501262 B1 PH12017501262 B1 PH 12017501262B1
Authority
PH
Philippines
Prior art keywords
particle diameter
conductive
film
anisotropic conductive
conductive film
Prior art date
Application number
PH1/2017/501262A
Other languages
English (en)
Other versions
PH12017501262A1 (en
Inventor
Yasushi Akutsu
Ryousuke Odaka
Daisuke Sato
Yusuke Tanaka
Original Assignee
Dexerials Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Dexerials Corp filed Critical Dexerials Corp
Publication of PH12017501262A1 publication Critical patent/PH12017501262A1/en
Publication of PH12017501262B1 publication Critical patent/PH12017501262B1/en

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J9/00—Adhesives characterised by their physical nature or the effects produced, e.g. glue sticks
    • C09J9/02—Electrically-conducting adhesives
    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B7/00—Mountings, adjusting means, or light-tight connections, for optical elements
    • G02B7/02—Mountings, adjusting means, or light-tight connections, for optical elements for lenses
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J11/00—Features of adhesives not provided for in group C09J9/00, e.g. additives
    • C09J11/02—Non-macromolecular additives
    • C09J11/04—Non-macromolecular additives inorganic
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J163/00—Adhesives based on epoxy resins; Adhesives based on derivatives of epoxy resins
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J7/00—Adhesives in the form of films or foils
    • C09J7/10—Adhesives in the form of films or foils without carriers
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
    • H01B1/00—Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors
    • H01B1/20—Conductive material dispersed in non-conductive organic material
    • H01B1/22—Conductive material dispersed in non-conductive organic material the conductive material comprising metals or alloys
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
    • H01B5/00—Non-insulated conductors or conductive bodies characterised by their form
    • H01B5/16—Non-insulated conductors or conductive bodies characterised by their form comprising conductive material in insulating or poorly conductive material, e.g. conductive rubber
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R11/00—Individual connecting elements providing two or more spaced connecting locations for conductive members which are, or may be, thereby interconnected, e.g. end pieces for wires or cables supported by the wire or cable and having means for facilitating electrical connection to some other wire, terminal, or conductive member, blocks of binding posts
    • H01R11/01—Individual connecting elements providing two or more spaced connecting locations for conductive members which are, or may be, thereby interconnected, e.g. end pieces for wires or cables supported by the wire or cable and having means for facilitating electrical connection to some other wire, terminal, or conductive member, blocks of binding posts characterised by the form or arrangement of the conductive interconnection between the connecting locations
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R4/00—Electrically-conductive connections between two or more conductive members in direct contact, i.e. touching one another; Means for effecting or maintaining such contact; Electrically-conductive connections having two or more spaced connecting locations for conductors and using contact members penetrating insulation
    • H01R4/04—Electrically-conductive connections between two or more conductive members in direct contact, i.e. touching one another; Means for effecting or maintaining such contact; Electrically-conductive connections having two or more spaced connecting locations for conductors and using contact members penetrating insulation using electrically conductive adhesives
    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04N—PICTORIAL COMMUNICATION, e.g. TELEVISION
    • H04N23/00—Cameras or camera modules comprising electronic image sensors; Control thereof
    • H04N23/50—Constructional details
    • H04N23/54—Mounting of pick-up tubes, electronic image sensors, deviation or focusing coils
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/18—Printed circuits structurally associated with non-printed electric components
    • H05K1/181—Printed circuits structurally associated with non-printed electric components associated with surface mounted components
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/321—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by conductive adhesives
    • H05K3/323—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by conductive adhesives by applying an anisotropic conductive adhesive layer over an array of pads
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10F—INORGANIC SEMICONDUCTOR DEVICES SENSITIVE TO INFRARED RADIATION, LIGHT, ELECTROMAGNETIC RADIATION OF SHORTER WAVELENGTH OR CORPUSCULAR RADIATION
    • H10F39/00—Integrated devices, or assemblies of multiple devices, comprising at least one element covered by group H10F30/00, e.g. radiation detectors comprising photodiode arrays
    • H10F39/80—Constructional details of image sensors
    • H10F39/804—Containers or encapsulations
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K2201/00—Specific properties of additives
    • C08K2201/001—Conductive additives
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K2201/00—Specific properties of additives
    • C08K2201/002—Physical properties
    • C08K2201/003—Additives being defined by their diameter
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K3/00—Use of inorganic substances as compounding ingredients
    • C08K3/02—Elements
    • C08K3/08—Metals
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K3/00—Use of inorganic substances as compounding ingredients
    • C08K3/10—Metal compounds
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K3/00—Use of inorganic substances as compounding ingredients
    • C08K3/34—Silicon-containing compounds
    • C08K3/36—Silica
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K9/00—Use of pretreated ingredients
    • C08K9/02—Ingredients treated with inorganic substances
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J2203/00—Applications of adhesives in processes or use of adhesives in the form of films or foils
    • C09J2203/326—Applications of adhesives in processes or use of adhesives in the form of films or foils for bonding electronic components such as wafers, chips or semiconductors
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J2301/00—Additional features of adhesives in the form of films or foils
    • C09J2301/40—Additional features of adhesives in the form of films or foils characterized by the presence of essential components
    • C09J2301/408—Additional features of adhesives in the form of films or foils characterized by the presence of essential components additives as essential feature of the adhesive layer
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03B—APPARATUS OR ARRANGEMENTS FOR TAKING PHOTOGRAPHS OR FOR PROJECTING OR VIEWING THEM; APPARATUS OR ARRANGEMENTS EMPLOYING ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ACCESSORIES THEREFOR
    • G03B17/00—Details of cameras or camera bodies; Accessories therefor
    • G03B17/02—Bodies
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805—Shape
    • H01L2224/4809—Loop shape
    • H01L2224/48091—Arched
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0266—Marks, test patterns or identification means
    • H05K1/0269—Marks, test patterns or identification means for visual or optical inspection
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/03—Use of materials for the substrate
    • H05K1/0306—Inorganic insulating substrates, e.g. ceramic, glass
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09818—Shape or layout details not covered by a single group of H05K2201/09009 - H05K2201/09809
    • H05K2201/09918—Optically detected marks used for aligning tool relative to the PCB, e.g. for mounting of components
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10007—Types of components
    • H05K2201/10121—Optical component, e.g. opto-electronic component
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10007—Types of components
    • H05K2201/10151—Sensor

Landscapes

  • Chemical & Material Sciences (AREA)
  • Organic Chemistry (AREA)
  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Health & Medical Sciences (AREA)
  • Polymers & Plastics (AREA)
  • Medicinal Chemistry (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Manufacturing & Machinery (AREA)
  • Dispersion Chemistry (AREA)
  • Spectroscopy & Molecular Physics (AREA)
  • Multimedia (AREA)
  • Signal Processing (AREA)
  • General Physics & Mathematics (AREA)
  • Inorganic Chemistry (AREA)
  • Optics & Photonics (AREA)
  • Non-Insulated Conductors (AREA)
  • Adhesive Tapes (AREA)
  • Adhesives Or Adhesive Processes (AREA)
  • Studio Devices (AREA)
  • Lens Barrels (AREA)
  • Camera Bodies And Camera Details Or Accessories (AREA)
  • Manufacturing Of Electrical Connectors (AREA)
  • Laminated Bodies (AREA)
PH1/2017/501262A 2015-01-13 2016-01-13 Anisotropic conductive film PH12017501262B1 (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2015004597 2015-01-13
PCT/JP2016/050858 WO2016114314A1 (ja) 2015-01-13 2016-01-13 異方導電性フィルム

Publications (2)

Publication Number Publication Date
PH12017501262A1 PH12017501262A1 (en) 2018-01-15
PH12017501262B1 true PH12017501262B1 (en) 2023-02-08

Family

ID=56405855

Family Applications (1)

Application Number Title Priority Date Filing Date
PH1/2017/501262A PH12017501262B1 (en) 2015-01-13 2016-01-13 Anisotropic conductive film

Country Status (8)

Country Link
US (2) US11591499B2 (enExample)
JP (3) JP6394613B2 (enExample)
KR (3) KR102276325B1 (enExample)
CN (2) CN107112067B (enExample)
PH (1) PH12017501262B1 (enExample)
SG (2) SG10201909698RA (enExample)
TW (3) TWI694128B (enExample)
WO (1) WO2016114314A1 (enExample)

Families Citing this family (24)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP7052254B2 (ja) 2016-11-04 2022-04-12 デクセリアルズ株式会社 フィラー含有フィルム
WO2016114314A1 (ja) 2015-01-13 2016-07-21 デクセリアルズ株式会社 異方導電性フィルム
WO2017191772A1 (ja) * 2016-05-05 2017-11-09 デクセリアルズ株式会社 フィラー配置フィルム
JP6187665B1 (ja) * 2016-10-18 2017-08-30 デクセリアルズ株式会社 異方性導電フィルム
CN109983628B (zh) * 2016-11-30 2021-12-24 迪睿合株式会社 导电粒子配置膜、其制造方法、检查探头单元、导通检查方法
KR102649406B1 (ko) * 2016-12-01 2024-03-20 데쿠세리아루즈 가부시키가이샤 필러 함유 필름
JP7047282B2 (ja) 2016-12-01 2022-04-05 デクセリアルズ株式会社 フィラー含有フィルム
WO2018125164A1 (en) * 2016-12-29 2018-07-05 Intel Corporation Semiconductor package having package substrate containing non-homogeneous dielectric layer
JP7062389B2 (ja) * 2017-08-23 2022-05-06 デクセリアルズ株式会社 異方性導電フィルム
CN116505675A (zh) * 2017-09-15 2023-07-28 台达电子工业股份有限公司 直流无刷马达风扇
JP7020029B2 (ja) * 2017-09-28 2022-02-16 昭和電工マテリアルズ株式会社 導電性接着フィルム
WO2019074060A1 (ja) * 2017-10-12 2019-04-18 富士フイルム株式会社 複合材
KR102254470B1 (ko) * 2018-07-12 2021-05-21 에이치엔에스하이텍(주) 도전입자의 이격거리가 제어된 이방도전성 접착필름의 제조방법
CN109943253B (zh) * 2019-03-29 2020-08-18 京东方科技集团股份有限公司 一种异方性导电胶及制备方法、显示装置
JP6794591B1 (ja) * 2019-05-20 2020-12-02 タツタ電線株式会社 導電性接着シート
KR20230046292A (ko) * 2020-07-29 2023-04-05 쓰리엠 이노베이티브 프로퍼티즈 컴파니 전기 전도성 접착 필름
CN112898776B (zh) * 2021-01-22 2022-12-02 镇江中垒新材料科技有限公司 一种异方性导电薄片及其制备方法
WO2023152840A1 (ja) * 2022-02-09 2023-08-17 株式会社レゾナック 配線形成用部材、配線形成用部材を用いた配線層の形成方法、及び、配線形成部材
WO2023153443A1 (ja) * 2022-02-09 2023-08-17 株式会社レゾナック 配線形成用部材、配線形成用部材を用いた配線層の形成方法、及び、配線形成部材
CN118661476A (zh) * 2022-02-09 2024-09-17 株式会社力森诺科 配线形成用部件、使用了配线形成用部件的配线层的形成方法及配线形成部件
JP2024040759A (ja) * 2022-09-13 2024-03-26 デクセリアルズ株式会社 個片フィルムの製造方法及び個片フィルム、並びに表示装置の製造方法及び表示装置
JP2024136143A (ja) * 2023-03-23 2024-10-04 デクセリアルズ株式会社 異方性導電フィルム
JP2024170214A (ja) * 2023-05-26 2024-12-06 デクセリアルズ株式会社 導電性接着フィルム、導電性接着フィルムの製造方法、接続体、接続体の製造方法
WO2025018178A1 (ja) * 2023-07-14 2025-01-23 デクセリアルズ株式会社 導電フィルム、導電フィルムの製造方法および接続構造体の製造方法

Family Cites Families (33)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4731282A (en) * 1983-10-14 1988-03-15 Hitachi Chemical Co., Ltd. Anisotropic-electroconductive adhesive film
JPS62229714A (ja) 1986-03-31 1987-10-08 日東電工株式会社 異方導電性シ−ト
JPS63102110A (ja) 1986-10-17 1988-05-07 富士ゼロックス株式会社 異方導電体及びその製法
JPS6414886A (en) 1987-07-09 1989-01-19 Ricoh Kk Bond for terminal connection and connecting method
US20010046021A1 (en) * 1997-08-28 2001-11-29 Takeshi Kozuka A conductive particle to conductively bond conductive members to each other, an anisotropic adhesive containing the conductive particle, a liquid crystal display device using the anisotropic conductive adhesive, a method for manufacturing the liquid crystal display device
JP3491595B2 (ja) * 2000-02-25 2004-01-26 ソニーケミカル株式会社 異方導電性接着フィルム
JP2001307555A (ja) 2000-04-17 2001-11-02 Sony Corp 異方性導電フィルム及びこれを用いた実装方法ならびに配線用の基板
JP2004035686A (ja) * 2002-07-02 2004-02-05 Bridgestone Corp 異方性導電フィルム
JP2004164692A (ja) * 2002-11-08 2004-06-10 Toshiba Corp 磁気記録媒体及びその製造方法
JP5196703B2 (ja) 2004-01-15 2013-05-15 デクセリアルズ株式会社 接着フィルム
JPWO2006075381A1 (ja) 2005-01-14 2008-06-12 株式会社ルネサステクノロジ カメラモジュールおよび半導体装置
US20060280912A1 (en) * 2005-06-13 2006-12-14 Rong-Chang Liang Non-random array anisotropic conductive film (ACF) and manufacturing processes
JP4887700B2 (ja) 2005-09-09 2012-02-29 住友ベークライト株式会社 異方導電性フィルムおよび電子・電機機器
JP4720814B2 (ja) * 2007-10-29 2011-07-13 住友電気工業株式会社 配線板の接続方法
EP2524264A4 (en) 2010-01-11 2014-02-19 Flextronics Ap Llc CAMERA MODULE WITH A HOLDER FOR A MOLDED BAND FLIP CHIP IMAGER AND METHOD OF MANUFACTURING THEREOF
JP5471504B2 (ja) * 2010-01-25 2014-04-16 日立化成株式会社 異方導電性フィルム
JP2012099729A (ja) 2010-11-04 2012-05-24 Toshiba Corp テンプレート、テンプレートの形成方法及び半導体装置の製造方法
JP5310750B2 (ja) 2011-01-19 2013-10-09 デクセリアルズ株式会社 異方性導電フィルム
JP5685473B2 (ja) * 2011-04-06 2015-03-18 デクセリアルズ株式会社 異方性導電フィルム、接合体の製造方法、及び接合体
JP5803393B2 (ja) * 2011-08-02 2015-11-04 日立化成株式会社 絶縁被覆導電粒子及び異方導電性接着フィルム
JP2013110226A (ja) * 2011-11-18 2013-06-06 Lasertec Corp アライメント方法、及びマスクの製造方法
JP5737278B2 (ja) * 2011-12-21 2015-06-17 日立化成株式会社 回路接続材料、接続体、及び接続体を製造する方法
JP5939918B2 (ja) 2012-07-20 2016-06-22 矢崎総業株式会社 車載カメラ装置
CN107722853B (zh) 2012-08-01 2021-12-17 迪睿合电子材料有限公司 各向异性导电膜的制造方法、各向异性导电膜及连接构造体
TWI547538B (zh) * 2012-08-24 2016-09-01 Dexerials Corp 異向性導電膜之製造方法及異向性導電膜
CN109334132B (zh) * 2012-08-24 2022-02-25 迪睿合电子材料有限公司 各向异性导电膜及其制造方法
JP5964187B2 (ja) 2012-09-18 2016-08-03 デクセリアルズ株式会社 異方性導電フィルム、接続方法、及び接合体
JP2014102943A (ja) * 2012-11-19 2014-06-05 Dexerials Corp 異方性導電フィルム、接続方法、及び接合体
KR101474123B1 (ko) * 2013-04-23 2014-12-17 삼성전기주식회사 배선기판 및 카메라 모듈
US20160155717A1 (en) * 2013-07-31 2016-06-02 Dexerials Corporation Anisotropic conductive film and manufacturing method therefor
JP6119718B2 (ja) * 2013-11-19 2017-04-26 デクセリアルズ株式会社 異方導電性フィルム及び接続構造体
JP5682720B2 (ja) * 2014-03-27 2015-03-11 デクセリアルズ株式会社 異方導電性接着フィルム及びその製造方法
WO2016114314A1 (ja) * 2015-01-13 2016-07-21 デクセリアルズ株式会社 異方導電性フィルム

Also Published As

Publication number Publication date
TWI835413B (zh) 2024-03-11
JP6394613B2 (ja) 2018-09-26
JP6504307B1 (ja) 2019-04-24
US11591499B2 (en) 2023-02-28
TWI787601B (zh) 2022-12-21
KR20170088985A (ko) 2017-08-02
CN107112067A (zh) 2017-08-29
CN110265174A (zh) 2019-09-20
TW201700664A (zh) 2017-01-01
TW202033698A (zh) 2020-09-16
KR102542797B1 (ko) 2023-06-14
CN110265174B (zh) 2022-06-28
JP6489516B2 (ja) 2019-03-27
CN107112067B (zh) 2019-04-16
TW202313881A (zh) 2023-04-01
US20180002575A1 (en) 2018-01-04
KR20180135110A (ko) 2018-12-19
US20230159797A1 (en) 2023-05-25
KR101929951B1 (ko) 2018-12-18
JP2019087536A (ja) 2019-06-06
SG11201705711QA (en) 2017-08-30
PH12017501262A1 (en) 2018-01-15
JP2016131152A (ja) 2016-07-21
KR20210088023A (ko) 2021-07-13
US12480024B2 (en) 2025-11-25
WO2016114314A1 (ja) 2016-07-21
JP2018200880A (ja) 2018-12-20
KR102276325B1 (ko) 2021-07-13
TWI694128B (zh) 2020-05-21
SG10201909698RA (en) 2019-11-28

Similar Documents

Publication Publication Date Title
PH12017501262B1 (en) Anisotropic conductive film
EP4351284A3 (en) Flexible wiring for low temperature applications
SG10201808518RA (en) Bonding electronic components to patterned nanowire transparent conductors
EP4550505A3 (en) Separator having electrode adhesive layer and electrochemical device including the same
WO2014122419A3 (en) Heating element
EP4095895A3 (en) Through electrode substrate and semiconductor device using through electrode substrate
MX2019001401A (es) Vaporizador de un dispositivo de vaporizacion electronico y metodo de formacion de un vaporizador.
EP4300576A3 (en) Method of manufacturing a component carrier
TW201612964A (en) Semiconductor device and semiconductor device manufacturing method
PH12016501783B1 (en) Electroactive optical device
MY184180A (en) Wafer-processing tape
WO2013140295A3 (en) Thermal interface material
MY166609A (en) Connector assembly and method of manufacture
WO2011063082A3 (en) Surface-modified adhesives
SG11201810343TA (en) Release film
EP3586358A4 (en) ELECTRICAL DEVICE HAVING A SUBSTRATE AND A TRANSPARENT CONDUCTIVE LAYER, AND METHOD OF FORMING THEREOF
WO2016003523A3 (en) Polar elastomers for high performance electronic and optoelectronic devices
AU2018293774A1 (en) Optical effect pigment
JP2018138966A5 (enExample)
EP4309529A3 (en) Electronic smoking device with a heating element having a modified surface
PH12020500566A1 (en) Insulting film, insulated conductor, metal base substrate
SG10201913156WA (en) Device substrate with high thermal conductivity and method of manufacturing the same
WO2009057582A1 (ja) 電気的接続体及びその製造方法
WO2017007554A3 (en) Devices with organic semiconductor layers electrically-doped over a controlled depth
WO2015040048A9 (de) Spannungsfeste, elektrisch isolierende beschichtungen