PH12014502409A1 - Guide vane and jetting apparatus - Google Patents

Guide vane and jetting apparatus

Info

Publication number
PH12014502409A1
PH12014502409A1 PH12014502409A PH12014502409A PH12014502409A1 PH 12014502409 A1 PH12014502409 A1 PH 12014502409A1 PH 12014502409 A PH12014502409 A PH 12014502409A PH 12014502409 A PH12014502409 A PH 12014502409A PH 12014502409 A1 PH12014502409 A1 PH 12014502409A1
Authority
PH
Philippines
Prior art keywords
semi
cylindrical plate
molten solder
predetermined
change
Prior art date
Application number
PH12014502409A
Other languages
English (en)
Other versions
PH12014502409B1 (en
Inventor
Nishida Shingo
Original Assignee
Senju Metal Industry Co
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Senju Metal Industry Co filed Critical Senju Metal Industry Co
Publication of PH12014502409B1 publication Critical patent/PH12014502409B1/en
Publication of PH12014502409A1 publication Critical patent/PH12014502409A1/en

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
    • H05K13/04—Mounting of components, e.g. of leadless components
    • H05K13/046—Surface mounting
    • H05K13/0465—Surface mounting by soldering
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K3/00—Tools, devices or special appurtenances for soldering, e.g. brazing, or unsoldering, not specially adapted for particular methods
    • B23K3/06—Solder feeding devices; Solder melting pans
    • B23K3/0646—Solder baths
    • B23K3/0653—Solder baths with wave generating means, e.g. nozzles, jets, fountains
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K1/00—Soldering, e.g. brazing, or unsoldering
    • B23K1/08—Soldering by means of dipping in molten solder
    • B23K1/085—Wave soldering
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K31/00—Processes relevant to this subclass, specially adapted for particular articles or purposes, but not covered by any single one of main groups B23K1/00 - B23K28/00
    • B23K31/02—Processes relevant to this subclass, specially adapted for particular articles or purposes, but not covered by any single one of main groups B23K1/00 - B23K28/00 relating to soldering or welding
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistors
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistors electrically connecting electric components or wires to printed circuits
    • H05K3/34—Assembling printed circuits with electric components, e.g. with resistors electrically connecting electric components or wires to printed circuits by soldering
    • H05K3/3465—Application of solder
    • H05K3/3468—Application of molten solder, e.g. dip soldering

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Molten Solder (AREA)
  • Electric Connection Of Electric Components To Printed Circuits (AREA)
PH12014502409A 2012-04-27 2014-10-27 Guide vane and jetting apparatus PH12014502409A1 (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2012103249A JP5601342B2 (ja) 2012-04-27 2012-04-27 偏流板及び噴流装置
PCT/JP2013/057832 WO2013161453A1 (ja) 2012-04-27 2013-03-19 偏流板及び噴流装置

Publications (2)

Publication Number Publication Date
PH12014502409B1 PH12014502409B1 (en) 2015-01-12
PH12014502409A1 true PH12014502409A1 (en) 2015-01-12

Family

ID=49482790

Family Applications (1)

Application Number Title Priority Date Filing Date
PH12014502409A PH12014502409A1 (en) 2012-04-27 2014-10-27 Guide vane and jetting apparatus

Country Status (10)

Country Link
US (1) US9622395B2 (https=)
EP (1) EP2842683B1 (https=)
JP (1) JP5601342B2 (https=)
KR (1) KR101524993B1 (https=)
CN (1) CN104254423B (https=)
IN (1) IN2014DN09117A (https=)
MY (1) MY182200A (https=)
PH (1) PH12014502409A1 (https=)
SG (1) SG11201406926XA (https=)
WO (1) WO2013161453A1 (https=)

Families Citing this family (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2014157339A1 (ja) * 2013-03-29 2014-10-02 千住金属工業株式会社 偏流板及び噴流装置
DE102013110731B3 (de) * 2013-09-27 2014-11-06 Ersa Gmbh Trennstreifen-Anordnung für Lötdüse, sowie Lötdüseneinrichtung zum selektiven Wellenlöten
CN104594990B (zh) * 2015-02-27 2017-06-23 天纳克（苏州）排放系统有限公司 混合管及其排气处理装置
CN106975816A (zh) * 2017-03-28 2017-07-25 深圳市联合超越电子设备有限公司 喷口角度可调的喷流装置
CN113262392B (zh) * 2021-04-25 2022-08-09 泰尔茂医疗产品(杭州)有限公司 连接器
CN116871620A (zh) * 2023-08-02 2023-10-13 快克智能装备股份有限公司 可适用于盲区焊接的喷嘴及选择性波峰焊接装置
CN117508622A (zh) * 2023-11-29 2024-02-06 中国航空工业集团公司沈阳飞机设计研究所 一种能够提高高温尾喷流控制效果的偏流板
CN118699619B (zh) * 2024-06-27 2025-11-21 武汉船用机械有限责任公司 导管的制作方法
CN121038247B (zh) * 2025-10-29 2026-01-27 华能会理风力发电有限公司 一种变流器散热装置

Family Cites Families (18)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS57154371A (en) * 1981-03-19 1982-09-24 Tdk Corp Method and device for soldering
GB2117690B (en) * 1982-04-02 1986-01-08 Zevatron Gmbh Apparatus for soldering workpieces
JPS63137570A (ja) * 1986-11-27 1988-06-09 Tamura Seisakusho Co Ltd 噴流式はんだ付け装置
JPH01114165A (ja) 1987-10-27 1989-05-02 Mitsubishi Electric Corp 垂直偏向回路
JPH01143762A (ja) 1987-11-26 1989-06-06 Tamura Seisakusho Co Ltd 噴流式はんだ付け装置
JPH0641722Y2 (ja) 1988-01-29 1994-11-02 千住金属工業株式会社 噴流はんだ槽
JPH0314059A (ja) 1989-06-13 1991-01-22 Nec Corp バスシステム
JPH0314059U (https=) * 1989-06-20 1991-02-13
JPH10313171A (ja) * 1997-05-12 1998-11-24 Nihon Dennetsu Keiki Co Ltd はんだ付け装置
JPH1144409A (ja) * 1997-07-23 1999-02-16 Kozo Sekimoto 燃焼炉
JP4136887B2 (ja) 2003-06-17 2008-08-20 千住システムテクノロジー株式会社 半田槽用ポンプ及びそれを使用する半田槽
PL1676662T3 (pl) * 2003-10-10 2010-10-29 Senju Metal Industry Co Dyszowy zbiornik dla lutowia
WO2006082960A1 (ja) 2005-02-07 2006-08-10 Senju Metal Industry Co., Ltd. 噴流はんだ槽
JP4893738B2 (ja) * 2006-04-05 2012-03-07 千住金属工業株式会社 噴流はんだ槽
JP2009019781A (ja) * 2007-07-10 2009-01-29 Showa Denko Kk 熱交換器
CN201089051Y (zh) * 2007-08-03 2008-07-23 陈许松 无铅波峰焊锡机
JP5332654B2 (ja) 2009-01-27 2013-11-06 千住金属工業株式会社 噴流はんだ槽
CN101698259A (zh) * 2009-09-30 2010-04-28 苏州明富自动化设备有限公司 一种焊锡喷锡装置

Also Published As

Publication number Publication date
EP2842683A4 (en) 2016-04-13
KR101524993B1 (ko) 2015-06-01
US20150305216A1 (en) 2015-10-22
US9622395B2 (en) 2017-04-11
EP2842683A1 (en) 2015-03-04
PH12014502409B1 (en) 2015-01-12
SG11201406926XA (en) 2015-02-27
MY182200A (en) 2021-01-18
KR20140146219A (ko) 2014-12-24
JP5601342B2 (ja) 2014-10-08
EP2842683B1 (en) 2017-10-18
CN104254423A (zh) 2014-12-31
IN2014DN09117A (https=) 2015-05-22
WO2013161453A1 (ja) 2013-10-31
JP2013230481A (ja) 2013-11-14
CN104254423B (zh) 2015-11-25

Similar Documents

Publication Publication Date Title
PH12014502409A1 (en) Guide vane and jetting apparatus
AU201612288S (en) Controller with a removable directional pad
AU366403S (en) Controller component
WO2013144738A3 (en) A deformable apparatus and method
MY181216A (en) Susceptor support portion and epitaxial growth apparatus including susceptor support portion
MY176675A (en) Vector maximizing screen
MY154033A (en) Devices including a write pole tip with a convex shape
PH12018550065A1 (en) Selective particles transfer from one device to another
SG10201902551SA (en) Directed energy deposition to facilitate high speed applications
GB201300017D0 (en) Micro-electro-mechanical system (MEMS) structures and design structures
EP3315896A4 (en) Surface shape measuring method, misalignment amount calculating method, and surface shape measuring device
PL3245076T3 (pl) Element konstrukcyjny o strukturze powierzchniowej wytworzonej przez tłoczenie i sposób jego wytwarzania
IN2014DE01076A (https=)
PH12015502695A1 (en) Metal coating on ceramic substrates
IN2014DN08436A (https=)
TW201614229A (en) Semiconductor micro-analysis chip and method of manufacturing the same
EP3317724A4 (en) SELF-ORIENTING METAL STRUCTURING BASED ON PHOTONIC SINTERING OF METAL NANOPARTICLES
GB201203940D0 (en) Centerline generator support system and method of elevating a centerline generator from a support surface
MX2014003328A (es) Dispositivo de distribucion de liquido bajo la forma de gotas.
MY167951A (en) Gas Wiping Method and Gas Wiping Apparatus
GB2541336A (en) Method and apparatus for forming a wire structure
MX359192B (es) Montajes dispensadores y metodos relacionados.
WO2014202257A3 (en) Refractory submerged entry nozzle
WO2015001315A3 (en) Cavitation generation
Genoud Bifurcation from infinity for an asymptotically linear problem on the half-line